NL74VCX16373 Low-Voltage 1.8/2.5/3.3V 16-Bit Transparent Latch With 3.6V–Tolerant Inputs and Outputs (3–State, Non–Inverting) The NL74VCX16373 is an advanced performance, non–inverting 16–bit transparent latch. It is designed for very high–speed, very low–power operation in 1.8V, 2.5V or 3.3V systems. The VCX16373 is byte controlled, with each byte functioning identically, but independently. Each byte has separate Output Enable and Latch Enable inputs. These control pins can be tied together for full 16–bit operation. When operating at 2.5V (or 1.8V) the part is designed to tolerate voltages it may encounter on either inputs or outputs when interfacing to 3.3V busses. It is guaranteed to be over–voltage tolerant to 3.6V. The NL74VCX16373 contains 16 D–type latches with 3–state 3.6V–tolerant outputs. When the Latch Enable (LEn) inputs are HIGH, data on the Dn inputs enters the latches. In this condition, the latches are transparent, (a latch output will change state each time its D input changes). When LE is LOW, the latch stores the information that was present on the D inputs a setup time preceding the HIGH–to–LOW transition of LE. The 3–state outputs are controlled by the Output Enable (OEn) inputs. When OE is LOW, the outputs are enabled. When OE is HIGH, the standard outputs are in the high impedance state, but this does not interfere with new data entering into the latches. http://onsemi.com 48 1 TSSOP–48 DT SUFFIX CASE 1201 MARKING DIAGRAM 48 NL74VCX16373DT AWLYYWW 1 A WL YY WW • Designed for Low Voltage Operation: VCC = 1.65–3.6V • 3.6V Tolerant Inputs and Outputs • High Speed Operation: 3.0ns max for 3.0 to 3.6V • • • • • • 3.9ns max for 2.3 to 2.7V 6.8ns max for 1.65 to 1.95V Static Drive: ±24mA Drive at 3.0V ±18mA Drive at 2.3V ±6mA Drive at 1.65V Supports Live Insertion and Withdrawal IOFF Specification Guarantees High Impedance When VCC = 0V Near Zero Static Supply Current in All Three Logic States (20µA) Substantially Reduces System Power Requirements Latchup Performance Exceeds ±300mA @ 125°C ESD Performance: Human Body Model >2000V; Machine Model >200V Semiconductor Components Industries, LLC, 2000 May, 2000 – Rev. 0 Powered by ICminer.com Electronic-Library Service CopyRight 2003 1 = Assembly Location = Wafer Lot = Year = Work Week PIN NAMES Pins Function OEn LEn D0–D15 O0–O15 Output Enable Inputs Latch Enable Inputs Inputs Outputs ORDERING INFORMATION Package Shipping NL74VCX16373DT Device TSSOP 39 / Rail NL74VCX16373DTR2 TSSOP 2500 / Reel Publication Order Number: NL74VCX16373/D NL74VCX16373 OE1 1 48 LE1 O0 2 47 D0 O1 3 46 D1 GND 4 45 GND O2 5 44 D2 O3 6 43 D3 VCC 7 O4 8 42 VCC 41 D4 O5 9 OE1 LE1 D0 D1 40 D5 GND 10 39 GND O6 11 38 D6 O7 12 37 D7 O8 13 36 D8 O9 14 35 D9 GND 15 D2 D3 34 GND O10 16 33 D10 O11 17 32 D11 VCC 18 O12 19 31 VCC 30 D12 O13 20 29 D13 GND 21 28 GND O14 22 27 D14 O15 23 26 D15 OE2 24 25 LE2 D4 D5 D6 D7 1 OE2 48 LE2 nLE 47 D nLE 46 D nLE 44 D nLE 43 D nLE 41 D nLE 40 D nLE 38 D nLE 37 D Figure 1. 48–Lead Pinout (Top View) 25 O0 36 D8 3 Q O1 35 D9 5 Q O2 33 D10 6 Q O3 32 D11 8 Q O4 30 D12 9 Q O5 29 D13 11 Q O6 27 D14 12 Q O7 26 D15 nLE D nLE D nLE D nLE D nLE D nLE D nLE D nLE D 13 Q 14 Q 16 Q 17 Q 19 Q 20 Q 22 Q 23 Q O8 O9 O10 O11 O12 O13 O14 O15 Figure 2. Logic Diagram 1 OE1 48 LE1 25 LE2 24 OE2 D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 Inputs 2 Q 24 47 46 44 43 41 40 38 37 36 35 33 32 30 29 27 26 EN1 EN2 EN3 EN4 1 1∇ 1 2∇ 1 3∇ 1 4∇ Outputs 2 3 5 6 8 9 11 12 13 14 16 17 19 20 22 23 O0 O1 O2 O3 O4 O5 O6 O7 O8 O9 O10 O11 O12 O13 O14 O15 Inputs Outputs LE1 OE1 D0:7 O0:7 LE2 OE2 D8:15 O8:15 X H X Z X H X Z H L L L H L L L H L H H H L H H L L X O0 L L X O0 H = High Voltage Level; L = Low Voltage Level; Z = High Impedance State; X = High or Low Voltage Level and Transitions Are Acceptable, for ICC reasons, DO NOT FLOAT Inputs. O0 = No Change. http://onsemi.com 2 Powered by ICminer.com Electronic-Library Service CopyRight 2003 NL74VCX16373 ABSOLUTE MAXIMUM RATINGS* Symbol Parameter VCC DC Supply Voltage VI VO Value Condition Unit –0.5 to +4.6 V DC Input Voltage –0.5 ≤ VI ≤ +4.6 V DC Output Voltage –0.5 ≤ VO ≤ +4.6 Output in 3–State V –0.5 ≤ VO ≤ VCC + 0.5 Note 1.; Outputs Active V IIK DC Input Diode Current –50 VI < GND mA IOK DC Output Diode Current –50 VO < GND mA +50 VO > VCC mA IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current Per Ground Pin ±100 mA TSTG Storage Temperature Range –65 to +150 °C * Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied. 1. IO absolute maximum rating must be observed. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Operating Data Retention Only Min Typ Max Unit 1.65 1.2 3.3 3.3 3.6 3.6 V –0.3 3.6 V 0 0 VCC 3.6 V VCC Supply Voltage VI Input Voltage VO Output Voltage IOH HIGH Level Output Current, VCC = 3.0V – 3.6V –24 mA IOL LOW Level Output Current, VCC = 3.0V – 3.6V 24 mA IOH HIGH Level Output Current, VCC = 2.3V – 2.7V –18 mA IOL LOW Level Output Current, VCC = 2.3V – 2.7V 18 mA IOH HIGH Level Output Current, VCC = 1.65 – 1.95V –6 mA IOL LOW Level Output Current, VCC = 1.65 – 1.95V 6 mA TA Operating Free–Air Temperature –40 +85 °C ∆t/∆V Input Transition Rise or Fall Rate, VIN from 0.8V to 2.0V, VCC = 3.0V 0 10 ns/V (Active State) (3–State) http://onsemi.com 3 Powered by ICminer.com Electronic-Library Service CopyRight 2003 NL74VCX16373 DC ELECTRICAL CHARACTERISTICS TA = –40°C to +85°C Symbol VIH VIL VOH VOL Characteristic HIGH Level Input Voltage (Note 2.) LOW Level Input Voltage (Note 2.) HIGH Level Output Voltage LOW Level Output Voltage Condition Min 1.65V ≤ VCC < 2.3V 0.65 x VCC 2.3V ≤ VCC ≤ 2.7V 1.6 2.7V < VCC ≤ 3.6V 2.0 Max V 1.65V ≤ VCC < 2.3V 0.35 x VCC 2.3V ≤ VCC ≤ 2.7V 0.7 2.7V < VCC ≤ 3.6V 0.8 1.65V ≤ VCC ≤ 3.6V; IOH = –100µA VCC – 0.2 VCC = 1.65V; IOH = –6mA 1.25 VCC = 2.3V; IOH = –6mA 2.0 VCC = 2.3V; IOH = –12mA 1.8 VCC = 2.3V; IOH = –18mA 1.7 VCC = 2.7V; IOH = –12mA 2.2 VCC = 3.0V; IOH = –18mA 2.4 VCC = 3.0V; IOH = –24mA 2.2 Unit V V 1.65V ≤ VCC ≤ 3.6V; IOL = 100µA 0.2 VCC = 1.65V; IOL = 6mA 0.3 VCC = 2.3V; IOL = 12mA VCC = 2.3V; IOL = 18mA 0.4 VCC = 2.7V; IOL = 12mA 0.4 VCC = 3.0V; IOL = 18mA 0.4 V 0.6 VCC = 3.0V; IOL = 24mA 0.55 II Input Leakage Current 1.65V ≤ VCC ≤ 3.6V; 0V ≤ VI ≤ 3.6V ±5.0 µA IOZ 3–State Output Current 1.65V ≤ VCC ≤ 3.6V; 0V ≤ VO ≤ 3.6V; VI = VIH or VIL ±10 µA IOFF ICC Power–Off Leakage Current Quiescent Supply Current (Note 3.) VCC = 0V; VI or VO = 3.6V 10 µA 1.65V ≤ VCC ≤ 3.6V; VI = GND or VCC 20 µA 1.65V ≤ VCC ≤ 3.6V; 3.6V ≤ VI, VO ≤ 3.6V ±20 µA 750 µA ∆ICC Increase in ICC per Input 2.7V < VCC ≤ 3.6V; VIH = VCC – 0.6V 2. These values of VI are used to test DC electrical characteristics only. 3. Outputs disabled or 3–state only. http://onsemi.com 4 Powered by ICminer.com Electronic-Library Service CopyRight 2003 NL74VCX16373 AC CHARACTERISTICS (Note 4.; tR = tF = 2.0ns; CL = 30pF; RL = 500Ω) Limits TA = –40°C to +85°C VCC = 3.0V to 3.6V Symbol Parameter VCC = 2.3V to 2.7V VCC = 1.65 to 1.95V Waveform Min Max Min Max Min Max Unit tPLH tPHL Propagation Delay Dn to On 1 0.8 0.8 3.0 3.0 1.0 1.0 3.4 3.4 1.5 1.5 6.8 6.8 ns tPLH tPHL Propagation Delay LE to On 1 0.8 0.8 3.0 3.0 1.0 1.0 3.9 3.9 1.5 1.5 7.8 7.8 ns tPZH tPZL Output Enable Time to High and Low Level 2 0.8 0.8 3.5 3.5 1.0 1.0 4.6 4.6 1.5 1.5 9.2 9.2 ns tPHZ tPLZ Output Disable Time From High and Low Level 2 0.8 0.8 3.5 3.5 1.0 1.0 3.8 3.8 1.5 1.5 6.8 6.8 ns ts Setup Time, High or Low Dn to LE 3 1.5 1.5 2.5 ns th Hold Time, High or Low Dn to LE 3 1.0 1.0 1.0 ns tw LE Pulse Width, High 3 1.5 1.5 4.0 ns tOSHL tOSLH Output–to–Output Skew (Note 5.) 0.5 0.5 0.5 0.5 0.75 0.75 ns 4. For CL = 50pF, add approximately 300ps to the AC maximum specification. 5. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (tOSHL) or LOW–to–HIGH (tOSLH); parameter guaranteed by design. DYNAMIC SWITCHING CHARACTERISTICS TA = +25°C Symbol VOLP VOLV VOHV Characteristic Condition Typ Unit Dynamic LOW Peak Voltage VCC = 1.8V, CL = 30pF, VIH = VCC, VIL = 0V 0.25 V (Note 6.) VCC = 2.5V, CL = 30pF, VIH = VCC, VIL = 0V 0.6 VCC = 3.3V, CL = 30pF, VIH = VCC, VIL = 0V 0.8 Dynamic LOW Valley Voltage VCC = 1.8V, CL = 30pF, VIH = VCC, VIL = 0V –0.25 (Note 6.) VCC = 2.5V, CL = 30pF, VIH = VCC, VIL = 0V –0.6 VCC = 3.3V, CL = 30pF, VIH = VCC, VIL = 0V –0.8 Dynamic HIGH Valley Voltage VCC = 1.8V, CL = 30pF, VIH = VCC, VIL = 0V 1.5 (Note 7.) VCC = 2.5V, CL = 30pF, VIH = VCC, VIL = 0V 1.9 V V VCC = 3.3V, CL = 30pF, VIH = VCC, VIL = 0V 2.2 6. Number of outputs defined as “n”. Measured with “n–1” outputs switching from HIGH–to–LOW or LOW–to–HIGH. The remaining output is measured in the LOW state. 7. Number of outputs defined as “n”. Measured with “n–1” outputs switching from HIGH–to–LOW or LOW–to–HIGH. The remaining output is measured in the HIGH state. CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit CIN Input Capacitance Note 8. 6 pF COUT Output Capacitance Note 8. 7 pF CPD Power Dissipation Capacitance Note 8., 10MHz 20 pF 8. VCC = 1.8, 2.5 or 3.3V; VI = 0V or VCC. http://onsemi.com 5 Powered by ICminer.com Electronic-Library Service CopyRight 2003 NL74VCX16373 VIH Vm Dn Vm 0V tPLH tPHL VOH Vm On Vm VOL WAVEFORM 1 – PROPAGATION DELAYS tR = tF = 2.0ns, 10% to 90%; f = 1MHz; tW = 500ns Figure 3. AC Waveforms VIH Dn Vm Vm OEn VIH Vm Vm 0V tPZH 0V ts tPHZ VIH VOH Vy LEn Vm On th tw Vm Vm ≈ 0V 0V tPLH, tPHL tPZL On tPLZ ≈ VCC VOH On Vm Vm VOL Vx VOL WAVEFORM 3 – LE to On PROPAGATION DELAYS, LE MINIMUM PULSE WIDTH, Dn to LE SETUP AND HOLD TIMES tR = tF = 2.0ns, 10% to 90%; f = 1MHz; tW = 500ns except when noted WAVEFORM 2 – OUTPUT ENABLE AND DISABLE TIMES tR = tF = 2.0ns, 10% to 90%; f = 1MHz; tW = 500ns Figure 4. AC Waveforms VCC Symbol 3.3V ±0.3V 2.5V ±0.2V 1.8V ±0.15V VIH 2.7V VCC VCC Vm 1.5V VCC/2 VCC/2 Vx VOL + 0.3V VOL + 0.15V VOL + 0.15V Vy VOH – 0.3V VOH – 0.15V VCC VOH – 0.15V PULSE GENERATOR RL DUT CL RT TEST RL SWITCH tPLH, tPHL Open tPZL, tPLZ 6V at VCC = 3.3 ±0.3V; VCC× 2 at VCC = 2.5 ±0.2V; 1.8V ±0.15V tPZH, tPHZ GND CL = 30pF or equivalent (Includes jig and probe capacitance) RL = 500Ω or equivalent RT = ZOUT of pulse generator (typically 50Ω) Figure 5. Test Circuit http://onsemi.com 6 Powered by ICminer.com Electronic-Library Service CopyRight 2003 6V or VCC × 2 OPEN GND NL74VCX16373 VIH Vm Dn Vm 0V tPLH tPHL VOH Vm On Vm VOL WAVEFORM 4 – PROPAGATION DELAYS tR = tF = 2.0ns, 10% to 90%; f = 1MHz; tW = 500ns Figure 6. AC Waveforms VIH Vm OEn VIH Dn Vm Vm Vm 0V tPZH 0V ts tPHZ VIH VOH Vy LEn Vm On th tw Vm ≈ 0V Vm 0V tPLH, tPHL tPZL On tPLZ VOH ≈ VCC On Vm Vm VOL Vx VOL WAVEFORM 6 – LE to On PROPAGATION DELAYS, LE MINIMUM PULSE WIDTH, Dn to LE SETUP AND HOLD TIMES tR = tF = 2.0ns, 10% to 90%; f = 1MHz; tW = 500ns except when noted WAVEFORM 5 – OUTPUT ENABLE AND DISABLE TIMES tR = tF = 2.0ns, 10% to 90%; f = 1MHz; tW = 500ns Figure 7. AC Waveforms VCC Symbol 3.3V ±0.3V 2.7V VIH 2.7V 2.7V Vm 1.5V 1.5V Vx VOL + 0.3V VOL + 0.3V Vy VOH – 0.3V VOH – 0.3V http://onsemi.com 7 Powered by ICminer.com Electronic-Library Service CopyRight 2003 NL74VCX16373 AC CHARACTERISTICS (tR = tF = 2.0ns; CL = 50pF; RL = 500Ω) Limits TA = –40°C to +85°C VCC = 3.0V to 3.6V Symbol Parameter VCC = 2.7V Waveform Min Max Max Unit tPLH tPHL Propagation Delay Dn to On 4 1.0 1.0 3.6 3.6 Min 4.3 4.3 ns tPLH tPHL Propagation Delay LE to On 4 1.0 1.0 3.9 3.9 4.6 4.6 ns tPZH tPZL Output Enable Time to High and Low Level 5 1.0 1.0 4.7 4.7 5.7 5.7 ns tPHZ tPLZ Output Disable Time From High and Low Level 5 1.0 1.0 4.1 4.1 4.5 4.5 ns tOSHL tOSLH Output–to–Output Skew (Note 9.) 0.5 0.5 0.5 0.5 ns 9. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (tOSHL) or LOW–to–HIGH (tOSLH); parameter guaranteed by design. VCC PULSE GENERATOR RL DUT RT CL RL SWITCH TEST tPLH, tPHL Open tPZL, tPLZ 6V at VCC = 3.3 ±0.3V; VCC× 2 at VCC = 2.5 ±0.2V; 1.8V ±0.15V tPZH, tPHZ GND CL = 50pF or equivalent (Includes jig and probe capacitance) RL = 500Ω or equivalent RT = ZOUT of pulse generator (typically 50Ω) Figure 8. Test Circuit http://onsemi.com 8 Powered by ICminer.com Electronic-Library Service CopyRight 2003 6V or VCC × 2 OPEN GND NL74VCX16373 PACKAGE DIMENSIONS TSSOP DT SUFFIX CASE 1201–01 ISSUE A 48X ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ ÇÇÇ ÉÉÉ K K1 K REF 0.12 (0.005) M T U S V S T U S J J1 48 25 SECTION N–N M 0.254 (0.010) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSIONS A AND B ARE TO BE DETERMINED AT DATUM PLANE –W–. B –U– L N 1 24 A –V– PIN 1 IDENT. N F DETAIL E D C 0.25 (0.010) –W– 0.076 (0.003) –T– SEATING DETAIL E PLANE MILLIMETERS MIN MAX 12.40 12.60 6.00 6.20 ––– 1.10 0.05 0.15 0.50 0.75 0.50 BSC 0.37 ––– 0.09 0.20 0.09 0.16 0.17 0.27 0.17 0.23 7.95 8.25 0_ 8_ H G ÉÉ ÉÉ ÉÉ É ÉÉ É ÉÉ ÉÉ ÉÉ É ÉÉ É ÉÉ ÉÉÉÉÉÉÉÉ ÉÉ ÉÉ ÉÉ É ÉÉ É ÉÉ ÉÉÉÉÉÉÉÉ ÉÉ ÉÉ ÉÉ ÉÉ É ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ É ÉÉ ÉÉÉÉ ÉÉÉÉÉÉÉ ÉÉ ÉÉ ÉÉ ÉÉ É ÉÉ ÉÉÉÉ ÉÉÉÉÉÉÉ F K L M DIM A B C D F G H J J1 K K1 L M G 48 Leads Package Footprint http://onsemi.com 9 Powered by ICminer.com Electronic-Library Service CopyRight 2003 INCHES MIN MAX 0.488 0.496 0.236 0.244 ––– 0.043 0.002 0.006 0.020 0.030 0.0197 BSC 0.015 ––– 0.004 0.008 0.004 0.006 0.007 0.011 0.007 0.009 0.313 0.325 0_ 8_ NL74VCX16373 10 PITCHES CUMULATIVE TOLERANCE ON TAPE ±0.2 mm (±0.008”) P0 K P2 D t TOP COVER TAPE E A0 + K0 SEE NOTE 2 B1 SEE NOTE 2 F + B0 W + D1 FOR COMPONENTS 2.0 mm × 1.2 mm AND LARGER P EMBOSSMENT FOR MACHINE REFERENCE ONLY INCLUDING DRAFT AND RADII CONCENTRIC AROUND B0 CENTER LINES OF CAVITY USER DIRECTION OF FEED *TOP COVER TAPE THICKNESS (t1) 0.10 mm (0.004”) MAX. R MIN. TAPE AND COMPONENTS SHALL PASS AROUND RADIUS “R” WITHOUT DAMAGE EMBOSSED CARRIER BENDING RADIUS 10° 100 mm (3.937”) MAXIMUM COMPONENT ROTATION EMBOSSMENT 1 mm MAX TYPICAL COMPONENT CAVITY CENTER LINE TAPE 1 mm (0.039”) MAX TYPICAL COMPONENT CENTER LINE 250 mm (9.843”) CAMBER (TOP VIEW) ALLOWABLE CAMBER TO BE 1 mm/100 mm NONACCUMULATIVE OVER 250 mm Figure 9. Carrier Tape Specifications EMBOSSED CARRIER DIMENSIONS (See Notes 1 and 2) Tape Size B1 Max 24mm 20.1mm (0.791”) D D1 E F K P P0 P2 R T W 1.5 + 0.1mm –0.0 (0.059 +0.004” –0.0) 1.5mm Min (0.060”) 1.75 ±0.1 mm (0.069 ±0.004”) 11.5 ±0.10 mm (0.453 ±0.004”) 11.9 mm Max (0.468”) 16.0 ±0.1 mm (0.63 ±0.004”) 4.0 ±0.1 mm (0.157 ±0.004”) 2.0 ±0.1 mm (0.079 ±0.004”) 30 mm (1.18”) 0.6 mm (0.024”) 24.3 mm (0.957”) 1. Metric Dimensions Govern–English are in parentheses for reference only. 2. A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to 0.50 mm max. The component cannot rotate more than 10° within the determined cavity http://onsemi.com 10 Powered by ICminer.com Electronic-Library Service CopyRight 2003 NL74VCX16373 t MAX 13.0 mm ±0.2 mm (0.512” ±0.008”) 1.5 mm MIN (0.06”) A 20.2 mm MIN (0.795”) 50 mm MIN (1.969”) FULL RADIUS G Figure 10. Reel Dimensions REEL DIMENSIONS Tape Size A Max G t Max 24 mm 360 mm (14.173”) 24.4 mm + 2.0 mm, –0.0 (0.961” + 0.078”, –0.00) 30.4 mm (1.197”) DIRECTION OF FEED BARCODE LABEL POCKET Figure 11. Reel Winding Direction http://onsemi.com 11 Powered by ICminer.com Electronic-Library Service CopyRight 2003 HOLE NL74VCX16373 CAVITY TAPE TOP TAPE TAPE TRAILER (Connected to Reel Hub) NO COMPONENTS 160 mm MIN COMPONENTS TAPE LEADER NO COMPONENTS 400 mm MIN DIRECTION OF FEED Figure 12. Tape Ends for Finished Goods User Direction of Feed Figure 13. Reel Configuration ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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American Technical Support: 800–282–9855 Toll Free USA/Canada EUROPE: LDC for ON Semiconductor – European Support German Phone: (+1) 303–308–7140 (M–F 1:00pm to 5:00pm Munich Time) Email: ONlit–[email protected] French Phone: (+1) 303–308–7141 (M–F 1:00pm to 5:00pm Toulouse Time) Email: ONlit–[email protected] English Phone: (+1) 303–308–7142 (M–F 12:00pm to 5:00pm UK Time) Email: [email protected] EUROPEAN TOLL–FREE ACCESS*: 00–800–4422–3781 *Available from Germany, France, Italy, England, Ireland CENTRAL/SOUTH AMERICA: Spanish Phone: 303–308–7143 (Mon–Fri 8:00am to 5:00pm MST) Email: ONlit–[email protected] ASIA/PACIFIC: LDC for ON Semiconductor – Asia Support Phone: 303–675–2121 (Tue–Fri 9:00am to 1:00pm, Hong Kong Time) Toll Free from Hong Kong & Singapore: 001–800–4422–3781 Email: ONlit–[email protected] JAPAN: ON Semiconductor, Japan Customer Focus Center 4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–8549 Phone: 81–3–5740–2745 Email: [email protected] ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. http://onsemi.com 12 Powered by ICminer.com Electronic-Library Service CopyRight 2003 NL74VCX16373/D