H Avantek Products Surface Mount Limiting Amplifier 10 to 1000 MHz Technical Data PPL-504 Features Description Pin Configuration • Frequency Range: 10 to 1000 MHz The PPL-504 is a four-stage bipolar RF limiting amplifier in a PlanarPak surface mount package using a single polarity supply with a compression range of up to 55␣dB. Emitter-coupled pair design provides even-harmonic suppression and low AM-to-PM conversion. The RF signal is coupled through the amplifier by means of internal blocking capacitors. PP-48 • Up to 55 dB Compression Range • Low Phase Shift • Surface Mount Package Applications • All FM Systems GROUND RFIN GROUND GROUND GROUND V+ GROUND GROUND GND RF OUT • Communications • Telemetry • Radar Warning • Measurement Systems Maximum Ratings Parameter DC Voltage Continuous RF Input Power Operating Case Temperature Storage Temperature “R” Series Burn-In Temperature (TC) Temperature Rise (Junction Above Case) Thermal Resistance (Junction-Case) Transistor Power Dissipation Weight: (typical) 0.15 grams Maximum ±17 Volts +15 dBm –55 to +125°C –62 to +150°C +125°C 20°C 225°C/W 90 mW 2 Electrical Specifications (Measured in 50 Ω system @ +15 VDC nominal unless otherwise noted) Symbol BW — — — — — — — NF ID Characteristic Frequency Range Compression Range @ POUT = ±0.5 dB 10-250 MHz 250-500 MHz 500-1000 MHz Saturated Power @ PIN = 0 dBm 10-1000 MHz (Min.) Saturated Flatness @ PIN = 0 dBm: 10-500 MHz (Max.) 10-1000 MHz (Max.) VSWR Input/Output: 10-500 MHz (Max.) 500-1000 MHz (Max.) Phase Shift per dB of Compression per MHz, deg. 10-1000 MHz Even Harmonic Suppression @ P IN = 0 dBm 250 MHz (Min.) 500 MHz (Min.) 1000 MHz (Min.) Odd Harmonic Suppression @ P IN = 0 dBm 250 MHz (Min.) 500 MHz (Min.) Noise Figure: 250 MHz 500 MHz 1000 MHz DC Current (@ Rated Voltage) Typical Guaranteed Specifications TC = 25°C TC = 0 to 50°C TC = –55 to +85°C Unit 10-1000 10-1000 10-1000 MHz –52 to +10 –48 to +10 –32 to +10 –45 to +10 –40 to +10 –25 to +10 –45 to +10 –40 to +10 –25 to +10 dBm 0 –4 –4 dBm ±0.2 ±0.6 ±0.4 ±0.8 ±0.5 ±1.0 dB 1.3/1.3:1 1.6/2.0:1 1.5/1.5:1 2.0/2.2:1 2.0/2.0:1 2.0/2.5:1 — 0.0035 — — –26 –18 –10 –20 –13 –7 –20 –13 –6 dBc –10 –12 9 9 10 +80 –8 –10 11 11 11 — –7 –8 12 12 12 — dBc dB mA 3 Typical Performance Over Temperature (@ +15 VDC unless otherwise noted) Key: +25°C +85°C -55°C Output Power vs. Input Power Saturated Power Output –1 –2 –2 100 MHz Gain, dB Pout, dBm Psat, dBm Small Signal Gain 60 0 0 200 MHz –4 300 MHz –6 50 40 400 MHz –3 10 200 400 600 800 –8 –70 1000 30 –50 Phase Shift 2 1 200 200 400 600 800 1000 400 600 Output Noise Power 38 50 62 74 10 200 400 600 800 1000 Frequency, MHz Output Spectrum fIN = 50 MHz, PIN = 0 dBm Output Waveform f = 50 MHz –20 200 mV/DIv Output Power, dBm 10 Frequency, MHz Frequency, MHz 0 +10 PIN, dBm 3 0 10 –10 Output Noise Power per 1 MHz Bandwidth, dBm Phase Shift, DEQ/dB of Compression Frequency, MHz –30 –40 –60 PIN=–50 dBm PIN=0 dBm –80 –100 0 0.2 0.4 0.6 0.8 1.0 5 ns/Div Output Frequency, GHz Product Options PPA – 1021R Model Number Prefix PPAPPDPPFPPLPPMPPSModel Number PLPPSP- Screening Option Blank = No Screening R = R-Series Screening For more information on R-Series screening, see Reliability Screening, Pub. 5963-3240E. 800 1000 H Case Drawings PP-48 .4 x .8 PLANARPAK SURFACE MOUNTED COMPONENTS .150 +.010 .100 (8) PLACES .006 .004 .035 R (10) PLACES .400 .100 (16) PLACES REF. TAB GND .010 R (10) PLACES RF IN .040 DETAIL "A" GND GND GND V+ .800 .015 ± .002 (10) PLACES GND GND A GND RF OUT .030 (9) PLACES .050 ± .010 (20X) .015 .050 (20) PLACES TYPICAL WEIGHT 1.1 GRAMS NOTES (UNLESS OTHERWISE SPECIFIED): 1. DIMENSIONS ARE SPECIFIED IN INCHES 2. TOLERANCES: xxx ± .005 Recommended Assembly Procedure 1. Chemically clean the PC board and the unit to be mounted using a vapor degreaser or acetone followed by an isopropol alcohol wash. Do not use ultrasonic cleaning. 2. Mask the backside of the PC board to prevent solder from reflowing through the plated thru-holes causing a rough ground plane surface. A suggested masking material is 2 mil thick Kapton® film with silicone adhesive back (Permacel part #P-222). 3. Apply solder cream (suggest Multicore SN62PRMAB3 or equivalent) using screen printing techniques or careful hand application. A layer 4 to 6 mils thick is adequate. 4. Reflow of the unit to the board may be done in many ways. Using a hot plate is one of the most simple. During reflow, pressure (with a clamping arrangement) on the unit is recommended, but not absolutely necessary. Absolute maximum reflow temperature is 260°C for not more than 10 seconds. 5. Chemically reclean the unit using the procedures given in step one. Make sure that a flux remover is used which is appropriate for the type of solder cream used (Multicore PC81 is the recommended flux remover for the above mentioned cream). It should be noted that there are many alternatives for component attachment. This procedure has been found to be simple and effective. For more detailed instructions on how to use PlanarPak Products, please see the application note “PlanarPak Users Information” Pub. 5963-3232E. For more information: United States* Europe* Far East/Australasia: (65) 290-6305 Canada: (416) 206-4725 Japan: (81 3) 3331-6111 *Call your local HP sales office listed in your telephone directory. Ask for a Components representative. Data Subject to Change Copyright © 1995 Hewlett-Packard Co. Printed in U.S.A. 5963-2585E (10/94)