PRELIMINARY DATA SHEET ECM028 Korean PCS CDMA 3.5V POWER AMPLIFIER MODULE Description Features The ECM028 is a Korean Band Personal Communications Service (PCS) power amplifier housed in a 6-pin, 6 X 6mm Land Grid Array, surface mounted module. The RF input and RF output are both matched to 50Ω and it operates at 3.5V Vcc with high efficiency within the 1750 to 1780 MHz band. This device was developed using EiC’s own InGaP Gallium Arsenide Heterojunction Bipolar Transistor (HBT) process and is optimized for PCS CDMA (digital) providing excellent power added efficiency up to 28dBm output. Operates from a single 3.5V Supply for 3-Cell Ni or Li-Ion Battery Power-down activated when Vref pin <1V Very low leakage current <10uA 28 dBm CDMA Power 40% CDMA Efficiency @ 28dBm Power-down Capability Applications 50 mA Typical Quiescent Current 3.5 V Korean PCS CDMA Handsets High Reliability InGaP design CAUTION! SENSITIVE ELECTRONIC DEVICE SS-000520-000 Revision E EiC Corp. A Subsidiary of EiC Enterprises, Ltd. 45738 Northport Loop West, Fremont, CA 94538 Phone: (510) 979-8999 Fax: (510) 979-8902 www.eiccorp.com 1 PRELIMINARY DATA SHEET ECM028 Korean PCS CDMA 3.5V POWER AMPLIFIER MODULE ELECTRICAL SPECIFICATIONS The following tables list the electrical characteristics of the ECM028 Power Amplifier Module. Table 1 lists the electrical performance of the ECM028 for nominal operating conditions for the Korean PCS band. Table 2 lists the absolute maximum ratings for continuous operation. Table 1 - Electrical Specifications Test Conditions: Ta = 25oC, VCC = +3.5V, VREF / PD (reference / power-down voltage) = +2.9V, F = 1750 to 1780 MHz SYMBOL PARAMETER CONDITION Frequency Gain (CDMA Modulation) Po = +28 dBm Output Power (CDMA) Adjacent Channel Power Rejection Po = +28 dBm Adjacent Channel Power Rejection Po = +28 dBm Power Added Efficiency (CDMA) Po = +28 dBm Total Current, Icc Po = +28 dBm Total Current, Icc Po = +22 dBm Total Current, Icc Po = +16 dBm Output Stability Quiscent Current No RF Applied Leakage Current No RF Applied Supply Voltage V reference (power down) Input Return Loss 2nd Harmonics Po = +28 dBm Noise Noise Power in RX Band Po = +28 dBm Noise Figure NF TON/OFF Power Down On/Off Time NOTE 1: Using Application Schematic. Tuned for CDMA. NOTE 2: @ 1250 KHz and 2250KHz offset from band center. NOTE 3: No oscillation all phases NOTE 4: Vcc = 3.5V, VREF/PD = 0V, No RF F G P ACPR ACPR2 PAE Icc Icc Icc S ICQ ILeak Vcc Vref/Vpd IRL LIMITS MIN. 1750 25 35 3.0 UNIT TYP. MAX. 1780 28 28 -48 -58 40 450 225 125 6:1 50 7 3.5 2.9 10 -40 -140 5 <100 -45 -55 70 20 TEST CONDITION MHz dB dBm dBc dBc % mA mA mA VSWR mA uA V V dB dBc dBm/Hz dB ns NOTE 1 NOTE 2 NOTE 2 NOTE 3 NOTE 4 Table 2 - Absolute Maximum Ratings Exceeding any of the absolute maximum ratings may cause permanent damage to the device. No damage assuming only one paeameter is set at limit at a time with other parameters set at or below nominal value. PARAMETER Supply Voltage Reference / Power-down Voltage(Vcc=VREF / PD ) RF Power Input Ambient Operating Temperature Storage Temperature RATING 7 UNIT Volts 4 Volts +15 -40 to +110 -65 to +140 dBm °C °C TEST CONDITION VREF / PD = 2.9V V CC = 3.5V VCC , VREF / PD SS-000520-000 Revision E EiC Corp. A Subsidiary of EiC Enterprises, Ltd. 45738 Northport Loop West, Fremont, CA 94538 Phone: (510) 979-8999 = 2.9V Fax: (510) 979-8902 www.eiccorp.com 2 PRELIMINARY DATA SHEET ECM028 Korean PCS CDMA 3.5V POWER AMPLIFIER MODULE PACKAGE DIMENSIONS AND MARKINGS The ECM028 is a multi-layer laminate base, overmold encapsulated modular package designed for surface-mounted solder attachment to a printed circuit board. Package Dimensions X X1 X1 1 6 inches Y1 Y2 Y3 7 2 5 Y nom max min nom X .228 .232 .236 5.78 5.89 5.99 X1 .091 .095 .099 2.31 2.41 2.51 X2 .043 .047 .051 1.09 1.19 1.29 X3 .090 .228 .094 .232 .098 .236 2.29 2.39 2.49 5.78 5.89 5.99 Y Y1 3 4 millimeters min max Y1 .091 .095 .099 2.31 2.41 2.51 Y2 .071 .075 .079 1.81 1.91 2.01 Y3 .139 .143 .147 3.53 3.63 3.73 Metric values are converted from English values. X2 Metric values are rounded off. BOTTOM SIDE PAD .036" X .030" (0.91mm X 0.76mm) BOTTOM SIDE GROUND PAD (The exposed ground metal is within this area.) X3 Device Marking .062" +/- .004" (1.57 mm +/-0.10 mm) 1 2 3 4 5 6 7 PINOUT Vcc1 RFin VPD Vcc2 RFout GND GND .232" +/- 0.004" (5.89mm +/- 0.1mm) .232" +/- 0.004" (5.89mm +/- 0.1mm) PIN 1 INDICATOR EiC xxxx ECM028 XXXX XXXX LOT NUMBER TOP VIEW WITH MARKING DIAGRAM SS-000520-000 Revision E EiC Corp. A Subsidiary of EiC Enterprises, Ltd. 45738 Northport Loop West, Fremont, CA 94538 Phone: (510) 979-8999 Fax: (510) 979-8902 www.eiccorp.com 3 PRELIMINARY DATA SHEET ECM028 Korean PCS CDMA 3.5V POWER AMPLIFIER MODULE PCB LAYOUT 1. The front side of the pcb ground area under the PAM requires the use of multiple vias to provide low thermal resistance to the backside of the pcb ground. EVAL BOARD SCHEMATIC SS-000520-000 Revision E EiC Corp. A Subsidiary of EiC Enterprises, Ltd. 45738 Northport Loop West, Fremont, CA 94538 Phone: (510) 979-8999 Fax: (510) 979-8902 www.eiccorp.com 4 PRELIMINARY DATA SHEET ECM028 Korean PCS CDMA 3.5V POWER AMPLIFIER MODULE PIN 1 2 FUNCTION Vcc1 RF In 3 Vref / Vpd 4 5 6 Vcc2 RF Out GND 7 GND Notes: DESCRIPTION PIN 1 connects to the driver stage HBT collector. RF input port connects to internally matched 50 ohm circuit. Ref. Voltage for the bias circuit. No significant amplifier current is drawn until Vref reaches approximately 2.5V. Vcc2 connects to the power amplifier stage HBT collector. RF out is internally matched to 50 ohms and expects a 50 ohm load impedance. Ground Ground. This ground also serves as heat sink and must connect well to the PCB RF ground and heat sink. All supply pins may be connected together at the supply. SS-000520-000 Revision E EiC Corp. A Subsidiary of EiC Enterprises, Ltd. 45738 Northport Loop West, Fremont, CA 94538 Phone: (510) 979-8999 Fax: (510) 979-8902 www.eiccorp.com 5 PRELIMINARY DATA SHEET ECM028 Korean PCS CDMA 3.5V POWER AMPLIFIER MODULE Figure 1 Gain vs. Pout vs. Frequency vs. Temperature 30 Gain (dB) 29 -30°C 1750MHz 25°C 1750MHz 85°C 1750MHz -30°C 1780MHz 28 27 26 25°C 1780MHz 85°C 1780MHz 25 24 23 14 16 18 20 22 24 26 28 30 Pout (dBm) Figure 2 CDMA Gain vs. Temperature vs. Frequency 30 Gain (dB) 29 1750MHz 1780MHz 28 27 26 -30°C -20°C 0°C 25°C 40°C 60°C Temperature SS-000520-000 Revision E EiC Corp. A Subsidiary of EiC Enterprises, Ltd. 45738 Northport Loop West, Fremont, CA 94538 Phone: (510) 979-8999 Fax: (510) 979-8902 www.eiccorp.com 6 PRELIMINARY DATA SHEET ECM028 Korean PCS CDMA 3.5V POWER AMPLIFIER MODULE Figure 3 PAE vs. Frequency vs. Temperature @ 28.0dBm 42 41 PAE (%) 40 -30°C 39 25°C 85°C 38 37 36 35 1750MHz 1780MHz Frequency (MHz) Figure 4 PAE vs. Pout vs. Frequency 60 PAE (%) 50 25°C 1750MHz 25°C 1780MHz -30°C 1750MHz -30°C 1780MHz 85°C 1750MHz 85°C 1780MHz 40 30 20 10 0 14 16 18 20 22 24 26 28 30 Pout (dBm) SS-000520-000 Revision E EiC Corp. A Subsidiary of EiC Enterprises, Ltd. 45738 Northport Loop West, Fremont, CA 94538 Phone: (510) 979-8999 Fax: (510) 979-8902 www.eiccorp.com 7 PRELIMINARY DATA SHEET ECM028 Korean PCS CDMA 3.5V POWER AMPLIFIER MODULE Figure 5 ACPR1 vs. Pout vs. Frequency vs. Temperature 0 ACPR1 (dBc) -10 -30°C 1750MHz -20 25°C 1750MHz -30 85°C 1750MHz -40 -30°C 1780MHz 25°C 1780MHz -50 85°C 1780MHz -60 -70 14 16 18 20 22 24 26 28 30 Pout (dBm) Figure 6 ACPR2 vs. Pout vs. Frequency vs. temperature 0 ACPR2 (dBc) -10 -20 -30°C 1750MHz -30 25°C 1750MHz 85°C 1750MHz -40 -30°C 1780MHzx -50 25°C 1780MHz -60 85°C 1780MHz -70 -80 14 16 18 20 22 24 26 28 30 Pout (dBm) SS-000520-000 Revision E EiC Corp. A Subsidiary of EiC Enterprises, Ltd. 45738 Northport Loop West, Fremont, CA 94538 Phone: (510) 979-8999 Fax: (510) 979-8902 www.eiccorp.com 8 PRELIMINARY DATA SHEET ECM028 Korean PCS CDMA 3.5V POWER AMPLIFIER MODULE Figure 7 ACPR1 vs. Temperature vs. Frequency @ 28.0dBm ACPR (dBc) -44 -46 1750MHz 1780MHz -48 -50 -52 -30°C -20°C 0°C 25°C 40°C 60°C Temperature Figure 8 PAE vs. Frequency vs. Temperature @ 28.0dBm 42 -30°C -20°C 0°C 25°C 40°C 60°C 85°C 41 PAE (%) 40 39 38 37 36 35 1750MHz 1780MHz Frequency (MHz) SS-000520-000 Revision E EiC Corp. A Subsidiary of EiC Enterprises, Ltd. 45738 Northport Loop West, Fremont, CA 94538 Phone: (510) 979-8999 Fax: (510) 979-8902 www.eiccorp.com 9 PRELIMINARY DATA SHEET ECM028 Korean PCS CDMA 3.5V POWER AMPLIFIER MODULE ECM028 Operating Principles and Key Features ECM028 is a 6x6mm size Power Amplifier Module (PAM) for the Korean PCS band CDMA handset market.. The PAM utilizes InGaP HBT technology and a multi layer laminate base, over molded modular package with a LGA signal pad. I. In GaP HBT offers Reliability and Quality EiCs proprietary InGaP HBT provides excellent reliability and is used in the infrastructure industry. The InGaP HBT is inherently superior to AlGaAs HBT. The surface defect density in InGaP is much lower than that of AlGaAs. The HBT life test of EiC InGaP HBT has gone through 315oC junction temperature and 50kA/cm2 for over 6000 hours (8 ½ months), translating to multimillion hours lifetime or longer in the operation envelope [1]. This kind of robust performance is far superior to conventional AlGaAs HBT. The InGaP HBT PAM goes through a product burn-in test as well. A large sample group, usually 100 pieces, goes through burn-in test at an ambient temperature of 125 to 145 oC for 1000 hours. The FIT number is than calculated based upon the data collected. The MTTF is simply 1/FIT, this MTTF should agree with the HBT life test results. The agreement between the MTTF of HBT from life test and the FIT is essential: it validates both tests! If there is a large discrepancy [2], the quality claim may be flawed. Although handset applications do not have as stringent operating requirements as the infrastructure market, the high reliability of InGaP HBT offers an assurance to the user of a high quality product designed for high volume production. II. InGaP HBT and Patent-pending Circuit Design Offers Low Temperature Variation Current gain of InGaP HBT varies about 10% over –40 to +85oC range, compared with 50% of AlGaAs HBT. This low gain variation over temperature, coupled with the patent-pending circuit design approach, provides for more stable electrical performance. III. ECM028 Offers High Gain and Margin for Transmitter Chain Design The typical gain of the ECM028 is 28dB. This high gain allows the driver amplifier to run very linear which results in reduced current. Taking into account the 3dB loss of the BPF in front of the PAM, the driver needs to deliver only 4dBm linear power. The P1dB of the driver amplifier should be more than 10dBm. SS-000520-000 Revision E EiC Corp. A Subsidiary of EiC Enterprises, Ltd. 45738 Northport Loop West, Fremont, CA 94538 Phone: (510) 979-8999 Fax: (510) 979-8902 www.eiccorp.com 10 PRELIMINARY DATA SHEET ECM028 Korean PCS CDMA 3.5V POWER AMPLIFIER MODULE If a lower gain PAM is used, the driver needs to provide more power, at the expense of more operation current and possible degradation in ACPR. Therefore the ECM028 can replace a lower gain PAM, this allows the driver to work at a lower output power and provide better ACPR, this improved performance offers more design margin in the transmitter chain. IV. Easy Shut Down and Low Leakage Current The Vcc pin of the PAM is connected directly to the battery, therefore a shut down FET is not required. A voltage is applied to the Vref pin, which then brings up the quiescent current. Removing the voltage applied to Vref pin, the quiescent current will drop to a small leakage current, typically <10uA. The low leakage current of the PAM allows for a longer standby time for the phone. V. General Application The PAM requires a minimal number of external components. Both the input and output are dc-blocked within the PAM as shown in the function diagram. The input pin is connected to ground through a shunt inductor within the PAM. ECM028 is designed with a low quiescent current of 50mA typical. At full CDMA power of 28dBm, the operation current will be around 500mA. Therefore it is a “quasi class B” or “deep class AB” amplifier. The operation current increases with output power. CDMA signal has a time varying amplitude. The peak power is 4dB above the average RF power (it can be more accurately defined by PDF, power density function). As the peak power is clipped by the amplifier saturation power level, the distortion of the signal will cause the ACPR to deteriorate rapidly. Therefore the P1dB (as tested by a SINE wave) of the amplifier should be over 31dBm to provide good ACPR at 28 dBm of output power. A 100pF capacitor is required adjacent to the Vcc2 pin. In addition, a large capacitor (>uF) is required. The CDMA signal has a time-varying amplitude; therefore the PAM draws on operation current corresponding to the instantaneous demand by the RF power. The large capacitor near-by is the electric charge reservoir, providing current on demand. The long electrical path from battery behaves as a large inductor; the instantaneous demand on current will cause a voltage drop, resulting in poor ACPR. On the evaluation board, a large shunt capacitor is added to protect the Vref pin from power supply over-voltage during ON/OFF. This is similar but SS-000520-000 Revision E EiC Corp. A Subsidiary of EiC Enterprises, Ltd. 45738 Northport Loop West, Fremont, CA 94538 Phone: (510) 979-8999 Fax: (510) 979-8902 www.eiccorp.com 11 PRELIMINARY DATA SHEET ECM028 Korean PCS CDMA 3.5V POWER AMPLIFIER MODULE different from the ESD. Therefore the rise and fall time test of the power down feature needs to be tested with the shunt capacitor on Vref pin removed. Conclusion ECM028 offers high gain, low quiescent current, and a small footprint. The InGaP technology provides excellent reliability and quality, assuring the phone set manufacturer a high quality product designed for high volume production. 1. “InGaP HBTs offer Enhanced Reliability”, Barry Lin, Applied Microwave and Wireless. pp 115-116, Dec. 2000 2.” Interaction of Degradation Mechanisms in Be-Doped GaAs HBTs”, Darrell Hill and John Parsey, Digest GaAs IC Symposium, Oct., 2000. pp 241-244 APPLICATION NOTES Please visit our website at www.eiccorp.com to view or download the following documents. You may also call our Customer Service to request a hardcopy. Document # Description AP-000513-000 Tape and Reel Specifications: PAMS AP-000516-000 Application Note Index SS-000520-000 Revision E EiC Corp. A Subsidiary of EiC Enterprises, Ltd. 45738 Northport Loop West, Fremont, CA 94538 Phone: (510) 979-8999 Fax: (510) 979-8902 www.eiccorp.com 12