AN26032A Ultra small , Single Band LNA-IC with Band-limiting filter for 600 MHz Band Applications FEATURES DESCRIPTION • Low voltage operation +2.85 V typ. AN26032A is single band LNA-IC for 600 MHz Band applications. • Low current consumption It realizes high performance by using 0.18 µm SiGeC Bi-CMOS process (fT = 90 GHz, fmax = 140 GHz). 1 µA typ. (Low-Gain mode) High/Low Gain mode is changeable, controlled by • High gain 14.0 dB typ. fRX = 620 MHz (High-Gain mode) integrated CMOS logic circuit. • Low noise figure The Band limiting filter is built-in. 1.20 dB typ. fRX = 620 MHz (High-Gain mode) A WLCSP package (Wafer Level Chip Sized Package) • Low distortion (IIP3 +10 MHz offset) achieves miniaturization. 4 dBm typ. fRX = 620 MHz (High-Gain mode) 4 mA typ. (High-Gain mode) • Small and thin package 6 pin Wafer level chip size package (WLCSP) APPLICATIONS zDTV（UHF） SIMPLIFIED APPLICATION RF output 50 Ω L2 A3 TOP VIEW Components Size L1 0603 8.2 nH LQP03TN8N2H04 Murata L2 0603 12 nH LQP03TN12NJ04 Murata C1 0603 C2 0603 B3 VCC C2 A1 B1 Part Number Vendor 1 000 pF GRM033B11C102KD01 100 000 pF GRM33B30J104KE18 Murata Murata Notes) This application circuit is an example. The operation of mass B2 A2 Value CNT (Gain cnt) production set is not guaranteed. You should perform enough evaluation and verification on the design of mass production set. You are fully responsible for the incorporation of the above application circuit and information in the design of your equipment. C1 L1 RF input Publication date: February 2013 50 Ω 1 Ver. CEB AN26032A ABSOLUTE MAXIMUM RATINGS Parameter Symbol Rating Unit Notes Supply voltage VCC 3.6 V *1 Supply current ICC 18 mA — Operating ambient temperature Topr –25 to+85 °C *2 Operating junction temperature Tj -40 to +125 °C *2 Tstg –55 to +125 °C *2 IN (Pin No.A1) — V *3 CNT (Pin No.B1) -0.3 to (VCC + 0.3) V *4 OUT1 (Pin No.A3) –0.3 to 1.4 V — OUT2 (Pin No.B3) –0.3 to 1.4 V — HBM (Human Body Model) 1 kV — Storage temperature Input Voltage Range ESD Notes). This product may sustain permanent damage if subjected to conditions higher than the above stated absolute maximum rating. This rating is the maximum rating and device operating at this range is not guaranteeable as it is higher than our stated recommended operating range. When subjected under the absolute maximum rating for a long time, the reliability of the product may be affected. *1:The.values under the condition not exceeding the above absolute maximum ratings and the power dissipation *2:Except for the operating ambient temperature, operating junction temperature, and storage temperature, all ratings are for Ta = 25°C. *3:RF signal input pin. Do not apply DC. *4:(VCC + 0.3) V must not be exceeded 3.6V. POWER DISSIPATION RATING θ JA PD (Ta=25 °C) PD (Ta=85 °C) 1433℃/W 0.070W 0.028W PACKAGE WLCSP Note). For the actual usage, please refer to the PD-Ta characteristics diagram in the package specification, supply voltage, load and ambient temperature conditions to ensure that there is enough margin follow the power and the thermal design does not exceed the allowable value. CAUTION Although this has limited built-in ESD protection circuit, but permanent damage may occur on it. Therefore, proper ESD precautions are recommended to avoid electrostatic damage to the MOS gates RECOMMENDED OPERATING CONDITIONS Parameter Supply voltage range Symbol Min. Typ. Max. Unit Notes VCC 2.5 2.85 3.0 V *1 Note) *1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. 2 Ver. CEB AN26032A ELECRTRICAL CHARACTERISTICS Note) Vcc = 2.85V Ta = 25°C±2°C unless otherwise specified Min Limits Typ Max Vcc current at High-Gain mode No input signal — 4.0 5.8 mA — IccL Vcc current at Low-Gain mode No input signal — 1.0 9.5 μA — Switching voltage (High-Gain mode) VIH — 1.40 2.85 — V — Switching voltage (Low-Gain mode) VIL — — 0.0 0.55 V — Switching current (High) IIH — 4 9.5 μA — Parameter Symbol Condition Supply current HG IccH Supply current LG Unit Note DC electrical characteristics Current at CNT pin VIH = Vcc ELECRTRICAL CHARACTERISTICS (continued) Note) Vcc = 2.85 V Ta = 25°C±2°C, fRX = 620 MHz, PRX = –30 dBm, CW unless otherwise specified. Parameter Symbol Condition Min Limits Typ Max Unit Note AC electrical characteristics Power Gain HG GHS High-Gain mode f = fRX 12 14 16 dB — Power Gain LG GLS Low-Gain mode f = fRX, PRX = –20 dBm –7 –4.5 –1.5 dB — High-Gain mode f1 = fRX + 10 MHz f2 = fRX + 20 MHz Input 2 signals (f1, f2) –4 4 — dBm — IIP3–10 MHz offset HG IIP3H1S 3 Ver. CEB AN26032A APPLICATION INFORMATION REFERENCE VALUES FOR DESIGN Notes) Vcc = 2.85 V Ta = 25°C±2°C, fRX = 470 MHz, 620 MHz, 770 MHz, PRX = –30 dBm, CW unless otherwise specified. Reference values Parameter Symbol Conditions Min Typ Max Unit Note AC electrical characteristics Power Gain HG GH High-Gain mode f = fRX 10.9 14 16.5 dB *1 Power Gain LG GL Low-Gain mode f = fRX, PRX = –20 dBm –7.5 –4.5 –1.5 dB *1 Noise Figure HG NFH High-Gain mode f = fRX — 1.3 1.7 dB *1 ,*2 Noise Figure LG NFL Low-Gain mode f = fRX — 4.5 7.5 dB *1,*2 IIP3H1 High-Gain mode f1 = fRX + 10 MHz f2 = fRX + 20 MHz Input 2 signals (f1, f2) –5 4 — dBm *1 IIP3 –10 MHz offset HG IIP3H2 High-Gain mode f1 = fRX – 10 MHz f2 = fRX – 20 MHz Input 2 signals (f1, f2) –7 2 — dBm *1 Input P1dB HG IP1dBH High-Gain mode f = fRX –14 –10 — dBm *1 Reverse Isolation HG ISOH High-Gain mode f = fRX — –27 — dB *1 Reverse Isolation LG ISOL High-Gain mode f = fRX — –4.5 — dB *1 ATTH1 High-Gain mode f1 = 620 MHz f2 = 1520 MHz Gain(f2) – Gain(f1) — –31 –24 dB *1 ATTH2 High-Gain mode f1 = 620 MHz f2 = 1880 MHz Gain(f2) – Gain(f1) — –49 –41 dB *1 IIP3 +10 MHz offset HG Attenuation1 HG Attenuation2 HG Note) *1 : Checked by design, not production tested. *2 : Connector & substrate loss (0.1 dB) included. 4 Ver. CEB AN26032A APPLICATION INFORMATION (continued) REFERENCE VALUES FOR DESIGN (continued) Notes) Vcc = 2.5 V to 3.0 V Ta = –25°C to 85°C unless otherwise specified. Reference values Parameter Symbol Conditions Min Typ Max Unit Note DC electrical characteristics Supply current HG IccHT Vcc current at High-Gain mode No input signal — 4.0 5.9 mA *1 Supply current LG IccHT VCC current at Low-Gain mode No input signal — 1.0 10 μA *1 Switching voltage (High Gain Mode) VIHT — 1.50 2.85 — V *1 Switching voltage (Low Gain Mode) VILT — — 0.0 0.4 V *1 Switching current (High) IIHT — 4 10 μA *1 Current at CNT pin VIH = Vcc Note) *1 : Checked by design, not production tested. 5 Ver. CEB AN26032A APPLICATION INFORMATION (continued) REFERENCE VALUES FOR DESIGN (continued) Notes) Vcc = 2.5 V to 3.0 V Ta = –25°C to 85°C, fRX = 470 MHz, 620 MHz, 770 MHz, PRX = –30 dBm, CW unless otherwise specified. Reference values Parameter Symbol Conditions Unit Note 17 dB *1 Min Typ Max 10.4 14 AC electrical characteristics Power Gain HG GHT High-Gain mode f = fRX Power Gain LG GLT Low-Gain mode f = fRX, PRX = –20 dBm –8 –4.5 –1.5 dB *1 Noise Figure HG NFHT High-Gain mode f = fRX — 1.3 2.4 dB *1 ,*2 Noise Figure LG NFLT Low-Gain mode f = fRX — 4.5 8.0 dB *1,*2 IIP3H1Ta High-Gain mode f1 = fRX + 10 MHz f2 = fRX + 20 MHz Input 2 signals (f1, f2) –6 4 — dBm *1 IIP3 –10 MHz offset HG IIP3H2Ta High-Gain mode f1 = fRX – 10 MHz f2 = fRX – 20 MHz Input 2 signals (f1, f2) –8 2 — dBm *1 Input P1dB HG P1dBHT High-Gain mode f = fRX –16 –10 — dBm *1 ATTHT1 High-Gain mode f1 = 620 MHz f2 = 1520 MHz Gain(f2) – Gain(f1) — –31 –23 dB *1 ATTHT2 High-Gain mode f1 = 620 MHz f2 = 1880 MHz Gain(f2) – Gain(f1) — –49 –40 dB *1 IIP3 +10 MHz offset HG Attenuation1 HG Attenuation2 HG Note) *1 : Checked by design, not production tested. *2 : Connector & substrate loss (0.1 dB) included. 6 Ver. CEB AN26032A PIN CONFIGURATION Top View OUT1 A3 B3 OUT2 GND A2 B2 VCC A1 B1 CNT IN PIN FUNCTIONS Pin No. Pin name Type Description A1 IN Input RF Input A2 GND Ground GND A3 OUT1 Output RF Output B1 CNT Input B2 VCC Power Supply B3 OUT2 Output High-Gain / Low-Gain switch L: Low-Gain Mode H: High-Gain Mode VCC RF output FUNCTIONAL BLOCK DIAGRAM Top View Matching Circuit OUT1 A3 B3 OUT2 GND A2 B2 VCC IN A1 B1 CNT (Gain cnt) Notes) This circuit and these circuit constants show an example and do not guarantee the design as a mass-production set. This block diagram is for explaining functions. The part of the block diagram may be omitted, or it may be simplified. 7 Ver. CEB AN26032A PACKAGE INFORMATION ( Reference Data ) Package Code:ALGA006-W-0609AQA Unit:mm Body Material : Br/Sb Free Epoxy Resin Reroute Material : Cu Bump : SnAgCu 8 Ver. CEB AN26032A IMPORTANT NOTICE 1.The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. 2.When using the LSI for new models, verify the safety including the long-term reliability for each product. 3.When the application system is designed by using this LSI, be sure to confirm notes in this book. Be sure to read the notes to descriptions and the usage notes in the book. 4.The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information de-scribed in this book. 5.This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 6.This LSI is intended to be used for general electronic equipment [cellular phones]. Consult our sales staff in advance for information on the following applications: Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this LSI may directly jeopardize life or harm the human body. Any applications other than the standard applications intended. (1) Space appliance (such as artificial satellite, and rocket) (2) Traffic control equipment (such as for automobile, airplane, train, and ship) (3) Medical equipment for life support (4) Submarine transponder (5) Control equipment for power plant (6) Disaster prevention and security device (7) Weapon (8) Others : Applications of which reliability equivalent to (1) to (7) is required It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the LSI described in this book for any special application, unless our company agrees to your using the LSI in this book for any special application. 7.This LSI is neither designed nor intended for use in automotive applications or environments unless the specific product is designated by our company as compliant with the ISO/TS 16949 requirements. Our company shall not be held responsible for any damage incurred by you or any third party as a result of or in connection with your using the LSI in automotive application, unless our company agrees to your using the LSI in this book for such application. 8.If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. 9. Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Our company shall not be held responsible for any damage incurred as a result of your using the LSI not complying with the applicable laws and regulations. 9 Ver. CEB AN26032A USAGE NOTES 1. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. 2. Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. 3. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuitboard), it might smoke or ignite. 4. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In addition, refer to the Pin Description for the pin configuration. 5. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as a solder-bridge between the pins of the semiconductor device. Also, perform a full technical verification on the assembly quality, because the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the LSI during transportation. 6. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pin-VCC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin short (load short) . And, safety measures such as an installation of fuses are recommended because the extent of the abovementioned damage and smoke emission will depend on the current capability of the power supply. 7. Due to unshielded structure of this LSI, under exposure of light, function and characteristic of the product cannot be guaranteed. During normal operation or even under testing condition, please ensure that LSI is not exposed to light. 8. Basically, chip surface is ground potential. Please design to ensure no contact between chip surface and metal shielding. 10 Ver. CEB Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202