0603 Active Filter Series GENERAL DESCRIPTION AVX has developed the Active Filter Series to address the emissions and susceptibility problems typical of today’s high speed digital circuits. The Active Filter Series is the equivalent of back-to-back Zener diodes and an EMC capacitor integrated into a single 0603 SMT case size. In its off state the Active Filter Series can be used to attenuate EMI/RFI. Typical values of attenuation at 3dB are 450MHz - 5000MHz, and typical values of attenuation at 10dB are 950MHz - 2600MHz. A more definitive representation of the filter effect is shown in the S 21 curve. One of the specific advantages of the Active Filter Series is a consistent EMI attenuation across a large bandwidth (without multiple frequency poles occurring). This makes compliance to Electromagnetic Susceptibility and Emission Specifications such as FCC Part 68, SAE J1113 and IEC 61000-4-2 a much easier task for the designer. A KYOCERA GROUP COMPANY HOW TO ORDER AFS 0001 D P Style Active Filter Series Case Size 0001 = 0603 Discrete Packaging Code (Reel Size) D = 7" Reel (1,000 pcs.) R = 7" Reel (4,000 pcs.) T = 13" Reel (10,000 pcs.) Termination P = Plated (Ni/Sn Alloy) S21 Curve PERFORMANCE CHARACTERISTICS Peak Pulse Power Dissipation Power Dissipation Zener Voltage Device Capacitance Peak Current Reverse Recovery Time Turn On Time Operating Temperature Storage Temperature TEST CONDITION 1ms, Ta≤25°C Ta≤25°C, FR-4 Ta≤25°C, Alumina 1mA 1 MHz LIMIT 7.5 W 225 mW 300 mW 80 V 27 pF (max) 2.5 A ≤ 600 pS -5 S21 (dB) PARAMETER 0 -10 -15 -20 10 ≤ 600 pS -65 to +150°C -65 to +150°C 100 1000 Frequency (MHz) 10000 Typical Pulse Rating Curve CTE (PPM / °C) Thermal Conductivity 6.1 ppm/°C 0.5 (W/cm)/°C Peak Power (W) 10000 MECHANICAL SPECIFICATIONS 1000 100 10 10 100 1000 Pulse Duration (µS) 10000 0603 Active Filter Series PHYSICAL DIMENSIONS Length Width Thickness Term Band Width Term Separation TYPICAL INFRARED REFLOW PROCESS (IR) millimeters (inches) 1.6 ±0.15 (0.063 ±0.006) 0.8 ±0.15 (0.031 ±0.006) 0.9 Max. (0.035 Max.) 0.35 ±0.15 (0.014 ±0.006) 0.7 (0.028) Soldering with IR has the highest yields due to controlled heating rates and solder liquidus times. Only the dwell time and peak temperature limitations of resin-molded components need to be considered. Typical recommended solder paste wet layout is ≥ 6 mils. SOLDER PAD DIMENSIONS millimeters (inches) 250 TEMPERATURE °C 215-219°C 0.89 (0.035) 2.54 (0.100) 0.76 (0.030) 0.89 (0.035) 200 183°C N COATU OL RA DO L W 45-80 N SEC. ABOVE SOLDER MELTING POINT 150 100°C 100 ALLOWS UNIFORM BOARD HEATING 50 PREHEAT ZONE ACTIVATES SOLDER FLUX 0.76 (0.030) 0 0 1 2 TIME IN MINUTES 3 4 IR Reflow Solder Profile APPLICATION CPU The Active Filter Series is an important step towards integration of several active and passive devices into one package. Integration in turn creates a major size reduction for board layout engineers. Typical size reductions of >90% can be achieved by replacing diode packages and associated EMC capacitors with an AVX Active Filter device. An example of such replacement is shown on the right. In addition, overall system reliability is improved with the AFS due to a FIT of ≤0.1 failures (per billion hours). EMC CAP DIODE CLAMPS Diode Clamp and EMC Capacitor solution I/O BUS CPU Active Filter Series Simplified design with the AVX Active Filter Series NOTICE: Specifications are subject to change without notice. Contact your nearest AVX Sales Office for the latest specifications. All statements, information and data given herein are believed to be accurate and reliable, but are presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements or suggestions concerning possible use of our products are made without representation or warranty that any such use is free of patent infringement and are not recommendations to infringe any patent. The user should not assume that all safety measures are indicated or that other measures may not be required. Specifications are typical and may not apply to all applications. 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