User’s Manual IE-784915-R-EM1 I/O Emulation Board EP-784915GF-R Emulation Probe µPD784915 Subseries µPD784928 Subseries µPD784928Y Subseries Document No. U10931EJ2V0UM00 (2nd edition) Date Published October 1997 N © Printed in Japan 1996 [MEMO] 2 This product is designed to be used in a commercial or industrial district. If it is used in a residential district or in an area in the vicinity of a residential district, radio and TV receivers in the district may be affected. Use this product correctly by carefully reading its User’s Manual. The information in this document is subject to change without notice. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or of others. M7A 96.10 3 Regional Information Some information contained in this document may vary from country to country. Before using any NEC product in your application, please contact the NEC office in your country to obtain a list of authorized representatives and distributors. They will verify: • Device availability • Ordering information • Product release schedule • Availability of related technical literature • Development environment specifications (for example, specifications for third-party tools and components, host computers, power plugs, AC supply voltages, and so forth) • Network requirements In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary from country to country. NEC Electronics Inc. (U.S.) NEC Electronics (Germany) GmbH NEC Electronics Hong Kong Ltd. Santa Clara, California Tel: 800-366-9782 Fax: 800-729-9288 Benelux Office Eindhoven, The Netherlands Tel: 040-2445845 Fax: 040-2444580 Hong Kong Tel: 2886-9318 Fax: 2886-9022/9044 NEC Electronics (Germany) GmbH Duesseldorf, Germany Tel: 0211-65 03 02 Fax: 0211-65 03 490 NEC Electronics Hong Kong Ltd. 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Sao Paulo-SP, Brasil Tel: 011-889-1680 Fax: 011-889-1689 J96. 8 4 MAJOR REVISIONS IN THIS EDITION Page Contents Throughout µPD784928 subseries and µPD784928Y subseries added to the target devices. p.61 VOLUME 2 EP-784915GF-R APPENDIX A EXTERNAL VIEW OF CONVERSION SOCKET Drawing of the NQPACK100RB added. The mark shows major revised points. 5 [MEMO] 6 PREFACE Product outline The IE-784915-R-EM1 is connected to the IE-784000-R-EM, inserted in the IE784000-R, and used to debug the µPD784915 subseries, µPD784928 subseries, and µPD784928Y subseries 16-bit single-chip microcontrollers. The EP-784915GF-R is an emulation probe to connect the IE-784915-R-EM1 and a target system. The EP-784915GF-R is used in combination with the EV-9200GF100 or NQPACK100RB. Remark The NQPACK100RB is a product of Tokyo Eletech Corp. (03-5295-1661). When purchasing the product, consult your NEC distributor. Intended Readership This manual is intended for engineers who use the µPD784915 subseries, µPD784928 subseries, and µPD784928Y subseries 16-bit single-chip microcontrollers and perform system debugging, using the IE-784000-R and IE-784000-R-EM in combination with the IE-784915-R-EM1. It is also intended for engineers who upgrade a system using other in-circuit emulators so that it has functions equivalent to those of the IE784000-R. Therefore, the engineers who read this manual are assumed to be familiar with the functions and usage of the subseries used and have knowledge of debuggers. Purpose The purpose of this manual is to give readers an understanding of the method of connecting the IE-784915-R-EM1 to the IE-784000-R and IE-784000-R-EM, the setting method when debugging the µPD784915 subseries, µPD784928 subseries, and µPD784928Y subseries, and the method of connecting the EP-784915GF-R with the IE-784915-R-EM1. Organization This manual consists of the following two parts. VOLUME 1: IE-784915-R-EM1 • System configuration • Function of external interface VOLUME 2: EP-784915GF-R • General description • Connection method with IE-784000-R Use the IE-784000-R manual as well. 7 Using This Information VOLUME 1: IE-784915-R-EM1 To have a general understanding of the IE-784915-R-EM1 functions, → read according to the TABLE OF CONTENTS. To understand the basic specifications, → read CHAPTER 1 GENERAL DESCRIPTION. When looking up the setting method when the IE-784915-R-EM1 is connected with the IE-784000-R to debug the µPD784915 subseries, µPD784928 subseries, and µPD784928Y subseries, → read CHAPTER 2 INSTALLATION PROCEDURE. VOLUME 2: EP-784915GF-R To have a general understanding of the EP-784915GF-R functions, → read according to the TABLE OF CONTENTS. To understand the operating environment and configuration, → read CHAPTER 1 GENERAL DESCRIPTION. To understand the specific connection method, → read CHAPTER 2 CONNECTION. Terminology The meaning of each term used in this manual is described in the table below. Term Meaning Emulation device General term of devices that perform emulation of target devices in the emulator Includes the emulation CPU. Emulation CPU CPU block which executes the program created by the user in the emulator Target device Device that is an emulation target (real chip) Target program Program that is a debugging target (program created by the user) Target system System that is a debugging target (system created by the user). Includes a target program and hardware created by the user. Refers to hardware only in a narrow sense. Legend 8 Note : Explanation of items marked with Note in the text Caution : Item to be especially noted Remark : Supplementary information TABLE OF CONTENTS VOLUME 1 IE-784915-R-EM1 CHAPTER 1 GENERAL DESCRIPTION .............................................................................................. 1.1 Features .................................................................................................................................... 1.2 Product Configuration ............................................................................................................. 1.3 Part Names ............................................................................................................................... 1.4 Target Device ........................................................................................................................... 1.5 Emulation Probe ...................................................................................................................... 1.6 Operating Precautions ............................................................................................................ 13 13 13 16 17 17 17 CHAPTER 2 INSTALLATION PROCEDURE ...................................................................................... 2.1 Connection with IE-784000-R .................................................................................................. 2.2 Connection with Target System ............................................................................................. 2.3 When Target System is not Connected ................................................................................. 19 19 23 23 CHAPTER 3 SETTING OF USER CLOCK .......................................................................................... 25 3.1 Setting of Operating Clock ...................................................................................................... 25 3.2 Attaching Crystal Oscillator .................................................................................................... 26 CHAPTER 4 START-UP ....................................................................................................................... 29 CHAPTER 5 DIFFERENCES FROM TARGET DEVICE ...................................................................... 31 APPENDIX A PRODUCT SPECIFICATIONS ...................................................................................... 39 9 VOLUME 2 EP-784915GF-R CHAPTER 1 GENERAL DESCRIPTION .............................................................................................. 43 1.1 Operating Environment ........................................................................................................... 43 1.2 Configuration ........................................................................................................................... 43 CHAPTER 2 CONNECTION ................................................................................................................. 49 2.1 Outline of Connection Procedure ........................................................................................... 49 2.1.1 Connection of IE-784000-R-EM and IE-784915-R-EM1 ................................................................ 49 2.1.2 Connection of IE-784000-R and EP-784915GF-R ......................................................................... 49 2.1.3 Connection of EP-784915GF-R and target system ....................................................................... 51 2.1.4 Connection of external sense clips ................................................................................................ 54 2.2 Powering-On/Powering-Off Order .......................................................................................... 56 2.3 Removing EP-784915GF-R from Target System ................................................................... 57 APPENDIX A EXTERNAL VIEW OF CONVERSION SOCKET .......................................................... 59 A.1 External View of EV-9200GF-100 and Recommended Board Mounting Pattern ................ 59 A.2 External View of NQPACK100RB ........................................................................................... 61 10 VOLUME 1: IE-784915-R-EM1 I/O EMULATION BOARD 11 [MEMO] 12 CHAPTER 1 GENERAL DESCRIPTION The IE-784915-R-EM1 is an I/O emulation board for the µPD784915 subseries, µPD784928 subseries, and µPD784928Y subseries 16-bit single-chip microcontrollers. It can be made compatible with any product in the µPD784915 subseries, µPD784928 subseries, or µPD784928Y subseries just by changing the chip set board. Combining the IE-784915-R-EM1 and an emulation probe (EP-784915GF-R) with the IE-784000-R and IE-784000R-EM allows efficient debugging and operation verification of a system using the µPD784915 subseries, µPD784928 subseries, and µPD784928Y subseries. 1.1 Features The features of a combined system of the IE-784915-R-EM1 with IE-784000-R and IE-784000-R-EM are as follows. • Allows emulation of the µPD784915 subseries, µPD784928 subseries, and µPD784928Y subseries peripheral functions (such as I/O port) • Supply of CPU operating clock • Combination with a separately available emulation probe (EP-784915GF-R) and connection of a chip set board to the tip of the EP-784915GF-R allow debugging with characteristics similar to those of the real chip. 1.2 Product Configuration The IE-784915-R-EM1 has the following product configuration. Check the items included. • IE-784915-R-EM1 : 1 • Chip set board : 2 (For the µPD784915 subseries: 1, µPD784928/784928Y subseries: 1) • User’s Manual (this manual) : 1 Caution The chip set board is provided with a dedicated device (peripheral emulation device) to perform emulation of peripheral functions (I/O port, etc.) of the target device. 13 CHAPTER 1 GENERAL DESCRIPTION Figure 1-1. List of IE-784915-R-EM1 Product Configuration (1/3) (1) IE-784915-R-EM1 Front Back 14 CHAPTER 1 GENERAL DESCRIPTION Figure 1-1. List of IE-784915-R-EM1 Product Configuration (2/3) (2) Chip set board The photos below show the chip set board of the µPD784915 subseries. It has the same appearance as that of the µPD784928 and 784928Y subseries. Please use the µPD784915 subseries as a reference. Side to be connected to emulation probe Side to be connected to dummy board 15 CHAPTER 1 GENERAL DESCRIPTION Figure 1-1. List of IE-784915-R-EM1 Product Configuration (3/3) (3) User’s Manual (this manual) User’s Manual IE-784915-R-EM1 I/O Emulation Board EP-784915GF-R Emulation Probe µPD784915 Subseries µ PD784928 Subseries µ PD784928Y Subseries © 1996 Printed in Japan 1.3 Part Names Table 1-1 shows names of connectors and other parts. Table 1-1. IE-784915-R-EM1 Part Names Name CN1 Function Emulation probe (EP-784915GF-R) connector CN2 PJ1 Emulation board (EP-784000-R-EM) connector PJ2 TGCN1 Unused TGCN2 L1 L2 16 Chip set board Connector CHAPTER 1 GENERAL DESCRIPTION 1.4 Target Device The following products are the target devices that can be emulated by the IE-784000-R and IE-784000-R-EM in combination with the IE-784915-R-EM1. <µPD784915 subseries> <µPD784928 subseries> <µPD784928Y subseries> • µPD784915 • µPD784927 • µPD784927Y • µPD784928 • µPD784928Y • µPD78F4928 • µPD78F4928Y • µPD78P4916 Remark The µPD784928 subseries and 784928Y subseries are under development. 1.5 Emulation Probe Use of the IE-784915-R-EM1 connected to the target system always requires an emulation probe. The emulation probe is available separately. Part Number Target Package EP-784915GF-R 100-pin plastic QFP (14 × 20 mm) Caution Two types of probe tip board (dummy board) are provided: LCC type and QFP type. See VOLUME 2 EP-784915GF-R for details. 1.6 Operating Precautions (1) Be sure to turn off the power of the IE-784000-R and target system before connection of the IE-784915-REM1 with the IE-784000-R and IE-784000-R-EM and its removal. (2) When performing emulation of the target device by the IE-784915-R-EM1 in combination with the IE-784000R and IE-784000-R-EM, note that there are partial differences in pin characteristics from the real chip (see CHAPTER 5 DIFFERENCES FROM TARGET DEVICE). (3) Correctly attach the IE-784915-R-EM1 to the IE-784000-R-EM. (4) Correctly attach the IE-784000-R-EM to the IE-784000-R main unit. (5) Correctly connect the chip set board. • When an emulation probe is used, → connect the chip set board to the tip of the emulation probe. • When an emulation probe is not used, → connect the chip select board to connectors L1 and L2 of the IE-784915-R-EM1. Caution Do not simultaneously connect the chip set board to both the tip of the emulation probe and the IE-784915-R-EM1. 17 [MEMO] 18 CHAPTER 2 INSTALLATION PROCEDURE 2.1 Connection with IE-784000-R Figure 2-1 shows an installation schematic of the IE-784000-R. Figure 2-1. Installation Schematic of IE-784000-R Emulation probe Cover of IE-784000-R IE-784000-R-EM (available separately) IE-784915-R-EM1 IE-784000-R main unit 19 CHAPTER 2 INSTALLATION PROCEDURE The IE-784915-R-EM1 is connected to the IE-784000-R and IE-784000-R-EM according the following procedure. <1> Connection of chip set board Caution When used with an emulation probe connected, do not connect the chip set board to the IE784915-R-EM1. Connect the chip set board to L1 and L2 on the IE-784915-R-EM1. Figure 2-2. Connection of Chip Set Board Chip set board L2 L1 IE-784915-R-EM1 <2> Setting of user clock Perform the setting with reference to CHAPTER 3 SETTING OF USER CLOCK. 20 CHAPTER 2 INSTALLATION PROCEDURE <3> Mounting IE-784915-R-EM1 onto IE-784000-R-EM Connect connectors PJ1 and PJ2 on the IE-784000-R-EM with connectors PJ1 and PJ2 on the IE-784915R-EM1. Figure 2-3. Connection of IE-784915-R-EM1 and IE-784000-R-EM PJ2 IE-784915-R-EM1 PJ1 PJ2 IE-784000-R-EM PJ1 <4> Removal of top cover Remove 6 screws on the top surface of the unit and remove the top cover as shown in Figure 2-4. Figure 2-4. Removal of Top Cover 21 CHAPTER 2 INSTALLATION PROCEDURE <5> Removal of rubber of top cover After removing the top cover, remove the rubber. <6> Insert the IE-784000-R-EM + IE-784915-R-EM1 into the 2nd slot and 3rd slot, put the top cover, and replace the screws. Figure 2-5. Insertion of IE-784000-R-EM in IE-784000-R IE-784000-R-EM (2nd slot) IE-784915-R-EM1 (3rd slot) IE-784000-R-BK (performance board) (4th slot) Power supply switch IE-784000-R-BK (event trace board) (5th slot) Supervisor board (fixed) 22 CHAPTER 2 INSTALLATION PROCEDURE 2.2 Connection with Target System Connection of the IE-784000-R and the target system is performed using a separately available emulation probe (EP-784915GF-R). See 2.1.3 Connection of EP-784915GF-R and target system of VOLUME 2: EP-784915GFR for details. 2.3 When Target System is not Connected Even if the target system is not connected, the IE-784000-R can still be used. In this case, connect the chip set board that contains the µPD78P4916, µPD78F4928, or µPD78F4928Y (emulation chip) to connectors L1 and L2 of the IE-784915-R-EM1 to start the IE-784000-R. See 2.1 Connection with IE-784000-R for details. 23 [MEMO] 24 CHAPTER 3 SETTING OF USER CLOCK In the IE-784000-R, a fixed clock (16 MHz) on the IE-784915-R-EM1 is supplied to the emulation device unless the clock setting is changed. Operating the emulation device with an oscillation clock on the target system or an arbitrary clock requires the setting of the clock setting socket (IC15) and selection of an external clock in the configuration dialog on the integrated debugger (ID78K4). See the ID78K/IV Integrated Debugger User’s Manual for the setting method using the integrated debugger and this chapter for operating with an arbitrary clock. 3.1 Setting of Operating Clock The following operating clocks can be set in the IE-784000-R. (1) Operation with fixed clock on IE-784915-R-EM1 When an internal clock is selected by the debugger, a fixed clock (16 MHz) on the emulation board is supplied to the emulation device. This mode is set after the power of the IE-784000-R is turned on. This mode remains unchanged unless an external clock is selected. (2) Operation with arbitrary clock on IE-784915-R-EM1 An arbitrary clock mounted on the clock setting socket (IC15) is supplied to the emulation device by mounting a crystal oscillator with the same frequency as the clock supplied to the target device on the clock setting socket on the IE-784915-R-EM1 and selecting an external clock by the integrated debugger (ID78K4). See 3.2 Attaching Crystal Oscillator for details. Caution It is not possible to supply the clock from the oscillation clock on the target system to the emulation device. When operating at a frequency other than 16 MHz, use the method in (2) to supply the clock at the frequency actually used. 25 CHAPTER 3 SETTING OF USER CLOCK 3.2 Attaching Crystal Oscillator <1> Prepare the IE-784915-R-EM1. <2> Attach a crystal oscillator (MAX. 16 MHz) to the clock setting socket (IC15) on the IE-784915-R-EM1. Figure 3-1. Mounting Position on IE-784915-R-EM1 CN1 IC15 CN2 CLOCK OUT 8 7 GND VCC 14 1 NC [IC socket] 26 CLOCK OUT VCC GND NC [Crystal oscillator] CHAPTER 3 SETTING OF USER CLOCK When an external clock is selected by the integrated debugger (ID78K4), the following circuit is configured by which a clock is supplied from the crystal oscillator to the emulation device in the IE-784000-R-EM. Figure 3-2. Clock Supply of IE-784915-R-EM1 VCC 4.7 kΩ VHC244 Clock of clock setting socket on IE-784915-R-EM1 CLOCK IN (to emulation device) 27 CHAPTER 3 [MEMO] 28 SETTING OF USER CLOCK CHAPTER 4 START-UP For the start-up method, see the ID78K/IV Integrated Debugger User’s Manual after the connection with the host machine is completed. If the start-up does not work out, check problems using this manual or the IE-784000-R User’s Manual. 29 [MEMO] 30 CHAPTER 5 DIFFERENCES FROM TARGET DEVICE Since this IE performs emulation using the emulation CPU and peripheral simulation device, the IE pin characteristics are partly different from the pin characteristics of the target device. 31 CHAPTER 5 DIFFERENCES FROM TARGET DEVICE (1) When chip set board is connected to emulation probe Figure 5-1. Equivalent Circuit Diagram of Port Pin Emulation Circuit (1/3) Emulation device side Target probe side LVCC AS244 HC125 27Ω 10 KΩ STOP RESET AVDD1 AVDD1 NC AVSS1 AVDD2 AVSS1 AVREF NC VDD Noise filter AVREF VDD AVDD2 VSS VSS AVSS2 AVSS2 CKIN Selector VCC 16 MHz VCC NC TEST/VPP NC X1 NC X2 NC TX1 NC TX2 Clock module (IC socket) Caution If an external clock is selected in the configuration setting of the ID78K4, the clock frequency of the crystal oscillator mounted on the IC socket is selected. 32 CHAPTER 5 DIFFERENCES FROM TARGET DEVICE Figure 5-1. Equivalent Circuit Diagram of Port Pin Emulation Circuit (2/3) Emulation device side Target probe side P0 (7 : 0) P0 (7 : 0) 27Ω P4 (7 : 0) P4 (7 : 0) 27Ω P5 (7 : 0) P5 (7 : 0) 27Ω P6 (7 : 0) P6 (7 : 0) 27Ω P7 (7 : 0) P7 (7 : 0) P8 (7 : 0) P8 (7 : 0) P9 (6 : 0) P9 (6 : 0) 27Ω INTP (2 : 0) INTP (2 : 0) PTO0 (2 : 0) PTO0 (2 : 0) PWM (1 : 0) PWM (1 : 0) SCK2 SCK2 SO2 SO2 SI2/BUSY SI2/BUSY ANI (11 : 8) ANI (11 : 8) NMI Q D NMI NMIMSK1 (emulation board) 33 CHAPTER 5 DIFFERENCES FROM TARGET DEVICE Figure 5-1. Equivalent Circuit Diagram of Port Pin Emulation Circuit (3/3) 34 Emulation device side Target probe side REEL0IN REEL0IN REEL1IN REEL1IN CSYNCIN CSYNCIN DFGIN DFGIN DPGIN DPGIN CFGIN CFGIN CFGAMP0 CFGAMP0 CFGCPIN CFGCPIN CTLDLY CTLDLY RECCTL+ RECCTL+ RECCTL– RECCTL– CTLIN CTLIN CTLOUT1 CTLOUT1 CTLOUT2 CTLOUT2 VREFC VREFC CHAPTER 5 DIFFERENCES FROM TARGET DEVICE (2) When chip set board is connected to IE-784915-R-EM1 Figure 5-2. Equivalent Circuit Diagram of Port Pin Emulation Circuit (1/3) Emulation device side LVCC STOP VCC VDD AVDD1 AVDD2 Noise filter VSS AVSS1 AVSS2 CKIN Selector VCC 16 MHz VCC Clock module (IC socket) P0 (7 : 0) NC P4 (7 : 0) NC P5 (7 : 0) NC P6 (7 : 0) NC P7 (7 : 0) NC P8 (7 : 0) NC P9 (6 : 0) NC 35 CHAPTER 5 DIFFERENCES FROM TARGET DEVICE Figure 5-2. Equivalent Circuit Diagram of Port Pin Emulation Circuit (2/3) Emulation device side INTP (2 : 0) PTO0 (2 : 0) NC PWM (1 : 0) NC VCC SCK2 SO2 NC SI2/BUSY ANI (11 : 8) NMI REEL0IN REEL1IN 36 NC CHAPTER 5 DIFFERENCES FROM TARGET DEVICE Figure 5-2. Equivalent Circuit Diagram of Port Pin Emulation Circuit (3/3) Emulation device side CSYNCIN DFGIN DPGIN CFGIN CFGAMP0 NC CFGCPIN CTLDLY NC RECCTL+ NC RECCTL– NC CTLIN NC CTLOUT1 NC CTLOUT2 VREFC NC Caution When the chip set board is connected with the IE-784915-R-EM1, power supply VDD from the target is connected with LVCC. 37 [MEMO] 38 APPENDIX A PRODUCT SPECIFICATIONS Product name : IE-784915-R-EM1 Operating temperature : 10 to 40 °C (however, there should be no condensation.) Humidity : 10 to 80% (however, there should be no condensation.) Storage temperature : –15 to +45 °C (however, there should be no condensation.) Power supply : +3.0 V to +5.5 V (supplied from IE-784000-R) Printed circuit board size : 210 × 140 mm Connectors: Name CN1 Function Emulation probe (EP-784915GF-R) connector CN2 PJ1 Emulation board (IP-784000-R-EM) connector PJ2 TGCN1 Unused TGCN2 L1 Chip set board connector L2 39 [MEMO] 40 VOLUME 2: EP-784915GF-R EMULATION PROBE 41 [MEMO] 42 CHAPTER 1 GENERAL DESCRIPTION This chapter explains an outline of the EP-784915GF-R. 1.1 Operating Environment The EP-784915GF-R is a probe set to connect the IE-784915-R-EM1 with the target system. Connection by means of the EP-784915GF-R prepares a debugging environment for the microcontroller and allows you to perform integrated debugging of hardware and software of the target system using the µPD784915 subseries, µPD784928 subseries, and µPD784928Y subseries. It can be made compatible with any product in the µPD784915 subseries, µPD784928 subseries, or µPD784928Y subseries just by changing the chip set board. For the specific connection method, see CHAPTER 2 CONNECTION. Figure 1-1. Connection of IE-784000-R and Target System In-circuit emulator Emulation probe Conversion socket IE-784000-R EV-9200GF-R IE-784000-R-EM EP-784915GF-R + or Target system NQPACK100RB IE-784915-R-EM1 1.2 Configuration The EP-784915GF-R consists of the following three parts. • Cables • Chip set board • Dummy board (LCC type or QFP type can be selected) Caution The EP-784915GF-R does not come with the chip set board. Use the one provided for the EP784915-R-EM1. 43 CHAPTER 1 GENERAL DESCRIPTION Figure 1-2. EP-784915GF-R Configuration <1> LCC type EP-784915GF-R Cable Chip set board Target connection part Dummy board (LCC type) <2> QFP EP-784915GF-R Cable Chip set board Screw Target connection part Dummy board (QFP type) 44 CHAPTER 1 GENERAL DESCRIPTION <1> Cables The cables are used to connect CN1 and CN2 of the EP-784915-R-EM1 with the chip set board. The cables come with earth clips and external sense clips connected. • Earth clips Connect them to GND of the target system. They allow the GND potential of the IE-784000-R to become the same as that of the target system making them resistant to static electricity and noise. • External sense clips 8 sense clips are provided. They are used to examine the voltage level of the IC pin mounted on the target system. Figure 1-3. Emulation Probe (EP-784915GF-R) External sense clips 100-pin GF Earth clips 45 CHAPTER 1 GENERAL DESCRIPTION <2> Chip set board This is a board on which the µPD78P4916GF, µPD78F4928GF, or µPD78F4928YGF are mounted to perform emulation of peripheral functions. Two chip set boards are attached to the IE-784915-R-EM1; one is for the µPD784915 subseries, and other is for the µPD784928 and 784928Y subseries. The emulation probe can be made compatible with any product in the µPD784915 subseries, µPD784928 subseries, or µPD784928Y subseries just by changing the chip set board. <3> Dummy board This comprises the connection with the target system and two types are available: LCC type and QFP type The LCC type and QFP type have different sockets connected to the target (see Table 1-1). Table 1-1. LCC Type and QFP Type Sockets LCC Type Socket on target side EV-9200GF-100 Features QFP Type NQPACK100RB – µPD78P4916GF, µPD78F4928GF, or µPD78F4928YGF mountable on socket (top cover is necessary) 46 CHAPTER 1 GENERAL DESCRIPTION Figure 1-4. Dummy Board (1) LCC type • Side to be connected to chip set board • Side to be connected to target system (2) QFP type • Side to be connected to chip set board • Side to be connected to target system 47 [MEMO] 48 CHAPTER 2 CONNECTION This chapter explains the method of connecting the EP-784915GF-R, powering-on/powering-off procedure, and the method of removing the emulation probe from the target system. 2.1 Outline of Connection Procedure (1) Connection of emulation board and I/O emulation board (2) Connection of in-circuit emulator and emulation probe (3) Connection of emulation probe and target system (4) Connection of external sense clips (when external sense clips are used) (5) Powering-on Details of the connection procedure are given below. 2.1.1 Connection of IE-784000-R-EM and IE-784915-R-EM1 (1) Turn off the power of the IE-784000-R. (2) Remove the cover of the IE-784000-R. (3) Connect the IE-784915-R-EM1 to the IE-784000-R-EM. (4) Insert the IE-784000-R-EM and IE-784915-R-EM1 in the IE-784000-R. (5) Put the cover on the IE-784000-R. 2.1.2 Connection of IE-784000-R and EP-784915GF-R (1) Connect the EP-784915GF-R to the emulation probe connection DIN connectors (CN1 and CN2 of the IE784915-R-EM1) on the IE-784000-R. (2) After the connection, be sure to fix the EP-784915GF-R and IE-784000-R with fitting screws. 49 CHAPTER 2 CONNECTION Figure 2-1. Example of Connection of IE-784000-R Main Unit and EP-784915GF-R Fitting screws Emulation probe (CN1) (CN2) IE-784000-R main unit Caution The connection locations vary depending on the I/O emulation board. See the IE-784000-R User’s Manual. 50 CHAPTER 2 CONNECTION 2.1.3 Connection of EP-784915GF-R and target system The emulation probe and target system are connected in the following order. Cautions 1. Before connecting the EP-784915GF-R with the target system, be sure to connect the earth clips first. Without the earth clips, the IE-784000-R may be destroyed by static electricity, etc. 2. Pay attention to inverse insertion of pins when making the connection. Erroneous connection may destroy the IE-784000-R. (1) Turn off the power of the target system. (2) Solder the conversion socket (EV-9200GF-100 or NQPACK100RB) attached to the IE-78495-R-EM1 to the target system. (3) Connect the earth clips of the EP-784915GF-R to GND of the target system. (4) Insert the EP-784915GF-R while aligning the 100-pin GF at the tip of the EP-784915GF-R and pin 1 of the conversion socket (EV-9200GF-100 or NQPACK100RB) soldered to the target system in (2). 51 CHAPTER 2 CONNECTION Figure 2-2. Example of Connection of EP-784915GF-R and Target System (LCC Type) EP-784915GF-R Chip set board Dummy board (for LCC type) EV-9200GF-100 IE-784000-R <1> Connect the chip set board and dummy board. <2> Connect the EP-784915GF-R and <1>. <3> Connect <1> + <2> with the target system. 52 Target system CHAPTER 2 CONNECTION Figure 2-3. Example of Connection of EP-784915GF-R and Target System (QFP Type) EP-784915GF-R Chip set board Dummy board (for QFP type) NQPACK100RB IE-784000-R Target system <1> Connect the dummy board and target system and then fix them with screws. <2> Connect the EP-784915GF-R and the chip set board. <3> Connect <1> and <2>. 53 CHAPTER 2 CONNECTION 2.1.4 Connection of external sense clips The EP-784915GF-R is provided with 8 external sense clips that can trace signals of hardware on the target system in real-time. Since the external sense clips are directly connected to the HCT244 input buffer in the IE-784000-R, they are TTLlevel inputs. Normally, there are 8 external sense clip input signal lines, but the signal line of external sense clip 1 can be used as an outgoing trigger output signal line when an event occurs by setting the OUT command of the IE-784000-R (see the IE-784000-R User’s Manual for details). Cautions 1. Connect the external sense clips only to the TTL-level signal lines. If connected to signal lines other than the TTL-level signal lines, they cannot detect high/low levels accurately, or the sensor in the IE-784000-R may be destroyed depending on the voltage level. 2. When external sense clip 1 is used as an external trigger output, ensure that external sense clip 1 is not connected with the signal output line. malfunction. 54 Erroneous connection may cause CHAPTER 2 CONNECTION When using the external sense clips, connect them in the following order. (1) Turn off the power of the target system and IE-784000-R, in that order. (2) Attach the IC clips (sold separately) to any IC to be traced on the target system. (3) Connect the external sense clips to the IC clips attached. (4) Turn on the power of the IE-784000-R and target system, in that order. Figure 2-4. Connection of External Sense Clip External sense clip IC clip ,, ,, ,, ,, ,, IC Target system Remark When connecting the external clips, use the IC clips wherever possible. This will prevent mis-connection and improve operability. 55 CHAPTER 2 CONNECTION 2.2 Powering-On/Powering-Off Order After connection of the emulation probe and target system is completed, turn on the power. The powering-on/ powering-off order is as follows. Caution Be sure to observe the powering-on/powering-off order. Failing to observe it may destroy the IE-784000-R. <Powering-on order> (1) Turn on the power of the IE-784000-R. (2) Turn on the power of the target system. <Powering-off order> (1) Turn off the power of the target system. (2) Turn off the power of the IE-784000-R. 56 CHAPTER 2 CONNECTION 2.3 Removing EP-784915GF-R from Target System Remove the EP-784915GF-R from the target system in the following order. (1) LCC type <1> Turn off the power of the target system. <2> Turn off the power of the IE-784000-R. <3> Remove the EP-784915GF-R + chip set board + dummy board from the target system. (2) QFP type <1> Turn off the power of the target system. <2> Turn off the power of the IE-784000-R. <3> Remove the EP-784915GF-R + chip set board from the dummy board + target system. 57 [MEMO] 58 APPENDIX A EXTERNAL VIEW OF CONVERSION SOCKET A.1 External View of EV-9200GF-100 and Recommended Board Mounting Pattern Figure A-1. External View of EV-9200GF-100 (Reference) A B E M N O L K S J D C R F EV-9200GF-100 Q 1 No.1 pin index P G H I EV-9200GF-100-G0E ITEM MILLIMETERS INCHES A 24.6 0.969 B 21 0.827 C 15 0.591 D 18.6 0.732 E 4-C 2 4-C 0.079 F 0.8 0.031 G 12.0 0.472 H 22.6 0.89 I 25.3 0.996 J 6.0 0.236 K 16.6 0.654 L 19.3 076 M 8.2 0.323 N 8.0 0.315 O 2.5 0.098 P 2.0 0.079 Q 0.35 0.014 R φ 2.3 φ 0.091 S φ 1.5 φ 0.059 59 APPENDIX A EXTERNAL VIEW OF CONVERSION SOCKET Figure A-2. Recommended Board Mounting Pattern of EV-9200GF-100 (Reference) G J H D F E K I L C B A EV-9200GF-100-P1E ITEM MILLIMETERS A 26.3 B 21.6 1.035 0.85 C 0.65±0.02 × 29=18.85±0.05 D +0.003 0.65±0.02 × 19=12.35±0.05 0.026 +0.001 –0.002 × 0.748=0.486 –0.002 0.026 +0.001 –0.002 × 1.142=0.742+0.002 –0.002 E 15.6 0.614 F 20.3 0.799 G 12 ± 0.05 0.472 +0.003 –0.002 H 6 ± 0.05 0.236 +0.003 –0.002 I 0.35 ± 0.02 0.014 +0.001 –0.001 J φ 2.36 ± 0.03 φ 0.093+0.001 –0.002 K φ 2.3 φ 0.091 L φ 1.57 ± 0.03 φ 0.062+0.001 –0.002 Caution 60 INCHES Dimensions of mount pad for EV-9200 and that for target device (QFP) may be different in some parts. For the recommended mount pad dimensions for QFP, refer to "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (C10535E). APPENDIX A EXTERNAL VIEW OF CONVERSION SOCKET A.2 External View of NQPACK100RB Figure A-3. External View of NQPACK100RB (Target connection side) (Reference) D R S Q N M GF E J K O c Slit width P A B C Z a UT L d Protrusion height X H I e Yb V W i f h g k j n q l m o p ITEM MILLIMETERS INCHES ITEM MILLIMETERS INCHES A 21.75 0.856 a 22.75 0.896 B 14.25 0.561 b 0.5 0.020 C 0.65x19=12.35 D 0.65 0.026x0.748=0.486 0.026 c d 0.5 4-φ 2.0 0.020 4-φ 0.079 E F G 7.0 20.75 28.25 0.276 0.817 1.112 e f 1.8 9.45 0.071 0.372 g 1.85 0.073 H I 17.4 21.75 0.685 0.856 h i 3.7 3.9 0.146 0.154 J 0.65x29=18.85 0.026x1.142=0.742 j 0.2 0.008 K 23.9 0.941 L M 0.65 0.026 k l 1.2 15.25 0.047 0.600 0.4 0.016 m 16.25 0.640 N O 6.0 3- φ 1.0 0.236 3-φ 0.039 n o 0.5 0.25 0.020 0.010 0.020 P C 1.5 C 0.059 p 0.5 Q R 3-R 1.5 17.15 3-R 0.059 0.675 q 6.95 S 10.0 0.394 T U 12.0 23.65 0.472 0.931 V 15.25 0.600 W X 16.25 0.5 0.640 0.020 Y 0.5 0.020 Z 21.75 0.856 0.274 NQPACK100RB-G1E note: Product by TOKYO ELETECH CORPORATION. 61 APPENDIX A EXTERNAL VIEW OF CONVERSION SOCKET Figure A-4. External view of NQPACK100RB (Top Cover Mounted on Device) (Reference) L A B D C N F K O S GH I Z Y P Q X J R M E W i h j k g b a c d e f ITEM A note: Product by TOKYO ELETECH CORPORATION. MILLIMETERS 17.4 INCHES ITEM 0.685 a MILLIMETERS 2.25 INCHES 0.089 B 0.65x19=12.35 0.026x0.748=0.486 b 1.6 0.063 C D 0.65 0.026 0.236 c d 0.25 16.57 0.010 0.652 0.935 0.276 0.026x1.142=0.742 0.941 e f 17.57 0.5 0.692 0.020 g 3.9 0.154 2.3 1.2 0.091 0.047 G 6.0 23.75 7.0 0.65x29=18.85 H I 23.9 30.25 1.191 h i J K 0.65 3- φ 1.0 0.026 3-φ 0.039 j 3.1 0.122 k 7.4 0.291 L M C 2.0 C 0.079 3-R 2.5 3-R 0.098 N 4-φ 2.2 O 14.1 4-φ 0.087 0.555 E F 62 T U V P 24.07 0.948 Q 23.07 0.908 R 0.5 0.020 S 0.5 0.020 T U 16.57 17.57 0.652 0.692 V 0.5 0.020 W X 0.5 20.1 0.020 0.791 Y Z 0.2 C 1.5 0.008 C 0.059 HQPACK100RB-G0E APPENDIX A EXTERNAL VIEW OF CONVERSION SOCKET Figure A-5. External View of NQPACK100RB (Probe side) (Reference) A B D C U X W i b h S HGFE R NO P g ZY Q T a I J K L M j c d f k o p l e V x w n m v q r s u t ITEM A MILLIMETERS 17.4 INCHES ITEM MILLIMETERS INCHES 0.685 a 0.4 0.685 0.4 14.75 0.026 B 0.65x19=12.35 0.026x0.748=0.486 b C D 0.65 0.026 0.236 c d E F G 16.85 19.25 21.65 0.663 0.758 0.852 e f 15.55 0.4 0.4 g 20.1 H I 24.05 10.35 0.2 0.407 h i 0.791 0.008 C 1.5 C 0.059 J K 12.75 15.15 0.502 0.596 j k 0.3 0.25x0.3 0.012 0.010x0.012 L M 17.55 23.75 0.691 0.935 l m 9.0 0.354 2.2 0.087 N 0.65x29=18.85 O 23.9 0.026x1.142=0.742 0.941 n o 3.1 3.7 0.122 0.146 6.0 0.947 0.748 0.486 0.016 0.016 P 30.25 1.191 p 2.5 0.098 Q R 0.65 7.0 0.026 0.276 q r 0.25 14.75 0.010 0.581 S 0.25 0.010 s 15.55 0.612 T U 3- φ 1.0 C 2.0 3-φ 0.039 C 0.079 t u 0.4 7.4 0.016 0.291 V 3-R 2.5 3-R 0.098 v 3.9 0.154 W X 4-φ 2.2 14.1 4-φ 0.087 0.555 w x 2.3 1.2 0.091 0.047 Y Z 21.25 22.05 0.837 0.868 YQPACK100RB-G0E note: Product by TOKYO ELETECH CORPORATION. 63 [MEMO] 64 Facsimile Message From: Name Company Tel. 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