NUF3101FC Three Line EMI Filter This device is a three−line EMI filter array for SIM Card wireless applications. Greater than −25 dB attenuation is obtained at frequencies from 800 MHz to 2.2 GHz. ESD protection is provided across all capacitors. Features http://onsemi.com • EMI Filtering and ESD Protection • Integration of 10 Discretes • Provides Protection for IEC61000−4−2 (Level 4) C2 100 R A3 8.0 kV (Contact) 15 kV (Air) Flip−Chip Package Moisture Sensitivity Level 1 ESD Rating: Machine Model = C; Human Body Model = 3B Pb−Free Package is Available* ♦ • • • • 47 R 100 R C1 C3 B2 GND • Reduces EMI/RFI Emissions on a Data Line • Integrated Solution Offers Cost and Space Savings • Reduces Parasitic Inductances Which Offer a More “Ideal” MARKING DIAGRAM A2 Low Pass Filter Response Integrated Solution Improves System Reliability 1 3101 AYWW G G 8−Pin Flip−Chip FC SUFFIX CASE 499AG Applications • • • • B1 B3 ♦ Benefits • A2 SIM Card EMI Filtering and ESD Protection for Data Lines Cell Phones Handheld Products 3101 A Y WW G = Specific Device Code = Assembly Location = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Rating ESD Discharge IEC61000−4−2 Air Discharge Value Unit VPP 15 kV A3 A2 B3 B2 B1 C3 C2 C1 Contact Discharge 8.0 Steady−State Power per Resistor PR 100 mW Steady−State Power per Package PT 300 mW Operating Temperature Range TOP −40 to +85 °C Storage Temperature Range TSTG −55 to +150 °C TJ +125 °C Junction Temperature Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 March, 2006 − Rev. 2 PIN CONFIGURATION Symbol 1 ORDERING INFORMATION Device Package Shipping† NUF3101FCT1 Flip−Chip 3000 Tape & Reel NUF3101FCT1G Flip−Chip (Pb−Free) 3000 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: NUF3101FC/D NUF3101FC ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Test Conditions Min Typ Max Unit Maximum Reverse Working Voltage VRWM − − − 5.6 V VBR IR = 1.0 mA 6.0 − 8.0 V Leakage Current IR VRM = 3.0 V − − 0.1 mA Series Resistance R1 − 80 100 120 W Series Resistance R2 − 38 47 56 W Series Resistance R3 − 80 100 120 W CLINE 1 f = 1.0 MHz, 0 Vdc − − 40 pF f3dB 50 W Source and 50 W Load Termination 100 − 300 MHz Breakdown Voltage Capacitance Cut−Off Frequency TYPICAL PERFORMANCE CURVES (TA = 25°C unless otherwise specified) 0 B3−B1 −5 S21 (dB) −10 A3−A2 −15 −20 −25 −30 C3−C1 −35 1.0E+07 1.0E+08 1.0E+09 1.0E+10 FREQUENCY (Hz) Figure 1. Insertion Loss Characteristics 45 104 B3−B2 40 103 102 RESISTANCE (%) CAPACITANCE (pF) 35 C3−B2 30 25 20 A3−B2 15 10 100 99 98 97 C2−B2 96 5 0 101 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 95 −40 5 REVERSE VOLTAGE (V) −15 10 35 60 TEMPERATURE (°C) Figure 2. Typical Line Capacitance vs. Reverse Bias Voltage Figure 3. Typical Normalized Resistance Over Temperature http://onsemi.com 2 85 NUF3101FC PRINTED CIRCUIT BOARD RECOMMENDATIONS 500 mm Pitch 300 or 350 mm Solder Ball Parameter PCB Pad Size 250 mm +25 −0 Pad Shape Round Pad Type NSMD Solder Mask Opening 350 mm "25 Solder Stencil Thickness 125 mm Stencil Aperture 250 x 250 mm sq. Solder Flux Ratio 50/50 Solder Paste Type No Clean Type 3 or Finer Trace Finish OSP Cu Trace Width 150 mm Max Copper Solder mask NSMD SMD Figure 4. NSMD vs. SMD − − − − − − − − − − − − − − − − − − − − − − − − − − − − Tp = (15−30 sec) Tp = 260°C − 5°C RAMP−UP tL (60−90 sec) RAMP−DOWN PRE−HEAT ZONE 0− 15 − 30 − 45 − 60 − 75 − 90 − 105 − 119 − 134 − 149 − 165 − 180 − 195 − 209 − 224 − 239 − 254 − 269 − 284 − 299 − 314 − 329 − 344 − 359 − 374 − 389 − 404 − 419 − 434 − 449 − 464 − 479 − 494 − TEMPERATURE (°C) 280 270 260 250 240 230 TL= 217 210 200 190 180 170 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 TIME (seconds) Figure 5. Typical Pb−Free Solder Heating Profile http://onsemi.com 3 NUF3101FC PACKAGE DIMENSIONS 8 PIN FLIP−CHIP FC SUFFIX CASE 499AG−01 ISSUE A A 4X D 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B E PIN ONE LOCATION MILLIMETERS DIM MIN MAX A −−− 0.700 A1 0.210 0.270 A2 0.380 0.430 D 1.550 BSC E 1.550 BSC b 0.290 0.340 e 0.500 BSC D1 1.000 BSC E1 1.000 BSC TOP VIEW A2 0.10 C A C 0.05 C A1 SEATING PLANE SIDE VIEW D1 e E1 C B A 8X b 0.05 C A B 1 2 3 BOTTOM VIEW e 0.03 C ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 4 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. NUF3101FC/D