CSPEMI400 SIM Card EMI Filter Array with ESD Protection Features Product Description • CAMD's CSPEMI400 is an EMI filter array with ESD protection, which integrates three pi filters (C-R-C) and two additional channels of ESD protection. The CSPEMI400 has component values of 20pF-47Ω-20pF, and 20pF-100Ω-20pF. The parts include avalanchetype ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of ±10kV, beyond the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±25kV. • • • • • • Three channels of EMI filtering, each with ESD protection Two additional channels of ESD-only protection ±10kV ESD protection (IEC 61000-4-2, contact discharge) ±25kV ESD protection (HBM) Greater than 30dB of attenuation at 1GHz 10-bump, 1.960mm x 1.330mm footprint Chip Scale Package (CSP) Lead-free version available Applications • • • SIM Card slot in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs, etc. EMI filtering for data ports in cell phones, PDAs or notebook computers The ESD diodes on pins A4 and C4 ports are designed and characterized to safely dissipate ESD strikes of ±10kV, well beyond the maximum requirement of the IEC 61000-4-2 international standard. This device is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package format and easy-touse pin assignments. In particular, the CSPEMI400 is ideal for EMI filtering and protecting data lines from ESD for the SIM card slot in mobile handsets. The CSPEMI400 is available in a space-saving, lowprofile Chip Scale Package with optional lead-free finishing. Electrical Schematic R1 R2 A1 C1 C A2 C C2 C C GND R1 A3 C3 C A4 C4 C C B2,B4 C R1=100Ω R2=47Ω © 2003 California Micro Devices Corp. All rights reserved. 10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 1 CSPEMI400 PACKAGE / PINOUT DIAGRAMS TOP VIEW (Bumps Down View) Orientation Marking (see note 2) 1 2 3 BOTTOM VIEW (Bumps Up View) 4 A A4 A2 Orientation Marking A1 A1 AG B A3 B2 C C4 B1 C3 C2 C1 CSPEMI400 CSP Package Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS TYPE PIN DESCRIPTION EMI Filter A1 EMI Filter with ESD Protection for RST Signal C1 EMI Filter with ESD Protection for RST Signal A2 EMI Filter with ESD Protection for CLK Signal C2 EMI Filter with ESD Protection for CLK Signal Device Ground B1 Device Ground B2 Device Ground EMI Filter A3 DAT EMI Filter with ESD Protection C3 DAT EMI Filter with ESD Protection ESD Channel A4 ESD Proection Channel - VCC Supply ESD Channel C4 ESD Proection Channel EMI Filter Ordering Information PART NUMBERING INFORMATION Lead-free Finish 2 Standard Finish Ordering Part Bumps Package Number1 10 CSP CSPEMI400 Ordering Part Part Marking Number1 Part Marking AG CSPEMI400G AG Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2003 California Micro Devices Corp. All rights reserved. 2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 10/10/03 CSPEMI400 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 300 mW RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS R1 Resistance of R1 80 100 120 Ω R2 Resistance of R2 38 47 56 Ω C Capacitance VIN = 2.5VDC, 1MHz, 30mV ac 16 20 24 pF Stand-off Voltage I = 10µA 5.5 ILEAK Diode Leakage Current VBIAS = 3.3V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA ILOAD = -10mA VSTANDOFF V µA 100 5.6 -1.5 6.8 -0.8 9.0 -0.4 V V In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Notes 2,4 and 5 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3,4 and 5 fC1 Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω R = 100Ω, C = 20pF 77 MHz fC2 Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω R = 47Ω, C = 20pF 85 MHz VESD VCL ±25 kV ±10 kV +12 -7 V V Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: The parameters are guaranteed by design. © 2003 California Micro Devices Corp. All rights reserved. 10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 3 CSPEMI400 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. A1-C1 EMI Filter Performance Figure 2. A2-C2 EMI Filter Performance © 2003 California Micro Devices Corp. All rights reserved. 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 10/10/03 CSPEMI400 Performance Information (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 3. A3-C3 EMI Filter Performance Figure 4. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5VDC) © 2003 California Micro Devices Corp. All rights reserved. 10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 5 CSPEMI400 Application Information The CSPEMI400 provides a bidirectional filter and protector for all the signals and the power line on the SIM (subscriber identity module) card connector. SIM cards are found in all GSM cellular phones and in some other handheld devices or card readers. The ESD diodes protect the controller against possible ESD strikes that may occur when the connector pins are exposed during direct con- tact, or during insertion of the SIM card into the card slot. The EMI filter suppresses all high-frequency noise, preventing the unwanted EMI signals from both entering and exiting the main board. The signals that interface with the SIM card are the Reset, the Clock and the bidirectional data I/O, as shown in Figure 5. CSPEMI400 Controller with logic level translator SIM Card Connector 100ohm RST 47ohm CLK 100ohm I/O VCC VCC supply (5V, 3.3V or 1.8V) Reset Clock Data I/O 5V/3V/1.8V 1uF GND GND Note: One channel of the CSPEMI400 with a zener diode is not shown on the diagram. Figure 5. Typical Application Diagram for the SIM Card Interface For best filter and ESD performance, both GND bumps (B1, B2) of the CSPEMI400 should be directly connected to the Ground plane. A small capacitor of about 1µF is required next to the VCC pin of the SIM connector in order to improve stability of the SIM card supply rail. For information on the assembly of the CSPEMI400 to the PCB (printed circuit board), please refer to the Chip Scale Package (CSP) Application Note AP217, or contact factory at 800-325-4966 for technical support. © 2003 California Micro Devices Corp. All rights reserved. 6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 10/10/03 CSPEMI400 Application Information (cont’d) Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125 - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50µm Solder Ball Side Coplanarity +20µm Maximum Dwell Time Above Liquidous 60 seconds Soldering Maximum Temperature 260°C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 6. Recommended Non-Solder Mask Defined Pad Illustration Temperature (°C) 250 200 150 100 50 0 Figure 7. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 8. Lead-free (SnAgCu) Solder Ball Reflow Profile © 2003 California Micro Devices Corp. All rights reserved. 10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 7 CSPEMI400 CSP Mechanical Specifications Mechanical Package Diagrams CSPEMI400 devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. BOTTOM VIEW A1 SIDE VIEW C1 B4 B3 B2 B1 C PACKAGE DIMENSIONS Custom CSP B Bumps 10 A Min Nom Inches Max Min Nom 1 1.915 1.960 2.005 0.0754 0.0772 0.0789 A2 1.285 1.330 1.375 0.0506 0.0524 0.0541 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 D1 0.561 0.605 0.649 0.0221 0.0238 0.0255 D2 0.355 0.380 0.405 0.0140 0.0150 0.0159 # per tape and reel 3 4 Max A1 0.091 2 C2 Dim Millimeters A2 Package 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS D1 D2 DIMENSIONS IN MILLIMETERS Package Dimensions for CSPEMI400 Chip Scale Package 0.0110 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CSPEMI400 1.96 X 1.33 X 0.6 2.08 X 1.45 X 0.71 8mm 178mm (7") 3500 4mm 4mm Po Top Cover Tape 10 Pitches cumulative tolerance on tape ±0.2 mm Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment P1 Center lines of cavity User direction of feed Figure 9. Tape and Reel Mechanical Data © 2003 California Micro Devices Corp. All rights reserved. 8 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 10/10/03