H Avantek Products Surface Mount Cascadable Amplifier 1 to 2 GHz Technical Data PPA-2123 Features Description Pin Configuration • Frequency Range: 1 to 2␣GHz The PPA-2123 is a multistage, lownoise, high-gain amplifier utilizing discrete GaAs FETs on a thin-film substrate. The low input/output VSWR is maintained by reactive circuits. The RF signal is transformer-coupled at the input (at DC ground) and capacitively-coupled at the output. The PPA-2123 is available in a hermetically sealed PPA-48 (.4 in. x .8 in.) surface mount package. PP-48 • Small Surface Mount Package: .4 in. x .8 in. • Ultra Low Noise Figure: 1.5 (Typ) • High Gain: 34 dB (Typ) • Flat Response: ±0.6 dB (Typ) • Moderate Power Out: 13␣dBm (Typ) GROUND RFIN GROUND GROUND GROUND + V15V + GROUND GROUND GND RF OUT • Internally Regulated Applications Maximum Ratings • GPS Receiver Parameter • IF Amplifier DC Voltage Continuous RF Input Power Operating Case Temperature Storage Temperature “R” Series Burn-In Temperature • Receiver Front End Schematic V+ VREG RFIN Maximum +17 Volts +15 dBm –55 to +125°C –62 to +150°C +125°C Thermal Characteristics1 RFOUT θJC2 Active Transistor Power Dissipation2 Junction Temperature Above Case Temperature2 100°C/W, 120°C/W 84 mW, 160 mW 8°C/19°C Notes: 1. For further information, see Reliability Screening, Pub. 5963-3240E. 2. Values refer to (1 & 2) and (3 & 4) stage transistors respectively. Weight: (typical) 1.1 grams 2 Electrical Specifications (Measured in 50 Ω system @ +12 VDC nominal unless otherwise noted) Symbol Typical Guaranteed Specifications TC = 25°C TC = 0 to 50°C TC = –55 to +85°C Characteristic 1000-2000 Frequency Range 34.0 Small Signal Gain (Min.) ±0.6 Gain Flatness (Max.) 1.5 Noise Figure (Max.) +13.0 Power Output @ +1 dB Comp. (Min.) 1.5:1 Input VSWR (Max.) 1.5:1 Output VSWR (Max.) +23 Two Tone 3rd Order Intercept Point +37 Two Tone 2nd Order Intercept Point +43 One Tone 2nd Harmonic Intercept Point +12 to +15 DC Voltage (1% Reg.) 80 DC Current BW GP — NF P1dB — — IP3 IP2 HP2 VD ID 1000-2000 31.0 ±1.0 2.2 11.0 2.0:1 2.0:1 — — — — 90 Unit MHz dB dB dB dBm — — dBm dBm dBm Volts mA 1000-2000 30.0 ±1.0 2.3 9.0 2.0:1 2.0:1 — — — — 90 1.2 1.4 1.6 1.8 1.2 Frequency, 1.4 1.6GHz 1.8 1.2 Frequency, 1.4 1.6GHz 1.8 2.0 2.0 2.0 2.5 2.5 2.0 2.5 2.0 1.5 2.0 1.5 1.0 1.5 1.0 0.5 1.0 0.5 0 0.5 01.0 01.0 1.0 Input VSWR Input VSWR Input VSWR VSWR VSWR VSWR 1.7 1.7 1.6 1.7 1.6 1.5 1.6 1.5 1.4 1.5 1.4 1.3 1.4 1.3 1.2 1.3 1.2 1.1 1.2 1.1 1.0 1.11.0 1.0 1.01.0 1.0 1.2 1.4 1.6 1.8 1.2 Frequency, 1.4 1.6GHz 1.8 1.2 Frequency, 1.4 1.6GHz 1.8 1.2 1.4 1.6 1.8 1.2 Frequency, 1.4 1.6GHz 1.8 1.2 Frequency, 1.4 1.6GHz 1.8 2.0 2.0 2.0 14 14 13 14 13 12 13 12 11 12 11 10 11 10 9 10 9 8 9 8 7 8 71.0 71.0 1.0 Power Output Power Output Power Output 1.2 1.2 1.2 Frequency, GHz 2.0 2.0 2.0 1.7 1.7 1.6 1.7 1.6 1.5 1.6 1.5 1.4 1.5 1.4 1.3 1.4 1.3 1.2 1.3 1.2 1.1 1.2 1.1 1.0 1.11.0 1.0 1.01.0 1.0 Frequency, GHz Output VSWR Output VSWR Output VSWR 1.2 1.4 1.6 1.8 1.2 Frequency, 1.4 1.6GHz 1.8 1.2 Frequency, 1.4 1.6GHz 1.8 65 65 60 65 60 55 60 55 50 55 50 45 50 45 40 45 40 35 40 35 30 351.0 30 301.0 1.0 Frequency, GHz 1.6 1.8 2.0 2.0 2.0 Third-Order Intercept Point Third-Order Intercept Point Third-Order Intercept Point 2.0 2.0 2.0 2.0 2.0 2.0 60 Second-Harmonic Intercept Point Second-Harmonic Intercept Point 60 55 60 55 50 55 50 45 50 45 40 45 40 35 40 1.2 1.4 1.6 1.8 2.0 351.0 1.2 Frequency, 1.4 1.6GHz 1.8 2.0 351.0 1.2 Frequency, 1.4 1.6GHz 1.8 2.0 1.0 Second-Order Intercept Point Second-Order Intercept Point Second-Order Intercept Point 1.2 1.4 1.6 1.8 1.2 Frequency, 1.4 1.6GHz 1.8 1.2 Frequency, 1.4 1.6GHz 1.8 1.4 1.4 1.6GHz 1.8 Frequency, 1.4 1.6GHz 1.8 Frequency, Frequency, GHz 26 26 25 26 25 24 25 24 23 24 23 22 23 22 21 22 21 20 21 20 19 20 191.0 191.0 1.0 Frequency, GHz , dBm IP2IP , dBm 2IP 2, dBm VSWR VSWR VSWR Frequency, GHz Noise Figure Noise Figure Noise Figure Power Power Output Output Power Output 1 dB 1Gain dB Gain Gain @@ 1@ dB Compression Compression Compression Gain Gain Gain , dBm IP3IP , dBm 3IP 3, dBm 39 39 38 39 38 37 38 37 36 37 36 35 36 35 34 35 34 33 34 33 32 331.0 32 321.0 1.0 1.2 1.2 1.2 1.4 1.6 1.8 1.4 1.6GHz 1.8 Frequency, 1.4 1.6GHz 1.8 Frequency, Frequency, GHz 2.0 2.0 2.0 Second-Harmonic Intercept Point HPHP dBm 2, dBm 2, dBm 2,HP Gain, Gain, Gain, dBdBdB Key: +25°C +85°C -55°C Noise Noise Figure, Figure, Noise Figure, dBdBdB Typical Performance Over Temperature (@ +12 VDC unless otherwise noted) Frequency, GHz 3 Automatic Network Analyzer Measurements (Typical production unit @ +25°C ambient) S-Parameters and Numerical Readings Bias = 12.00 Volts; Current = 79 mA S12 S21 S11 FREQ GHz Mag Ang .100 .200 .250 .300 .400 .500 .550 .600 .650 .700 .750 .800 .850 .900 .950 1.000 1.050 1.100 1.150 1.200 1.250 1.300 1.350 1.400 1.450 1.500 1.550 1.600 1.650 1.700 1.750 1.800 1.850 1.900 1.950 2.000 2.100 2.150 2.200 2.300 2.400 2.500 .85 .83 .81 .76 .61 .46 .40 .36 .34 .31 .28 .25 .23 .22 .22 .22 .21 .19 .16 .13 .11 .11 .12 .12 .11 .10 .07 .06 .06 .07 .10 .12 .14 .16 .17 .18 .21 .24 .27 .27 .22 .22 135.5 89.4 64.9 40.0 –8.4 –55.3 –78.0 –96.8 –112.6 –124.8 –136.1 –147.5 –159.9 –171.2 –178.7 176.5 173.3 171.0 168.3 160.4 146.8 134.5 124.8 120.1 120.9 118.2 117.6 101.4 80.1 71.8 65.2 70.2 74.5 76.4 74.7 63.1 34.0 24.9 19.3 14.1 .4 –22.6 dB Ang dB –22.71 9.21 17.71 23.51 30.30 33.56 34.44 35.06 35.49 35.77 35.92 35.97 35.93 35.83 35.72 35.59 35.47 35.32 35.22 35.08 34.98 34.86 34.73 34.64 34.61 34.62 34.68 34.80 34.93 35.05 35.18 35.29 35.41 35.53 35.54 35.34 34.49 33.89 33.10 31.41 29.26 27.13 –48.3 –92.0 –135.2 –175.7 111.5 50.8 24.6 .8 –21.3 –42.2 –61.6 –80.1 –97.6 –114.2 –129.6 –144.4 –158.8 –172.8 173.5 160.2 147.1 134.3 121.8 109.9 97.9 85.8 73.8 61.5 48.8 35.7 22.2 8.4 –5.9 –21.0 –37.3 –54.2 –87.6 –103.5 –119.1 –149.1 –176.8 160.3 –61.9 –63.8 –63.1 –70.5 –68.3 –56.3 –60.9 –68.3 –64.5 –66.2 –71.6 –64.7 –61.8 –64.0 –63.0 –63.3 –58.1 –65.0 –70.1 –62.9 –60.9 –73.0 –60.3 –58.0 –63.4 –70.6 –63.2 –60.9 –59.5 –63.7 –59.4 –61.5 –73.5 –56.1 –61.8 –61.0 –63.5 –57.6 –64.8 –64.9 –66.7 –68.4 S22 Ang 53.6 –31.2 –71.3 –153.1 –104.6 158.3 74.7 12.0 11.2 171.1 47.8 –17.6 165.2 –174.4 –110.5 141.6 146.6 –12.1 –156.5 –30.8 30.7 –106.1 81.3 76.2 –40.1 –71.8 –126.9 63.7 –97.8 –68.0 –5.9 –162.8 44.9 –109.9 75.7 –101.5 179.7 144.7 26.6 107.9 17.9 50.3 Mag .77 .79 .72 .65 .55 .47 .44 .40 .37 .34 .31 .29 .27 .26 .24 .22 .20 .17 .15 .13 .12 .13 .14 .16 .17 .17 .16 .13 .10 .06 .06 .07 .06 .05 .07 .15 .33 .38 .41 .47 .57 .66 Ang –161.72 163.17 153.40 145.10 135.90 133.45 133.26 132.61 131.46 128.67 125.72 123.51 122.96 124.66 130.33 137.20 146.11 153.81 159.19 160.06 156.82 153.12 149.07 151.70 155.00 159.95 163.96 166.10 159.78 139.27 97.49 74.42 53.29 14.65 –53.24 –72.58 –90.96 –97.77 –108.28 –133.70 –151.89 –157.48 GPDEL ns 2.34 2.56 2.94 2.84 2.52 2.17 2.03 1.92 1.82 1.76 1.68 1.61 1.57 1.52 1.47 1.42 1.39 1.36 1.32 1.29 1.27 1.26 1.24 1.22 1.23 1.23 1.22 1.24 1.24 1.27 1.31 1.35 1.41 1.49 1.68 1.65 1.61 1.58 1.56 1.35 1.28 1.21 Product Options PPA – 1021R Model Number Prefix PPAPPDPPFPPLPPMPPSModel Number PLPPSP- Screening Option Blank = No Screening R = R-Series Screening For more information on R-Series screening, see Reliability Screening, Pub. 5963-3240E. PHASE DEG .49 –1.26 –2.41 –2.99 –2.93 –2.65 –1.98 –1.11 .17 1.39 2.53 3.76 4.78 5.66 6.07 5.73 4.76 2.71 –.79 –7.80 –14.13 H Case Drawings PP-48 .4 x .8 PLANARPAK SURFACE MOUNTED COMPONENTS .150 +.010 .100 (8) PLACES .006 .004 .035 R (10) PLACES .400 .100 (16) PLACES REF. TAB GND .010 R (10) PLACES RF IN .040 DETAIL "A" GND GND GND V+ .800 .015 ± .002 (10) PLACES GND GND A GND RF OUT .030 (9) PLACES .050 ± .010 (20X) .015 .050 (20) PLACES TYPICAL WEIGHT 1.1 GRAMS NOTES (UNLESS OTHERWISE SPECIFIED): 1. DIMENSIONS ARE SPECIFIED IN INCHES 2. TOLERANCES: xxx ± .005 Recommended Assembly Procedure 1. Chemically clean the PC board and the unit to be mounted using a vapor degreaser or acetone followed by an isopropol alcohol wash. Do not use ultrasonic cleaning. 2. Mask the backside of the PC board to prevent solder from reflowing through the plated thru-holes causing a rough ground plane surface. A suggested masking material is 2 mil thick Kapton® film with silicone adhesive back (Permacel part #P-222). 3. Apply solder cream (suggest Multicore SN62PRMAB3 or equivalent) using screen printing techniques or careful hand application. A layer 4 to 6 mils thick is adequate. 4. Reflow of the unit to the board may be done in many ways. Using a hot plate is one of the most simple. During reflow, pressure (with a clamping arrangement) on the unit is recommended, but not absolutely necessary. Absolute maximum reflow temperature is 260°C for not more than 10 seconds. 5. Chemically reclean the unit using the procedures given in step one. Make sure that a flux remover is used which is appropriate for the type of solder cream used (Multicore PC81 is the recommended flux remover for the above mentioned cream). It should be noted that there are many alternatives for component attachment. This procedure has been found to be simple and effective. For more detailed instructions on how to use PlanarPak Products, please see the application note “PlanarPak Users Information” Pub. 5963-3232E. For more information: United States* Europe* Far East/Australasia: (65) 290-6305 Canada: (416) 206-4725 Japan: (81 3) 3331-6111 *Call your local HP sales office listed in your telephone directory. Ask for a Components representative. Data Subject to Change Copyright © 1995 Hewlett-Packard Co. Printed in U.S.A. 5963-2597E (10/94)