PRELIMINARY CM1425 4 Channel EMI Filter Array with ESD Protection Features Product Description • • • CAMD's CM1425 is an EMI filter array with ESD protection, which integrates 4 pi filters (C-R-C). The CM1425 has component values of 20pF-100Ω-20pF. The parts include ESD protection diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of ±15kV, beyond the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. • • • • • Four channels of EMI filtering with ESD protection Pin compatible with CMD’s CSPRC032A Greater than 30dB attenuation over the 800MHz to 3GHz frequency range ±15kV ESD protection (IEC 61000-4-2, contact discharge) ±30kV ESD protection (HBM) 9-bump, 2.470mm x 0.970mm footprint Chip Scale Package (CSP) Available with Optiguard™ coating for improved reliability Lead-free versions available Applications • • • • This device is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package format and easy-touse pin assignments. In particular, the CM1425 is ideal for EMI filtering and protecting data lines from ESD in wireless handsets. FIltering for antenna and keypad data lines I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. EMI filtering for LCD and chip-to-chip data lines in mobile electronic devices that use flexible PCB interconnections All CM1425 devices are optionally available with OptiGuard™ coating which results in improved reliability at assembly. These devices are also available with standard and lead-free finishing. The CM1425 is housed in a space-saving, low-profile, chip-scale package and is fabricated with California Micro Devices' Centurion™ processes. Electrical Schematic 100Ω 100Ω FILTER+ESD1* FILTER+ESD1* 20pF 20pF FILTER+ESD3* GND (Pin B3) 100Ω 20pF 100Ω FILTER+ESD2* FILTER+ESD2* 20pF FILTER+ESD3* 20pF 20pF FILTER+ESD4* FILTER+ESD4* 20pF 20pF © 2004 California Micro Devices Corp. All rights reserved. 04/21/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 1 PRELIMINARY CM1425 PACKAGE / PINOUT DIAGRAMS Orientation Marking (see note 2) 1 A 1 A B BOTTOM VIEW (Bumps Up View) 2 3 4 5 N251 B Orientation Marking (see note 2) TOP VIEW (Bumps Down View) 2 3 4 5 A5 A4 B5 B4 A5 A4 B5 B4 B3 A2 A1 B2 B1 A2 A1 B2 B1 CM1425-01 CSP Package (No coating) N253 B3 CM1425-03 CSP Package (OptiGuard™ coating) Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS PIN(s) NAME DESCRIPTION PIN(s) NAME DESCRIPTION A1 FILTER+ESD1 Filter Channel 1 B1 FILTER+ESD1 Filter Channel 1 A2 FILTER+ESD2 Filter Channel 2 B2 FILTER+ESD2 Filter Channel 2 A4 FILTER+ESD3 Filter Channel 3 B4 FILTER+ESD3 Filter Channel 3 A5 FILTER+ESD4 Filter Channel 4 B5 FILTER+ESD4 Filter Channel 4 B3 GND Device Ground Ordering Information PART NUMBERING INFORMATION Lead-free Finish2 Standard Finish Optiguard™ Coated No Coating Ordering Part Optiguard™ Coated No Coating Number1 Number1 Part Marking Ordering Part Number1 Part Marking Ordering Part PKG Part Marking Ordering Part Bumps Number1 Part Marking 9 CSP CM1425-01CS N251 CM1425-03CS N253 CM1425-01CP N251 CM1425-03CP N253 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2004 California Micro Devices Corp. All rights reserved. 2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 04/21/04 PRELIMINARY CM1425 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range RATING UNITS -65 to +150 °C Power Rating per Resistor 100 mW Package Power Rating 300 mW RATING UNITS -40 to +85 °C STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL PARAMETER MIN TYP MAX UNITS 80 100 120 Ω At 2.5V DC, 1MHz, 30mV AC 16 20 24 pF Diode Standoff Voltage IDIODE = 10µA 5.5 ILEAK Diode Leakage Current (reverse bias) VDIODE = 3.3V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA ILOAD = -10mA R Resistance C Capacitance VDIODE VESD VCL fC CONDITIONS In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-42 Level 4 Notes 2,4 and 5 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3,4 and 5 Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω R = 100Ω, C = 20pF 5.6 -1.5 V 6.8 -0.8 100 nA 9.0 -0.4 V V ±30 kV ±15 kV +12 -7 V V 86 MHz Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: These parameters are guaranteed by design and characterization. © 2004 California Micro Devices Corp. All rights reserved. 04/21/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 3 PRELIMINARY CM1425 Performance Information . Figure 1. CM1425 Filter Typical Measured Frequency Response Figure 2. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) © 2004 California Micro Devices Corp. All rights reserved. 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 04/21/04 PRELIMINARY CM1425 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125 - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50µm Solder Ball Side Coplanarity +20µm Maximum Dwell Time Above Liquidous 60 seconds Soldering Maximum Temperature 260°C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 3. Recommended Non-Solder Mask Defined Pad Illustration Temperature (°C) 250 200 150 100 50 0 Figure 4. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 5. Lead-free (SnAgCu) Solder Ball Reflow Profile © 2004 California Micro Devices Corp. All rights reserved. 04/21/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 5 PRELIMINARY CM1425 Mechanical Details CM1425 devices are packaged in a custom Chip Scale Packages (CSP) and available with optional OptiGuard™ coating. Mechanical Package Diagrams . Non-coated CSP CM1425 9-bump CSP Mechanical Specifications The CM1425 devices are packaged in a 9-bump custom Chip Scale Package (CSP). Dimensions are presented below. BOTTOM VIEW A1 C1 B2 B1 5 PACKAGE DIMENSIONS 4 Package Custom CSP Bumps 9 2 Inches Nom Max A1 0.925 0.970 1.015 0.0364 0.0382 0.0400 A2 2.425 2.470 2.515 0.0955 0.0972 0.0990 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.495 0.500 0.505 0.0195 0.0197 0.0199 C1 0.185 0.235 0.285 0.0073 0.0093 0.0112 C2 0.185 0.235 0.285 0.0073 0.0093 0.0112 D11 0.562 0.606 0.650 0.0221 0.0239 0.0256 D21 0.356 0.381 0.406 0.0140 0.0150 0.0160 D32 0.600 0.670 0.739 0.0236 0.0264 0.0291 D42 0.394 0.445 0.495 0.0155 0.0175 0.0195 # per tape and reel Min Nom Max 3500 pieces Controlling dimension: millimeters B A B A 1 D1 0.30 DIA. D2 63/37 Sn/Pb (Eutectic) or 95.5/3.8/0.7 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW OptiGuard™ Coated CSP BOTTOM VIEW A1 OptiGuardTM Coating C1 B1 B2 Min A2 Millimeters C2 Dim 3 5 4 B A B A C2 2 A2 3 Note 1: Applies to uncoated devices only. Note 2: Applies to OptiGuard (coated) devices only. 1 D3 0.30 DIA. D4 63/37 Sn/Pb (Eutectic) or 95.5/3.8/0.7 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW DIMENSIONS IN MILLIMETERS Package Dimensions CM1425 9-bump Chip Scale Package © 2004 California Micro Devices Corp. All rights reserved. 6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 04/21/04 PRELIMINARY CM1425 Mechanical Details (cont’d) CSP Tape and Reel Specifications TAPE WIDTH W REEL DIA. QTY PER REEL P0 P1 PART NUMBER PKG. SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 CM1425-01 2.470 X 0.970 X 0.606 2.62 X 1.12 X 0.762 8mm 178mm (7") 3500 4mm 4mm CM1425-03 2.470 X 0.970 X 0.670 2.62 X 1.12 X 0.762 8mm 178mm (7") 3500 4mm 4mm Po Top Cover Tape 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment P1 Center Lines of Cavity User Direction of Feed Figure 6. Tape and Reel Mechanical Data © 2004 California Micro Devices Corp. All rights reserved. 04/21/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 7