INTEL DCP847SKE

Intel® Next Unit of Computing
Board DCP847SKE
Technical Product Specification
May 2013
Order Number: G81548-003
The Intel Next Unit of Computing Board DCP847SKE may contain design defects or errors known as errata that may cause the product to deviate from
published specifications. Current characterized errata are documented in the Intel Next Unit of Computing Board DCP847SKE Specification Update.
Revision History
Revision
Revision History
Date
®
001
First release of the Intel Next Unit of Computing Board DCP847SKE
Technical Product Specification
January 2013
002
Specification clarification
January 2013
003
Specification clarification
May 2013
This product specification applies to only the standard Intel® Next Unit of Computing Board with
BIOS identifier GKPPT10H.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
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IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR
INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS
OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED
FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION
WHERE PERSONAL INJURY OR DEATH MAY OCCUR.
All Intel® Next Unit of Computing Boards are evaluated as Information Technology Equipment (I.T.E.) for
use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar
locations. The suitability of this product for other PC or embedded non-PC applications or other
environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported
without further evaluation by Intel.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
intellectual property rights that relate to the presented subject matter. The furnishing of documents and
other materials and information does not provide any license, express or implied, by estoppel or otherwise,
to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel Next Unit of Computing Boards may contain design defects or errors known as errata, which may
cause the product to deviate from published specifications. Current characterized errata are available on
request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
Intel and Intel Celeron are trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others.
Copyright  2013, Intel Corporation. All rights reserved.
Board Identification Information
Basic Intel® Next Unit of Computing Board DCP847SKE
Identification Information
AA Revision
BIOS Revision
Notes
G79416-103
GKPPT10H.86A.0028
1,2
Notes:
1.
The AA number is found on a small label on the component side of the board.
2.
The Intel® QS77 PCH and Intel® Celeron® processor 847 used on this AA revision consists
of the following components:
Device
Stepping
S-Spec Numbers
Intel Celeron 847
Q0
SR08N
Intel BD82QS77
C1
SLI8B
Specification Changes or Clarifications
The table below indicates the Specification Changes or Specification Clarifications that
apply to the Intel® Desktop Board DCP847SKE.
Specification Changes or Clarifications
Date
Type of Change
Description of Changes or Clarifications
January 2013
Spec Clarification
Deleted the note in Section 3.8 on page 60 regarding removing
power before setting or clearing the hard disk drive password.
May 2013
Spec Clarification
• Replaced Table 4. Supported Memory Configurations.
• Added a sentence to the Caution in Section 2.5.1 to reference
1 x 2 power connector part information.
• Deleted a sentence from the Caution in Section 2.5.1 that
referred to a plastic lid in the accessories box.
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See www.intel.com/nextunitofcomputing for the latest documentation.
iii
Intel Desktop Board DCP847SKE Technical Product Specification
iv
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for Intel® Next Unit
of Computing Board DCP847SKE.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel Next Unit of
Computing Board DCP847SKE and its components to the vendors, system integrators,
and other engineers and technicians who need this level of information. It is
specifically not intended for general audiences.
What This Document Contains
Chapter
Description
1
A description of the hardware used on Intel Next Unit of Computing Board
DCP847SKE
2
A map of the resources of the Intel Next Unit of Computing Board
3
The features supported by the BIOS Setup program
4
A description of the BIOS error messages, beep codes, and POST codes
5
Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
v
Intel Desktop Board DCP847SKE Technical Product Specification
Other Common Notation
vi
#
Used after a signal name to identify an active-low signal (such as USBP0#)
GB
Gigabyte (1,073,741,824 bytes)
GB/s
Gigabytes per second
Gb/s
Gigabits per second
KB
Kilobyte (1024 bytes)
Kb
Kilobit (1024 bits)
kb/s
1000 bits per second
MB
Megabyte (1,048,576 bytes)
MB/s
Megabytes per second
Mb
Megabit (1,048,576 bits)
Mb/s
Megabits per second
TDP
Thermal Design Power
xxh
An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V
Volts. Voltages are DC unless otherwise specified.
*
This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
Contents
Revision History
Board Identification Information .................................................................. iii
Errata ......................................................................................................iii
Preface
Intended Audience..................................................................................... v
What This Document Contains..................................................................... v
Typographical Conventions ......................................................................... v
1 Product Description
1.1 Overview ......................................................................................... 11
1.1.1 Feature Summary ................................................................. 11
1.1.2 Board Layout (Top) ............................................................... 13
1.1.3 Board Layout (Bottom) .......................................................... 15
1.1.4 Block Diagram ...................................................................... 17
1.2 Online Support ................................................................................. 18
1.3 Processor ........................................................................................ 18
1.4 System Memory ............................................................................... 19
1.4.1 Memory Configurations .......................................................... 20
1.5 Intel® QS77 Express Chipset .............................................................. 22
1.5.1 Direct Media Interface (DMI) .................................................. 22
1.5.2 Display Interfaces ................................................................. 22
1.6 Graphics Subsystem ......................................................................... 22
1.6.1 Integrated Graphics ............................................................... 22
1.6.2 USB ..................................................................................... 24
1.7 SATA Interface ................................................................................. 24
1.7.1 AHCI Mode ........................................................................... 24
1.8 Real-Time Clock Subsystem ............................................................... 25
1.9 LAN Subsystem ................................................................................ 25
1.9.1 Intel® 82579V Gigabit Ethernet Controller ................................ 26
1.9.2 LAN Subsystem Software ....................................................... 26
1.9.3 RJ-45 LAN Connector with Integrated LEDs .............................. 27
1.10 Hardware Management Subsystem ..................................................... 28
1.10.1 Hardware Monitoring ............................................................. 28
1.10.2 Fan Monitoring ...................................................................... 28
1.10.3 Thermal Solution ................................................................... 29
1.11 Power Management .......................................................................... 30
1.11.1 ACPI .................................................................................... 30
1.11.2 Hardware Support ................................................................. 32
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Intel Desktop Board DCP847SKE Technical Product Specification
2 Technical Reference
2.1 Memory Resources ........................................................................... 35
2.1.1 Addressable Memory ............................................................. 35
2.1.2 Memory Map ......................................................................... 37
2.2 Connectors and Headers .................................................................... 37
2.2.1 Back Panel Connectors ........................................................... 38
2.2.2 Connectors and Headers (Bottom) ........................................... 39
2.3 BIOS Setup Configuration Jumper ....................................................... 46
2.4 Mechanical Considerations ................................................................. 48
2.4.1 Form Factor .......................................................................... 48
2.5 Electrical Considerations .................................................................... 49
2.5.1 Power Supply Considerations .................................................. 49
2.5.2 Fan Header Current Capability ................................................ 50
2.6 Thermal Considerations ..................................................................... 50
2.7 Reliability......................................................................................... 53
2.8 Environmental .................................................................................. 53
3 Overview of BIOS Features
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
Introduction ..................................................................................... 55
BIOS Flash Memory Organization ........................................................ 56
System Management BIOS (SMBIOS) ................................................. 56
Legacy USB Support ......................................................................... 56
BIOS Updates .................................................................................. 57
3.5.1 Language Support ................................................................. 57
3.5.2 Custom Splash Screen ........................................................... 58
BIOS Recovery ................................................................................. 58
Boot Options .................................................................................... 59
3.7.1 Network Boot........................................................................ 59
3.7.2 Booting Without Attached Devices ........................................... 59
3.7.3 Changing the Default Boot Device During POST ......................... 59
Hard Disk Drive Password Security Feature .......................................... 60
BIOS Security Features ..................................................................... 61
4 Error Messages and Blink Codes
4.1 Front-panel Power LED Blink Codes ..................................................... 63
4.2 BIOS Error Messages ........................................................................ 63
4.3 Port 80h POST Codes ........................................................................ 64
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance ...................................................................... 71
5.1.1 Safety Standards................................................................... 71
5.1.2 European Union Declaration of Conformity Statement ................ 72
5.1.3 Product Ecology Statements ................................................... 73
5.1.4 EMC Regulations ................................................................... 75
viii
Contents
5.1.5 ENERGY STAR* 5.2, e-Standby, and ErP Compliance ................. 78
5.1.6 Regulatory Compliance Marks (Board Level) ............................. 79
5.2 Battery Disposal Information .............................................................. 80
Figures
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
Major Board Components (Top) .......................................................... 13
Major Board Components (Bottom) ..................................................... 15
Block Diagram .................................................................................. 17
Memory Channel and SO-DIMM Configuration ...................................... 21
LAN Connector LED Locations ............................................................. 27
Thermal Solution and Fan Header ....................................................... 29
Location of the Standby Power LED ..................................................... 34
Detailed System Memory Address Map ................................................ 36
Back Panel Connectors ...................................................................... 38
Connectors and Headers (Bottom) ...................................................... 39
Connection Diagram for Front Panel Header ......................................... 44
Connection Diagram for Front Panel USB 2.0 Dual-Port Header............... 45
Location of the BIOS Configuration Setup Jumper ................................. 46
Board Dimensions ............................................................................. 48
Localized High Temperature Zones ..................................................... 51
Tables
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
Feature Summary ............................................................................. 11
Components Shown in Figure 1 .......................................................... 14
Components Shown in Figure 2 .......................................................... 16
Supported Memory Configurations ...................................................... 19
LAN Connector LED States ................................................................. 27
Effects of Pressing the Power Switch ................................................... 30
Power States and Targeted System Power ........................................... 31
Wake-up Devices and Events ............................................................. 32
System Memory Map ........................................................................ 37
Connectors and Headers Shown in Figure 10 ........................................ 40
PCI Express Full-Mini Card Connector .................................................. 41
Dual-Port Front Panel USB 2.0 Header ................................................. 42
19 V Internal Power Supply Connector ................................................ 43
Front Panel Header ........................................................................... 43
States for a One-Color Power LED....................................................... 44
BIOS Setup Configuration Jumper Settings .......................................... 47
Fan Header Current Capability ............................................................ 50
Thermal Considerations for Components .............................................. 52
Tcontrol Values for Components ......................................................... 52
Environmental Specifications .............................................................. 53
AccepDrives/Media Types for BIOS Recovery ....................................... 58
Boot Device Menu Options ................................................................. 59
ix
Intel Desktop Board DCP847SKE Technical Product Specification
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
x
Master Key and User Hard Drive Password Functions ............................ 60
Supervisor and User Password Functions ............................................. 61
Front-panel Power LED Blink Codes ..................................................... 63
BIOS Error Messages ........................................................................ 63
Port 80h POST Code Ranges .............................................................. 64
Port 80h POST Codes ........................................................................ 65
Typical Port 80h POST Sequence ........................................................ 69
Safety Standards .............................................................................. 71
EMC Regulations ............................................................................... 75
Regulatory Compliance Marks ............................................................ 79
1
Product Description
1.1
Overview
1.1.1
Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters)
Processor
• Soldered-down Intel® Celeron® processor 847 with up to 17 W TDP
― Integrated graphics
― Integrated memory controller
Memory
• Two 204-pin DDR3 SDRAM Small Outline Dual Inline Memory Module
(SO-DIMM) sockets
• Support for DDR3 1333 MHz and DDR3 1066 MHz SO-DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 16 GB of system memory with two SO-DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
• Support for 1.35 V low voltage JEDEC memory
Chipset
Intel® QS77 Express Chipset consisting of the Intel® QS77 Express Platform
Controller Hub (PCH)
Graphics
• Integrated graphics support for processors with Intel® Graphics Technology:
― Two High Definition Multimedia Interface* (HDMI*) back panel connectors
Audio
Intel® High Definition Audio via the HDMI v1.4a interfaces
Peripheral
Interfaces
• USB 2.0 ports:
― Three front panel ports (via one dual-port internal header and one front
panel connector)
― Two ports are implemented with vertical back panel connectors
― One port is reserved for the PCI Express* Half-Mini Card
― One port is reserved for the PCI Express Full-Mini Card
• SATA port:
― One internal mSATA port (PCI Express Full-Mini Card) for SSD support
Expansion
Capabilities
• One PCI Express Half-Mini Card connector
BIOS
• Intel® BIOS resident in the Serial Peripheral Interface (SPI) Flash device
• One PCI Express Full-Mini Card connector
• Support for Advanced Configuration and Power Interface (ACPI), Plug and
Play, and System Management BIOS (SMBIOS)
continued
11
Intel Desktop Board DCP847SKE Technical Product Specification
Table 1. Feature Summary (continued)
LAN Support
Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel® 82579V Gigabit
Ethernet Controller
Hardware Monitor
Subsystem
Hardware monitoring subsystem, based on a Nuvoton NPCE791C embedded
controller, including:
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• One processor fan header
• Fan sense input used to monitor fan activity
• Simple fan speed control
12
Product Description
1.1.2
Board Layout (Top)
Figure 1 shows the location of the major components on the top-side of Intel Next Unit
of Computing Board DCP847SKE.
Figure 1. Major Board Components (Top)
13
Intel Desktop Board DCP847SKE Technical Product Specification
Table 2 lists the components identified in Figure 1.
Table 2. Components Shown in Figure 1
14
Item from Figure 1
Description
A
Battery
B
Standby power LED
C
Processor fan header
D
Onboard power button
E
Power LED
F
Hard Disk Drive LED
G
Thermal solution
Product Description
1.1.3
Board Layout (Bottom)
Figure 2 shows the location of the major components on the bottom-side of Intel Next
Unit of Computing Board DCP847SKE.
Figure 2. Major Board Components (Bottom)
15
Intel Desktop Board DCP847SKE Technical Product Specification
Table 3. Components Shown in Figure 2
16
Item from
Figure 2
Description
A
Back panel connectors
B
PCI Express Full-Mini Card connector
C
PCI Express Half-Mini Card connector
D
Front panel dual-port USB 2.0 header
E
BIOS setup configuration jumper
F
Front panel USB 2.0 connector
G
Front panel header
H
DDR3 SO-DIMM 2 socket
I
DDR3 SO-DIMM 1 socket
J
Internal DC power connector
Product Description
1.1.4
Block Diagram
Figure 3 is a block diagram of the major functional areas of the board.
Figure 3. Block Diagram
17
Intel Desktop Board DCP847SKE Technical Product Specification
1.2
1.3
Online Support
To find information about…
Visit this World Wide Web site:
Intel Next Unit of Computing Board
DCP847SKE
http://www.intel.com/products/motherboard/index.htm
Next Unit of Computing Board Support
http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for Intel Next
Unit of Computing Board DCP847SKE
http://ark.intel.com
Chipset information
http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates
http://downloadcenter.intel.com
Tested memory
http://www.intel.com/support/motherboards/desktop/sb/CS025414.htm
Integration information
http://www.intel.com/support/go/buildit
Processor
The board has a soldered-down Intel Celeron processor 847 with Integrated Graphics
Technology and integrated memory controller.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 49 for information on power supply requirements for this board.
18
Product Description
1.4
System Memory
The board has two 204-pin SO-DIMM sockets and supports the following memory
features:
•
•
•
•
•
•
•
•
•
•
1.5 V DDR3 SDRAM SO-DIMMs with gold plated contacts
Support for 1.35 V Low Voltage DDR3 (new JEDEC specification)
Two independent memory channels with interleaved mode support
Unbuffered, single-sided or double-sided SO-DIMMs
16 GB maximum total system memory (with 4 Gb memory technology). Refer to
Section 2.1.1 on page 35 for information on the total amount of addressable
memory.
Minimum recommended total system memory: 1024 MB
Non-ECC SO-DIMMs
Serial Presence Detect
XMP profile support for voltage detection
DDR3 1333 MHz and DDR3 1066 MHz SDRAM SO-DIMMs
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with SO-DIMMs that support the Serial Presence Detect (SPD)
data structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the SO-DIMMs may not function under
the determined frequency.
Table 4 lists the supported SO-DIMM configurations.
Table 4. Supported Memory Configurations
SO-DIMM
Capacity
1024 MB
2048 MB
2048 MB
4096 MB
4096 MB
8192 MB
Note:
Configuration (Note)
SS
DS
SS
DS
SS
DS
SDRAM
Density
1 Gbit
1 Gbit
2 Gbit
2 Gbit
4 Gbit
4 Gbit
SDRAM Organization
Front-side/Back-side
128 M x8/empty
128 M x8/128 M x8
256 M x8/empty
256 M x8/256 M x8
512 M x8/empty
512 M x8/512 M x8
Number of SDRAM
Devices
8
16
8
16
8
16
“DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
For information about…
Refer to:
Tested Memory
http://support.intel.com/support/motherboards/desktop/sb
/CS-025414.htm
19
Intel Desktop Board DCP847SKE Technical Product Specification
1.4.1
Memory Configurations
The processor supports the following types of memory organization:
•
•
20
Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both SO-DIMM channels are equal. Technology and device width can
vary from one channel to the other but the installed memory capacity for each
channel must be equal. If different speed SO-DIMMs are used between channels,
the slowest memory timing will be used.
Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single SO-DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed SO-DIMMs
are used between channels, the slowest memory timing will be used.
For information about…
Refer to:
Memory Configuration Examples
http://www.intel.com/support/motherboards/desktop/sb/cs011965.htm
Product Description
Figure 4 illustrates the memory channel and SO-DIMM configuration.
Figure 4. Memory Channel and SO-DIMM Configuration
21
Intel Desktop Board DCP847SKE Technical Product Specification
Intel® QS77 Express Chipset
1.5
Intel QS77 Express Chipset with Direct Media Interface (DMI) interconnect provides
interfaces to the processor and the USB, SATA, LPC, LAN, and PCI Express interfaces.
The Intel QS77 Express Chipset is a centralized controller for the board’s I/O paths.
For information about
Refer to
The Intel QS77 chipset
http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset
Chapter 2
1.5.1
Direct Media Interface (DMI)
Direct Media Interface (DMI) is the chip-to-chip connection between the processor and
PCH. This high-speed interface integrates advanced priority-based servicing allowing
for concurrent traffic and true isochronous transfer capabilities.
1.5.2
Display Interfaces
Display is divided between the processor and the PCH. The processor houses the
memory interface, display planes, and pipes while the PCH has transcoder and display
interface or ports. The PCH receives the display data over Intel® Flexible Display
Interface (Intel® FDI) and transcodes the data as per the display technology protocol
and sends the data through the display interface.
1.5.2.1
Intel® Flexible Display Interconnect (Intel® FDI)
Intel FDI connects the display engine in the processor with the display interfaces on
the PCH. The display data from the frame buffer is processed in the display engine of
the processor and sent to the PCH over the Intel FDI where it is transcoded as per the
display protocol and driven to the display monitor.
1.5.2.2
High-bandwidth Digital Content Protection (HDCP)
HDCP is the technology for protecting high definition content against unauthorized
copy or unreceptive between a source (computer, digital set top boxes, etc.) and the
sink (panels, monitor, and TVs). The PCH supports HDCP 1.4 for content protection
over wired displays (HDMI).
1.6
Graphics Subsystem
The board supports graphics through Intel Graphics Technology.
1.6.1
Integrated Graphics
The board supports integrated graphics through Intel FDI.
22
Product Description
1.6.1.1
Intel® High Definition (Intel® HD) Graphics
The Intel HD graphics controller features the following:
•
3D Features
 DirectX* 10.1 and OpenGL* 3.0 compliant
 DirectX 11.0 CS4.0 only
•
 Shader Model 4.0
Video
 High-Definition content at up to 1080p resolution
 Hardware accelerated MPEG-2, VC-1/WMV and H.264/AVC Hi-Definition video
formats
 Intel HD Technology with Advanced Hardware Video Transcoding
 Blu-ray* S3D via HDMI 1.4a
 Dynamic Video Memory Technology (DVMT) 5.0 support
 Support of up to 1.7 GB Video Memory with 4 GB and above system memory
configuration
1.6.1.2
Video Memory Allocation
Intel® Dynamic Video Memory Technology (DVMT) is a method for dynamically
allocating system memory for use as graphics memory to balance 2D/3D graphics and
system performance. If your computer is configured to use DVMT, graphics memory is
allocated based on system requirements and application demands (up to the
configured maximum amount). When memory is no longer needed by an application,
the dynamically allocated portion of memory is returned to the operating system for
other uses.
1.6.1.3
High Definition Multimedia Interface* (HDMI*)
The two HDMI ports support standard, enhanced, or high definition video, plus multichannel digital audio on a single cable. Each port is compatible with all ATSC and DVB
HDTV standards and supports eight full range channels at 24-bit/96 kHz audio of
lossless audio formats such as Dolby* TrueHD or DTS* HD Master Audio. The
maximum supported resolution is 1920 x 1200 (WUXGA). The HDMI port is compliant
with the HDMI 1.4a specification.
1.6.1.3.1
Integrated Audio Provided by the HDMI Interfaces
The following audio technologies are supported by the HDMI 1.4a interfaces directly
from the PCH:
•
•
•
•
AC-3 - Dolby* Digital
Dolby Digital Plus
DTS-HD*
LPCM, 192 kHz/24-bit, 8 Channel
NOTE

The PCH only supports one audio stream at a time over HDMI. Dual audio signals are
not supported.
23
Intel Desktop Board DCP847SKE Technical Product Specification
1.6.2
USB
The board supports seven USB 2.0 ports. The port arrangement is as follows:
•
•
•
•
Three front panel ports (via one dual-port internal header and one front panel
connector)
Two ports are implemented with vertical back panel connectors
One port is reserved for the PCI Express Half-Mini Card
One port is reserved for the PCI Express Full-Mini Card
All seven USB 2.0 ports are high-speed, full-speed, and low-speed capable.
NOTE
Computer systems that have an unshielded cable attached to a USB port may not meet
FCC Class B requirements, even if no device is attached to the cable. Use a shielded
cable that meets the requirements for full-speed devices.
For information about
Refer to
The location of the USB connectors on the back panel
Figure 9, page 38
The location of the front panel USB headers
Figure 2, page 15
1.7
SATA Interface
The board provides one internal mSATA port (PCI Express Full-Mini Card connector) for
SSD support.
The PCH provides independent SATA ports with a theoretical maximum transfer rate of
6 Gb/s. A point-to-point interface is used for host to device connections.
The underlying SATA functionality is transparent to the operating system. The SATA
controller can operate in both legacy and native modes. In legacy mode, standard IDE
I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for
configurations using Windows operating systems.
1.7.1
AHCI Mode
The board supports AHCI storage mode via the Intel QS77 Express Chipset.
NOTE
In order to use AHCI mode, AHCI must be enabled in the BIOS. Also, during Microsoft
Windows XP installation, F6 must be pressed to install the AHCI drivers. See your
Microsoft Windows XP documentation for more information about installing drivers
during installation. Microsoft Windows 7 includes the necessary AHCI drivers without
the need to install separate AHCI drivers during the operating system installation
process, however, it is always good practice to update the AHCI drivers to the latest
available by Intel.
24
Product Description
1.8
Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the
computer is not plugged into a wall socket, the battery has an estimated life of three
years. When the computer is plugged in, the standby current from the power supply
extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC
with 3.3 VSB applied via the power supply 5 V STBY rail.
NOTE
If the battery and AC power fail, date and time values will be reset and the user will be
notified during the POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.
1.9
LAN Subsystem
The LAN subsystem consists of the following:
•
•
•
Intel 82579V Gigabit Ethernet Controller (10/100/1000 Mb/s)
Intel QS77 Express Chipset
RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• Jumbo frame support
• LAN connect interface between the PCH and the LAN controller
• Power management capabilities
 ACPI technology support
•
 LAN wake capabilities
LAN subsystem software
For information about
Refer to
LAN software and drivers
http://downloadcenter.intel.com
25
Intel Desktop Board DCP847SKE Technical Product Specification
1.9.1
Intel® 82579V Gigabit Ethernet Controller
The Intel 82579V Gigabit Ethernet Controller supports the following features:
•
•
•
10/100/1000 BASE-T IEEE 802.3 compliant
Energy Efficient Ethernet (EEE) IEEE802.3az support (Low Power Idle (LPI) mode)
Dual interconnect between the Integrated LAN Controller and the Physical Layer
(PHY):
 PCI Express-based interface for active state operation (S0) state
•
•
•
•
1.9.2
 SMBUS for host and management traffic (Sx low power state)
Compliant to IEEE 802.3x flow control support
802.1p and 802.1q
TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
Full device driver compatibility
LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
26
For information about
Refer to
Obtaining LAN software and drivers
http://downloadcenter.intel.com
Product Description
1.9.3
RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).
Item
Description
A
Link LED (Green)
B
Data Rate LED (Green/Yellow)
Figure 5. LAN Connector LED Locations
Table 5 describes the LED states when the board is powered up and the LAN
subsystem is operating.
Table 5. LAN Connector LED States
LED
LED Color
LED State
Condition
Off
LAN link is not established.
Link
Green
On
LAN link is established.
Blinking
LAN activity is occurring.
Off
10 Mb/s data rate is selected.
Green
100 Mb/s data rate is selected.
Yellow
1000 Mb/s data rate is selected.
Data Rate
Green/Yellow
27
Intel Desktop Board DCP847SKE Technical Product Specification
1.10 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including thermal and voltage monitoring.
For information about
Refer to
Wired for Management (WfM) Specification
www.intel.com/design/archives/wfm/
1.10.1
Hardware Monitoring
The hardware monitoring and fan control subsystem is based on a Nuvoton NPCE791C
embedded controller, which supports the following:
•
•
•
•
Processor and system ambient temperature monitoring
Chassis fan speed monitoring
Voltage monitoring of +12 V, +5 V, +3.3 V, Memory Vcc (V_SM), +Vccp, PCH Vcc
SMBus interface
1.10.2
Fan Monitoring
Fan monitoring can be implemented using third-party software.
28
Product Description
1.10.3
Thermal Solution
Figure 6 shows the location of the thermal solution and processor fan header.
Item
Description
A
Processor fan header
B
Thermal solution
Figure 6. Thermal Solution and Fan Header
29
Intel Desktop Board DCP847SKE Technical Product Specification
1.11 Power Management
Power management is implemented at several levels, including:
•
•
Software support through Advanced Configuration and Power Interface (ACPI)
Hardware support:
 Power Input
 Instantly Available PC technology
 LAN wake capabilities
 Wake from USB
 WAKE# signal wake-up support
 Wake from S5
 +5 V Standby Power Indicator LED
1.11.1
ACPI
ACPI gives the operating system direct control over the power management and Plug
and Play functions of a computer. The use of ACPI with this board requires an
operating system that provides full ACPI support. ACPI features include:
•
•
•
•
•
•
Plug and Play (including bus and device enumeration)
Power management control of individual devices, add-in boards (some add-in
boards may require an ACPI-aware driver), video displays, and hard disk drives
Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
A Soft-off feature that enables the operating system to power-off the computer
Support for multiple wake-up events (see Table 8 on page 32)
Support for a front panel power and sleep mode switch
Table 6 lists the system states based on how long the power switch is pressed,
depending on how ACPI is configured with an ACPI-aware operating system.
Table 6. Effects of Pressing the Power Switch
If the system is in this
state…
…and the power switch is
pressed for
Off
(ACPI G2/G5 – Soft off)
Less than four seconds
Power-on
(ACPI G0 – working state)
On
(ACPI G0 – working state)
Less than four seconds
Soft-off/Standby
(ACPI G1 – sleeping state)
On
(ACPI G0 – working state)
More than six seconds
Fail safe power-off
(ACPI G2/G5 – Soft off)
Sleep
(ACPI G1 – sleeping state)
Less than four seconds
Wake-up
(ACPI G0 – working state)
Sleep
(ACPI G1 – sleeping state)
More than six seconds
Power-off
(ACPI G2/G5 – Soft off)
…the system enters this state
Note: Depending on power management settings in the operating system.
30
Note
Product Description
1.11.1.1
System States and Power States
Under ACPI, the operating system directs all system and device power state
transitions. The operating system puts devices in and out of low-power states based
on user preferences and knowledge of how devices are being used by applications.
Devices that are not being used can be turned off. The operating system uses
information from applications and user settings to put the system as a whole into a
low-power state.
Table 7 lists the power states supported by the board along with the associated system
power targets. See the ACPI specification for a complete description of the various
system and power states.
Table 7. Power States and Targeted System Power
Global States
Sleeping States
Processor
States
G0 – working
state
S0 – working
C0 – working
D0 – working
state.
Full power > 30 W
G1 – sleeping
state
S3 – Suspend to
RAM. Context
saved to RAM.
No power
D3 – no power
except for
wake-up logic.
Power < 5 W
(Note 2)
G1 – sleeping
state
S4 – Suspend to
disk. Context
saved to disk.
No power
D3 – no power
except for
wake-up logic.
Power < 5 W
(Note 2)
G2/S5
S5 – Soft off.
Context not saved.
Cold boot is
required.
No power
D3 – no power
except for
wake-up logic.
Power < 5 W
(Note 2)
G3 –
mechanical off
No power to the
system.
No power
D3 – no power for
wake-up logic,
except when
provided by
battery or
external source.
No power to the system.
Service can be performed
safely.
AC power is
disconnected
from the
computer.
Device States
Targeted System
Power (Note 1)
Notes:
1.
Total system power is dependent on the system configuration, including add-in boards and peripherals
powered by the system chassis’ power supply.
2.
Dependent on the standby power consumption of wake-up devices used in the system.
31
Intel Desktop Board DCP847SKE Technical Product Specification
1.11.1.2
Wake-up Devices and Events
Table 8 lists the devices or specific events that can wake the computer from specific
states.
Table 8. Wake-up Devices and Events
Devices/events that wake up the system…
…from this sleep state
Power switch
S3, S4, S5
RTC alarm
S3, S4, S5
LAN
S3, S4, S5
USB
S3
WAKE#
S3, S4, S5
(Note
1)
(Note 1)
(Note 1)
…from this global state
G1, G2, G3
G1, G2
G1, G2
(Note 3)
(Note 3)
G1
(Note 1)
G1, G2
(Note 3)
Notes:
1.
S4 implies operating system support only.
2.
Wake from S4 and S5 is recommended by Microsoft.
3.
Wake from device/event not supported immediately upon return from AC loss.
NOTE
The use of these wake-up events from an ACPI state requires an operating system that
provides full ACPI support. In addition, software, drivers, and peripherals must fully
support ACPI wake events.
1.11.2
Hardware Support
The board provides several power management hardware features, including:
•
•
•
•
•
•
•
Wake from Power Button signal
Instantly Available PC technology
LAN wake capabilities
Wake from USB
WAKE# signal wake-up support
Wake from S5
+5 V Standby Power Indicator LED
NOTE
The use of Wake from USB from an ACPI state requires an operating system that
provides full ACPI support.
32
Product Description
1.11.2.1
Power Input
When resuming from an AC power failure, the computer returns to the power state it
was in before power was interrupted (on or off). The computer’s response can be set
using the Last Power State feature in the BIOS Setup program’s Boot menu.
For information about
Refer to
The location of the internal power connector
Figure 2, page 15
The signal names of the internal power connector
Table 13, page 43
1.11.2.2
Instantly Available PC Technology
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the
power supply is off, and the front panel LED is amber if dual colored, or off if single
colored.) When signaled by a wake-up device or event, the system quickly returns to
its last known wake state. Table 8 on page 32 lists the devices and events that can
wake the computer from the S3 state.
The use of Instantly Available PC technology requires operating system support and
drivers for any installed PCI Express add-in card.
1.11.2.3
LAN Wake Capabilities
LAN wake capabilities enable remote wake-up of the computer through a network. The
LAN subsystem monitors network traffic at the Media Independent Interface. Upon
detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal that
powers up the computer.
1.11.2.4
Wake from USB
USB bus activity wakes the computer from an ACPI S3 state.
NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB.
1.11.2.5
WAKE# Signal Wake-up Support
When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from
an ACPI S3, S4, or S5 state.
1.11.2.6
Wake from S5
When the RTC Date and Time is set in the BIOS, the computer will automatically wake
from an ACPI S5 state.
33
Intel Desktop Board DCP847SKE Technical Product Specification
1.11.2.7
+5 V Standby Power Indicator LED
The standby power indicator LED shows that power is still present even when the
computer appears to be off. Figure 7 shows the location of the standby power LED.
CAUTION
If AC power has been switched off and the standby power indicator is still lit,
disconnect the power cord before installing or removing any devices connected to the
board. Failure to do so could damage the board and any attached devices.
Figure 7. Location of the Standby Power LED
34
2
Technical Reference
2.1
Memory Resources
2.1.1
Addressable Memory
The board utilizes 16 GB of addressable system memory. Typically the address space
that is allocated for PCI Conventional bus add-in cards, PCI Express configuration
space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM
(total system memory). On a system that has 16 GB of system memory installed, it is
not possible to use all of the installed memory due to system address space being
allocated for other system critical functions. These functions include the following:
•
•
•
•
•
•
BIOS/SPI Flash device (16 Mbit)
Local APIC (19 MB)
Direct Media Interface (40 MB)
PCI Express configuration space (256 MB)
PCH base address registers PCI Express ports (up to 256 MB)
Memory-mapped I/O that is dynamically allocated for PCI Express add-in cards
(256 MB)
The board provides the capability to reclaim the physical memory overlapped by the
memory mapped I/O logical address space. The board remaps physical memory from
the top of usable DRAM boundary to the 4 GB boundary to an equivalent sized logical
address range located just above the 4 GB boundary. Figure 8 shows a schematic of
the system memory map. All installed system memory can be used when there is no
overlap of system addresses.
35
Intel Desktop Board DCP847SKE Technical Product Specification
Figure 8. Detailed System Memory Address Map
36
Technical Reference
2.1.2
Memory Map
Table 9 lists the system memory map.
Table 9. System Memory Map
Address Range (decimal) Address Range (hex)
Size
Description
1024 K - 16777216 K
100000 – 400000000
16382 MB
Extended memory
960 K - 1024 K
F0000 - FFFFF
64 KB
Runtime BIOS
896 K - 960 K
E0000 - EFFFF
64 KB
Reserved
800 K - 896 K
C8000 - DFFFF
96 KB
Potential available high DOS
memory (open to the PCI
Conventional bus). Dependent on
video adapter used.
640 K - 800 K
A0000 - C7FFF
160 KB
Video memory and BIOS
639 K - 640 K
9FC00 - 9FFFF
1 KB
Extended BIOS data (movable by
memory manager software)
512 K - 639 K
80000 - 9FBFF
127 KB
Extended conventional memory
0 K - 512 K
00000 - 7FFFF
512 KB
Conventional memory
2.2
Connectors and Headers
CAUTION
Only the following connectors and headers have overcurrent protection: back panel
and front panel USB.
The other internal connectors and headers are not overcurrent protected and should
connect only to devices inside the computer’s chassis, such as fans and internal
peripherals. Do not use these connectors or headers to power devices external to the
computer’s chassis. A fault in the load presented by the external devices could cause
damage to the computer, the power cable, and the external devices themselves.
Furthermore, improper connection of USB header single wire connectors may
eventually overload the overcurrent protection and cause damage to the board.
This section describes the board’s connectors and headers. The connectors and
headers can be divided into these groups:
•
•
Back panel I/O connectors
On-board I/O connectors and headers (see page 39)
37
Intel Desktop Board DCP847SKE Technical Product Specification
2.2.1
Back Panel Connectors
Figure 9 shows the location of the back panel connectors for the board.
Item
Description
A
B
C
D
E
F
LAN
HDMI connector 2
HDMI connector 1
USB 2.0 port
USB 2.0 port
19 V DC input jack
Figure 9. Back Panel Connectors
38
Technical Reference
2.2.2
Connectors and Headers (Bottom)
Figure 10 shows the locations of the connectors and headers on the bottom-side of the
board.
Figure 10. Connectors and Headers (Bottom)
39
Intel Desktop Board DCP847SKE Technical Product Specification
Table 10 lists the connectors and headers identified in Figure 10.
Table 10. Connectors and Headers Shown in Figure 10
40
Item from
Figure 10
Description
A
PCI Express Full-Mini Card connector
B
PCI Express Half-Mini Card connector
C
Front panel dual-port USB 2.0 header
D
Front panel header
E
Internal DC power connector
Technical Reference
2.2.2.1
Signal Tables for the Connectors and Headers
Table 11. PCI Express Full-Mini Card Connector
Pin
Signal Name
1
WAKE#
2
3.3 V
3
Reserved
4
GND
5
Reserved
6
1.5 V
7
CLKREQ#
8
Reserved
9
GND
10
Reserved
11
REFCLK-
12
Reserved
13
REFCLK+
14
Reserved
15
GND
16
Reserved
17
Reserved
18
GND
19
Reserved
20
Reserved
21
GND
22
PERST#
23
PERn0
24
+3.3 V aux
25
PERp0
26
GND
27
GND
28
+1.5 V
29
GND
30
SMB_CLK
31
PETn0
32
SMB_DATA
33
PETp0
34
GND
35
GND
36
USB_D-
37
GND
38
USB_D+
Additional Signal Name
(Extra USB) +5 V_MINI
(Extra USB) CARDIN
(Extra USB) LP5(Extra USB) LP5+
continued
41
Intel Desktop Board DCP847SKE Technical Product Specification
Table 11. PCI Express Full-Mini Card Connector (continued)
Pin
Signal Name
39
+3.3 Vaux
40
GND
41
+3.3 Vaux
42
LED_WWAN#
43
Reserved
44
LED_WLAN#
45
Reserved
46
LED_WPAN#
47
Reserved
48
+1.5V
49
Reserved
50
GND
51
Reserved
52
+3.3V
Additional Signal Name
(mSATA) Vendor
(mSATA) Vendor
(mSATA) DA/DSS
(mSATA) Presence Detection
Table 12. Dual-Port Front Panel USB 2.0 Header
Pin
Signal Name
Pin
Signal Name
1
+5 V DC
2
+5 V DC
3
D−
4
D−
5
D+
6
D+
7
Ground
8
Ground
9
KEY (no pin)
10
No Connect
2.2.2.2
Add-in Card Connectors
The board has the following add-in card connectors:
•
•
42
One PCI Express Half-Mini Card
One PCI Express Full-Mini Card
Technical Reference
2.2.2.3
Power Supply Connectors
The board has the following power supply connectors:
•
•
External Power Supply – the board can be powered through a 19 V DC connector
on the back panel. The back panel DC connector is compatible with a 5.5 mm/OD
(outer diameter) and 2.5 mm/ID (inner diameter) plug, where the inner contact is
+19 (±10%) V DC and the shell is GND. The maximum current rating is 10 A.
Internal Power Supply – the board can alternatively be powered via the internal
19 V DC 1 x 2 power connector, where pin 1 is GND and pin 2 is +19 (±10%) VDC.
Table 13. 19 V Internal Power Supply Connector
Pin
Signal Name
1
Ground
2
+19 V (±10%)
For information about
Refer to
Power supply considerations
Section 2.5.1, page 49
2.2.2.4
Front Panel Header
This section describes the functions of the front panel header. Table 14 lists the signal
names of the front panel header. Figure 11 is a connection diagram for the front panel
header.
Table 14. Front Panel Header
Pin
Signal Name
Description
Pin
Signal Name
Description
1
HDD_POWER_LED
Pull-up resistor
(750 Ω) to +5V
2
POWER_LED_MAIN
[Out] Front panel LED
(main color)
3
HDD_LED#
[Out] Hard disk
activity LED
4
POWER_LED_ALT
[Out] Front panel LED
(alt color)
5
GROUND
Ground
6
POWER_SWITCH#
[In] Power switch
7
RESET_SWITCH#
[In] Reset switch
8
GROUND
Ground
9
+5V_DC
Power
10
Key
No pin
43
Intel Desktop Board DCP847SKE Technical Product Specification
Figure 11. Connection Diagram for Front Panel Header
2.2.2.4.1
Hard Drive Activity LED Header
Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is
being read from or written to a hard drive. Proper LED function requires a SATA hard
drive or optical drive connected to an onboard SATA connector.
2.2.2.4.2
Reset Switch Header
Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type
switch that is normally open. When the switch is closed, the board resets and runs the
POST.
2.2.2.4.3
Power/Sleep LED Header
Pins 2 and 4 can be connected to a one- or two-color LED. Table 15 shows the
possible LED states.
Table 15. States for a One-Color Power LED
LED State
Description
Off
Power off
Blinking
Standby
Steady
Normal operation
NOTE
The LED behavior shown in Table 15 is default – other patterns may be set via BIOS
setup.
44
Technical Reference
2.2.2.4.4
Power Switch Header
Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The
switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power
supply to switch on or off. (The time requirement is due to internal debounce circuitry
on the board.) At least two seconds must pass before the power supply will recognize
another on/off signal.
2.2.2.5
Front Panel USB 2.0 Header
Figure 12 is a connection diagram for the front panel USB 2.0 header.
NOTE
•
•
The +5 V DC power on the USB header is fused.
Use only a front panel USB connector that conforms to the USB 2.0 specification for
high-speed USB devices.
Figure 12. Connection Diagram for Front Panel
USB 2.0 Dual-Port Header
45
Intel Desktop Board DCP847SKE Technical Product Specification
2.3
BIOS Setup Configuration Jumper
CAUTION
Do not move a jumper with the power on. Always turn off the power and unplug the
power cord from the computer before changing a jumper setting. Otherwise, the board
could be damaged.
Figure 13 shows the location of the BIOS Setup Configuration jumper.
Table 16 describes the BIOS Setup configuration jumper settings for the three modes:
normal, configure, and recovery. When the jumper is set to configure mode and the
computer is powered-up, the BIOS compares the processor version and the microcode
version in the BIOS and reports if the two match.
Figure 13. Location of the BIOS Configuration Setup Jumper
46
Technical Reference
Table 16 lists the settings for the jumper.
Table 16. BIOS Setup Configuration Jumper Settings
Function/Mode
Jumper Setting
Configuration
Normal
1-2
The BIOS uses current configuration information and passwords
for booting.
Configure
2-3
After the POST runs, Setup runs automatically. The maintenance
menu is displayed.
Note that this Configure mode is the only way to clear the
BIOS/CMOS settings. Press F9 (restore defaults) while in
Configure mode to restore the BIOS/CMOS settings to their
default values.
Recovery
None
The BIOS attempts to recover the BIOS configuration. A
recovery CD or flash drive is required.
47
Intel Desktop Board DCP847SKE Technical Product Specification
2.4
2.4.1
Mechanical Considerations
Form Factor
The board is designed to fit into a custom chassis. Figure 14 illustrates the mechanical
form factor for the board. Dimensions are given in inches [millimeters]. The outer
dimensions are 4.0 inches by 4.0 inches [101.60 millimeters by 101.60 millimeters].
Figure 14. Board Dimensions
48
Technical Reference
2.5
2.5.1
Electrical Considerations
Power Supply Considerations
CAUTION
The external 19 V DC jack is the primary power input connector of Intel Next Unit of
Computing Board DCP847SKE. However, the board also provides an internal 1 x 2
power connector that can be used in custom-developed systems that have an internal
power supply. The internal 1 x 2 power connector is a Molex 5566-2 header which
accepts a Molex 5557-02R connector from the power supply.
There is no isolation circuitry between the external 19 V DC jack and the internal 1 x 2
power connector. It is the system integrator’s responsibility to ensure no more than
one power supply unit is or can be attached to the board at any time and to ensure the
external 19 V DC jack is covered if the internal 1 x 2 power connector is to be used.
Simultaneous connection of both external and internal power supply units could result
in potential damage to the board, power supplies, or other hardware.
System power requirements will depend on actual system configurations chosen by the
integrator, as well as end user expansion preferences. It is the system integrator’s
responsibility to ensure an appropriate power budget for the system configuration is
properly assessed based on the system-level components chosen.
49
Intel Desktop Board DCP847SKE Technical Product Specification
2.5.2
Fan Header Current Capability
Table 17 lists the current capability of the fan headers.
Table 17. Fan Header Current Capability
2.6
Fan Header
Maximum Available Current
Processor fan
.1 A
Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 58 oC at the processor fan
inlet is a requirement. Whenever possible, use of a processor heat sink that provides
omni-directional airflow to maintain required airflow across the processor voltage
regulator area is recommended.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board.
All responsibility for determining the adequacy of any thermal or system design
remains solely with the system integrator. Intel makes no warranties or
representations that merely following the instructions presented in this document will
result in a system with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.8.
CAUTION
The processor voltage regulator area (shown in Figure 15) can reach a temperature of
up to 97.5 oC in an open chassis. Ensure that proper airflow is maintained in the
processor voltage regulator circuit. Failure to do so may result in shorter than
expected product lifetime.
50
Technical Reference
Figure 15 shows the locations of the localized high temperature zones.
Item
Description
A
B
Processor voltage regulator area
Thermal solution
Figure 15. Localized High Temperature Zones
51
Intel Desktop Board DCP847SKE Technical Product Specification
Table 18 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 18. Thermal Considerations for Components
Component
Maximum Case Temperature
Processor
For processor case temperature, see processor datasheets and
processor specification updates
Intel QS77 Express Chipset
104 oC
To ensure functionality and reliability, the component is specified for proper operation
when Case Temperature is maintained at or below the maximum temperature listed in
Table 19. This is a requirement for sustained power dissipation equal to Thermal
Design Power (TDP is specified as the maximum sustainable power to be dissipated by
the components). When the component is dissipating less than TDP, the case
temperature should be below the Maximum Case Temperature. The surface
temperature at the geometric center of the component corresponds to Case
Temperature.
It is important to note that the temperature measurement in the system BIOS is a
value reported by embedded thermal sensors in the components and does not directly
correspond to the Maximum Case Temperature. The upper operating limit when
monitoring this thermal sensor is Tcontrol.
Table 19. Tcontrol Values for Components
52
Component
Tcontrol
Processor
For processor case temperature, see processor datasheets and
processor specification updates
Intel QS77 Express Chipset
104 oC
For information about
Refer to
Processor datasheets and specification updates
Section 1.2, page 18
Intel® 7 Series Chipset Thermal Mechanical Specifications and
Design Guidelines
http://www.intel.com/Products/Desktop/
Chipsets/ec-QS77/QS77technicaldocuments.htm
Technical Reference
2.7
Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Telcordia SR-332
Issue 2, Method I, Case 3, 55 ºC ambient. The MTBF prediction is used to estimate
repair rates and spare parts requirements. The MTBF for the board is 90,936 hours.
2.8
Environmental
Table 20 lists the environmental specifications for the board.
Table 20. Environmental Specifications
Parameter
Specification
Temperature
Non-Operating
-40 °C to +60 °C
Operating
0 °C to +50 °C
Shock
Unpackaged
50 g trapezoidal waveform
Velocity change of 170 inches/s²
Packaged
Half sine 2 millisecond
Product Weight (pounds)
Free Fall (inches)
Velocity Change (inches/s²)
<20
36
167
21-40
30
152
41-80
24
136
81-100
18
118
Vibration
Unpackaged
5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged
5 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
53
Intel Desktop Board DCP847SKE Technical Product Specification
54
3
Overview of BIOS Features
3.1
Introduction
The board uses a Intel Visual BIOS that is stored in the Serial Peripheral Interface
Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI
Flash contains the Visual BIOS Setup program, POST, the PCI auto-configuration
utility, LAN EEPROM information, and Plug and Play support.
The BIOS displays a message during POST identifying the type of BIOS and a revision
code. The initial production BIOSs are identified as GKPPT10H.86A.
When the BIOS Setup configuration jumper is set to configure mode and the computer
is powered-up, the BIOS compares the CPU version and the microcode version in the
BIOS and reports if the two match.
The Visual BIOS Setup program can be used to view and change the BIOS settings for
the computer. The BIOS Setup program is accessed by pressing the <F2> key after
the Power-On Self-Test (POST) memory test begins and before the operating system
boot begins.
NOTE
The maintenance menu is displayed only when the board is in configure mode.
Section 2.3 on page 46 shows how to put the board in configure mode.
55
Intel Desktop Board DCP847SKE Technical Product Specification
3.2
BIOS Flash Memory Organization
The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 64 Mb (8192 KB)
flash memory device.
3.3
System Management BIOS (SMBIOS)
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing
computers in a managed network.
The main component of SMBIOS is the Management Information Format (MIF)
database, which contains information about the computing system and its
components. Using SMBIOS, a system administrator can obtain the system types,
capabilities, operational status, and installation dates for system components. The MIF
database defines the data and provides the method for accessing this information. The
BIOS enables applications such as third-party management software to use SMBIOS.
The BIOS stores and reports the following SMBIOS information:
•
•
•
•
BIOS data, such as the BIOS revision level
Fixed-system data, such as peripherals, serial numbers, and asset tags
Resource data, such as memory size, cache size, and processor speed
Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems require an additional interface for obtaining the
SMBIOS information. The BIOS supports an SMBIOS table interface for such operating
systems. Using this support, an SMBIOS service-level application running on a
non-Plug and Play operating system can obtain the SMBIOS information. Additional
board information can be found in the BIOS under the Additional Information header
under the Main BIOS page.
3.4
Legacy USB Support
Legacy USB support enables USB devices to be used even when the operating system’s
USB drivers are not yet available. Legacy USB support is used to access the BIOS
Setup program, and to install an operating system that supports USB. By default,
Legacy USB support is set to Enabled.
Legacy USB support operates as follows:
1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to
enter and configure the BIOS Setup program and the maintenance menu.
4. POST completes.
5. The operating system loads. While the operating system is loading, USB keyboards
and mice are recognized and may be used to configure the operating system.
(Keyboards and mice are not recognized during this period if Legacy USB support
was set to Disabled in the BIOS Setup program.)
56
Error Messages and Beep Codes
6. After the operating system loads the USB drivers, all legacy and non-legacy USB
devices are recognized by the operating system, and Legacy USB support from the
BIOS is no longer used.
7. Additional USB legacy feature options can be access by using Intel® Integrator
Toolkit.
To install an operating system that supports USB, verify that Legacy USB support in
the BIOS Setup program is set to Enabled and follow the operating system’s
installation instructions.
3.5
BIOS Updates
The BIOS can be updated using either of the following utilities, which are available on
the Intel World Wide Web site:
•
•
•
Intel® Express BIOS Update utility, which enables automated updating while in the
Windows environment. Using this utility, the BIOS can be updated from a file on a
hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM, or from
the file location on the Web.
Intel® Flash Memory Update Utility, which requires booting from DOS. Using this
utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash
drive or a USB hard drive), or a CD-ROM.
Intel® F7 switch during POST allows a user to select where the BIOS .bio file is
located and perform the update from that location/device. Similar to performing a
BIOS Recovery without removing the BIOS configuration jumper.
Both utilities verify that the updated BIOS matches the target system to prevent
accidentally installing an incompatible BIOS.
NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS
update.
For information about
Refer to
BIOS update utilities
http://support.intel.com/support/motherboards/desktop/sb
/CS-022312.htm
3.5.1
Language Support
The BIOS Setup program and help messages are supported in US English. Check the
Intel web site for support.
57
Intel Desktop Board DCP847SKE Technical Product Specification
3.5.2
Custom Splash Screen
During POST, an Intel® splash screen is displayed by default. This splash screen can
be augmented with a custom splash screen. The Intel Integrator’s Toolkit that is
available from Intel can be used to create a custom splash screen.
NOTE
If you add a custom splash screen, it will share space with the Intel branded logo.
For information about
Refer to
Intel Integrator Toolkit
http://developer.intel.com/design/motherbd/software/itk/
Additional Intel® software tools
http://developer.intel.com/design/motherbd/software.htm
3.6
BIOS Recovery
It is unlikely that anything will interrupt a BIOS update; however, if an interruption
occurs, the BIOS could be damaged. Table 21 lists the drives and media types that
can and cannot be used for BIOS recovery. The BIOS recovery media does not need to
be made bootable.
Table 21. Acceptable Drives/Media Types for BIOS Recovery
Media Type (Note)
Can be used for BIOS recovery?
Hard disk drive (connected to SATA or USB)
Yes
CD/DVD drive (connected to SATA or USB)
Yes
USB flash drive
Yes
USB diskette drive (with a 1.4 MB diskette)
No (BIOS update file is bigger than 1.4 MB size limit)
NOTE
Supported file systems for BIOS recovery:
•
•
•
•
•
58
NTFS (sparse, compressed, or encrypted files are not supported)
FAT32
FAT16
FAT12
ISO 9660
For information about
Refer to
BIOS recovery
http://www.intel.com/support/motherboards/desktop/sb/cs-023360.htm
Error Messages and Beep Codes
3.7
Boot Options
In the BIOS Setup program, the user can choose to boot from a hard drive, optical
drive, removable drive, or the network. The default setting is for the optical drive to
be the first boot device, the hard drive second, removable drive third, and the network
fourth.
3.7.1
Network Boot
The network can be selected as a boot device. This selection allows booting from the
onboard LAN or a network add-in card with a remote boot ROM installed.
Pressing the <F12> key during POST automatically forces booting from the LAN. To
use this key during POST, the User Access Level in the BIOS Setup program's Security
menu must be set to Full.
3.7.2
Booting Without Attached Devices
For use in embedded applications, the BIOS has been designed so that after passing
the POST, the operating system loader is invoked even if the following devices are not
present:
•
•
•
Video adapter
Keyboard
Mouse
3.7.3
Changing the Default Boot Device During POST
Pressing the <F10> key during POST causes a boot device menu to be displayed. This
menu displays the list of available boot devices. Table 22 lists the boot device menu
options.
Table 22. Boot Device Menu Options
Boot Device Menu Function Keys
Description
<↑> or <↓>
Selects a default boot device
<Enter>
Exits the menu, and boots from the selected device
<Esc>
Exits the menu and boots according to the boot priority
defined through BIOS setup
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Intel Desktop Board DCP847SKE Technical Product Specification
3.8
Hard Disk Drive Password Security Feature
The Hard Disk Drive Password Security feature blocks read and write accesses to the
hard disk drive until the correct password is given. Hard Disk Drive Passwords are set
in BIOS SETUP and are prompted for during BIOS POST. For convenient support of S3
resume, the system BIOS will automatically unlock drives on resume from S3.
The User hard disk drive password, when installed, will be required upon each powercycle until the Master Key or User hard disk drive password is submitted.
The Master Key hard disk drive password, when installed, will not lock the drive. The
Master Key hard disk drive password exists as an unlock override in the event that the
User hard disk drive password is forgotten. Only the installation of the User hard disk
drive password will cause a hard disk to be locked upon a system power-cycle.
Table 23 shows the effects of setting the Hard Disk Drive Passwords.
Table 23. Master Key and User Hard Drive Password Functions
Password Set
Password During Boot
Neither
None
Master only
None
User only
User only
Master and User Set
Master or User
During every POST, if a User hard disk drive password is set, POST execution will
pause with the following prompt to force the user to enter the Master Key or User hard
disk drive password:
Enter Hard Disk Drive Password:
Upon successful entry of the Master Key or User hard disk drive password, the system
will continue with normal POST.
If the hard disk drive password is not correctly entered, the system will go back to the
above prompt. The user will have three attempts to correctly enter the hard disk drive
password. After the third unsuccessful hard disk drive password attempt, the system
will halt with the message:
Hard Disk Drive Password Entry Error
A manual power cycle will be required to resume system operation.
NOTE
As implemented on DCP847SKE, Hard Disk Drive Password Security is only supported
on SATA port 0. The passwords are stored on the hard disk drive so if the drive is
relocated to another computer that does not support Hard Disk Drive Password
Security feature, the drive will not be accessible.
60
Error Messages and Beep Codes
3.9
BIOS Security Features
The BIOS includes security features that restrict access to the BIOS Setup program
and who can boot the computer. A supervisor password and a user password can be
set for the BIOS Setup program and for booting the computer, with the following
restrictions:
•
•
•
•
•
•
•
•
The supervisor password gives unrestricted access to view and change all the Setup
options in the BIOS Setup program. This is the supervisor mode.
The user password gives restricted access to view and change Setup options in the
BIOS Setup program. This is the user mode.
If only the supervisor password is set, pressing the <Enter> key at the password
prompt of the BIOS Setup program allows the user restricted access to Setup.
If both the supervisor and user passwords are set, users can enter either the
supervisor password or the user password to access Setup. Users have access to
Setup respective to which password is entered.
Setting the user password restricts who can boot the computer. The password
prompt will be displayed before the computer is booted. If only the supervisor
password is set, the computer boots without asking for a password. If both
passwords are set, the user can enter either password to boot the computer.
For enhanced security, use different passwords for the supervisor and user
passwords.
Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to
16 characters in length.
To clear a set password, enter a blank password after entering the existing
password.
Table 24 shows the effects of setting the supervisor password and user password. This
table is for reference only and is not displayed on the screen.
Table 24. Supervisor and User Password Functions
Setup Options
Password
to Enter
Setup
Password
During
Boot
None
None
None
Can change a
limited
number of
options
Supervisor Password
Supervisor
None
N/A
Can change all
options
Enter Password
Clear User Password
User
User
Can change all
options
Can change a
limited
number of
options
Supervisor Password
Enter Password
Supervisor or
user
Supervisor or
user
Password
Set
Supervisor
Mode
User Mode
Neither
Can change all
options (Note)
Can change all
options (Note)
Supervisor
only
Can change all
options
User only
Supervisor
and user set
Note:
If no password is set, any user can change all Setup options.
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Intel Desktop Board DCP847SKE Technical Product Specification
62
4
Error Messages and Blink Codes
4.1
Front-panel Power LED Blink Codes
Whenever a recoverable error occurs during POST, the BIOS causes the board’s front
panel power LED to blink an error message describing the problem (see Table 25).
Table 25. Front-panel Power LED Blink Codes
Type
Pattern
Note
BIOS update in progress Off when the update begins, then on for
0.5 seconds, then off for 0.5 seconds. The
pattern repeats until the BIOS update is
complete.
Video error
(Note)
On-off (1.0 second each) two times, then
2.5-second pause (off), entire pattern repeats
(blink and pause) until the system is powered
off.
Memory error
On-off (1.0 second each) three times, then
2.5-second pause (off), entire pattern repeats
(blinks and pause) until the system is powered
off.
Thermal trip warning
Each beep will be accompanied by the following
blink pattern: .25 seconds on, .25 seconds off,
.25 seconds on, .25 seconds off. This will result
in a total of 16 blinks.
When no VGA option ROM is
found.
Note: Disabled per default BIOS setup option.
4.2
BIOS Error Messages
Table 26 lists the error messages and provides a brief description of each.
Table 26. BIOS Error Messages
Error Message
Explanation
CMOS Battery Low
The battery may be losing power. Replace the battery soon.
CMOS Checksum Bad
The CMOS checksum is incorrect. CMOS memory may have
been corrupted. Run Setup to reset values.
Memory Size Decreased
Memory size has decreased since the last boot. If no memory
was removed, then memory may be bad.
No Boot Device Available
System did not find a device to boot.
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Intel Desktop Board DCP847SKE Technical Product Specification
4.3
Port 80h POST Codes
During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O
port 80h. If the POST fails, execution stops and the last POST code generated is left at
port 80h. This code is useful for determining the point where an error occurred.
Displaying the POST codes requires a POST card that can interface with the Debug
header. Refer to the location of the Debug header in Figure 1.
The following tables provide information about the POST codes generated by the BIOS:
•
•
•
Table 27 lists the Port 80h POST code ranges
Table 28 lists the Port 80h POST codes themselves
Table 29 lists the Port 80h POST sequence
NOTE
In the tables listed above, all POST codes and range values are listed in hexadecimal.
Table 27. Port 80h POST Code Ranges
Range
64
Subsystem
0x00 – 0x05
Entering SX states S0 to S5.
0x10, 0x20, 0x30,
0x40, 0x50
Resuming from SX states (0x10 –0x20 – S2, 0x30 – S3, etc.)
0x01 – 0x0F
Security (SEC) phase
0x11 – 0x1F
PEI phase pre MRC execution
0x21 – 0x29
MRC memory detection
0x2A – 0x2F
PEI phase post MRC execution
0x31 – 0x35
Recovery
0x36 – 0x3F
Platform DXE driver
0x41 – 0x4F
CPU Initialization (PEI, DXE, SMM)
0x50 – 0x5F
I/O Buses: PCI, USB, ATA etc. 0x5F is an unrecoverable error. Start with PCI.
0x60 – 0x6F
BDS
0x70 – 0x7F
Output devices: All output consoles.
0x80 – 0x8F
For future use
0x90 – 0x9F
Input devices: Keyboard/Mouse.
0xA0 – 0xAF
For future use
0xB0 – 0xBF
Boot Devices: Includes fixed media and removable media. Not that critical since
consoles should be up at this point.
0xC0 – 0xCF
For future use
0xD0 – 0xDF
For future use
Error Messages and Beep Codes
Table 28. Port 80h POST Codes
Port 80 Code
Progress Code Enumeration
0x00,0x01,0x02,0x03,0x04,0x05
Entering S0, S2, S3, S4, or S5 state
0x10,0x20,0x30,0x40,0x50
Resuming from S2, S3, S4, or S5 state
0x08
Starting BIOS execution after CPU BIST
0x09
SPI prefetching and caching
0x0A
Load BSP microcode
0x0B
Load APs microcode
0x0C
Platform program baseaddresses
ACPI S States
Security Phase (SEC)
0x0D
Wake Up All APs
0x0E
Initialize NEM
0x0F
Pass entry point of the PEI core
PEI before MRC
PEI Platform driver
0x11
Set bootmode, GPIO init
0x12
Early chipset register programming including graphics init
0x13
Basic PCH init, discrete device init (IEEE 1394, SATA)
0x14
LAN init
0x15
Exit early platform init driver
0x16
SMBUSriver init
0x17
Entry to SMBUS execute read/write
0x18
Exit SMBUS execute read/write
PEI SMBUS
Memory
0x21
MRC entry point
0x22
Reading SPD from memory DIMMs
0x23
Detecting presence of memory DIMMs
0x25
Configuring memory
0x28
Testing memory
0x29
Exit MRC driver
0x2A
Start to Program MTRR Settings
0x2B
Done Programming MTRR Settings
PEI after MRC
continued
65
Intel Desktop Board DCP847SKE Technical Product Specification
Table 28. Port 80h POST Codes (continued)
Port 80 Code
Progress Code Enumeration
0x31
Crisis Recovery has initiated
0x34
Loading recovery capsule
0x35
Start recovery capsule / valid capsule is found
PEIMs/Recovery
CPU Initialization
CPU PEI Phase
0x41
Begin CPU PEI Init
0x42
XMM instruction enabling
0x43
End CPU PEI Init
0x44
Begin CPU SMM Init smm relocate bases
0x45
Smm relocate bases for APs
0x46
End CPU SMM Init
CPU PEI SMM Phase
CPU DXE Phase
0x47
CPU DXE Phase begin
0x48
Refresh memory space attributes according to MTRRs
0x49
Load the microcode if needed
0x4A
Initialize strings to HII database
0x4B
Initialize MP support
0x4C
CPU DXE Phase End
CPU DXE SMM Phase
0x4D
CPU DXE SMM Phase begin
0x4E
Relocate SM bases for all APs
0x4F
CPU DXE SMM Phase end
I/O BUSES
0x50
Enumerating PCI buses
0x51
Allocating resources to PCI bus
0x52
Hot Plug PCI controller initialization
USB
0x58
Resetting USB bus
0x59
Reserved for USB
ATA/ATAPI/SATA
0x5A
Resetting PATA/SATA bus and all devices
0x5B
Reserved for ATA
continued
66
Error Messages and Beep Codes
Table 28. Port 80h POST Codes (continued)
Port 80 Code
Progress Code Enumeration
0x60
BDS driver entry point initialize
0x61
BDS service routine entry point (can be called multiple times)
0x62
BDS Step2
0x63
BDS Step3
0x64
BDS Step4
0x65
BDS Step5
0x66
BDS Step6
0x67
BDS Step7
0x68
BDS Step8
0x69
BDS Step9
0x6A
BDS Step10
0x6B
BDS Step11
0x6C
BDS Step12
BDS
0x6D
BDS Step13
0x6E
BDS Step14
0x6F
BDS return to DXE core (should not get here)
0x90
Resetting keyboard
0x91
Disabling the keyboard
0x92
Detecting the presence of the keyboard
0x93
Enabling the keyboard
0x94
Clearing keyboard input buffer
0x95
Instructing keyboard controller to run Self Test (PS/2 only)
Keyboard (PS/2 or USB)
Mouse (PS/2 or USB)
0x98
Resetting mouse
0x99
Detecting mouse
0x9B
Enabling mouse
Detecting presence of mouse
Fixed Media
0xB0
Resetting fixed media
0xB1
Disabling fixed media
0xB2
Detecting presence of a fixed media (IDE hard drive detection etc.)
0xB3
Enabling/configuring a fixed media
continued
67
Intel Desktop Board DCP847SKE Technical Product Specification
Table 28. Port 80h POST Codes (continued)
Port 80 Code
Progress Code Enumeration
0xB8
Resetting removable media
0xB9
Disabling removable media
0xBA
Detecting presence of a removable media (IDE, CDROM detection
etc.)
0xBC
Enabling/configuring a removable media
0xE4
Entered DXE phase
Removable Media
DXE Core
BDS
0xE7
Waiting for user input
0xE8
Checking password
0xE9
Entering BIOS setup
0xEB
Calling Legacy Option ROMs
Runtime Phase/EFI OS Boot
68
0xF8
EFI boot service ExitBootServices ( ) has been called
0xF9
EFI runtime service SetVirtualAddressMap ( ) has been called
Error Messages and Beep Codes
Table 29. Typical Port 80h POST Sequence
POST Code
Description
21
Initializing a chipset component
22
Reading SPD from memory DIMMs
23
Detecting presence of memory DIMMs
25
Configuring memory
28
Testing memory
34
Loading recovery capsule
E4
Entered DXE phase
12
Starting application processor initialization
13
SMM initialization
50
Enumerating PCI buses
51
Allocating resourced to PCI bus
92
Detecting the presence of the keyboard
90
Resetting keyboard
94
Clearing keyboard input buffer
95
Keyboard Self Test
EB
Calling Video BIOS
58
Resetting USB bus
5A
Resetting PATA/SATA bus and all devices
92
Detecting the presence of the keyboard
90
Resetting keyboard
94
Clearing keyboard input buffer
5A
Resetting PATA/SATA bus and all devices
28
Testing memory
90
Resetting keyboard
94
Clearing keyboard input buffer
E7
Waiting for user input
01
INT 19
00
Ready to boot
69
Intel Desktop Board DCP847SKE Technical Product Specification
70
5
Regulatory Compliance and Battery
Disposal Information
5.1
Regulatory Compliance
This section contains the following regulatory compliance information for Intel Next
Unit of Computing Board DCP847SKE:
•
•
•
•
•
5.1.1
Safety standards
European Union Declaration of Conformity statement
Product Ecology statements
Electromagnetic Compatibility (EMC) standards
Product certification markings
Safety Standards
Intel Next Unit of Computing Board DCP847SKE complies with the safety standards
stated in Table 30 when correctly installed in a compatible host system.
Table 30. Safety Standards
Standard
Title
CSA/UL 60950-1
Information Technology Equipment – Safety - Part 1: General
Requirements (USA and Canada)
EN 60950-1
Information Technology Equipment – Safety - Part 1: General
Requirements (European Union)
IEC 60950-1
Information Technology Equipment – Safety - Part 1: General
Requirements (International)
71
Intel Desktop Board DCP847SKE Technical Product Specification
5.1.2
European Union Declaration of Conformity
Statement
We, Intel Corporation, declare under our sole responsibility that the products Intel®
Next Unit of Computing Board DCP847SKE is in conformity with all applicable essential
requirements necessary for CE marking, following the provisions of the European
Council Directive 2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive),
and 2002/95/EC (ROHS Directive).
The product is properly CE marked demonstrating this conformity and is for
distribution within all member states of the EU with no restrictions.
This product follows the provisions of the European Directives 2004/108/EC,
2006/95/EC, and 2002/95/EC.
Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC,
2006/95/EC a 2002/95/EC.
Dansk Dette produkt er i overensstemmelse med det europæiske direktiv
2004/108/EC, 2006/95/EC & 2002/95/EC.
Dutch Dit product is in navolging van de bepalingen van Europees Directief
2004/108/EC, 2006/95/EC & 2002/95/EC.
Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC, ja 2006/95/EC ja
2002/95/EC kehtestatud nõuetele.
Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC, 2006/95/EC & 2002/95/EC
määräyksiä.
Français Ce produit est conforme aux exigences de la Directive Européenne
2004/108/EC, 2006/95/EC & 2002/95/EC.
Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie
2004/108/EC, 2006/95/EC & 2002/95/EC.
Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών
2004/108/EC, 2006/95/EC και 2002/95/EC.
Magyar E termék megfelel a 2004/108/EC, 2006/95/EC és 2002/95/EC Európai
Irányelv előírásainak.
Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer
2004/108/EC, 2006/95/EC, & 2002/95/EC.
Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC,
2006/95/EC & 2002/95/EC.
Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC, 2006/95/EC un
2002/95/EC noteikumiem.
Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC, 2006/95/EC, ir
2002/95/EC nuostatas.
Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej
2004/108/EC, 2006/95/EC u 2002/95/EC.
Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet
2004/108/EC, 2006/95/EC & 2002/95/EC.
Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej
2004/108/EC, 206/95/EC i 2002/95/EC.
72
Regulatory Compliance and Battery Disposal Information
Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC,
2006/95/EC & 2002/95/EC.
Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC,
2006/95/EC & 2002/95/EC.
Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív
2004/108/EC, 2006/95/EC a 2002/95/EC.
Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC,
2006/95/EC in 2002/95/EC.
Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC,
2006/95/EC & 2002/95/EC.
Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC, 2006/95/EC ve 2002/95/EC
yönergelerine uyar.
5.1.3
Product Ecology Statements
The following information is provided to address worldwide product ecology concerns
and regulations.
5.1.3.1
Disposal Considerations
This product contains the following materials that may be regulated upon disposal:
lead solder on the printed wiring board assembly.
5.1.3.2
Recycling Considerations
As part of its commitment to environmental responsibility, Intel has implemented the
Intel Product Recycling Program to allow retail consumers of Intel’s branded products
to return used products to selected locations for proper recycling.
Please consult the http://www.intel.com/intel/other/ehs/product_ecology for the
details of this program, including the scope of covered products, available locations,
shipping instructions, terms and conditions, etc.
中文
作为其对环境责任之承诺的部分，英特尔已实施 Intel Product Recycling Program
（英特尔产品回收计划），以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作恰
当的重复使用处理。
请参考http://www.intel.com/intel/other/ehs/product_ecology
了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。
Deutsch
Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel
Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel
Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für
ordnungsgemäßes Recycling zurückzugeben.
Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte,
verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der
http://www.intel.com/intel/other/ehs/product_ecology
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Intel Desktop Board DCP847SKE Technical Product Specification
Español
Como parte de su compromiso de responsabilidad medioambiental, Intel ha
implantado el programa de reciclaje de productos Intel, que permite que los
consumidores al detalle de los productos Intel devuelvan los productos usados en los
lugares seleccionados para su correspondiente reciclado.
Consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles
del programa, que incluye los productos que abarca, los lugares disponibles,
instrucciones de envío, términos y condiciones, etc.
Français
Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis
en œuvre le programme Intel Product Recycling Program (Programme de recyclage des
produits Intel) pour permettre aux consommateurs de produits Intel de recycler les
produits usés en les retournant à des adresses spécifiées.
Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology pour en
savoir plus sur ce programme, à savoir les produits concernés, les adresses
disponibles, les instructions d'expédition, les conditions générales, etc.
日本語
インテルでは、環境保護活動の一環として、使い終えたインテル
ブランド製品を指定の場所へ返送していただき、リサイクルを適切に行えるよう、インテル製品リサイクル
プログラムを発足させました。
対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、http://www.intel.com/in
tel/other/ehs/product_ecology （英語）をご覧ください。
Malay
Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran,
Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan
pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke
lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.
Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan
butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi
tersedia, arahan penghantaran, terma & syarat, dsb.
Portuguese
Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o
Programa de Reciclagem de Produtos para que os consumidores finais possam enviar
produtos Intel usados para locais selecionados, onde esses produtos são reciclados de
maneira adequada.
Consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em Inglês)
para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos,
os locais disponíveis, as instruções de envio, os termos e condições, etc.
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Regulatory Compliance and Battery Disposal Information
Russian
В качестве части своих обязательств к окружающей среде, в Intel создана
программа утилизации продукции Intel (Product Recycling Program) для
предоставления конечным пользователям марок продукции Intel возможности
возврата используемой продукции в специализированные пункты для должной
утилизации.
Пожалуйста, обратитесь на веб-сайт
http://www.intel.com/intel/other/ehs/product_ecology за информацией об этой
программе, принимаемых продуктах, местах приема, инструкциях об отправке,
положениях и условиях и т.д.
Türkçe
Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin
Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri
dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya
koymuştur.
Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve
şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen
http://www.intel.com/intel/other/ehs/product_ecology
Web sayfasına gidin.
5.1.4
EMC Regulations
Intel Next Unit of Computing Board DCP847SKE complies with the EMC regulations
stated in Table 31 when correctly installed in a compatible host system.
Table 31. EMC Regulations
Regulation
Title
FCC 47 CFR Part 15,
Subpart B
Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Radio
Frequency Devices. (USA)
ICES-003
Interference-Causing Equipment Standard, Digital Apparatus. (Canada)
EN55022
Limits and methods of measurement of Radio Interference Characteristics
of Information Technology Equipment. (European Union)
EN55024
Information Technology Equipment – Immunity Characteristics Limits and
methods of measurement. (European Union)
EN55022
Australian Communications Authority, Standard for Electromagnetic
Compatibility. (Australia and New Zealand)
CISPR 22
Limits and methods of measurement of Radio Disturbance Characteristics
of Information Technology Equipment. (International)
CISPR 24
Information Technology Equipment – Immunity Characteristics – Limits
and Methods of Measurement. (International)
VCCI V-3, V-4
Voluntary Control for Interference by Information Technology Equipment.
(Japan)
KN-22, KN-24
Korean Communications Commission – Framework Act on
Telecommunications and Radio Waves Act (South Korea)
CNS 13438
Bureau of Standards, Metrology, and Inspection (Taiwan)
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Intel Desktop Board DCP847SKE Technical Product Specification
FCC Declaration of Conformity
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) this device may not cause harmful interference, and (2)
this device must accept any interference received, including interference that may
cause undesired operation.
For questions related to the EMC performance of this product, contact:
Intel Corporation, 5200 N.E. Elam Young Parkway, Hillsboro, OR 97124
1-800-628-8686
This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference in a residential installation.
This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not
occur in a particular installation. If this equipment does cause harmful interference to
radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one or more of the
following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and the receiver.
Connect the equipment to an outlet on a circuit other than the one to which the
receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications to the equipment not expressly approved by Intel
Corporation could void the user’s authority to operate the equipment.
Tested to comply with FCC standards for home or office use.
Canadian Department of Communications Compliance Statement
This digital apparatus does not exceed the Class B limits for radio noise emissions from
digital apparatus set out in the Radio Interference Regulations of the Canadian
Department of Communications.
Le présent appareil numerique német pas de bruits radioélectriques dépassant les
limites applicables aux appareils numériques de la classe B prescrites dans le
Réglement sur le broullage radioélectrique édicté par le ministére des Communications
du Canada.
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Regulatory Compliance and Battery Disposal Information
Japan VCCI Statement
Japan VCCI Statement translation: This is a Class B product based on the standard of
the Voluntary Control Council for Interference from Information Technology Equipment
(VCCI). If this is used near a radio or television receiver in a domestic environment, it
may cause radio interference. Install and use the equipment according to the
instruction manual.
Korea Class B Statement
Korea Class B Statement translation: This equipment is for home use, and has
acquired electromagnetic conformity registration, so it can be used not only in
residential areas, but also other areas.
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Intel Desktop Board DCP847SKE Technical Product Specification
5.1.5
ENERGY STAR* 5.2, e-Standby, and ErP
Compliance
The US Department of Energy and the US Environmental Protection Agency have
continually revised the ENERGY STAR requirements. Intel has worked directly with
these two governmental agencies in the definition of new requirements.
Intel Next Unit of Computing Board DCP847SKE meets the following program
requirements in an adequate system configuration, including appropriate selection of
an efficient power supply:
•
•
•
•
Energy Star v5.2, category B
EPEAT*
Korea e-Standby
European Union Energy-related Products Directive 2013 (ErP) Lot 6
NOTE
Energy Star compliance is based at the system level not the board level. Use of an
Intel Next Unit of Computing Board alone does not guarantee Energy Star compliance.
78
For information about
Refer to
ENERGY STAR requirements and recommended configurations
http://www.intel.com/go/energystar
Electronic Product Environmental Assessment Tool (EPEAT)
http://www.epeat.net/
Korea e-Standby Program
http://www.kemco.or.kr/new_eng/pg02
/pg02100300.asp
European Union Energy-related Products Directive 2009 (ErP)
http://ec.europa.eu/enterprise/policies/s
ustainable-business/sustainableproduct-policy/ecodesign/index_en.htm
Regulatory Compliance and Battery Disposal Information
5.1.6
Regulatory Compliance Marks (Board Level)
Intel Next Unit of Computing Board DCP847SKE has the regulatory compliance marks
shown in Table 32.
Table 32. Regulatory Compliance Marks
Description
Mark
UL joint US/Canada Recognized Component mark. Includes adjacent UL file
number for Intel Next Unit of Computing Boards: E210882.
FCC Declaration of Conformity logo mark for Class B equipment.
CE mark. Declaring compliance to the European Union (EU) EMC directive,
Low Voltage directive, and RoHS directive.
Australian Communications Authority (ACA) and New Zealand Radio
Spectrum Management (NZ RSM) C-tick mark. Includes adjacent Intel
supplier code number, N-232.
Japan VCCI (Voluntary Control Council for Interference) mark.
Korea Certification mark. Includes an adjacent KCC (Korean
Communications Commission) certification number:
KCC-REM-CPU-DCP847SKE.
Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark.
Includes adjacent Intel company number, D33025.
Printed wiring board manufacturer’s recognition mark. Consists of a unique
UL recognized manufacturer’s logo, along with a flammability rating (solder
side).
V-0
China RoHS/Environmentally Friendly Use Period Logo: This is an example of
the symbol used on Intel Next Unit of Computing Boards and associated
collateral. The color of the mark may vary depending upon the application.
The Environmental Friendly Usage Period (EFUP) for Intel Next Unit of
Computing Boards has been determined to be 10 years.
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Intel Desktop Board DCP847SKE Technical Product Specification
5.2
Battery Disposal Information
CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be
recycled where possible. Disposal of used batteries must be in accordance with local
environmental regulations.
PRÉCAUTION
Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les
piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des
piles usagées doit respecter les réglementations locales en vigueur en matière de
protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier bør
om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i overensstemmelse
med gældende miljølovgivning.
OBS!
Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier
bør kastes i henhold til gjeldende miljølovgivning.
VIKTIGT!
Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras
enligt de lokala miljövårdsbestämmelserna.
VARO
Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on
mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten
mukaisesti.
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie
darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen
Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des
Herstellers entsprechend.
AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.
Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per
disfarsi delle pile usate, seguire le istruzioni del produttore.
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Regulatory Compliance and Battery Disposal Information
PRECAUCIÓN
Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice
solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del
equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del
fabricante.
WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type
batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het
weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.
ATENÇÃO
Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto.
As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias
usadas deve ser feita de acordo com as regulamentações ambientais da região.
AŚCIAROŽZNAŚĆ
Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу.
Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых
акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.
UPOZORNÌNÍ
V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné,
baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními
předpisy o životním prostředí.
Προσοχή
Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία
λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι
δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με
τους κατά τόπο περιβαλλοντικούς κανονισμούς.
VIGYÁZAT
Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket
lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi
előírásoknak megfelelően kell kiselejtezni.
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Intel Desktop Board DCP847SKE Technical Product Specification
AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri
sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi
peraturan alam sekitar tempatan.
OSTRZEŻENIE
Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu
baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi
przepisami ochrony środowiska.
PRECAUŢIE
Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător.
Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să
respecte reglementările locale privind protecţia mediului.
ВНИМАНИЕ
При использовании батареи несоответствующего типа существует риск ее взрыва.
Батареи должны быть утилизированы по возможности. Утилизация батарей должна
проводится по правилам, соответствующим местным требованиям.
UPOZORNENIE
Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu.
Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí
vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia.
POZOR
Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo.
Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi
okoljevarstvenimi predpisi.
UYARI
Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri
dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.
OСТОРОГА
Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху.
Якщо можливо, використані батареї слід утилізувати. Утилізація використаних
батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.
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Regulatory Compliance and Battery Disposal Information
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Intel Desktop Board DCP847SKE Technical Product Specification
84