DIGITAL AUDIO PLAYER YP-30S DIGITAL AUDIO PLAYER CONTENTS 1. Precautions 2. Specifications 3. Parts Description 4. Mass-production Initialization Program 5. Troubleshooting Guide 6. Exploded View and Disassembly Order 7. Electrical Part List 8. Block Diagram 9. Internal Block Diagram of Main IC 10. PCB Wiring Diagrams 11. Schematic Diagram ELECTRONICS © Samsung Electronics Co., Ltd. OCT. 2001 Printed in Korea AH68-00999A Precautions 1. Precautions 1-1 Static electricity sense device Some semi-conductor parts may be easily damaged due to static electricity. These elements are generally called as static electricity sense device (ESD). Typically examples of EST include IC, some transistor and chip element for semi-conductor with electrical field effect. The following methods should be used to reduce damage of elements occurred due to static electricity: 1. Contact and emit all the grounding objects with static electricity from your body before handling with elements for semi-conductor or devices with elements for semi-conductor. You should purchase and use static electricity arm rings or commercially available. You should remove it due to potential shock before supplying power to the device under test. 2. You should place appliance on the conductive surface like aluminum film to prevent that static electricity is accumulated or the device is disclosed outside after removing electrical appliance with the ESD device. 3. You should use only soldering iron that is ground when soldering the ESD device. 4. Minimize physical operation when handling with the ESD device for replacement without packing (Otherwise, namely friction between cloth fibers or lifting of the foot from the carpet floor may cause static electricity enough to damage the ESD device). 1-2 Cautions for Safety 1. To remove dust from cabinet, use a dry cloth without using liquid and aerosol cleaner. 2. You should not use attachments not recommended by the company. Otherwise, it may cause critical damage. 3. You should not use this product near water such as bathtub, swimming pool or lake etc. 4. Power supply: A type of battery as displayed on the label should be only used. 5. You should not put any object or liquid into product. Otherwise, it may cause failure or mal-operation. 6. If replacement material is required, service engineer should use materials with the same standard. The use of non-standardized materials may cause failure of product. Samsung Electronics 1-1 MEMO 1-2 Samsung Electronics Specifications 2. Specifications Standards and design may be changed without notice and related weight and dimensions are only approximate. Power 1.5V (1EA of AAA cell) Playing Time Lasts 5 hours(based on Alkaline cell) Memory capacity 64MB Dimensions (WxHxD) / Weight 44 x 65 x 14.5 mm/34g Material of case Plastic / Aluminum File transfer speed Max. 7 Mbps (USB) Earphones output Power 5mW (16Ω earphone) Ratio of signal to noise 85dB with 20KHz LPP Scope of output frequency 20Hz – 20KHz Processor 18MHz, 20bit RISC Temperature characteristics -5 ~ 35OC Samsung Electronics 2-1 MEMO 2-2 Samsung Electronics Parts Description 3. Parts Description Front Side Rear Side Samsung Electronics 3-1 Screen Display Window EQ Display BASS Function Current Time Display Repetition Display/ Section Repetition Display EQ Display Repetition of Semi-music Repetition of All music Shuffle Play Play of Initial Part Under Setting of Section Repetition Section Repetition Play Hold Display (No Display in Release) Display of Cell Remained Text Display Area (Information of the current status is displayed as text) Mode Display Voice Recording Mode Music Play Mode Track Number Play Time Classification of Display Method/ Display of Recording Time Recording Time Play Time Remaining Time Total Time 3-2 Play Time Display/ Recording Time Display The followings are displayed depending on setting: Remained memory : 32 Compression Ratio : 128 Pause Status : STOP Samsung Electronics Mass-production Initialization Program 4. Mass-production Initialization Program 4-1 About Mass-production Initialization Program Program for test and product initialization is provided as separate software in service of this product. This program is not provided to customers and is only designed to use good product inspection and initialization of the ASS’Y PCB obtained from the service center. 4-1-1 Method to supply program Always perform downloading since this program is not provided as a separate diskette but is distributed via YP-30S SVC Manual Sub-Chapter of ITSELF System. 4-1-2 Environment for using program (1) IBM compatible PC (PII 233 or more is recommended) (2) WINDOWS 98SE/ME/2000 (3) USB Interface (4) Supporting 16bits Color or more and using Video Card (5) HDD 5Mbyte or more 4-1-3 Program Function (1) Downloading FONT, ICON, LOGO (2) Testing Download, Delete, Format (3) Downloading Sample Song (4) Saving UID 4-1-4 Method to install program (1) Execute downloaded program (YP30MASS. Exe) (2) Execute installation in accordance with guide of a dialog box. (3) Program (yepp Mass Program.exe) is installed on the desktop if installation is completed. 4-1-5 Method to use program ASS’Y PCB obtained from the service center is not initialized and subject to good product inspection. Please execute as follows for good product inspection and initialization of the obtained ASS’Y. (1) Connect ASS’Y PCB of YP 30S to PC via the USB cable. (2) After connecting YP-30S to PC, wait 1 minute for YP-30S to format itself. (3) No USB communication is done when YP-30S is in clock display mode. Please change to general mode by pressing the (√/ ■) button. (4) Execute program (yepp Mass Program.exe) installed on the basic screen. (5) Select all the test items (all are basically selected). (6) Click START from the operation button. (7) Good product inspection and initialization are successfully completed if a pop-up window called PASS. (8) You can view saved contents if clicking the pop-up window called PASS and then clicking the Test Information TAB. Samsung Electronics 4-1 Mass-production Initialization Program 4-2 Explanation of Mass-production Initialization Program 1. TAB If clicking each tab, you can see the relevant contents. (1) Procedure List -. Test progress information message is output. (2) Error List -. Error message occurred during test progress is output. (3) Test Information -. Result information is output after completing test. 2. SELECT MODEL (model selection) (1) YP-30S -. For YP-30S (selected for this product) (2) YP-MF -. For YP-MF series 3. SAMPLE SONG TYPE (1) OTHER -. Music file to be initially saved among products released in area except for USA. -. Music files at “ WMUSIC W kor W” where program is installed. -. File name: “Yepp-1 groove.mp3”, “Yepp-2 funk.mp3” 4-2 Samsung Electronics Mass-production Initialization Program (2) USA -. Music file to be initially saved among products released in USA. -. Music files at “ W MUSIC W eng W ” where program is installed. -. File name: “Yepp-1 groove.mp3”, “Yepp-2 funk.mp3” 4. Test item (explanation) Select items to test. (1) Font/Icon/Logo -. Ascii Font, Icon, Default Logo, User Logo download check box (2) DOWNLOAD -. Download test check box (file download for test, not for consumer) (3) DELETE -. Delete test check box (4) FORMAT -. Format test check box (5) SAMPLE SONG -. Sample song download check box (basic file provided to consumers) (6) SETUID -. Check box to register UID ❈All items are basically checked (select the only relevant check box if necessary) 5. Operation button Execute the selected test item. (1) START -. Perform test for only . (2) STOP -. Suspend test during test. (3) CLOSE -. Complete test application. Test progress information 1. Circle is filled with blue if no error occurs in the selected test items. 2. Circle is filled with red if error occurs in the selected test items. Samsung Electronics 4-3 MEMO 4-4 Samsung Electronics Troubleshooting Guide 5. Troubleshooting Guide Status of Non-conforming Cause Point of Repair Poor power connection Poor contact of PCB’s battery(+) terminal Replace battery(+) terminal plate. Poor switch Poor key (SW1 – SW6) contact Replace the relevant switch. No back-light ON Poor LCD contact Replace LCD. Poor display or No display (forming of stripe, partial dark) Poor LCD Replace LCD. No initialization Execute initialization program. Poor initialization work Execute initialization program. Poor computer - Test in comparison with other YP-30S set - Test in comparison with other computer Poor USB cable - Test in comparison with other USB cable Soldering of USB port - Ensure soldering status Black screen in display of FONT and LOGO Poor USB communication (perform test sequentially) Samsung Electronics 5-1 MEMO 5-2 Samsung Electronics Exploded View and Disassembly Order 6. Exploded View and Disassembly Order AH64-01376A AH97-00789A AH97-00790A AH97-00791A AH97-00792A AH64-01407A AH64-01379A AH64-01382A AH61-00790A 6003-001257 AH92-01100A AH92-01382A AH07-00059A AH64-01381A AH39-00301A AH59-01014A AH61-00845A AH63-00380A AH63-00328A AH97-00844A AH80-00028A CABINET-TOP;YP-30S,ANODIZING,AL,0.7T ASSY-CASE BOTTOM; ASSY, YP-30S ASSY-FRAME TOP; ASSY, YP-30S ASSY-FRAME BOTTOM; ASSY, YP-30S ASSY-COVER BATTERY; ASSY, YP-30S WINDOW-LCD; YP-30S, ACRYL, 1.5 KNOB-HOLD; YP-30S, ABS DECORATION-RING; YP-30S, ABS HOLDER-LCD; YP-30S, ABS SCREW-TAPTITE; PH, +, B, M1, L, L6.5, NI PLT, SW ASSY PCB-MIC; YP-30S, ONE-BOARD (For 64MB YP-30S) ASSY PCB-32MB-ONE-BOARD; YP-30S(For 32MB YP-30S/CT) LCD; UG-12T14-FGHT X-A, YP-30S, -, 32X4 KNOB-VOLUME; YP-30S, ABS CABLE FORM; YD-150B, YP-MF64,4P, 1.2M, -,-,PVC, BEIGE, 4PX1200MM,-,USB CABLE SPEAKER SYSTEM; YP-30S, YH-30SGU, 0.22V,0.2 HANGER-NECKLES; YP-30S BAND; -,-,PVC, YP-30S,DOMESTIC(For Asia) BAND-ARM; -,-,PVC,YP-30S(Except Asia) ASSY-CRADLE; -,YP-30S INSTALL-MFN CD; YP-30S,30S CD, CD, KOR-CD Disassembly and assembly method 1. Remove No . while pressing No. "PUSH OPEN". 2. Remove No. 3. Remove No. 4. Pull and remove No. while pressing the upper part of No. (take care so that No. 5. Carefully extend No. a little, and lift up and remove it along with the main body 6. Remove No. switch would not be pressed). 7. Lift No. up (separate it No. , No. , No. and No. ). 8. Lift the No. LCD connector up. 9. After lifting No. up from the connector lightly, apply heat with a soldering iron on the soldering part. 10. Separate No. and No. . Cautions in assembling 1. After ensuring No. is properly placed at No. , insert frame (without care, SW2 or SW3 may be damaged). 2. Since a flaw may occur if lifting No. up from the lower part and then inserting it, lower it down from the upper part for insertion. 3. Securely insert No. and No. into the No. connector and then fix them at the PCB. (Back light soldering condition of LCD: 360˚C, within 2 seconds) 4. When properly placing No. (+, -), adjust orientation accurately. Samsung Electronics 6-1 Electric Parts List 7. Electrical Parts List Loc. No. Code No. B3 BT2 C10 C13 C14 C15 C16 C17 C18 C19 C2 C20 C21 C22 C3 C30 C32 C33 C34 C35 C36 C38 C39 C4 C40 C41 C42 C43 C46 C47 C52 C54 C55 C56 C6 C60 C61 C62 C63 C64 C65 C7 C8 C9 D11 D12 D13 D3 D4 D5 D6 D7 D9 J1 J2 J3 L1 L2 L3 L4 L5 MIC Q2 Q3 R10 R11 R12 R13 R15 R16 3301-001419 2409-001042 2203-000726 2203-000125 2203-000125 2203-005005 2203-005005 2203-005005 2203-001103 2203-001103 2404-000293 2404-001159 2404-001159 2203-000257 2404-000335 2203-000315 2203-005005 2203-005005 2203-005005 2404-001020 2404-000151 2203-005005 2203-005005 2404-000293 2203-005005 2203-005005 2203-005005 2203-005005 2203-005005 2203-005005 2203-000315 2203-000315 2404-000151 2203-000726 2404-000335 2203-000626 2203-001195 2203-000257 2203-000257 2203-000998 2203-000998 2203-000257 2404-001158 2203-000257 0404-001010 0404-001010 0404-001010 0404-001089 0404-001089 0404-001010 0404-001010 0404-001010 0404-001010 3722-001605 3708-001630 3708-001600 2703-001864 2703-001864 2703-002247 2703-000271 2703-000271 3003-001062 0505-001426 0504-001048 2007-000123 2007-000123 2007-000121 2007-000102 2007-000090 2007-000090 Samsung Electronics Description ; Specification Remark CORE-FERRITE BEAD;AB,220ohm,1.6x0.8x0.8m C-EDL;200000UF,3.3V,3.3V,0.15MA,TP,6 C-CERAMIC,CHIP;3.9nF,10%,50V,X7R,TP,1608 C-CERAMIC,CHIP;1.2nF,10%,50V,X7R,TP,1608 C-CERAMIC,CHIP;1.2nF,10%,50V,X7R,TP,1608 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608 C-CERAMIC,CHIP;6.8nF,10%,50V,X7R,TP,1608 C-CERAMIC,CHIP;6.8nF,10%,50V,X7R,TP,1608 C-TA,CHIP;220UF,10%,6.3V,GP,TP,7343H C-TA,CHIP;100UF,10%,6.3V,GP,TP,6032 C-TA,CHIP;100UF,10%,6.3V,GP,TP,6032 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 C-TA,CHIP;3.3uF,20%,16V,GP,TP,3216 C-CERAMIC,CHIP;0.12nF,5%,50V,NP0,TP,1608 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608 C-TA,CHIP;10uF,20%,10V,GP,TP,3216,3.2 C-TA,CHIP;1uF,20%,16V,-,TP,3216,C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608 C-TA,CHIP;220UF,10%,6.3V,GP,TP,7343H C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608 C-CERAMIC,CHIP;0.12nF,5%,50V,NP0,TP,1608 C-CERAMIC,CHIP;0.12nF,5%,50V,NP0,TP,1608 C-TA,CHIP;1uF,20%,16V,-,TP,3216,C-CERAMIC,CHIP;3.9nF,10%,50V,X7R,TP,1608 C-TA,CHIP;3.3uF,20%,16V,GP,TP,3216 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160 C-CERAMIC,CHIP;0.007nF,0.25pF,50V,NP0,TP C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 C-CERAMIC,CHIP;0.047nF,5%,50V,NP0,TP,160 C-CERAMIC,CHIP;0.047nF,5%,50V,NP0,TP,160 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 C-TA,CHIP;47uF,10%,6.3V,GP,TP,3528 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 DIODE-SCHOTTKY;MA729,30V,200mA,DSM,TP DIODE-SCHOTTKY;MA729,30V,200mA,DSM,TP DIODE-SCHOTTKY;MA729,30V,200mA,DSM,TP DIODE-SCHOTTKY;RB551V-30,30V,500mA,SOD-3 DIODE-SCHOTTKY;RB551V-30,30V,500mA,SOD-3 DIODE-SCHOTTKY;MA729,30V,200mA,DSM,TP DIODE-SCHOTTKY;MA729,30V,200mA,DSM,TP DIODE-SCHOTTKY;MA729,30V,200mA,DSM,TP DIODE-SCHOTTKY;MA729,30V,200mA,DSM,TP JACK-PHONE;3P,3.6PI,AG,BLK,CONNECTOR-FPC/FC/PIC;15P,0.5MM,SMD-A,CONNECTOR-FPC/FC/PIC;4P,0.8MM,SMD-A,GOLD INDUCTOR-SMD;15UH,20%,6X6X2.8MM INDUCTOR-SMD;15UH,20%,6X6X2.8MM INDUCTOR-SMD;4.7MH,20%,3.8X3.8X2.0 INDUCTOR-SMD;4.7uH,10%,2x1.25x1.25mm INDUCTOR-SMD;4.7uH,10%,2x1.25x1.25mm MIC-CONDENSOR;2V,130UA-50,-42DB+-3DB,2.2 FET-SILICON;IRLML6401,P,-12V,-4.3A,0.05o TR-DIGITAL;-,NPN,100MW,47K,SC-70,TP R-CHIP;1.5Kohm,5%,1/16W,DA,TP,1608 R-CHIP;1.5Kohm,5%,1/16W,DA,TP,1608 R-CHIP;820ohm,5%,1/16W,DA,TP,1608 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608 Loc. No. Code No. R19 R2 R20 R21 R22 R23 R24 R25 R26 R29 R3 R30 R31 R33 R34 R4 R40 R41 R42 R43 R44 R45 R46 R47 R48 R49 R5 R50 R51 R52 R53 R54 R55 R57 R59 R6 R60 R62 R7 R8 R9 SW1 SW2 SW3 SW4 SW5 SW6 T1 T2 T3 T4 T5 U1 U2 U3 U4 U5 U6 U7 Y1 Y2 Y3 2007-000120 2007-000102 2007-000125 2007-000102 2007-000090 2007-000123 2007-000123 2007-000123 2007-000113 2007-000090 2007-000102 2007-000090 2007-000102 2007-000102 2007-000090 2007-000090 2007-000071 2007-000123 2007-000071 2007-000109 2007-000102 2007-000102 2007-000102 2007-000102 2007-000102 2007-000090 2007-000124 2007-000125 2007-000125 2007-000125 2007-000090 2007-000090 2007-000102 2007-000121 2007-000987 2007-001147 2007-000102 2007-000090 2007-001147 2007-000113 2007-000113 3408-001070 3404-001161 3404-001161 3404-001180 3404-001180 3408-001052 0406-001128 0406-001128 0406-001128 0406-001128 0406-001128 0903-001248 1204-001881 1107-001280 0909-001031 1003-001233 1203-001970 1203-002172 2802-001168 2801-004053 2802-001150 AA61-00787A AA61-00806A Description ; Specification Remark R-CHIP;680ohm,5%,1/16W,DA,TP,1608 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 R-CHIP;3.9Kohm,5%,1/16W,DA,TP,1608 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608 R-CHIP;1.5Kohm,5%,1/16W,DA,TP,1608 R-CHIP;1.5Kohm,5%,1/16W,DA,TP,1608 R-CHIP;1.5Kohm,5%,1/16W,DA,TP,1608 R-CHIP;33ohm,5%,1/16W,DA,TP,1608 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608 R-CHIP;22ohm,5%,1/16W,DA,TP,1608 R-CHIP;1.5Kohm,5%,1/16W,DA,TP,1608 R-CHIP;22ohm,5%,1/16W,DA,TP,1608 R-CHIP;1Mohm,5%,1/16W,DA,TP,1608 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608 R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608 R-CHIP;3.9Kohm,5%,1/16W,DA,TP,1608 R-CHIP;3.9Kohm,5%,1/16W,DA,TP,1608 R-CHIP;3.9Kohm,5%,1/16W,DA,TP,1608 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 R-CHIP;820ohm,5%,1/16W,DA,TP,1608 R-CHIP;5.6ohm,5%,1/16W,DA,TP,1608 R-CHIP;7.5ohm,5%,1/16W,DA,TP,1608 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608 R-CHIP;7.5ohm,5%,1/16W,DA,TP,1608 R-CHIP;33ohm,5%,1/16W,DA,TP,1608 R-CHIP;33ohm,5%,1/16W,DA,TP,1608 SWITCH-SLIDE;5V DC,10mA,-,OFF-<ON>,SWITCH-TACT;12V DC,50mA,220gf,5.5x4.5x1. SWITCH-TACT;12V DC,50mA,220gf,5.5x4.5x1. SWITCH-TACT;12V DC,50MA,260GF,5.2X5.2X1. SWITCH-TACT;12V DC,50MA,260GF,5.2X5.2X1. SWITCH-SLIDE;5V,0.3A,2P,<OFF-ON>,DIODE-TVS;MLVS-0603-E08,50V,-,DIODE-TVS;MLVS-0603-E08,50V,-,DIODE-TVS;MLVS-0603-E08,50V,-,DIODE-TVS;MLVS-0603-E08,50V,-,DIODE-TVS;MLVS-0603-E08,50V,-,IC-MICROCONTROLLER;ML66Q525,16BIT,TQFP,1 IC-ENCODER/DECODER;MAS3519F,PLQFP,64P,-, IC-FLASH MEMORY;9K1208,64Mx8Bit,TSOP,48P IC-REAL TIME CLOCK;8563,-,TSSOP,8P,118MI IC-POWER DRIVER;1DDD355AA-M02,MSOP,8P,-, IC-VOLTAGE REGULATOR;-,SOT-89,3P,100MIL IC-VOL. DETECTOR;80823,SC-82AB,4P,49MIL, RESONATOR-CERAMIC;12MHZ,0.5%,TP,3.7X3.1X CRYSTAL-SMD;0.032768MHZ,20PPM,28-BCG,7PF RESONATOR-CERAMIC;18.432MHZ,0.5%,TP,3.2X PLATE-BATTERY;YP-30S,BPS,0.2T,Au-p SPRING-BATTERY;YP-30S,SWC,0.45,-,-,- 7-1 MEMO 7-2 Samsung Electronics Block Diagram 8. Block Diagram Samsung Electronics 8-1 MEMO 8-2 Samsung Electronics Internal Block Diagram of Main IC 9. Internal Block Diagram of Main IC 9-1 MAS3519 Samsung Electronics 9-1 Internal Block Diagram of Main IC 9-2 ML66525 9-2 Samsung Electronics PCB Wiring Diagrams 10. PCB Wiring Diagrams 10-1 Component Side Samsung Electronics 10-1 PCB Wiring Diagrams 10-2 Solder Side 10-2 Samsung Electronics Schematic Diagrams 11. Schematic Diagram Samsung Electronics 11-1