PANASONICBATTERY AN26102A

DATA SHEET
Part No.
AN26102A
Package Code No.
ALGA011-W-0912ANB
Publication date: May 2012
Ver. AEB
1
AN26102A
Contents
„ Overview ………………………………………………….…………………………………………………………. 3
„ Features ………………………………………………….…………………………………………………………. 3
„ Applications ……………………………………………….…………………………………………………………. 3
„ Package ………………………………………………….…………………………………………………………. 3
„ Type ……………………………………………………….…………………………………………………………. 3
„ Application Circuit Example (Block Diagram) ………….…………….…………………………………………. 4
„ Pin Descriptions ………………………………………….………………………………………………………….
„ Absolute Maximum Ratings
5
…………………………………………….………………………………………. 6
„ Operating Supply Voltage Range
…………………………………….…………………………………………. 6
„ Allowable Current and Voltage Range ………………………………….………………………………………. 7
„ Electrical Characteristics …………………………………………………………………………………………. 8
„ Control Pin Mode Table
…………………………….……………………………………………………………. 10
„ Truth Table ………………………………………………….……………………………………………………… 10
„ Technical Data ……………………………………………….……………………………………………………. 11
y I/O block circuit diagram and pin function descriptions …….…………………………………………………. 11
y PD ⎯ Ta diagram
………………………………………………………………………………………………… 13
„ Usage Notes ……….………………………………………………………………………………………………. 14
Ver. AEB
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AN26102A
AN26102A
SiGe Linear Power Amplifier for 2.4 GHz Band Applications
„ Overview
y AN26102A is Power amplifier IC for 2.4 GHz band (2 400 MHz to 2 500 MHz) applications.
y Realizing high performance by using 0.25 μm Bi-CMOS process (fT = 50 GHz, fmax = 60 GHz).
y Achieving miniaturization by using chip size package.
„ Features
y Operating voltage
VCC = PAVCC = +3.30 V typ.
y Low current consumption 145 mA typ. @Pout = +18 dBm
y High gain
30 dB typ. @fTX = 2450 MHz, Pout = +18 dBm
y Chip size package (11-pin WLCSP)
„ Applications
y 2.4 GHz band (2 400 MHz to 2 500 MHz) applications
„ Package
y 11 pin Wafer Level Chip Size Package (WLCSP)
Size : 1.16 mm × 0.86 mm (0.3mm pitch)
„ Type
y Bi-CMOS IC
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AN26102A
„ Application Circuit Example (Block Diagram)
VCC
PAVCC
VEN
Cp2
*L1
Cp3
R1
IN
C4
C3
C2
C1
50 Ω
PAIN
VCC
VEN
PAOUT
B4
B3
B1
VDET
GND
GND
A4
A3
A2
A1
PAVCC1
GND
PAVCC2
GND
VDET
Cp1
Cp6
PAVCC
*L2
OUT
Cp4
50 Ω
Cp5
PAVCC
Notes) y This application circuit is an example. The operation of mass production set is not guaranteed. You should perform enough evaluation and
verification on the design of mass production set. You are fully responsible for the incorporation of the above application circuit and
information in the design of your equipment.
y This block diagram is for explaining functions. The part of the block diagram may be omitted, or it may be simplified.
y *L1, *L2 is a substrate pattern L.
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AN26102A
„ Pin Descriptions
Pin No.
Pin name
Type
Ground
Description
A1
GND
A2
PAVCC2
A3
GND
A4
PAVCC1
B1
GND
Ground
GND
B3
GND
Ground
GND
B4
VDET
Output
Power detector output
C1
PAOUT
Output
RF output , 3rd stage amplifier collector supply
C2
VEN
Input
Bias circuit control
C3
VCC
Power Supply
Bias circuit supply
C4
PAIN
Input
Power Supply
Ground
Power Supply
GND
2nd stage amplifier collector supply
GND
1st stage amplifier collector supply
RF input, DC block required
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AN26102A
„ Absolute Maximum Ratings
Note) Absolute maximum ratings are limit values which do not result in damages to this IC, and IC operation is not guaranteed at these limit values.
A No.
Parameter
Symbol
Rating
Unit
Notes
VCC
4.5
V
*1
PAVCC
4.5
V
*1
1
Supply voltage
2
Supply current
ICC
300
mA
*1
3
Power dissipation
PD
50
mW
*2
4
Operating ambient temperature
Topr
–30 to +85
°C
*3
5
Storage temperature
Tstg
–40 to +150
°C
*3
Notes) *1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
*2 : The power dissipation shown is the value at Ta = 85°C for the independent (unmounted) IC package without a heat sink.
When using this IC, refer to the y PD – Ta diagram in the „ Technical Data and design the heat radiation with sufficient margin so that the
allowable value might not be exceeded based on the conditions of power supply voltage, load, and ambient temperature.
*3 : Except for the power dissipation, operating ambient temperature, and storage temperature, all ratings are for Ta = 25°C.
„ Operating Supply Voltage Range
Parameter
Supply voltage range
Note)
Symbol
Range
Unit
Notes
VCC
2.95 to 4.20
V
*1
PAVCC
2.95 to 4.20
V
*1
*1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
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AN26102A
„ Allowable Current and Voltage Range
Notes) y Allowable current and voltage ranges are limit ranges which do not result in damages to this IC, and IC operation is not guaranteed within
these limit ranges.
y Voltage values, unless otherwise specified, are with respect to GND.
y PAVCC is voltage for PAVCC1, PAVCC2, PAOUT
y Do not apply external currents or voltages to any pin not specifically mentioned.
Pin No. Pin name
Range
Unit
Notes
C2
VEN
– 0.3 to 4.0
V
—
C1
PAOUT
– 0.3 to PAVCC
V
*1
A4
PAVCC2
– 0.3 to PAVCC
V
—
A2
PAVCC1
– 0.3 to PAVCC
V
—
C4
PAIN
—
V
*2
Notes) *1 : RF signal output pin. (Maximum output power is 23.5 dBm.)
*2 : RF signal input pin. (Maximum input power is –2 dBm.) Do not apply DC current.
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AN26102A
„ Electrical Characteristics at VEN = 2.85 V, VCC = PAVCC = 3.3 V
Note) Unless otherwise specified, Ta = 25°C±2°C, ZS = ZL = 50 Ω.
B No.
Parameter
Symbol
Conditions
Limits
Min
Typ
Max
Unit
Notes
DC electrical characteristics
DC-1 Supply current (Active mode)
ICCH
Current at Active mode
(No RF signal input)
—
85
135
mA
—
DC-2 Supply current (Sleep mode)
ICCL
Current at Sleep mode
(No RF signal input)
—
20
30
µA
—
DC-3
SW voltage
(Active mode)
VIH
VEN for Active mode
2.70
2.85
3.40
V
—
DC-4
SW voltage
(Sleep mode)
VIL
VEN for Sleep mode
—
0.0
0.30
V
—
IIH
Current at VEN pin
VIH = VEN
—
1.5
3.5
mA
—
DC-5 SW current (Active mode)
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AN26102A
„ Electrical Characteristics (continued) at VEN = 2.85 V, VCC = PAVCC = 3.3 V
Note) Unless otherwise specified, Ta = 25°C±2°C, fTX = 2450 MHz, CW, ZS = ZL = 50 Ω.
B No.
Parameter
Symbol
Conditions
Limits
Min
Typ
Max
Unit
Notes
Power amplifier AC electrical characteristics
A-1
Operation current
(Signal : CW)
IDS
Active mode,
f = fTX, CW
Pout = +18 dBm
—
150
200
mA
—
A-2
Power gain
(Signal : CW)
GDS
Active mode,
f = fTX, CW
Pout = +18 dBm
26
30
33.5
dB
—
A-3
2nd harmonics
HF2S
Active mode,
f = fTX
Pout = +18 dBm
—
–50
–40
dBc
—
A-4
DET output voltage
(Pout = +18 dBm)
DET1S
Active mode,
Pout = +18 dBm
0.3
0.43
0.495
V
—
A-5
DET output voltage
(Pout = +22 dBm)
DET2S
Active mode,
Pout = +22 dBm
0.485
0.58
0.72
V
—
A-6
Delta DET voltage
DDET
Active mode
0.02
0.15
0.22
V
—
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AN26102A
„ Control Pin Mode Table
Note) See parameters B No. DC-3 / B No. DC-4 in the Electrical Characteristics for control voltage relation ranges.
Pin No.
Descriptions
C3
Active/Sleep switching
Voltage
Low
High
Sleep
Active
Note
—
„ Truth Table
Note) See parameters B No. DC-3 / B No. DC-4 in the Electrical Characteristics for control voltage relation ranges.
CNT
PA
Mode
High
Active
PA Active
Low
Sleep
PA Sleep
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AN26102A
„ Technical Data
y I/O block circuit diagrams and pin function descriptions
Note) The characteristics listed below are reference values based on the IC design and are not guaranteed.
Pin
No.
Voltage
Internal circuit
A1
0.00 V
—
Descriptions
GND
VCC
A2
3.30 V
A2
2nd stage amplifier collector supply (PAVCC)
GND
A3
0.00 V
—
GND
VCC
A4
A4
3.30 V
1st stage amplifier collector supply (PAVCC)
GND
B1
0.00 V
—
GND
B3
0.00 V
—
GND
VCC
B4
—
B4
Power detector output
GND
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AN26102A
„ Technical Data (continued)
y I/O block circuit diagrams and pin function descriptions (continued)
Note) The characteristics listed below are reference values based on the IC design and are not guaranteed.
Pin
No.
Voltage
Internal Circuit
Descriptions
VCC
C1
3.30 V
C1
RF Output
3rd stage amplifier collector supply (PAVCC)
GND
VCC
C2
Active/Sleep SW Input
Less than 0.30 V : Sleep mode
More than 2.70 V : Active mode
C2
—
GND
C3
C3
Voltage supply (VCC)
3.30 V
GND
VCC
C4
—
PA input
C4
GND
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AN26102A
„ Technical Data (continued)
y PD ⎯ Ta diagram
Ver. AEB
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AN26102A
„ Usage Notes
y Special attention and precaution in using
1. This IC is intended to be used for general electronic equipment [2.4 GHz Band Applications].
Consult our sales staff in advance for information on the following applications:
x Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this IC may
directly jeopardize life or harm the human body.
x Any applications other than the standard applications intended.
(1) Space appliance (such as artificial satellite, and rocket)
(2) Traffic control equipment (such as for automobile, airplane, train, and ship)
(3) Medical equipment for life support
(4) Submarine transponder
(5) Control equipment for power plant
(6) Disaster prevention and security device
(7) Weapon
(8) Others : Applications of which reliability equivalent to (1) to (7) is required
2. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board), it might
smoke or ignite.
3. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In
addition, refer to the Pin Description for the pin configuration.
4. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as a solderbridge between the pins of the semiconductor device. Also, perform a full technical verification on the assembly quality, because
the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the LSI during
transportation.
5. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pinVCC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin short (load short) .
And, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and
smoke emission will depend on the current capability of the power supply.
6. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
7. When using the LSI for new models, verify the safety including the long-term reliability for each product.
8. When the application system is designed by using this LSI, be sure to confirm notes in this book.
Be sure to read the notes to descriptions and the usage notes in the book.
9. Due to unshielded structure of this IC, under exposure of light, function and characteristic of the product cannot be guaranteed.
During normal operation or even under testing condition, please ensure that IC is not exposed to light.
10. Basically, chip surface is ground potential. Please design to ensure no contact between chip surface and metal shielding.
Ver. AEB
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Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
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