Infrared Transceiver Technical Data HSDL-1100 Features • Fully Compliant to IrDA 1.1 – 4 Mbps • Compatible with ASK, HPSIR, and TV Remote • Backward Compatible to Slower Speeds • Excellent Noise Immunity • No Programming to Switch Speeds • Available in Several Mounting Options • Designed to Compensate for Light Loss Due to Cosmetic Windows • Fully Supported by All Interface Chips • IEC 825-Class 1 Eye Safe Description The HSDL-1100 infrared transceiver provides the interface between logic and IR signals for through-air, serial, half-duplex IR data links and is designed to satisfy the IrDA Physical Layer Specification. The HSDL-1100 contains a high speed, high efficiency, TS AlGaAs 870 nm LED, a silicon PIN photodiode, and a bipolar, silicon integrated circuit. The IC contains an LED driver and a receiver providing two output signals, RXD-A for signal rates from 2.4 to 115.2 Kb/s and RXD-B for signal rates of 576 Kb/s and 4.0 Mb/s. The receiver is designed for maximum sensitivity to IrDA signals and minimum sensitivity to signals outside the IrDA optical wavelength and frequency modulation of interest. A receiver lens magnifies the effective area of the PIN diode to enhance sensitivity. The lens is integral with the molded package and contains a dye which absorbs visible light. Receiver outputs pulse low when the IR signal is present. The power supply for the PIN and preamplifier are filtered to attenuate noise conducted from external sources. Applications for the HSDL-1100 include notebook PCs, LANs, telephones, pagers, printers, cameras, and industrial handheld devices. VCC Application Circuit CX7 R2 10 HSDL-1100 CX2 LEDA IE TX TXD R1 7 EI PIN BIAS RXD-A 8 R3 VCC 4 VCC VREF 2 GND ADAPTIVE THRESHOLD & SQUELCH CX5 CX6 RXD-B CX1 1 CX1 GND 6 CX4 3 CX3 9 CX4 CX3 5 2 Ordering Information Specify Part Number followed by Option Number HSDL-1100 #0x7 017 front mount orientation, 10 piece increment 007 front mount orientation, 200 piece increment HSDL-1100 #0x8 018 top mount orientation, 10 piece increment 008 top mount orientation, 200 piece increment HSDL-1100 #S07 front mount orientation, integrated shield, 200 piece increment Package Dimensions Option #0x7 13.21 ± 0.10 (0.520 ± 0.004) 6.35 (0.250) 3.43 (0.135) 0.43 (0.02) MAX. 0.47 ± 0.10 (0.019 ± 0.004) 8.75 ± 0.20 (0.345 ± 0.008) 6.86 ± 0.10 (0.270 ± 0.004) (12x) 4.42 ± 0.15 (0.174 ± 0.006) -B- (2x) 6.84 ± 0.15 (0.269 ± 0.006) THE –B– DATUM IS FORMED BY THE HIGHEST POINT ON THE SURFACE AND THE HIGHEST POINT ON THE CORRESPONDING SURFACE OF THE LEAD ON THE OTHER SIDE OF THE PACKAGE. R 2.87 (0.113) 3.50 ± 0.20 (0.138 ± 0.008) (7x) 1.27 ± 0.10 BSC (0.050 ± 0.004) -C- 2.61 ± 0.20 (0.103 ± 0.008) 1.00 ± 0.10 (2x) (0.039 ± 0.004) 6.22 ± 0.10 (0.245 ± 0.004) R 2.77 (0.109) (8x) 0.51 (0.020) (2x) 1.20 ± 0.10 (0.047 ± 0.004) 4.41 ± 0.20 (0.173 ± 0.008) -A- 2.71 ± 0.20 (0.106 ± 0.008) 1.71 ± 0.20 (0.067 ± 0.008) DIMENSIONS IN MILLIMETERS (INCHES). (12x) 0.63 ± 0.12 (0.025 ± 0.005) 5.94 ± 0.10 (0.234 ± 0.004) 15.89 ± 0.25 (0.626 ± 0.010) 4.10 ± 0.20 (0.161 ± 0.008) COPLANARITY OF LEADS TO BE O.1 mm (0.076 mm TOOL) (12x) 5.0° ± 3.5° (2x) 0.9 ± 0.2 (0.03 ± 0.01) (2x) 1.20 ± 0.20 (0.047 ± 0.008) (2x) 0.97 ± 0.10 (0.038 ± 0.004) 3 Option #0x8 13.21 ± 0.10 (0.520 ± 0.004) 6.35 (0.250) 3.43 (0.135) 0.43 (0.02) MAX. (4x) 0.67 (0.026) 0.47 ± 0.10 (0.019 ± 0.004) THE –B– DATUM IS FORMED BY THE TWO HIGHEST POINTS OF THE COMBINED SURFACE FORMED BY THIS SURFACE AND THE CORRESPONDING SURFACE OF THE SAME LEAD ON THE OPPOSITE SIDE OF THE PACKAGE. 6.86 ± 0.10 (0.270 ± 0.004) -B- 1.46 (0.057) 1.46 (0.057) 3.86 ± 0.15 (0.152 ± 0.006) R 2.87 R 2.77 (0.113) (0.109) (7x) 1.27 ± 0.10 BSC (0.050 ± 0.004) (2x) 1.18 ± 0.10 BSC (0.047 ± 0.004) (8x) 0.51 (0.020) -C- 8.85 ± 0.25 (0.348 ± 0.010) (12x) 1.15 ± 0.15 (0.045 ± 0.006) 6.22 ± 0.10 (0.245 ± 0.004) -A- 5.94 ± 0.10 (0.234 ± 0.004) (12x) 0.63 ± 0.12 (0.025 ± 0.005) (12x) 5.0° ± 3.5° 4.62 ± 0.20 (0.182 ± 0.008) LEAD COPLANARITY 0.1 mm 16.61 ± 0.25 (0.654 ± 0.010) (12x) 1.70 ± 0.10 (0.067 ± 0.004) DIMENSIONS IN MILLIMETERS (INCHES). Option #S07 13.21 ± 0.10 3.43 6.35 0.47 ± 0.10 6.86 ± 0.10 R -B- R 2. 87 2. 77 11.90 ± 0.15 (12x) 4.42 ± 0.15 6.84 ± 0.15 1.00 THE –B– DATUM IS FORMED BY THE HIGHEST POINT ON THE SURFACE AND THE HIGHEST POINT ON THE CORRESPONDING SURFACE OF THE LEAD ON THE OTHER SIDE OF THE PACKAGE. 5.0° ± 3.5° 3.50 ± 0.20 (8x) 0.51 -C- 0.63 ± 0.12 (7x) 1.27 ± 0.10 2.71 ± 0.20 2.61 ± 0.20 (2x) 1.00 ± 0.10 (2x) 1.20 ± 0.10 15.89 ± 0.25 4.41 ± 0.20 4.10 ± 0.20 6.22 ± 0.10 5.94 ± 0.10 -A- 1.71 ± 0.20 COPLANARITY OF LEADS TO BE 0.1 mm (0.076 mm TOOL) DIMENSIONS IN MILLIMETERS. 0.9 ± 0.2 (2x) 1.20 ± 0.20 4.66 ± 0.10 4 Tape and Reel Dimensions Option #0x7 24.00 ± 0.10 (0.945 ± 0.004) 4.00 ± 0.10 (0.157 ± 0.004) 2.00 ± 0.10 (0.079 ± 0.004) 1.50 ± 0.10 (0.059 ± 0.004) 1.75 ± 0.10 (0.069 ± 0.004) 14.20 ± 0.10 (0.559 ± 0.004) 32.00 ± 0.30 (1.260 ± 0.012) 2.18 (0.086) 1.19 R (0.046) 2.41 (0.095) 2.21 (0.087) 0.419 ± 0.013 (0.0165 ± 0.0005) 2.66 (0.105) 7.46 (0.294) 15° MAX. 1.25 (0.049) 2.75 (0.108) 3.86 (0.152) 13.39 (0.527) 9.27 11.66 ± 0.10 (0.365) (0.459 ± 0.004) 5° MAX. 1.5° MAX. 16.99 ± 0.10 (0.669 ± 0.004) 15.38 ± 0.10 (0.606 ± 0.004) AO DIMENSIONS ARE IN MILLIMETERS (INCHES). KO BO 5 Tape and Reel Dimensions Option #0x8 1.55 ± 0.10 (0.061 ± 0.002) 16.00 ± 0.10 (0.630 ± 0.004) 4.00 ± 0.10 (0.157 ± 0.004) 2.00 ± 0.10 (0.079 ± 0.004) 1.75 ± 0.10 (0.069 ± 0.004) 14.20 ± 0.10 (0.559 ± 0.004) 32.00 ± 0.30 (1.26 ± 0.012) 1.14 R (0.045) 2.00 + 0.25 (0.079 + 0.010) 2.74 (0.108) 6.53 (0.257) 1.70 (0.067) 0.368 ± 0.013 (0.0145 ± 0.0005) 5.03 (0.198) 3.58 (0.141) 7° MAX. 9.02 ± 0.10 (0.355 ± 0.004) DIMENSIONS ARE IN MILLIMETERS (INCHES). 4° MAX. 7.04 ± 0.10 (0.277 ± 0.004) 17.15 ± 0.10 (0.675 ± 0.004) 6 Tape and Reel Dimensions Option #S07 24.00 ± 0.10 1.75 ± 0.10 2.00 ± 0.10 4.00 ± 0.10 1.50 ± 0.10 14.20 ± 0.10 32.00 ± 0.30 0.76 x 45° 1.19 R 2.18 13.50 -0.419 ± 0.013 2.41 2.75 3.18 2.67 1.25 4.80 8.23 9.80 15° MAX. 5° MAX. 12.34 ± 0.10 1.5° MAX. 16.97 ± 0.10 15.56 ± 0.10 AO KO BO DIMENSIONS ARE IN MILLIMETERS. Table 1. Recommended Application Circuit Components Component Recommended Value Notes R1 560 Ω, ± 5%, 0.125 Watt R2 4.7 Ω, ± 5%, 0.5 Watt R3 10 Ω, ± 5%, 0.125 Watt 1 CX1 0.47 µF, ± 10%, X7R Ceramic 2 CX2 220 pF, ± 10%, X7R Ceramic CX3 4700 pF, ± 10%, X7R Ceramic CX4 0.010 µF, ± 10%, X7R Ceramic CX5 0.47 µF, ± 20%, X7R Ceramic ≤ 5 mm lead length CX6 6.8 µF Tantalum. Larger value recommended for noisy supplies or environments CX7 0.47 µF, ± 20%, X7R Ceramic Notes: 1. In environments with noisy power supplies, supply rejection can be enhanced by including R3 as shown in application circuit on page 1. 2. CX1 and CX5 must be placed within 0.7 cm of the HSDL-1100 to obtain optimum noise immunity. 3. Only necessary in applications where transmitter switching causes more than a 50 mV ripple on VCC. 2 3 7 Truth Table Inputs TXD VIH VIL VIH VIL EI X EIH[4] EIH[5] EIL Outputs RXD-A NV Low[6] NV High IE (LED) High Low Low Low RXD-B NV NV Low[6] High X = Don’t care NV = Not Valid Notes: 4. In-Band EI ≤ 115.2 Kb/s. 5. In-Band EI ≥ 576 Kb/s. 6. Logic Low is a pulsed response. The condition is maintained for a duration dependent on pattern and strength of the incident intensity. Pinout Pin Description Symbol 1 2 3 4 PIN Bypass Capacitor Ground (Analog) Averaging Capacitor Supply Voltage 5 6 Receiver Data Output – Channel B Ground RXD-B GND 7 8 9 Transmitter Data Input Receiver Data Output – Channel A Threshold Capacitor TX RXD-A CX3 LED Anode LEDA 10 CX1 GND CX4 VCC PIN 1 PIN 10 1100 YYWW PIN 10 NOTE: PINS 1 AND 10 ARE COMPRISED OF TWO PHYSICAL LEADS EACH. THE TWO PHYSICAL LEADS OF EACH PAIR SHOULD BE TIED TOGETHER ELECTRICALLY ON THE APPLICATION PC BOARD. Absolute Maximum Ratings For implementations where case to ambient thermal resistance ≤ 50°C/W. Parameter Symbol Min. Max. Units TS -20 85 °C Operating Temperature Average LED Current TA ILED (DC1) 0 70 100 °C mA Average LED Current ILED (DC2) 165 mA Repetitive Pulsed LED Current ILED (RP) 660 mA Peak LED Current ILED (PK) 1.0 A LED Anode Voltage Supply Voltage VLEDA VCC -0.5 0 7.0 7.0 V V ITXD (DC) VRXD-A VRXD-B -12 -0.5 -0.5 12 VCC + 0.5 VCC + 0.5 mA V V Storage Temperature Transmitter Data Input Current Receiver Data Output Voltage PIN 1 Conditions ≤ ≤ ≤ ≤ ≤ ≤ 90 µs Pulse Width, 25% Duty Cycle 90 µs Pulse Width, 25% Duty Cycle 2 µs Pulse Width, 10% Duty Cycle 8 Infrared Reflow Profile 300 t2 = 11.5 ± .5 MINS. (SOLDER JOINT) T (MAX.) = 250 °C OR 235 °C (+5-0) °C ANY PART OF COMPONENT BODY TEMPERATURE – °C (T) 250 t1 = 8 ± 1 MINS. (SOLDER JOINT) 200 185 °C 3.5 ± .5 MINS. (SOLDER JOINT) 150 T > 120 °C FOR t GREATER THAN 2.5 MINS. (SOLDER JOINT) 100 50 dT/dt < 3 °C/SEC. 0 0 2 4 6 8 10 12 14 TIME (t) Recommended Operating Conditions Parameter Symbol Min. Max. Units Operating Temperature TA 0 70 °C Supply Voltage Logic High Transmitter Input Voltage (TXD) VCC VIH 4.75 4.25 5.25 5.25 V V 8 Logic Low Transmitter Input Voltage (TXD) Logic High Receiver Input Irradiance Logic Low Receiver Input Irradiance VIL 0.0 0.3 V 8 EIIH 0.0036 0.0090 500 500 0.3 LED (Logic High) Current Pulse Amplitude Receiver Setup Time Receiver Signal Rate RXD-A Receiver Signal Rate RXD-B Ambient Light EIIL ILEDA 400 2.4 0.576 Conditions Case to Ambient Thermal Resistance ≤ 50°C/W mW/cm2 For in-band signals ≤ 116 Kb/s mW/cm2 For in-band signals ≤ 576 Kb/s µW/cm2 For in-band signals 660 mA 1.0 ms 116 4 Kb/s Mb/s Notes 9 7 7 9 For full sensitivity after transmitting See IrDA Serial Infrared Physical Layer Link Specification, Appendix A for ambient levels. Notes: 7. An in-band optical signal is a pulse/sequence where the peak wavelength, λp, is defined as 850 nm ≤ λp ≤ 900 nm, and the pulse characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification. 8. With RI, CX2 Input network and where tr (VI ) and tf (VI ) ≤ 5 ns. See Application Circuit (Table 1) for component values. The driver gate for this input should be able to source and sink ± 6 mA (DC) and ± 50 mA (pk). TXD refers to the node on the driver gate side of R1, CX2 on application circuit. 9. See the thermal derating curves on pages 8 and 9 for maximum operating conditions in order to maintain T junction <125°C. 9 Electrical and Optical Specifications Specifications hold over the Recommended Operating Conditions unless otherwise noted. Test Conditions represent worse case values for the parameters under test. Unspecified test conditions can be anywhere in their operating range. All typicals are at 25°C and 5 V unless otherwise noted. Parameter Receiver Data Output Symbol Min. Typ. Max. Unit Conditions Notes Logic Low VOL (RXD-A) 0.5 V IO (RXD-A) = 1.0 mA, For in-band EI ≥ 3.6 µW/cm2, φ1/2 ≤ 15° 11 Logic Low VOL (RXD-B) 0.5 V IO (RXD-B) = 1.0 mA, For in-band EI ≥ 9.0 µW/cm2, φ1/2 ≤ 15° 11 Logic High VOH (RXD-A) VCC-0.6 V IOH (RXD-A) = -20 µA, For in-band EI ≤ 0.3 µW/cm2 Logic High VOH (RXD-B) VCC-1.2 V IOH (RXD-B) = -20 µA, For in-band EI ≤ 0.3 µW/cm2 2φ1/2 30 degrees Voltage Viewing Angle Effective Detector Area Transmitter Radiant Intensity Logic High cm2 0.2 EI 100 177 mW/SR VIH (TXD) = 4.25 V ILEDA = 400 mA TA = 25°C, θ1/2 ≤ 15° 10 EI 80 177 324 mW/SR VIH (TXD) = 4.25 V ILEDA = 400 mA 0°C ≤ TA ≤ 70°C, θ1/2 ≤ 15° 10 λp 875 nm Spectral Line Half Width ∆λ1/2 35 nm Viewing Angle 2θ1/2 30 60 degrees Peak Wavelength Transmitter Logic Low I IL(TXD) -2.0 2.0 µA GND ≤ VIL (TXD) ≤ 0.3 V 10 Data Input Current Logic High IIH(TXD) 5.4 6.6 mA VIH (TXD) = 4.25 V 10 LED Anode Supply Current Receiver Peak Sensitivity Wavelength On State Voltage VON (LEDA) 2.78 V ILEDA = 400 mA, 25°C VIH (TXD) = 4.25 V 10 Off State Leakage I LK (LEDA) 250 µA VLEDA = VCC = 5.25 V, VIL (TXD) = 0.3 V 10 Idle ICC1 3 5.1 mA VCC = 5.25 V, VI (TXD) = VIL, EI = 0 Active Receiver ICC2 4 18 mA VCC = 5.25 V, VI (TXD) = VIL, EI ≤ 500 mW/cm 2 λp 880 nm Notes: 10. With R1, CX2 input network. See Application Circuit (Table 1) for component values. TXD refers to driver gate of R1, CX2 on application circuit. 11. Logic Low is a pulsed response. The condition is maintained for a duration dependent on pattern and strength of the incident intensity. 10 Switching Specifications Specifications hold over the Recommended Operating Conditions unless otherwise noted. Test Conditions represent worst case values for the parameters under test. Unspecified test conditions can be anywhere in their operating range. All typicals are at 25°C and 5 V unless otherwise noted. Parameter Transmitter Radiant Intensity Pulse Width Symbol tpw (IE) Transmitter Radiant Intensity Rise and Fall Times RXD-A Pulse Width RXD-B Pulse Width tr(IE), tf(IE) tpw (RXD-A) tpw (RXD-B) RXD-B Pulse Width (ASK) Receiver Latency Time Min. 1.5 Typ. 1.6 Max. 1.8 Unit µs 115 125 135 ns 40 ns 1.0 7.5 µs Conditions tpw (TXD) = 1.6 µs at 115.2 K pulses/second tpw (TXD) = 125 ns at 2.0 M pulses/second tpw (TXD) = 125 ns at 2.0 M pulses/second φ1/2 ≤ 15° 75 185 ns φ1/2 ≤ 15° 14 1.0 1.3 µs 500 kHz/50% duty cycle carrier ASK 15 0.50 1.0 ms 0.7 tL (RXD-B) tL (RXD-A) Notes 12 12 13 13, 14 Notes: 12. Pulse widths measured at 1.4 volts. 13. For In-Band signals ≤ 115.2 Kb/s where 3.6 µW/cm2 ≤ EIL ≤ 500 mW/cm2 . 14. For In-Band signals, 125 ns PW, 4 Mb/s, 4 PPM where 9.0 µW/cm2 ≤ EI ≤ 500 mW/cm2. 15. Pulse width specified is the pulse width of the second 500 kHz carrier pulse received in a data bit. The first 500 kHz carrier pulse may exceed 2 µs in width, which will not affect correct demodulation of the data stream. An ASK and DASK system using the HSDL-1100 has been shown to correctly receive all data bits for 9 µW/cm2 <EI <500 mW/cm 2 incoming signal strength. ASK or DASK should use the RXD-B channel only. Thermal Derating Curves 100 REFERENCE 80 THERMAL RESISTANCE BOARD TO AMBIENT 60 50 C/W 100 C/W 40 GUARANTEED 200 C/W 20 250 C/W 300 C/W 0 REFERENCE -20 150 C/W 0 0.2 0.4 0.6 0.8 LED DRIVE CURRENT (A) HSDL-1100#0x7 Leadform Max. Ambient vs. LED Drive Current MAXIMUM AMBIENT TEMPERATURE (°C) MAXIMUM AMBIENT TEMPERATURE (°C) These 2 graphs show maximum allowable LED drive current as a function of ambient temperature and the designer's PCB-to-ambient thermal resistance. 100 REFERENCE 80 THERMAL RESISTANCE BOARD TO AMBIENT 60 50 C/W 100 C/W 40 GUARANTEED 150 C/W 200 C/W 20 250 C/W 300 C/W 0 REFERENCE -20 0 0.2 0.4 0.6 0.8 LED DRIVE CURRENT (A) HSDL-1100#0x8 Leadform Max. Ambient vs. LED Drive Current *Note: Performance is guaranteed in the operating temperature range of 0°C - 70°C. The information provided outside of this range is for reference only. 11 MAXIMUM DRIVE CURRENT (A) 0.8 JUNCTION TO CASE MEASUREMENTS FOR HSDL-1100#0X7 MAX. CASE TEMPERATURE If (mA) (° C) 400 101.3 450 98.4 500 95.3 550 92.1 600 88.7 650 85.2 700 81.6 750 77.9 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 20 40 60 80 100 120 CASE TEMPERATURE (°C) HSDL-1100#0x7 Leadform Max. LED Drive Current vs. Case Temperature Appendix A. Test Methods A.1. Background Light and Electromagnetic Field There are four ambient interference conditions in which the receiver is to operate correctly. The conditions are to be applied separately: 1. Electromagnetic field: 3 V/m maximum (refer to IEC 801-3. severity level 3 for details) 2. Sunlight: 10 kilolux maximum at the optical port This is simulated with an IR source having a peak wavelength within the range 850 nm to 900 nm and a spectral width less than 50 nm biased to provide 490 µW/cm2 (with no modulation) at the optical port. The light source faces the optical port. This simulates sunlight within the IrDA spectral range. The effect of longer wavelength radiation is covered by the incandescent condition. 3. Incandescent Lighting: 1000 lux maximum This is produced with general service, tungsten-filament, gasfilled, inside-frosted lamps in the 60 Watt to 150 Watt range to generate 1000 lux over the horizontal surface on which the equipment under test rests. The light sources are above the test area. The source is expected to have a filament temperature in the 2700 to 3050 degrees Kelvin range and a spectral peak in the 850 nm to 1050 nm range. 4. Fluorescent Lighting: 1000 lux maximum This is simulated with an IR source having a peak wavelength within the range 850 nm to 900 nm and a spectral width of less than 50 nm biased and modulated to provide an optical square wave signal (0 µW/cm2 minimum and 0.3 µW/cm2 peak amplitude with 10% to 90% rise and fall times less than or equal to 100 ns) over the horizontal surface on which the equipment under test rests. The light sources are above the test area. The frequency of the optical signal is swept over the frequency range from 20 kHz to 200 kHz. Due to the variety of fluorescent lamps and the range of IR emissions, this condition is not expected to cover all circumstances. It will provide a common floor for IrDA operation. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6271 2451 India, Australia, New Zealand: (+65) 6271 2394 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6271 2194 Malaysia, Singapore: (+65) 6271 2054 Taiwan: (+65) 6271 2654 Data subject to change. Copyright © 2002 Agilent Technologies, Inc. Obsoletes 5980-2957EN April 30, 2002 5988-6259EN