TAIYO-YUDEN EMK212BJ106KG-T

Notice for TAIYO YUDEN products　Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2012. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or usage of the Products.
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this catalog or individual
specification.
■ Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is
available.
■ Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
■ All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, submarine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliability evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices or distributors (so called“TAIYO YUDEN’
s official sales channel”).
It is only applicable to the products purchased from any of TAIYO YUDEN’s official sales channel.
■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may occur in connection with a third party's intellectual property rights and other related rights arising from your usage of
products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to“Foreign Exchange and Foreign Trade Control Law”of Japan,“U.S. Export Administration Regulations”, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
13
MULTILAYER CERAMIC CAPACITORS
MULTILAYER CERAMIC CAPACIT�RS
WAVE
REFLOW
■PARTS NUMBER
J M K
① ② ③
3
1 6
④
CERAMIC CAPACITORS
①Rated voltage
Code
P
A
J
L
E
T
G
U
H
Q
S
②Series name
Code
M
V
W
△
⑤
B
J
1
⑥
0 6
⑦
M L － T △
⑧ ⑨ ⑩ ⑪ ⑫
③End termination
Code
K
R
Rated voltage［VDC］
2.5
4
6.3
10
16
25
35
50
100
250
630
A
Dimensions
（L×W）［mm］
042
0.4×0.2
063
0.6×0.3
1.0×0.5
105
0.52×1.0 ※
1.6×0.8
107
0.8×1.6 ※
2.0×1.25
212
1.25×2.0 ※
316
3.2×1.6
325
3.2×2.5
432
4.5×3.2
Note : ※LW reverse type（□WK） only
Type
L［mm］
Standard
W［mm］
Standard
0.6±0.05
1.0±0.10
1.6＋0.15/－0.05
0.3±0.05
0.5±0.10
0.8＋0.15/－0.05
212
2.0＋0.15/－0.05
1.25＋0.15/－0.05
316
3.2±0.20
1.25±0.20
325
105
3.2±0.30
1.0＋0.15/－0.05
2.5±0.30
0.5＋0.15/－0.05
107
1.6＋0.20/－0
0.8＋0.20/－0
212
2.0＋0.20/－0
1.25＋0.20/－0
316
105
3.2±0.30
1.6±0.30
1.0＋0.20/－0
0.5＋0.20/－0
Note: P.6 Standard external dimensions
⑥Temperature characteristics code
■High dielectric type（Excluding Super low distortion multilayer ceramic capacitor（CFCAPTM））
Applicable
Temperature
Code
Ref. Temp.［℃］
Capacitance change
standard
range［℃］
JIS
B
－25～＋ 85
20
±10％
EIA
X5R
－55～＋ 85
25
±15％
B7
EIA
X7R
－55～＋125
25
±15％
C6
EIA
X6S
－55～＋105
25
±22％
C7
EIA
X7S
－55～＋125
25
±22％
LD(※)
EIA
X5R
－55～＋ 85
25
±15％
BJ
JIS
F
－25～＋ 85
20
EIA
Y5V
－30～＋ 85
25
Note : ※.LD Low distortion high value multilayer ceramic capacitor
△F
EIA（inch）
01005
0201
0402
0204
0603
0306
0805
0508
1206
1210
1812
T［mm］
Standard
0.3±0.05
0.5±0.10
0.8＋0.15/－0.05
0.45±0.05
0.85±0.10
1.25＋0.15/－0.05
0.85±0.10
1.6±0.20
2.5±0.30
0.5＋0.15/－0.05
0.45±0.05
0.8＋0.20/－0
0.85±0.10
1.25＋0.20/－0
1.6±0.30
0.5＋0.20/－0
△= Blank space
B
C
End termination
Plated
High Reliability Application
④Dimension（L×W）
Series name
Multilayer ceramic capacitor
Multilayer ceramic capacitor for high frequency
LW reverse type multilayer capacitor
⑤Dimension tolerance
Code
Type
△
ALL
063
105
107
△＝Blank space
＋30/－80％
＋22－82％
Capacitance
Tolerance
tolerance
code
±10％
K
±20％
M
±10％
K
±20％
M
±10％
K
±20％
M
±10％
K
±20％
M
±10％
K
±20％
M
±10％
K
±20％
M
＋80/－20％
Z
＋80/－20％
Z
△= Blank space
▶This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
4
13
■Temperature compensating type
Applicable
Code
standard
JIS
CH
CH
CJ
CK
UK
SL
Ref. Temp.［℃］
C0H
JIS
EIA
JIS
EIA
JIS
CJ
C0J
CK
C0J
UJ
EIA
U2J
JIS
EIA
JIS
UK
U2K
S
⑧Capacitance tolerance
Code
B
C
D
F
J
K
M
Z
0±120ppm/℃
±0.25pF
C
0±250ppm/℃
±0.25pF
C
－750±120ppm/℃
±0.25pF
±0.5pF
±5％
C
D
J
－750±250ppm/℃
±0.5pF
C
+350～－1000ppm/℃
±5％
J
0±60ppm/℃
25
－55～＋125
－55～＋125
－55～＋125
－55～＋125
－55～＋125
－55～＋125
20
25
20
25
20
25
20
25
20
⑥Series code
（Super low distortion multilayer ceramic capacitor（CFCAPTM）only）
Code
Series code
SD
Standard
⑦Nominal capacitance
Code
（example）
0R5
010
100
101
102
103
104
105
106
107
Note : R＝Decimal point
Tolerance
code
B
C
D
F
J
K
20
－55～＋125
EIA
Capacitance
tolerance
±0.1pF
±0.25pF
±0.5pF
1pF
±5％
±10％
Capacitance change
Nominal capacitance
0.5pF
1pF
10pF
100p
1,000pF
10,000pF
0.1μF
1.0μF
10μF
100μF
Capacitance tolerance
±0.1pF
±0.25pF
±0.5pF
±1pF
±5％
±10％
±20％
＋80/－20％
⑨Thickness
Code
C
D
P
T
K
V
W
A
D
F
G
H
L
N
Y
M
Thickness［mm］
0.2
0.2(Temperature compensating of 042type)
0.3
0.45
CERAMIC CAPACITORS
UJ
Temperature
range［℃］
0.5
0.8
0.85(212type or more)
1.15
1.25
1.5
1.6
1.9
2.0 max
2.5
⑩Special code
Code
－
H
⑪Packaging
Code
F
T
Special code
Standard
MLCC for Industrial, Automotive Comfort
and Safety
Packaging
φ178mm Taping （2mm pitch）
φ178mm Taping （4mm pitch）
φ178mm Taping （4mm pitch, 1000 pcs/reel）
325 type（Thickness code M）
φ178mm Taping（1mm pitch）042type only
P
W
⑫Internal code
Code
△
Internal code
Standard
▶This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
13
5
■STANDARD EXTERNAL DIMENSIONS
Type( EIA )
CERAMIC CAPACITORS
e
※ LW reverse type
Dimension [mm]
T
Ｌ
Ｗ
□MK042（01005）
0.4±0.02
0.2±0.02
0.2±0.02
□MK063（0201）
0.6±0.03
0.3±0.03
0.3±0.03
□MK105（0402）
1.0±0.05
0.5±0.05
□VK105（0402）
□WK105（0204）※
1.0±0.05
0.52±0.05
0.5±0.05
1.0±0.05
□MK107（0603）
1.6±0.10
0.8±0.10
□MR107（0603）
□WK107（0306）※
1.6±0.10
0.8±0.10
0.8±0.10
1.6±0.10
□MK212（0805）
2.0±0.10
1.25±0.10
□MR212（0805）
□WK212（0508）※
2.0±0.10
1.25±0.15
1.25±0.10
2.0±0.15
□MK316（1206）
3.2±0.15
1.6±0.15
□MR316（1206）
3.2±0.15
1.6±0.15
□MK325（1210）
3.2±0.30
2.5±0.20
□MR325（1210）
3.2±0.30
2.5±0.20
□MK432（1812）
4.5±0.40
Note : ※. LW reverse type, *1.Thickness code
3.2±0.30
0.2±0.02
0.3±0.03
0.5±0.05
0.5±0.05
0.3±0.05
0.45±0.05
0.8±0.10
0.8±0.10
0.5±0.05
0.45±0.05
0.85±0.10
1.25±0.10
1.25±0.10
0.85±0.1
0.85±0.10
1.15±0.10
1.25±0.10
1.6±0.20
1.6±0.20
0.85±0.10
1.15±0.10
1.5±0.10
1.9±0.20
1.9+0.1/-0.2
2.5±0.20
1.9±0.20
2.5±0.20
2.5±0.20
*1
C
D
P
T
C
P
V
W
P
K
A
Ａ
Ｖ
K
D
G
Ｇ
Ｄ
D
Ｆ
G
L
Ｌ
D
F
H
N
Y
M
N
M
M
e
0.1±0.03
0.15±0.05
0.25±0.10
0.25±0.10
0.18±0.08
0.35±0.25
0.1～0.6
0.25±0.15
0.5±0.25
0.25～0.75
0.3±0.2
0.5+0.35/-0.25
0.25～0.85
0.6±0.3
0.3～0.9
0.9±0.6
■STANDARD QUANTITY
Type
EIA（inch）
Dimension
［ｍｍ］
042
01005
0.2
063
0201
0.3
105
0402
0.5
0204 ※
107
0603
0306 ※
212
0805
0508 ※
316
325
0.2
0.3
1206
1210
432
1812
Note : ※.LW Reverse type（□WK）
0.30
0.45
0.8
0.50
0.45
0.85
1.25
0.85
0.85
1.15
1.25
1.6
0.85
1.15
1.5
1.9
2.0 max
2.5
2.5
Code
C
D
P
T
C
P
V
W
P
K
A
V
K
D
G
D
D
F
G
L
D
F
H
N
Y
M
M
Standard quantity［pcs］
Paper tape
Embossed tape
－
40000
15000
－
20000
15000
－
－
10000
－
4000
－
－
4000
4000
－
－
4000
4000
3000
－
－
－
3000
－
2000
－
2000
－
－
500（T），1000（P）
500
▶This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
6
13
Multilayer Ceramic Capacitors
■PACKAGING
①Minimum Quantity
●Taped package
Type(EIA)
□MK042(01005)
□MK063(0201)
□WK105(0204) ※
□MK105(0402)
□VK105(0402) ※
□MK107(0603)
□WK107(0306) ※
□MR107(0603)
□MK212(0805)
□WK212(0508) ※
□MR212(0805)
□MK316(1206)
□MR316(1206)
□MK325(1210)
□MR325(1210)
□MK432(1812)
Note : ※ LW Reverse type.
Thickness
mm
0.2
0.3
0.3
0.2
0.3
0.5
0.5
0.45
0.5
0.8
0.45
0.85
1.25
0.85
1.15
1.25
1.6
0.85
1.15
1.5
1.9
2.0max.
2.5
2.5
code
C, D
P, T
P
C
P
V
W
K
V
A
K
D
G
D
F
G
L
D
F
H
N
Y
M
M
Standard quantity [pcs]
Paper tape
Embossed tape
－
40000
15000
10000
20000
－
15000
10000
4000
－
4000
4000
－
－
4000
3000
－
－
3000
2000
－
－
500（T）, 1000（P）
500
②Taping material
※No bottom tape for pressed carrier tape
●Card board carrier tape
●Embossed tape
Chip filled
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack01_j-02
③Representative taping dimensions
●Paper Tape（8mm wide）
●Pressed carrier tape（ 2mm pitch）
Chip Cavity
Type(EIA)
Ａ
0.37
Ｂ
0.67
□MK063(0201)
□WK105(0204) ※
□MK105(0402) （*1 C）
0.65
1.15
□MK105(0402) （*1 P）
Note *1 Thickness, C：0.2mm ,P：0.3mm. ※ LW Reverse type.
Insertion Pitch
Ｆ
2.0±0.05
Tape Thicknes
Ｔ
T1
0.45max.
0.42max.
0.4max.
0.45max.
0.3max.
0.42max.
Unit：mm
●Punched carrier tape （2mm pitch）
Type(EIA)
□MK105 (0402)
□VK105 (0402)
Ａ
Chip Cavity
Ｂ
Insertion Pitch
Ｆ
Tape Thickness
Ｔ
0.65
1.15
2.0±0.05
0.8max.
Unit：ｍｍ
●Punched carrier tape （4mm pitch）
Type(EIA)
Chip Cavity
Ａ
Ｂ
Insertion Pich
Ｆ
□MK107(0603)
□WK107(0306) ※
1.0
1.8
□MR107(0603)
4.0±0.1
□MK212(0805)
1.65
2.4
□WK212(0508) ※
□MK316(1206)
2.0
3.6
Note：Taping size might be different depending on the size of the product. ※ LW Reverse type.
Tape Thickness
Ｔ
1.1max.
1.1max.
Unit：mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack01_j-02
●Embossed tape（4mm wide）
Type(EIA)
□MK042(01005)
Chp Cavity
Ａ
0.23
Ｂ
0.43
Insertion Pitch
Ｆ
1.0±0.02
Tape Thickness
K
0.5max.
T
0.25max.
Unit：mm
●Embossed tape（8mm wide）
Type(EIA)
□WK107(0306) ※
□MK212(0805)
□MR212(0805)
□MK316(1206)
□MR316(1206)
□MK325(1210)
□MR325(1210)
Note： ※ LW Reverse type.
Chip Cavity
Ａ
1.0
Ｂ
1.8
1.65
2.4
2.0
3.6
2.8
3.6
Insertion Pitch
Ｆ
4.0±0.1
Tape Thickness
K
1.3max.
T
0.25±0.1
3.4max.
0.6max.
Unit：mm
●Embossed tape（12mm wide）
Type(EIA)
□MK432(1812)
Chip Cavity
Ａ
3.7
Ｂ
4.9
Insertion Pitch
Ｆ
8.0±0.1
Tape Thickness
K
4.0max.
T
0.6max.
Unit：mm
④Trailer and Leader
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack01_j-02
⑤Reel size
A
φ178±2.0
B
φ50min.
C
φ13.0±0.2
D
φ21.0±0.8
4mm wide tape
8mm wide tape
12mm wide tape
T
1.5max.
2.5max.
2.5max.
W
5±1.0
10±1.5
14±1.5
Unit：mm
E
2.0±0.5
R
1.0
⑥Top Tape Strength
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below.
⑦Bulk Cassette
The exchange of individual specification is necessary.
Please contact Taiyo Yuden sales channels.
Unit：mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack01_j-02
Super Low Distortion Multilayer Ceramic Capacitors , Medium-High Voltage Multilayer Ceramic Capacitors and
High Reliability Application Multilayer Ceramic Capacitors are noted separately.
Multilayer Ceramic Capacitors
■RELIABILITY DATA
1.Operating Temperature Range
Temperature
Compensating（Class1）
Standard
High Frequency Type
－55 to ＋125℃
Specification
Temperature Range
B
－25 to ＋85℃
BJ
X5R
－55 to ＋85℃
B7
X7R
－55 to ＋125℃
C6
X6S
－55 to ＋105℃
C7
X7S
－55 to ＋125℃
LD(※)
X5R
－55 to ＋85℃
F
－25 to ＋85℃
F
Y5V
－30 to ＋85℃
Note: ※LD Low distortion high value multilayer ceramic capacitor
Specified
Value
High Permittivity （Class2）
2. Storage Conditions
Temperature
Compensating（Class1）
Standard
High Frequency Type
－55 to ＋125℃
Specification
Temperature Range
B
－25 to ＋85℃
BJ
X5R
－55 to ＋85℃
B7
X7R
－55 to ＋125℃
C6
X6S
－55 to ＋105℃
C7
X7S
－55 to ＋125℃
LD(※)
X5R
－55 to ＋85℃
F
－25 to ＋85℃
F
Y5V
－30 to ＋85℃
Note: ※LD Low distortion high value multilayer ceramic capacitor
Specified
Value
High Permittivity （Class2）
3. Rated Voltage
Specified
Value
Temperature
Compensating（Class1）
Standard
50VDC, 25VDC, 16VDC
High Frequency Type
High Permittivity （Class2）
50VDC, 16VDC
50VDC, 35VDC, 25VDC, 16VDC, 10VDC, 6.3VDC, 4VDC, 2.5VDC
4. Withstanding Voltage （Between terminals）
Specified
Value
Temperature
Compensating（Class1）
Standard
High Frequency Type
No breakdown or damage
High Permittivity （Class2）
Test
Methods and
Remarks
Class 1
Rated volta×3
Applied voltage
Duration
Charge/discharge current
Class 2
Rated voltage×2.5
1 to 5 sec.
50mA max.
5. Insulation Resistance
Specified
Value
Temperature
Compensating（Class1）
Standard
High Frequency Type
High Permittivity （Class2） Note 1
Test
Methods and
Remarks
Applied voltage
Duration
Charge/discharge current
10000 MΩ min.
C≦0.047μF : 10000 MΩ min.
C＞0.047μF : 500MΩ・μF
: Rated voltage
: 60±5 sec.
: 50mA max.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-01
6. Capacitance （Tolerance）
Specified
Value
Temperature
Compensating（Class1）
Standard
C□
U□
SL
0.2pF≦C≦5pF
0.2pF≦C≦10pF
C＞10pF
: ±0.25pF
: ±0.5pF
: ±5% or ±10%
High Frequency Type
CH
RH
0.3pF≦C≦2pF
C＞2pF
: ±0.1pF
: ±5%
BJ, B7, C6, C7, LD(※) : ±10% or ±20%,
F : ＋80/－20%
Note: ※LD Low distortion high value multilayer ceramic capacitor
High Permittivity （Class2）
Test
Methods and
Remarks
Standard
Preconditioning
Measuring frequency
Measuring voltage Note
Bias application
Class 1
High Frequency Type
None
1ＭHz±10%
0.5 to 5Vrms
Class 2
C≦10μF
Thermal treatment （at 150℃
1kHz±10%
1±0.2Vrms
one
C＞10μF
for 1hr） Note 2
120±10Hz
0.5±0.1rms
7. Q or Dissipation Factor
Specified
Value
Temperature
Compensating（Class1）
Standard
High Frequency Type
High Permittivity （Class2） Note 1
C＜30pF : Q≧400＋20C
C≧30pF : Q≧1000
（C：Nominal capacitance）
Refer to detailed specification
BJ, B7, C6, C7：2.5% max.,
Class 1
High Frequency Type
None
1ＭHz±10%
1GHz
0.5 to 5Vrms
Standard
Test
Methods and
Remarks
Preconditioning
Measuring frequey
Measuring voltage Note 1
Bias application
High Frequency Type
Measuring equipment
Measuring jig
F：7% max.
Class 2
C≦10μF
C＞10μF
Thermal treatment （at 150℃ for 1hr） Note 2
1ｋHz±10%
120±10Hz
1±0.2Vrms
0.5±0.1Vrms
None
: HP4291A
: HP16192A
8. Temperature Characteristic （Without voltage application）
Temperature Characteristic ［ppm/℃］
C□ : 0
CH, CJ, CK
Standard
Temperature
Compensating（Class1）
U□ : －750
SL
High Frequency Type
UJ, UK
: ＋350 to －1000
Temperature Characteristic ［ppm/℃］
C□ : 0
CH
R□ : －220
RH
Specified
Value
Tolerance ［ppm/℃］
H : ±60
J : ±120
K : ±250
Tolerance ［ppm/℃］
H : ±60
Capacitance
Reference
Temperature Range
change
temperature
±10%
20℃
－25 to ＋85℃
±15%
25℃
－55 to ＋85℃
±15%
25℃
－55 to ＋125℃
±22%
25℃
－55 to ＋105℃
±22%
25℃
－55 to ＋125℃
±15%
25℃
－55 to ＋85℃
＋30/－80%
20℃
－25 to ＋85℃
＋22/－82%
25℃
－30 to ＋85℃
distortion high value multilayer ceramic capacitor
Specification
B
X5R
B7
X7R
C6
X6S
C7
X7S
LD(※)
X5R
F
F
Y5V
Note : ※LD Low
BJ
High Permittivity （Class2）
Class 1
Capacitance at 20℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the
following equation.
（C85－C20）
×106（ppm/℃）
△T＝65
C20×△T
Test
Methods and
Remarks
Class 2
Capacitance at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following
equation.
Step
B、F
X5R、X7R、X6S、X7S、Y5V
1
Minimum operating temperature
2
20℃
25℃
3
Maximum operating temperature
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-01
（C－C2）
×100（%）
C2
C ：Capacitance in Step 1 or Step 3
C2 ：Capacitance in Step 2
9. Deflection
Standard
Temperature
Compensating（Class1）
High Frequency Type
Specified
Value
Appearance
Cpaitance change
: No abnormality
: Within±0.5 pF
: No abnormality
: Within ±12.5%（BJ, B7, C6, C7,LD(※)）
Within ±30%（F）
Note: ※LD Low distortion high value multilayer ceramic capacitor
Multilayer Ceramic Capacitors
105 Type
The other types
Glass epoxy-resin substrate
0.8mm
1.6mm
1mm
10 sec.
※
105 Type thickness, C： 0.2mm ,P： 0.3mm.
042, 063,
Board
Thickness
Warp
Duration
: No abnormality
: Within ±5% or ±0.5 pF, whichever is larger.
Appearance
Capacitance change
High Permittivity （Class2）
Test
Methods and
Remarks
Appearance
Capacitance change
※
Capacitance measurement shall be conducted
with the board bent
10. Body Strength
Specified
Value
Temperature
Compensating（Class1）
Standard
High Frequency Type
High Permittivity （Class2）
Test
Methods and
Remarks
－
No mechanical damage.
－
High Frequency Type
Applied force
: 5N
Duration
: 10 sec.
11. Adhesive Strength of Terminal Electrodes
Specified
Value
Temperature
Compensating（Class1）
Standard
High Frequency Type
No terminal separation or its indication.
High Permittivity （Class2）
Test
Methods and
Remarks
Applied force
Duration
Multilayer Ceramic Capacitors
042, 063 Type
105 Type or more
2N
5N
30±5 sec.
12. Solderability
Specified
Value
Temperature
Compensating（Class1）
Standard
High Frequency Type
At least 95% of terminal electrode is covered by new solder.
High Permittivity （Class2）
Test
Methods and
Remarks
Solder type
Solder temperature
Duration
Eutectic solder
H60A or H63A
230±5℃
Lead-free solder
Sn-3.0Ag-0.5Cu
245±3℃
4±1 sec.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-01
13. Resistance to Soldering
Standard
Appearance
Capacitance change
Q
Insulation resistance
Withstanding voltage
: No abnormlty
: Within ±2.5% or ±0.25pF, whichever is larger.
: Initial value
: Initial value
（between terminals） : No abnormality
High Frequency Type
Appearance
Capacitancecange
Q
Insulation resistance
Withstanding voltage
: No abnormality
: Within ±2.5%
: Initial value
: Initial value
（between terminals） : No abnormality
Temperature
Compensating（Class1）
Specified
Value
Appearance
Capactace change
High Permittivity （Class2）
: No abnormality
: Within ±7.5%（BJ, B7, C6, C7, LD(※)）
Within ±20%（F）
Dissipation factor
: Initial value
Insulation resistance
: Initial value
Withstanding voltage
（between terminals）: No abnormality
Note: ※LD Low distortion high value multilayer ceramic capacitor
Note 1
lss 1
042, 063 Type
105 Type
Preconditioning
Preheating
Test
Methods and
Remarks
None
Solder temp.
Duration
Recovery
270±5℃
3±0.5 sec.
6 to 24 hrs （Standard condition） Noe 5
042、063 Type
Preconditioning
Preheating
80 to 100℃, 2 to 5 min.
150 to 200℃, 2 to 5 min.
150℃, 1 to 2 min.
150℃, 1 to 2 min.
Solder temp.
Duration
Recovery
Class 2
105, 107, 212 Type
316, 325 Type
Thermal treatment （at 150℃ for 1 hr） Note 2
80 to 100℃, 2 to 5 min.
80 to 100℃, 5 to 10 min.
150 to 200℃, 2 to 5 min.
150 to 200℃, 5 to 10 min.
270±5℃
3±0.5 sec.
24±2 hrs （Standard condition） Note 5
14. Temperature Cycle (Thermal Shock）
Standard
Appearance
Capacitance change
Q
Insulation resistance
Withstanding voltage
: No abnormality
: Within ±2.5% or ±0.25pF, whichever is larger.
: Initial value
: Initial value
（between terminals） : No abnormality
High Frequency Type
Appearance
Capacitance change
Q
Insulation resistance
Withstanding voltage
: No abnormality
: Within ±0.25pF
: Initial value
: Initial value
（between terminals） : No abnormality
Temperature
Compensating（Class1）
Specified
Value
Appearance
Capacitance change
High Permittivity （Class2）
: No abnormality
: Within ±7.5% （BJ, B7, C6, C7, LD(※)）
Within ±20% （F）
Dissipation factor
: Initial value
Insulation resistance
: Initial value
Withstanding voltage
（between terminals） : No abnormality
Note: ※LD Low distortion high value multilayer ceramic capacitor
Note 1
Class 1
Preconditioning
Test
Methods and
Remarks
1 cycle
Number of cycles
Recovery
Class 2
Thermal treatment （at 150℃ for 1 hr）
Note 2
None
Step
1
2
3
4
Temperature（℃）
Minimum operating temperature
Normal temperature
Maximum operating temperature
Normal temperature
Time（min.）
30±3
2 to 3
30±3
2 to 3
5 times
6 to 24 hrs （Standard condition） Note 5
24±2 hrs （Standard condition） Note 5
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-01
15. Humidity （Steady State）
Appearance
Capacitance change
Q
Standard
Temperature
Compensating（Class1）
Specified
Value
High Frequency Type
Insulation resistance
: No abnormality
: Within ±5% or ±0.5pF, whichever is larger.
: C＜10pF : Q≧200＋10C
10≦C＜30pF : Q≧275＋2.5C
C≧30pF:Q≧350（C：Nominal capacitance）
: 1000 MΩ min.
Appearance
Capacitance change
Insulation resistance
: No abnormality
: Within ±0.5pF,
: 1000 MΩ min.
Appearance
Capacitance change
High Permittivity （Class2）
: No abnormality
: Within ±12.5% （BJ, B7, C6, C7, LD(※)）
Within ±30% （F）
Dissipation factor
: 5.0% max.（BJ, B7, C6, C7, LD(※)）
11.0% max.（F）
Insulation resistance
: 50 MΩμF or 1000 MΩ whichever is smaller.
Note: ※LD Low distortion high value multilayer ceramic capacitor
Note 1
Class 1
Standard
Test
Methods and
Remarks
Preconditioning
Temperature
Humidity
Duration
Recovery
Class 2
All items
Thermal treatment（ at 150℃ for 1 hr） Note 2
40±2℃
90 to 95%RH
500＋24/－0 hrs
24±2 hrs （Standard condition） Note 5
High Frequency Type
None
40±2℃
60±2℃
90 to 95%RH
500＋24/－0 hrs
6 to 24 hrs （Standard condition） Note 5
16. Humidity Loading
Appearance
Capacitance change
Q
Standard
Insulation resistance
Temperature
Compensating（Class1）
Appearance
Capacitance change
High Frequency Type
Specified
Value
: No abnormality
: Within ±7.5% or ±0.75pF, whichever is larger.
: C＜30pF：Q≧100＋10C/3
C≧30pF：Q≧200 （C：Nominal capacitance）
: 500 MΩ min.
Insulation resistance
: No abnormality
: C≦2pF：Within ±0.4 pF
C＞2pF：Within ±0.75 pF
（C：Nominal capacitance）
: 500 MΩ min.
Appearance
Capacitance change
High Permittivity （Class2）
Note 1
90 to 95%RH
500＋24/－0 hrs
Rated voltage
Class 2
All items
Voltage treatment
（Rated voltage are applied for 1 hour at 40℃） Note 3
40±2℃
90 to 95%RH
500＋24/－0 hrs
Rated voltage
50mA max.
50mA max.
6 to 24 hrs （Standard condition） Note 5
24±2 hrs（Standard condition） Note 5
Standard
Preconditioning
Test
Methods and
Remarks
Temperature
Humidity
Duration
Applied voltage
Charge/discharge
current
Recovery
: No abnormality
: Within ±12.5% （BJ, B7, C6, C7, LD(※)）
Within ±30% （F）
Dissipation factor
: 5.0% max. （BJ, B7, C6, C7, LD(※)）
11.0% max. （F）
Insulation resistance
: 25 MΩμF or 500 MΩ, whichever is smaller.
Note: ※LD Low distortion high value multilayer ceramic capacitor
Class 1
High Frequency Type
None
40±2℃
60±2℃
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-01
17. High Temperature Loading
Appearance
Capacitance change
Q
Standard
Temperature
Compensating（Class1）
Specified
Value
High Frequency Type
Insulation resistance
: No abnormality
: Within ±3% or ±0.3pF, whichever is larger.
: C＜10pF： Q≧200＋10C
10≦C＜30pF：Q≧275＋2.5C
C≧30pF： Q≧350（C：Nominal capacitance）
: 1000 MΩ min.
Appearance
Capacitance change
Insulation resistance
: No abnormality
: Within ±3% or ±0.3pF, whichever is larger.
: 1000 MΩ min.
Appearance
Capacitance change
High Permittivity （Class2）
Note 1
Maximum operating temperature
1000＋48/－0 hrs
Rated voltage×2
Class 2
BJ, LD(※), F
C6
B7, C7
Voltage treatment（Twice the rated voltage shall be applied for
1 hour at 85℃, 105℃ or 125℃） Note 3, 4
Maximum operating temperature
1000＋48/－0 hrs
Rated voltage×2 Note 4
50mA max.
50mA max.
Standard
Preconditioning
Test
Methods and
Remarks
Temperature
Duration
Applied voltage
Charge/discharge
current
Recovery
: No abnormality
: Within ±12.5% （BJ, B7, C6, C7, LD(※)）
Within ±30% （F）
Dissipation factor
: 5.0% max.（BJ, B7, C6, C7, LD(※)）
11.0% max.（F）
Insulation resistance
: 50 MΩμF or 1000 MΩ, whichever is smaller.
Note: ※LD Low distortion high value multilayer ceramic capacitor
Class 1
High Frequency Type
None
6 to 24hr （Standard condition） Note 5
24±2 hrs （Standard condition） Note 5
Note: ※LD Low distortion high value multilayer ceramic capacitor
Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail.
Note 2 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperature for
24±2hours.
Note 3 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in
the test conditions, and kept at room temperature for 24±2hours.
Note 4 150% of rated voltage is applicable to some items. Please refer to their specifications for further information.
Note 5 Standard condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa When there are questions concerning
measurement results, in order to provide correlation data, the test shall be conducted under the following condition.
Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa Unless otherwise specified, all the tests are conducted under the
"standard condition".
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-01
High Reliability Application Multilayer Ceramic Capacitors are noted separately.
Precautions on the use of Multilayer Ceramic Capacitors
■PRECAUTIONS
1. Circuit Design
Precautions
◆Verification of operating environment, electrical rating and performance
1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have
severe social ramifications.
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from
them used in general purpose applications.
◆Operating Voltage （Verification of Rated voltage）
1. The operating voltage for capacitors must always be their rated voltage or less.
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.
2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC
voltage or a pulse voltage having rapid rise time is used in a circuit.
2. PCB Design
Precautions
◆Pattern configurations （Design of Land-patterns）
1. When capacitors are mounted on PCBs, the amount of solder used （size of fillet） can directly affect the capacitor performance.
Therefore, the following items must be carefully considered in the design of land patterns:
（1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider
appropriate land-patterns for proper amount of solder.
（2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by
solder-resist.
◆Pattern configurations （Capacitor layout on PCBs）
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （PCB
cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land
pattern configurations and positions of capacitors shall be carefully considered to minimize stresses.
◆Pattern configurations （Design of Land-patterns）
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.
（1）Recommended land dimensions for typical chip capacitors
Land patterns for PCBs
●Multilayer Ceramic Capacitors : Recommended land dimensions
（unit: mm）
Wave-soldering
Type
107
212
316
325
L
1.6
2.0
3.2
3.2
Size
W
0.8
1.25
1.6
2.5
A
0.8 to 1.0
1.0 to 1.4
1.8 to 2.5
1.8 to 2.5
B
0.5 to 0.8
0.8 to 1.5
0.8 to 1.7
0.8 to 1.7
C
0.6 to 0.8
0.9 to 1.2
1.2 to 1.6
1.8 to 2.5
Technical
considerations
Reflow-soldering
Type
042
063
105
L
0.4
0.6
1.0
Size
W
0.2
0.3
0.5
A
0.15 to 0.25
0.20 to 0.30
0.45 to 0.55
B
0.15 to 0.20
0.20 to 0.30
0.40 to 0.50
C
0.15 to 0.30
0.25 to 0.40
0.45 to 0.55
Note：Recommended land size might be different according
107
212
316
1.6
2.0
3.2
0.8
1.25
1.6
0.8 to 1.0
0.8 to 1.2
1.8 to 2.5
0.6 to 0.8
0.8 to 1.2
1.0 to 1.5
0.6 to 0.8
0.9 to 1.6
1.2 to 2.0
to the allowance of the size of the product.
325
3.2
2.5
1.8 to 2.5
1.0 to 1.5
1.8 to 3.2
432
4.5
3.2
2.5 to 3.5
1.5 to 1.8
2.3 to 3.5
●LWDC: Recommended land dimensions for reflow-soldering
（unit: mm）
Type
105
107
212
L
0.52
0.8
1.25
Size
W
1.0
1.6
2.0
A
0.18 to 0.22
0.25 to 0.3
0.5 to 0.7
B
0.2 to 0.25
0.3 to 0.4
0.4 to 0.5
C
0.9 to 1.1
1.5 to 1.7
1.9 to 2.1
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-01
（2）Examples of good and bad solder application
Items
Not eommended
Recommended
Mixed mounting of SMD and
leaded components
Component placement close to
the chassis
Hand-soldering of leaded
Components near mounted
components
Horizontal component
placement
◆Pattern configurations （Capacitor layout on PCBs）
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any
stresses from board warp or deflection.
Items
Not recommended
Recommended
Deflection of board
possible mechanical
Place the product at a right
angle to the direction of the
anticipated mechanical
stress.
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods
are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB,
split methods as well as chip location.
3. Mounting
Precautions
◆Adjustment of mounting machine
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2. Maintenance and inspection of mounting machines shall be conducted periodically.
◆Selection of Adhesives
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the
following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and
hardening period. Therefore, please contact us for further information.
Technical
considerations
◆Adjustment of mounting machine
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid
this, the following points shall be considerable.
（1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.
（2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
（3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be
used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle
placement:
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-01
Items
Not recommended
Recommended
Single-sided mounting
Double-sided mounting
2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical
impact on the capacitors.
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of
the pin shall be conducted periodically.
◆Selection of Adhesives
Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in
stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect
components. Therefore, the following precautions shall be noted in the application of adhesives.
（1）Required adhesive characteristics
a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have sufficient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency.
d. The adhesive shall be used during its prescribed shelf life.
e. The adhesive shall harden rapidly.
f. The adhesive shall have corrosion resistance.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no effect on the human body.
（2）The recommended amount of adhesives is as follows;
After capacitors are bonded
Amount adhesive
［Recommended condition］
Figure
212/316 case sizes as examples
a
0.3mm min
b
100 to 120μm
c
Adhesives shall not contact land
4. Soldering
Precautions
◆Selection of Flux
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
（1）Flux used shall be less than or equal to 0.1 wt%（ in Cl equivalent） of halogenated content. Flux having a strong acidity content shall
not be applied.
（2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.
（3）When water-soluble flux is used, special care shall be taken to properly clean the boards.
◆Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.
Technical
considerations
◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.） content is used to activate flux, or highly acidic flux is used, it may lead to
corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted
and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high
humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning
methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used.
◆Soldering
･ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
･ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal
shock.
･ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within
100 to 130℃.
･ Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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［Reflow soldering］
【Recommended conditions for eutectic
soldering】
【Recommended condition for Pb-free
soldering】
Caution
①The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the
thickness of a capacitor.
②Because excessive dwell times can adversely affect solderability, soldering duration shall
be kept as close to recommended times as possible.
［Wave soldering］
【Recommended conditions for eutectic
soldering】
【Recommended condition for Pb-free
soldering】
Caution
①Wave soldering must not be applied to capacitors designated as for reflow soldering only.
［Hand soldering］
【Recommended conditions for eutectic
【Recommended condition for Pb-free
soldering】
soldering】
316type or less
⊿T
⊿T≦150℃
325type or more
⊿T
⊿T≦130℃
Caution
①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
②The soldering iron shall not directly touch capacitors.
5. Cleaning
Precautions
Technical
considerations
◆Cleaning conditions
1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use
of the cleaning. （e.g. to remove soldering flux or other materials from the production process.）
2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect
capacitor's characteristics.
1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate
their outer coating, resulting in a degradation of the capacitor's electrical properties （especially insulation resistance）.
2. Inappropriate cleaning conditions（ insufficient or excessive cleaning） may adversely affect the performance of
the capacitors.
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead
to the
cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall
be carefully checked;
Ultrasonic output :
20 W/ℓ or less
Ultrasonic frequency :
40 kHz or less
Ultrasonic washing period : 5 min. or less
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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6. Resin coating and mold
Precautions
1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the
hardening period or
while left under normal storage conditions resulting in the deterioration of the capacitor's performance.
2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat
may lead to damage or destruction of capacitors.
The use of such resins, molding materials etc. is not recommended.
7. Handling
◆Splitting of PCB
1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.
2. Board separation shall not be done manually, but by using the appropriate devices.
Precautions
◆Mechanical considerations
Be careful not to subject capacitors to excessive mechanical shocks.
（1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.
（2）Please be careful that the mounted components do not come in contact with or bump against other boards or
components.
8. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control
temperature and humidity in the storage area. Humidity should especially be kept as low as possible.
・Recommended conditions
Ambient temperature : Below 30℃
Humidity
: Below 70% RH
The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as
time passes, so capacitors shall be used within 6 months from the time of delivery.
・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.
2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so
care shall be
taken to design circuits . Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at
150℃ for 1hour.
Technical
considerations
If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and
quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the
above period, please check solderability before using the capacitors.
※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA.
Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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