NUD3212 Product Preview Integrated NPN Transistor with Free Wheeling Diode to Drive Inductive Loads This device is used to switch inductive loads between 1.0 V and 12 V such as small PCB relays, solenoids, and lamps. It is intended to replace an array of these or more discrete components with an integrated SMT device. http://onsemi.com INTERNAL CIRCUIT DIAGRAMS 5 4 Features • Optimized to Switch Inductive Pager/Phone Loads Such as Motors, Lamps and Speakers from a 1.0 V to 12 V Rail • Low VCE(SAT) Performance • Integrated Free-wheeling Diode • Provide a Robust Driver Interface between Inductive Load and 1 2 3 419A Sensitive Logic Circuits 6 5 4 Q2 Applications • Pager Silent Alert Motor • Pager E/M Acoustic Transducers • Cell Phone Vibrators Q1 1 MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Rating 2 3 419B Symbol Value Unit Collector-Base Voltage VCBO 15 Vdc MARKING DIAGRAMS Emitter-Base Voltage VEBO 5.0 Vdc 5 IC 100 mAd c Collector-Current - Continuous Diode Reverse Voltage VR 12 Vdc Symbol Max Unit PD 150 mW RJA 833 °C/W TJ, Tstg -55 to 150 °C THERMAL CHARACTERISTICS Characteristic Total Device Dissipation Thermal Resistance Junction to Ambient Junction and Storage Temperature This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice. 4 J2 D SC-88A (SOT-353) CASE 419A Style 8 1 2 3 6 J2 D 1 SC-88 (SOT-363) CASE 419B Style 25 J2 = Specific Device Code D = Date Code ORDERING INFORMATION Semiconductor Components Industries, LLC, 2003 June, 2003 - Rev. P0 1 Device Package Shipping NUD3212W5T1 SC-88A 3000 Tape & Reel NUD3212DWT1 SC-88 3000 Tape & Reel Publication Order Number: NUD3212/D NUD3212 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max 15 - - 5.0 - - 100 - 400 - - 0.125 - - 0.900 100 - - - - 18 - - 105 8.0 - - - - 1.0 - - 25 Unit OFF CHARACTERISTICS Collector - Emitter Breakdown Voltage (IC = 1.0 mAdc, IB = 0 mAdc) V(BR)CEO Emitter - Base Breakdown Voltage (IC = 10 Adc, IC = 0 mAdc) V(BR)EBO Vdc Vdc ON CHARACTERISTICS hFE DC Current Gain (IC = 100 mAdc, VBE = 5.0 Vdc) Collector - Emitter Saturation Voltage (IC = 100 mAdc, IB = 10 mAdc) VCE(sat) Base - Emitter Saturation Voltage (IC = 100 mAdc, IB = 1.0 mAdc) VBE(sat) Vdc Vdc SMALL- SIGNAL CHARACTERISTICS fT Current - Gain - Bandwidth Product (IC = 50 mAdc, VCE = 5.0 Vdc, f = 20 MHz) Output Capacitance (VCB = 10 Vdc, f = 1.0 MHz) Cobo Input Capacitance (VEB = 0.5 Vdc, f = 1.0 MHz) Cibo MHz pF pF DIODE CHARACTERISTICS V(BR) Reverse Breakdown Voltage (I(BR) = 100 Adc) Forward Voltage (IF = 50 mAdc) VF Reverse Recovery Time (IF = IR = 10 mAdc) trr 3 Vdc Vdc ns 1 V TO 12 Vdc VCC SPEAKER CMOS MCU Vdc (2) NUD3212WT1 VIBRATOR Vout Vout (6) (3) Vin Vin (1) (4) GND (5) Figure 1. Multiple Loads With Dual Inductive Load Driver http://onsemi.com 2 NUD3212 INFORMATION FOR USING THE SOT-353/SC-88A SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ 0.65 mm 0.65 mm 0.4 mm (min) 0.5 mm (min) SOT-353 1.9 mm SOT-353/SC-88A POWER DISSIPATION The power dissipation of the SOT-353/SC-88A is a function of the pad size. This can vary from the minimum pad size for soldering to the pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet, PD can be calculated as follows. PD = the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device which in this case is 125 milliwatts. PD = 150°C - 25°C 833°C/W = 150 milliwatts The 833°C/W assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 150 milliwatts. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad. Using a board material such as Thermal Clad, a higher power dissipation can be achieved using the same footprint. TJ(max) - TA RJA The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into SOLDERING PRECAUTIONS • The soldering temperature and time should not exceed The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. • Always preheat the device. • The delta temperature between the preheat and soldering should be 100°C or less.* • When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10°C. • • • 260°C for more than 10 seconds. When shifting from preheating to soldering, the maximum temperature gradient should be 5°C or less. After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. http://onsemi.com 3 NUD3212 SOLDER STENCIL GUIDELINES The stencil opening size for the surface mounted package should be the same as the pad size on the printed circuit board, i.e., a 1:1 registration. Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass or stainless steel with a typical thickness of 0.008 inches. TYPICAL SOLDER HEATING PROFILE The line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177-189 °C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings make up a heating “profile” for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 7 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. STEP 1 PREHEAT ZONE 1 RAMP" 200°C 150°C STEP 5 STEP 4 HEATING HEATING ZONES 3 & 6 ZONES 4 & 7 SPIKE" SOAK" STEP 2 STEP 3 VENT HEATING SOAK" ZONES 2 & 5 RAMP" DESIRED CURVE FOR HIGH MASS ASSEMBLIES 205° TO 219°C PEAK AT SOLDER JOINT 170°C 160°C 150°C 140°C 100°C 100°C 50°C STEP 6 STEP 7 VENT COOLING SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS ASSEMBLIES TIME (3 TO 7 MINUTES TOTAL) TMAX Figure 2. Typical Solder Heating Profile http://onsemi.com 4 NUD3212 INFORMATION FOR USING THE SOT-363 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ 0.65 mm 0.65 mm SOT-363 0.5 mm (min) 0.4 mm (min) interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 1.9 mm SOT-363 POWER DISSIPATION SOLDERING PRECAUTIONS The power dissipation of the SOT-363 is a function of the pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA. Using the values provided on the data sheet for the SOT-363 package, PD can be calculated as follows: PD = The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. • Always preheat the device. • The delta temperature between the preheat and soldering should be 100°C or less.* • When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10°C. • The soldering temperature and time shall not exceed 260°C for more than 10 seconds. • When shifting from preheating to soldering, the maximum temperature gradient shall be 5°C or less. • After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. • Mechanical stress or shock should not be applied during cooling. TJ(max) - TA RJA The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device which in this case is 120 milliwatts. PD = 120°C - 25°C 833°C/W = 120 milliwatts The 833°C/W for the SOT-363 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 120 milliwatts. There are other alternatives to achieving higher power dissipation from the SOT-363 package. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad. Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. http://onsemi.com 5 NUD3212 PACKAGE DIMENSIONS SC-88A/SOT-353 CASE 419A-01 ISSUE F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. A G 5 DIM A B C D G H J K N S 4 -B- S 1 2 3 D 5 PL 0.2 (0.008) M B M N J C H K http://onsemi.com 6 INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC −−− 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC −−− 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 NUD3212 PACKAGE DIMENSIONS SC-88/SOT-363 CASE 419B-02 ISSUE N A G 6 5 4 1 2 3 DIM A B C D G H J K N S -B- S D 6 PL 0.2 (0.008) M B M N J C H NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419B-01 OBSOLETE, NEW STANDARD 419B-02. K http://onsemi.com 7 INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 NUD3212 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer-s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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PUBLICATION ORDERING INFORMATION Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: [email protected] JAPAN: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. N. American Technical Support: 800-282-9855 Toll Free USA/Canada http://onsemi.com 8 NUD3212/D