ETC NUP4103FCT1/D

NUP4103FC
Four Channel ESD Array
This integrated transient voltage suppressor device (TVS) is
designed for applications requiring transient overvoltage protection. It
is intended for use in sensitive portable equipment and other
applications. Its integrated design provides very effective and reliable
protection for four (4) separate lines using only one package. These
devices are ideal for situations where board space is a premium.
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Features
•
•
•
•
CIRCUIT DESCRIPTION
Unidirectional, Quad ESD Protection
Ultra-small Flip Chip Packaging (0.95 mm x 1.33 mm)
Compliance with IEC61000-4-2 (Level 4) Requirements
Maximum Leakage Current of 100 nA at 3.3 V
A1
C1
B2
Benefits
• Protects Four Data Lines from ESD while Reducing Component
Count
• Small Package Saves On PCB Real Estate
• Provides Protection for ESD Industry Standards, IEC 61000, HBM
•
A3
C3
and MM
Low Leakage Capability Minimizes Power Loss in the System
Applications
•
•
•
•
ESD Protection for Portable Equipment
Cell Phones
MP3 Players
PDAs
5 PIN FLIP CHIP CSP
CASE 766AB
PLASTIC
TOP VIEW
(Bumps Down)
MAXIMUM RATINGS (TJ = 25°C, unless otherwise specified)
Rating
Symbol
ESD Discharge IEC61000-4-2,
- Air Discharge
- Contact Discharge
Human Body Model
Machine Model
1 2 3
Value
Unit
VPP
3
A
A
B
B
C
C
2 1
kV
30
30
16
1.6
Junction Temperature
TJ
150
°C
Operating Ambient Temperature
Range
TA
-40 to +85
°C
TSTG
-55 to +150
°C
Storage Temperature Range
BOTTOM VIEW
(Bumps Up)
DEVICE MARKING
È
È
ED
E = Specific Device Code
D = Month Code
ORDERING INFORMATION
 Semiconductor Components Industries, LLC, 2003
June, 2003 - Rev. 0
1
Device
Package
Shipping
NUP4103FCT1
Flip Chip
3000/Tape & Reel
Publication Order Number:
NUP4103FC/D
NUP4103FC
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified)
Parameter
Symbol
Conditions
VRWM
IRWM = 10 A (Note 1)
VBR
IT = 1.0 mA (Note 2)
Leakage Current
IR
VRM = 3.3 V per line
Junction Capacitance
CJ
VR = 2.5 V, f = 1 MHz
Reverse Stand-Off Voltage
Breakdown Voltage
Min
6.0
Typ
7.0
Max
Unit
5.5
V
8.0
V
100
nA
30
pF
1. TVS devices are normally selected according to the working peak reverse voltage (VRWM) which should be equal or greater than the DC
or continuous peak operating voltage level.
2. VBR is measured at pulse test current IT.
TYPICAL PERFORMANCE CURVES
(TJ = 25°C unless otherwise specified)
50
100.0E-9
IR, Leakage Current (A)
C, Capacitance (pF)
45
40
35
30
10.0E-9
1.0E-9
100.0E-12
25
20
0
1
2
3
VR, Reverse Voltage (V)
4
5
10.0E-12
-40
Figure 1. Reverse Voltage vs Junction Capacitance
-15
35
10
T, Temperature (°C)
60
Figure 2. Reverse Leakage Current
vs Junction Temperature
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2
85
NUP4103FC
200 ns
2.0 V/div
Figure 3. ESD Response for Human Body Model (+8 kV)
500 mV/div
200 ns
Figure 4. ESD Response for Human Body Model (-8 kV)
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3
NUP4103FC
Printed Circuit Board Recommendations
500 m Pitch
300 m Solder Ball
Parameter
250 m +25 / -0
PCB Pad Size
Pad Shape
Round
Pad Type
NSMD
350 m ±25
Solder Mask Opening
125 m
Solder Stencil Thickness
Stencil Aperture
250 x 250 m sq.
Solder Flux Ratio
50/50
Solder Paste Type
No Clean Type 3 or Finer
Trace Finish
OSP Cu
Trace Width
150 m Max
Copper
Solder Mask
NSMD
SMD
Figure 5. Solder Mask versus Non-Solder Mask Definition
Controlled Atmosphere
250
225°C Min
235°C Max
TEMPERATURE (°C)
200
183 °C
2 to 5 °C/s
150
140 to 160 °C
100
50
1 to 5 °C/s
0
0
1
2
3
4
1 to 2 min
30-100 sec
TIME (minutes)
Figure 6. Solder Reflow Profile
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4
5
NUP4103FC
PACKAGE DIMENSIONS
5 PIN FLIP CHIP CSP
CASE 766AB-01
ISSUE O
D
4X
A
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
0.10 C
È
È
TERMINAL A1
LOCATOR
E
A1
0.10 C
A2
A
C
0.05 C
SEATING
PLANE
D1
f
1
5X
b
0.05 C A B
0.03 C
e
2
3
A
B
C
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5
DIM
A
A1
A2
D
E
b
e
f
D1
MILLIMETERS
MIN
MAX
--0.680
0.210
0.270
0.380
0.430
1.330 BSC
0.960 BSC
0.290
0.340
0.500 BSC
0.433 BSC
0.866 BSC
NUP4103FC
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make
changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all
liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
Literature Fulfillment:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada
Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada
Email: [email protected]
JAPAN: ON Semiconductor, Japan Customer Focus Center
2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051
Phone: 81-3-5773-3850
ON Semiconductor Website: http://onsemi.com
For additional information, please contact your local
Sales Representative.
N. American Technical Support: 800-282-9855 Toll Free USA/Canada
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6
NUP4103FC/D