ETC PCA1532P

INTEGRATED CIRCUITS
DATA SHEET
PCA153X series
32 kHz clock circuit
Product specification
Supersedes data of October 1988
File under Integrated Circuits, IC16
Philips Semiconductors
January 1994
Philips Semiconductors
Product specification
32 kHz clock circuit
PCA153X series
FEATURES
GENERAL DESCRIPTION
• 32 kHz oscillator frequency
The PCA153X series are silicon-gate CMOS integrated
circuits specially suited for battery-operated,
quartz-crystal-controlled clocks, with a bipolar stepping
motor.
• Low current consumption; typically 2 µA, maximum 5 µA
• Low minimum supply voltage: 1.1 V
• Output for bipolar stepping motor
– output frequency 1 Hz
– pulse duration: see Table 1 Available types
• Test mode speed-up with an input frequency up to 20 Hz
(unchanged pulse duration).
ORDERING INFORMATION
EXTENDED TYPE
NUMBER
PACKAGE
PINS
PIN POSITION
MATERIAL
CODE
PCA1532P
8
DIL
plastic
SOT97
PCA1534P
8
DIL
plastic
SOT97
PCA1532T
8
SO
plastic
SO8; SOT96C
PCA1534T
8
SO
plastic
SO8; SOT96C
PCA1532U/10
−
chip on film frame carrier
(FFC)
−
−
PCA1534U/10
−
chip on film frame carrier
(FFC)
−
−
Table 1 Available types.
TYPE
NUMBER
PULSE WIDTH
tp (ms)
CAPACITANCE OUTPUT
Co (pF)
CAPACITANCE INPUT
Ci (pF)
PCA1532
23.4
24.0
3.0
PCA1534
46.8
24.0
3.0
January 1994
2
Philips Semiconductors
Product specification
32 kHz clock circuit
PCA153X series
PINNING
SYMBOL
PIN
DESCRIPTION
OSC OUT
1
oscillator output
VSS
2
ground (0 V)
TEST IN
3
test input
M1
4
M2
OSC OUT
1
VSS
2
motor 1 output
TEST IN
3
5
motor 2 output
M1
4
n.c.
6
not connected
VDD
7
supply voltage
OSC IN
8
oscillator input
PCA153X
SERIES
8
OSC IN
7
V DD
6
n.c.
5
M2
MGA932
Fig.1 Pin configuration.
FUNCTIONAL DESCRIPTION AND TESTING
Test mode
Operating mode
When testing the motor, a test frequency can be applied to
TEST IN (pin 3) which allows the motor outputs to be
accelerated up to 20 Hz.
In the operating mode pin 3 must be left open-circuit or
connected to VDD.
M1
VDD
V SS
tp
M2
VDD
V SS
tp
T
2T
Fig.2 Motor output waveforms.
January 1994
3
MLB322
Philips Semiconductors
Product specification
32 kHz clock circuit
PCA153X series
1.5 V
32 kHz
I
OSC OUT
V SS
TEST IN
M1
1
8
2
7
OSC IN
VDD
PCA153X
SERIES
3
6
4
5
n.c.
M2
RM
MGA935
Fig.3 Test speed-up circuit.
t
t
VDD
TEST IN
V SS
VDD
M2
tp
V SS
VDD
M1
tp
V SS
MGA933
0.5 ms
0.5 ms
Fig.4 Test speed-up signals.
January 1994
4
Philips Semiconductors
Product specification
32 kHz clock circuit
PCA153X series
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC134).
SYMBOL
PARAMETER
VSS
supply voltage
VI
input voltage
CONDITIONS
VDD = 0 V; note 1
MIN.
MAX.
UNIT
+1.8
−6.0
V
VSS
VDD
V
output short-circuit duration at pins 4 and 5
indefinite
Tamb
operating ambient temperature
−10
+60
°C
Tstg
storage temperature
−30
+125
°C
Note to the “Limiting values”
1. Connecting the battery at 1.8 V maximum with reversed polarity does not destroy the circuit, but in this condition a
large current flows, which will rapidly discharge the battery.
HANDLING
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
advisable to take handling precautions appropriate to handling MOS devices (see 'Handling MOS Devices').
January 1994
5
Philips Semiconductors
Product specification
32 kHz clock circuit
PCA153X series
CHARACTERISTICS
VDD = 0 V; VSS = −1.4 V; fosc = 32.768 kHz; Tamb = 25 °C; crystal: RS = 20 kΩ; Ci = 2 to 3 fF; Co = 1 to 3 pF; CL = 10 pF;
unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply (pins 2 and 7)
VSS1
supply voltage
operating
−1.1
−
−1.8
V
VSS2
supply voltage
starting
−1.2
−
−
V
IDD
supply current
RL = ∞
−
2
5
µA
−
1.0
−
s
PCA1532
−
23.4
−
ms
PCA1534
−
46.8
−
ms
Motor outputs (pins 4 and 5)
T
period
tp
pulse width
IM
current into load
RM = 200 Ω; VSS = −1.2 V
±4
−
−
mA
RO
output resistance
RM = 200 Ω
−
60
−
Ω
TEST IN at VSS
−
70
−
µA
3
10
30
MΩ
PCA1532
−
24.0
−
pF
PCA1534
−
24.0
−
pF
PCA1532
−
3.0
−
pF
PCA1534
−
3.0
−
pF
Test input (pin 3)
II
input current
Oscillator (pins 1 and 8)
Rp
polarization resistance
Co
output capacitance (pin 1) note 1
Ci
∆f/f
input capacitance (pin 8)
frequency stability
note 1
∆VSS = 100 mV
−
Note to the “Characteristics”
1. Sum of Ci and Co limited to 40 pF.
January 1994
6
0.4 x
10-6
−
Philips Semiconductors
Product specification
32 kHz clock circuit
PCA153X series
Bonding pad locations (dimensions in µm).
All x/y coordinates are referenced to bottom left pad (M1),
see Fig.5.
CHIP DIMENSIONS AND BONDING PAD LOCATIONS
y
PAD
OSC OUT
OSC IN
V SS
VDD
1.20 mm
PCA153X
SERIES
TEST IN
0
M1
M2
0
x
y
OSC OUT
0
880
VSS
0
670
TEST IN
0
380
M1
0
0
M2
675
94
VDD
675
575
OSC IN
675
785
−180
−180
chip corner
(max. value)
x
1.00 mm
MGA936
Chip area: 1.20 µm2.
Bonding pad dimensions: 120 µm x 120 µm.
Fig.5 Bonding pad locations; 7 pins.
APPLICATION INFORMATION
1.4 V
32 kHz
5 pF to 25 pF
CT
OSC OUT
V SS
TEST IN
M1
1
8
2
7
PCA153X
SERIES
3
6
4
5
OSC IN
VDD
n.c.
M2
M
MGA934
Fig.6 Typical application circuit diagram.
January 1994
7
Philips Semiconductors
Product specification
32 kHz clock circuit
PCA153X series
PACKAGE OUTLINES
8.25
7.80
9.8
9.2
seating plane
handbook, full pagewidth
3.2
max 4.2
max
0.51
min
3.60
3.05
2.54
(3x)
1.15
max
0.53
max
0.254 M
0.38 max
7.62
1.73 max
8
10.0
8.3
5
6.48
6.20
1
4
Dimensions in mm.
Fig.7 8-lead dual in-line; plastic (SOT97).
January 1994
8
MSA252 - 1
Philips Semiconductors
Product specification
32 kHz clock circuit
PCA153X series
4.0
3.8
5.0
4.8
A
6.4
6.2
0.7
0.3
5
8
0.7
0.6
1.45
1.25
1
0.25
0.19
4
detail A
pin 1
index
1.27
0.49
0.36
0.25 M
(8x)
Dimensions in mm.
Fig.8 8-lead small outline; plastic (SO8; SOT96C).
January 1994
9
MBC181
Philips Semiconductors
Product specification
32 kHz clock circuit
PCA153X series
SOLDERING
BY SOLDER PASTE REFLOW
Plastic dual in-line packages
Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.
BY DIP OR WAVE
The maximum permissible temperature of the solder is
260 °C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min. at 45 °C.
REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
IRON OR PULSE-HEATED SOLDER TOOL)
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between 270
and 320 °C. (Pulse-heated soldering is not recommended
for SO packages.)
Apply the soldering iron below the seating plane (or not
more than 2 mm above it). If its temperature is below
300 °C, it must not be in contact for more than 10 s; if
between 300 and 400 °C, for not more than 5 s.
Plastic small outline
BY WAVE
For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.
During placement and before soldering, the component
must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.
A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.
January 1994
10
Philips Semiconductors
Product specification
32 kHz clock circuit
PCA153X series
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
January 1994
11
Philips Semiconductors – a worldwide company
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428)
BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. (02)805 4455, Fax. (02)805 4466
Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213,
Tel. (01)60 101-1236, Fax. (01)60 101-1211
Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands,
Tel. (31)40 783 749, Fax. (31)40 788 399
Brazil: Rua do Rocio 220 - 5th floor, Suite 51,
CEP: 04552-903-SÃO PAULO-SP, Brazil.
P.O. Box 7383 (01064-970).
Tel. (011)829-1166, Fax. (011)829-1849
Canada: INTEGRATED CIRCUITS:
Tel. (800)234-7381, Fax. (708)296-8556
DISCRETE SEMICONDUCTORS: 601 Milner Ave,
SCARBOROUGH, ONTARIO, M1B 1M8,
Tel. (0416)292 5161 ext. 2336, Fax. (0416)292 4477
Chile: Av. Santa Maria 0760, SANTIAGO,
Tel. (02)773 816, Fax. (02)777 6730
Colombia: Carrera 21 No. 56-17, BOGOTA, D.E., P.O. Box 77621,
Tel. (571)217 4609, Fax. (01)217 4549
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. (032)88 2636, Fax. (031)57 1949
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. (9)0-50261, Fax. (9)0-520971
France: 4 rue du Port-aux-Vins, BP317,
92156 SURESNES Cedex,
Tel. (01)4099 6161, Fax. (01)4099 6427
Germany: P.O. Box 10 63 23, 20095 HAMBURG ,
Tel. (040)3296-0, Fax. (040)3296 213
Greece: No. 15, 25th March Street, GR 17778 TAVROS,
Tel. (01)4894 339/4894 911, Fax. (01)4814 240
Hong Kong: 15/F Philips Ind. Bldg., 24-28 Kung Yip St.,
KWAI CHUNG, Tel. (0)4245 121, Fax. (0)4806 960
India: PEICO ELECTRONICS & ELECTRICALS Ltd.,
Components Dept., Shivsagar Estate, Block 'A',
Dr. Annie Besant Rd., Worli, BOMBAY-400 018,
Tel. (022)4938 541, Fax. (022)4938 722
Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4,
P.O. Box 4252, JAKARTA 12950,
Tel. (021)5201 122, Fax. (021)5205 189
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. (01)640 000, Fax. (01)640 200
Italy: Viale F. Testi, 327, 20162-MILANO,
Tel. (02)6752.1, Fax. (02)6752.3350
Japan: Philips Bldg 13-37, Kohnan 2 -chome, Minato-ku, KOKIO 108,
Tel. (03)3740 5101, Fax. (03)3740 0570
Korea: (Republic of) Philips House, 260-199 Itaewon-dong,
Yongsan-ku, SEOUL, Tel. (02)794-5011, Fax. (02)798-8022
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA,
SELANGOR, Tel. (03)757 5511, Fax. (03)757 4880
Mexico: Philips Components, 5900 Gateway East, Suite 200,
EL PASO, TX 79905, Tel. 9-5(800)234-7381, Fax. (708)296-8556
Netherlands: Postbus 90050, 5600 PB EINDHOVEN,
Tel. (040)78 37 49, Fax. (040)78 83 99
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. (09)849-4160, Fax. (09)849-7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. (22)74 8000, Fax. (22)74 8341
Philips Semiconductors
Pakistan: Philips Markaz, M.A. Jinnah Rd., KARACHI-3,
Tel. (021)577 039, Fax. (021)569 1832
Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc,
106 Valero St. Salcedo Village, P.O. Box 911, MAKATI,
Metro MANILA, Tel. (02)810 0161, Fax. (02)817 3474
Portugal: Av. Eng. Duarte Pacheco 6, 1009 LISBOA Codex,
Tel. (01)683 121, Fax. (01)658 013
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. (65)350 2000, Fax. (65)251 6500
South Africa: 195-215 Main Road, Martindale,
P.O. Box 7430,JOHANNESBURG 2000,
Tel. (011)470-5433, Fax. (011)470-5494
Spain: Balmes 22, 08007 BARCELONA,
Tel. (03)301 6312, Fax. (03)301 4243
Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM,
Tel. (0)8-632 2000, Fax. (0)8-632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. (01)488 2211, Fax. (01)481 7730
Taiwan: 69, Min Sheng East Road, Sec 3, P.O. Box 22978,
TAIPEI 10446, Tel. (2)509 7666, Fax. (2)500 5899
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
60/14 MOO 11, Bangna - Trad Road Km. 3
Prakanong, BANGKOK 10260,
Tel. (2)399-3280 to 9, (2)398-2083, Fax. (2)398-2080
Turkey: Talatpasa Cad. No. 5, 80640 LEVENT/ISTANBUL,
Tel. (0212)279 2770, Fax. (0212)269 3094
United Kingdom: Philips Semiconductors Limited, P.O. Box 65,
Philips House, Torrington Place, LONDON, WC1E 7HD,
Tel. (071)436 41 44, Fax. (071)323 03 42
United States: INTEGRATED CIRCUITS:
811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. (800)234-7381, Fax. (708)296-8556
DISCRETE SEMICONDUCTORS: 2001 West Blue Heron Blvd.,
P.O. Box 10330, RIVIERA BEACH, FLORIDA 33404,
Tel. (800)447-3762 and (407)881-3200, Fax. (407)881-3300
Uruguay: Coronel Mora 433, MONTEVIDEO,
Tel. (02)70-4044, Fax. (02)92 0601
For all other countries apply to: Philips Semiconductors,
International Marketing and Sales, Building BAF-1,
P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands,
Telex 35000 phtcnl, Fax. +31-40-724825
SCD26
© Philips Electronics N.V. 1993
All rights are reserved. Reproduction in whole or in part is prohibited without the
prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation
or contract, is believed to be accurate and reliable and may be changed without
notice. No liability will be accepted by the publisher for any consequence of its
use. Publication thereof does not convey nor imply any license under patent- or
other industrial or intellectual property rights.
Printed in The Netherlands
9397 725 30011