DATA SHEET Part No. AN26102A Package Code No. ALGA011-W-0912ANB Publication date: May 2012 Ver. AEB 1 AN26102A Contents Overview ………………………………………………….…………………………………………………………. 3 Features ………………………………………………….…………………………………………………………. 3 Applications ……………………………………………….…………………………………………………………. 3 Package ………………………………………………….…………………………………………………………. 3 Type ……………………………………………………….…………………………………………………………. 3 Application Circuit Example (Block Diagram) ………….…………….…………………………………………. 4 Pin Descriptions ………………………………………….…………………………………………………………. Absolute Maximum Ratings 5 …………………………………………….………………………………………. 6 Operating Supply Voltage Range …………………………………….…………………………………………. 6 Allowable Current and Voltage Range ………………………………….………………………………………. 7 Electrical Characteristics …………………………………………………………………………………………. 8 Control Pin Mode Table …………………………….……………………………………………………………. 10 Truth Table ………………………………………………….……………………………………………………… 10 Technical Data ……………………………………………….……………………………………………………. 11 y I/O block circuit diagram and pin function descriptions …….…………………………………………………. 11 y PD ⎯ Ta diagram ………………………………………………………………………………………………… 13 Usage Notes ……….………………………………………………………………………………………………. 14 Ver. AEB 2 AN26102A AN26102A SiGe Linear Power Amplifier for 2.4 GHz Band Applications Overview y AN26102A is Power amplifier IC for 2.4 GHz band (2 400 MHz to 2 500 MHz) applications. y Realizing high performance by using 0.25 μm Bi-CMOS process (fT = 50 GHz, fmax = 60 GHz). y Achieving miniaturization by using chip size package. Features y Operating voltage VCC = PAVCC = +3.30 V typ. y Low current consumption 145 mA typ. @Pout = +18 dBm y High gain 30 dB typ. @fTX = 2450 MHz, Pout = +18 dBm y Chip size package (11-pin WLCSP) Applications y 2.4 GHz band (2 400 MHz to 2 500 MHz) applications Package y 11 pin Wafer Level Chip Size Package (WLCSP) Size : 1.16 mm × 0.86 mm (0.3mm pitch) Type y Bi-CMOS IC Ver. AEB 3 AN26102A Application Circuit Example (Block Diagram) VCC PAVCC VEN Cp2 *L1 Cp3 R1 IN C4 C3 C2 C1 50 Ω PAIN VCC VEN PAOUT B4 B3 B1 VDET GND GND A4 A3 A2 A1 PAVCC1 GND PAVCC2 GND VDET Cp1 Cp6 PAVCC *L2 OUT Cp4 50 Ω Cp5 PAVCC Notes) y This application circuit is an example. The operation of mass production set is not guaranteed. You should perform enough evaluation and verification on the design of mass production set. You are fully responsible for the incorporation of the above application circuit and information in the design of your equipment. y This block diagram is for explaining functions. The part of the block diagram may be omitted, or it may be simplified. y *L1, *L2 is a substrate pattern L. Ver. AEB 4 AN26102A Pin Descriptions Pin No. Pin name Type Ground Description A1 GND A2 PAVCC2 A3 GND A4 PAVCC1 B1 GND Ground GND B3 GND Ground GND B4 VDET Output Power detector output C1 PAOUT Output RF output , 3rd stage amplifier collector supply C2 VEN Input Bias circuit control C3 VCC Power Supply Bias circuit supply C4 PAIN Input Power Supply Ground Power Supply GND 2nd stage amplifier collector supply GND 1st stage amplifier collector supply RF input, DC block required Ver. AEB 5 AN26102A Absolute Maximum Ratings Note) Absolute maximum ratings are limit values which do not result in damages to this IC, and IC operation is not guaranteed at these limit values. A No. Parameter Symbol Rating Unit Notes VCC 4.5 V *1 PAVCC 4.5 V *1 1 Supply voltage 2 Supply current ICC 300 mA *1 3 Power dissipation PD 50 mW *2 4 Operating ambient temperature Topr –30 to +85 °C *3 5 Storage temperature Tstg –40 to +150 °C *3 Notes) *1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. *2 : The power dissipation shown is the value at Ta = 85°C for the independent (unmounted) IC package without a heat sink. When using this IC, refer to the y PD – Ta diagram in the Technical Data and design the heat radiation with sufficient margin so that the allowable value might not be exceeded based on the conditions of power supply voltage, load, and ambient temperature. *3 : Except for the power dissipation, operating ambient temperature, and storage temperature, all ratings are for Ta = 25°C. Operating Supply Voltage Range Parameter Supply voltage range Note) Symbol Range Unit Notes VCC 2.95 to 4.20 V *1 PAVCC 2.95 to 4.20 V *1 *1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. Ver. AEB 6 AN26102A Allowable Current and Voltage Range Notes) y Allowable current and voltage ranges are limit ranges which do not result in damages to this IC, and IC operation is not guaranteed within these limit ranges. y Voltage values, unless otherwise specified, are with respect to GND. y PAVCC is voltage for PAVCC1, PAVCC2, PAOUT y Do not apply external currents or voltages to any pin not specifically mentioned. Pin No. Pin name Range Unit Notes C2 VEN – 0.3 to 4.0 V — C1 PAOUT – 0.3 to PAVCC V *1 A4 PAVCC2 – 0.3 to PAVCC V — A2 PAVCC1 – 0.3 to PAVCC V — C4 PAIN — V *2 Notes) *1 : RF signal output pin. (Maximum output power is 23.5 dBm.) *2 : RF signal input pin. (Maximum input power is –2 dBm.) Do not apply DC current. Ver. AEB 7 AN26102A Electrical Characteristics at VEN = 2.85 V, VCC = PAVCC = 3.3 V Note) Unless otherwise specified, Ta = 25°C±2°C, ZS = ZL = 50 Ω. B No. Parameter Symbol Conditions Limits Min Typ Max Unit Notes DC electrical characteristics DC-1 Supply current (Active mode) ICCH Current at Active mode (No RF signal input) — 85 135 mA — DC-2 Supply current (Sleep mode) ICCL Current at Sleep mode (No RF signal input) — 20 30 µA — DC-3 SW voltage (Active mode) VIH VEN for Active mode 2.70 2.85 3.40 V — DC-4 SW voltage (Sleep mode) VIL VEN for Sleep mode — 0.0 0.30 V — IIH Current at VEN pin VIH = VEN — 1.5 3.5 mA — DC-5 SW current (Active mode) Ver. AEB 8 AN26102A Electrical Characteristics (continued) at VEN = 2.85 V, VCC = PAVCC = 3.3 V Note) Unless otherwise specified, Ta = 25°C±2°C, fTX = 2450 MHz, CW, ZS = ZL = 50 Ω. B No. Parameter Symbol Conditions Limits Min Typ Max Unit Notes Power amplifier AC electrical characteristics A-1 Operation current (Signal : CW) IDS Active mode, f = fTX, CW Pout = +18 dBm — 150 200 mA — A-2 Power gain (Signal : CW) GDS Active mode, f = fTX, CW Pout = +18 dBm 26 30 33.5 dB — A-3 2nd harmonics HF2S Active mode, f = fTX Pout = +18 dBm — –50 –40 dBc — A-4 DET output voltage (Pout = +18 dBm) DET1S Active mode, Pout = +18 dBm 0.3 0.43 0.495 V — A-5 DET output voltage (Pout = +22 dBm) DET2S Active mode, Pout = +22 dBm 0.485 0.58 0.72 V — A-6 Delta DET voltage DDET Active mode 0.02 0.15 0.22 V — Ver. AEB 9 AN26102A Control Pin Mode Table Note) See parameters B No. DC-3 / B No. DC-4 in the Electrical Characteristics for control voltage relation ranges. Pin No. Descriptions C3 Active/Sleep switching Voltage Low High Sleep Active Note — Truth Table Note) See parameters B No. DC-3 / B No. DC-4 in the Electrical Characteristics for control voltage relation ranges. CNT PA Mode High Active PA Active Low Sleep PA Sleep Ver. AEB 10 AN26102A Technical Data y I/O block circuit diagrams and pin function descriptions Note) The characteristics listed below are reference values based on the IC design and are not guaranteed. Pin No. Voltage Internal circuit A1 0.00 V — Descriptions GND VCC A2 3.30 V A2 2nd stage amplifier collector supply (PAVCC) GND A3 0.00 V — GND VCC A4 A4 3.30 V 1st stage amplifier collector supply (PAVCC) GND B1 0.00 V — GND B3 0.00 V — GND VCC B4 — B4 Power detector output GND Ver. AEB 11 AN26102A Technical Data (continued) y I/O block circuit diagrams and pin function descriptions (continued) Note) The characteristics listed below are reference values based on the IC design and are not guaranteed. Pin No. Voltage Internal Circuit Descriptions VCC C1 3.30 V C1 RF Output 3rd stage amplifier collector supply (PAVCC) GND VCC C2 Active/Sleep SW Input Less than 0.30 V : Sleep mode More than 2.70 V : Active mode C2 — GND C3 C3 Voltage supply (VCC) 3.30 V GND VCC C4 — PA input C4 GND Ver. AEB 12 AN26102A Technical Data (continued) y PD ⎯ Ta diagram Ver. AEB 13 AN26102A Usage Notes y Special attention and precaution in using 1. This IC is intended to be used for general electronic equipment [2.4 GHz Band Applications]. Consult our sales staff in advance for information on the following applications: x Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this IC may directly jeopardize life or harm the human body. x Any applications other than the standard applications intended. (1) Space appliance (such as artificial satellite, and rocket) (2) Traffic control equipment (such as for automobile, airplane, train, and ship) (3) Medical equipment for life support (4) Submarine transponder (5) Control equipment for power plant (6) Disaster prevention and security device (7) Weapon (8) Others : Applications of which reliability equivalent to (1) to (7) is required 2. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board), it might smoke or ignite. 3. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In addition, refer to the Pin Description for the pin configuration. 4. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as a solderbridge between the pins of the semiconductor device. Also, perform a full technical verification on the assembly quality, because the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the LSI during transportation. 5. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pinVCC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin short (load short) . And, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and smoke emission will depend on the current capability of the power supply. 6. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. 7. When using the LSI for new models, verify the safety including the long-term reliability for each product. 8. When the application system is designed by using this LSI, be sure to confirm notes in this book. Be sure to read the notes to descriptions and the usage notes in the book. 9. Due to unshielded structure of this IC, under exposure of light, function and characteristic of the product cannot be guaranteed. During normal operation or even under testing condition, please ensure that IC is not exposed to light. 10. Basically, chip surface is ground potential. Please design to ensure no contact between chip surface and metal shielding. Ver. AEB 14 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Panasonic: AN26102A-PR