NUP4103FC Four Channel ESD Array This integrated transient voltage suppressor device (TVS) is designed for applications requiring transient overvoltage protection. It is intended for use in sensitive portable equipment and other applications. Its integrated design provides very effective and reliable protection for four (4) separate lines using only one package. These devices are ideal for situations where board space is a premium. http://onsemi.com Features • • • • CIRCUIT DESCRIPTION Unidirectional, Quad ESD Protection Ultra-small Flip Chip Packaging (0.95 mm x 1.33 mm) Compliance with IEC61000-4-2 (Level 4) Requirements Maximum Leakage Current of 100 nA at 3.3 V A1 C1 B2 Benefits • Protects Four Data Lines from ESD while Reducing Component Count • Small Package Saves On PCB Real Estate • Provides Protection for ESD Industry Standards, IEC 61000, HBM • A3 C3 and MM Low Leakage Capability Minimizes Power Loss in the System Applications • • • • ESD Protection for Portable Equipment Cell Phones MP3 Players PDAs 5 PIN FLIP CHIP CSP CASE 766AB PLASTIC TOP VIEW (Bumps Down) MAXIMUM RATINGS (TJ = 25°C, unless otherwise specified) Rating Symbol ESD Discharge IEC61000-4-2, - Air Discharge - Contact Discharge Human Body Model Machine Model 1 2 3 Value Unit VPP 3 A A B B C C 2 1 kV 30 30 16 1.6 Junction Temperature TJ 150 °C Operating Ambient Temperature Range TA -40 to +85 °C TSTG -55 to +150 °C Storage Temperature Range BOTTOM VIEW (Bumps Up) DEVICE MARKING È È ED E = Specific Device Code D = Month Code ORDERING INFORMATION Semiconductor Components Industries, LLC, 2003 June, 2003 - Rev. 0 1 Device Package Shipping NUP4103FCT1 Flip Chip 3000/Tape & Reel Publication Order Number: NUP4103FC/D NUP4103FC ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified) Parameter Symbol Conditions VRWM IRWM = 10 A (Note 1) VBR IT = 1.0 mA (Note 2) Leakage Current IR VRM = 3.3 V per line Junction Capacitance CJ VR = 2.5 V, f = 1 MHz Reverse Stand-Off Voltage Breakdown Voltage Min 6.0 Typ 7.0 Max Unit 5.5 V 8.0 V 100 nA 30 pF 1. TVS devices are normally selected according to the working peak reverse voltage (VRWM) which should be equal or greater than the DC or continuous peak operating voltage level. 2. VBR is measured at pulse test current IT. TYPICAL PERFORMANCE CURVES (TJ = 25°C unless otherwise specified) 50 100.0E-9 IR, Leakage Current (A) C, Capacitance (pF) 45 40 35 30 10.0E-9 1.0E-9 100.0E-12 25 20 0 1 2 3 VR, Reverse Voltage (V) 4 5 10.0E-12 -40 Figure 1. Reverse Voltage vs Junction Capacitance -15 35 10 T, Temperature (°C) 60 Figure 2. Reverse Leakage Current vs Junction Temperature http://onsemi.com 2 85 NUP4103FC 200 ns 2.0 V/div Figure 3. ESD Response for Human Body Model (+8 kV) 500 mV/div 200 ns Figure 4. ESD Response for Human Body Model (-8 kV) http://onsemi.com 3 NUP4103FC Printed Circuit Board Recommendations 500 m Pitch 300 m Solder Ball Parameter 250 m +25 / -0 PCB Pad Size Pad Shape Round Pad Type NSMD 350 m ±25 Solder Mask Opening 125 m Solder Stencil Thickness Stencil Aperture 250 x 250 m sq. Solder Flux Ratio 50/50 Solder Paste Type No Clean Type 3 or Finer Trace Finish OSP Cu Trace Width 150 m Max Copper Solder Mask NSMD SMD Figure 5. Solder Mask versus Non-Solder Mask Definition Controlled Atmosphere 250 225°C Min 235°C Max TEMPERATURE (°C) 200 183 °C 2 to 5 °C/s 150 140 to 160 °C 100 50 1 to 5 °C/s 0 0 1 2 3 4 1 to 2 min 30-100 sec TIME (minutes) Figure 6. Solder Reflow Profile http://onsemi.com 4 5 NUP4103FC PACKAGE DIMENSIONS 5 PIN FLIP CHIP CSP CASE 766AB-01 ISSUE O D 4X A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. 0.10 C È È TERMINAL A1 LOCATOR E A1 0.10 C A2 A C 0.05 C SEATING PLANE D1 f 1 5X b 0.05 C A B 0.03 C e 2 3 A B C http://onsemi.com 5 DIM A A1 A2 D E b e f D1 MILLIMETERS MIN MAX --0.680 0.210 0.270 0.380 0.430 1.330 BSC 0.960 BSC 0.290 0.340 0.500 BSC 0.433 BSC 0.866 BSC NUP4103FC ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. PUBLICATION ORDERING INFORMATION Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: [email protected] JAPAN: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. N. American Technical Support: 800-282-9855 Toll Free USA/Canada http://onsemi.com 6 NUP4103FC/D