IrDA® Data 1.2 Compliant 115.2 Kb/s Infrared Transceiver Technical Data HSDL-3200 Features Description • Fully Compliant to IrDA Data 1.2 Low Power Specifications • Ultra Small Package • Minimal Height: 2.5 mm • 2.7 to 3.6 VCC • Low Shutdown Current – 10 nA Typical • Complete Shutdown – TXD, RXD, PIN Diode • Three External Components • Temperature Performance Guaranteed, –25˚C to +85˚C • 25 mA LED Drive Current • Integrated EMI Shield • IEC825-1 Class 1 Eye Safe • Edge Detection Input – Prevents the LED from Long Turn-On Time The HSDL-3200 is a new generation of low-cost Infrared (IR) transceiver module from Agilent Technologies. It features the smallest footprint in the industry at 2.5 H x 8.0 W x 3.0 D mm. The supply voltage can range from 2.7 V to 3.6 V. The LED drive current of 25 mA assures that link distances meet the IrDA Data 1.2 (low power) physical layer specification. The HSDL-3200 meets the link distance of 20 cm to other low power devices, and 30 cm to standard 1 meter IrDA devices. VCC Applications TXD RXD SHUT DOWN 8 LEDA 7 TXD LED DRIVER 6 RXD 5 SD SHIELD • Mobile Telecom – Cellular Phones – Pagers – Smart Phones • Data Communication – PDAs – Portable Printers • Digital Imaging – Digital Cameras – Photo-Imaging Printers • Electronic Wallet R1 47 Ω 4 AGND 3 VCC C1 6.8 µF 2 VCC CX C2 100 nF 1 GND RIX PULSE SHAPER 2 I/O Pins Configuration Table Pin Description Symbol Active Note 1 Ground GND 2 Pin Bypass Capacitor CX 3 Supply Voltage VCC 4 Analog Ground AGND 5 Shut Down SD High 1 6 Receiver Data Output RXD Low 7 Transmitter Data Input TXD High 8 LED Anode LEDA Note: 1. The shutdown pin (SD) must be driven either high or low. Do NOT float the pin. Transceiver I/O Truth Table Inputs Outputs TXD Light Input to Receiver SD LED RXD High Don’t Care Low On Not Valid Low High Low Off Low Low Low Low Off High Don’t Care Don’t Care High Off High Notes 2, 3 Notes: 2. In-Band IrDA signals and data rates ≤ 115.2 Kb/s. 3. RXD Logic Low is a pulsed response. The condition is maintained for a duration dependent on pattern and strength of the incident intensity. Recommended Application Circuit Components Component Recommended Value R1 47 Ω, ± 1%, 0.125 Watt C1 6.8 µF, ± 20%, Tantalum C2 100 nF, ± 20%, X7R Ceramic Note 4 Note: 4. C1 must be placed within 0.7 cm of the HSDL-3200 to obtain optimum noise immunity. Caution: The BiCMOS inherent to this design of this component increases the component’s susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. 3 Absolute Maximum Ratings For implementations where case to ambient thermal resistance ≤ 50˚C/W. Parameter Symbol Min. Max. Units Storage Temperature TS –40 100 ˚C Operating Temperature TA –25 85 ˚C DC LED Current ILED (DC) 20 mA Peak LED Current ILED (PK) 80 mA LED Anode Voltage VLEDA –0.5 7 V VCC 0 7 V Input Voltage TXD, SD VI 0 VCC +0.5 V Output Voltage RXD VO –0.5 VCC +0.5 V Supply Voltage Conditions ≤ 90 µs Pulse Width, ≤ 25% Duty Cycle Recommended Operating Conditions Parameter Symbol Min. Max. Units Operating Temperature TA –25 85 ˚C Supply Voltage VCC 2.7 3.6 V Logic High Voltage TXD, SD VIH 2/3 VCC VCC V Logic Low Voltage TXD, SD VIL 0 1/3 VCC V Logic High Receiver Input Irradiance EIH 0.0081 500 Logic Low Receiver Input Irradiance EIL LED Current Pulse Amplitude ILEDA Receiver Signal Rate Ambient Light Conditions Notes mW/cm2 For in-band signals. 5 0.3 µW/cm2 For in-band signals. 5 25 80 mA Guaranteed at 25˚C 2.4 115.2 Kb/s See “Test Methods” on page 12 for details Note: 5. An in-band optical signal is a pulse/sequence where the peak wavelength, λp, is defined as 850 nm ≤ λp ≤ 900 nm, and the pulse characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification. 4 Electrical and Optical Specifications Specifications hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions can be anywhere in their operating range. All typical values are at 25˚C and 3.0 V unless otherwise noted. Parameter Symbol Min. Typ. Max. Units Logic Low VOL 0 0.4 Logic High VOH VCC –0.2 VCC 2φ1/2 30 Conditions Note V IOL = 200 µA, For in-band EI 6 V IOH = –200 µA, For in-band EI ≤ 0.3 µW/cm2 Receiver RXD Output Voltage Viewing Angle Peak Sensitivity Wavelength λp RXD Pulse Width tpw RXD Rise and Fall Times ˚ 880 nm 2.5 4.0 µs tr, tf 25 100 ns Receiver Latency Time tL 25 50 µs 6 Receiver Wake Up Time tW 50 100 µs 7 8 28.8 mW/Sr ILEDA = 25 mA, TA = 25˚C, θ1/2 ≤ 15˚ 1.5 6 tpw (EI) = 1.6 µs, CL = 10 pF Transmitter Radiant Intensity EIH Peak Wavelength λp 875 nm Spectral Line Half Width ∆λ1/2 35 nm Viewing Angle 2θ1/2 30 Optical Pulse Width tpw 1.5 Optical Rise and Fall Times tr (EI) tf (EI) Maximum Optical Pulse Width tpw (max) LED Anode On State Voltage VON (LEDA) LED Anode Off State Leakage ILK (LEDA) 4 60 ˚ 2 µs tpw (TXD) = 1.6 µs 600 ns tpw (TXD) = 1.6 µs 50 µs TXD pin stuck high 1.6 V ILEDA = 25 mA, VIH (TXD) = 2.7 V 0.01 1.0 µA VLEDA = VCC = 3.6 V, VI (TXD) ≤ 1/3 VCC –0.01 1 µA 0 ≤ VI ≤ 1/3 VCC 1.6 20 Transceiver TXD and SD Input Current Logic Low IL –1 Logic High IH 0.01 1 µA VI ≥ 2/3 VCC Supply Current Shutdown ICC1 10 200 nA VCC = 3.6 V, VSD ≥ VCC –0.5 Idle ICC2 2.5 4 mA VCC = 3.6 V, VI (TXD) ≤ 1/3 VCC, EI = 0 Active Receiver ICC3 2.6 5 mA VCC = 3.6 V, VI (TXD) ≤ 1/3 VCC Notes: 6. For in-band signals ≤ 115.2 Kb/s where 8.1 µW/cm2 ≤ EI ≤ 500 mW/cm2 . 7. Wake up time is measured from SD pin high to low transition or VCC power on to valid RXD output. 8. Typical value is at EI = 10 mW/cm2. 9. Maximum value is at EI = 500 mW/cm 2. 8, 9 5 Package Outline with Dimensions for Recommended PC Board Pad Layout MOUNTING CENTER 1.35 EXTERNAL GROUND MOUNTING CENTER SOLDERING PATTERN CL MOUNTING EXTERNAL 1.35 CENTER GROUND CL 1.25 4 1.025 2.05 1.425 1.25 0.775 0.775 1.75 1.75 0.6 0.60 RECEIVER 2.05 0.475 0.475 1.425 1.425 2.375 UNIT: mm 2.375 3.325 TOLERANCE ± 0.2 mm 3.325 EMITTER CL 2.2 2.5 1.175 0.35 0.65 0.80 1.05 1.25 2.85 2.55 CL 4 8 8 7 6 5 4 0.6 3 3 2 1 3.325 2.9 1.85 P0.95X7 = 6.65 UNIT: mm TOLERANCE: ± 0.2mm 1 GND 2 CX 5 SD 6 RXD 3 VCC 4 AGND 7 TXD 8 LEDA Tape and Reel Dimensions TAPE DIMENSIONS UNIT: mm 4 ± 0.1 1.75 ± 0.1 + 0.1 ∅1.5 0 1.5 ± 0.1 POLARITY PIN 8: LEDA 7.5 ± 0.1 16.0 ± 0.2 8.4 ± 0.1 2.0 ± 0.5 ∅13.0 ± 0.5 PIN 1: GND R1.0 3.4 ± 0.1 A B 0.4 ± 0.05 8 ± 0.1 2.8 ± 0.1 21 ± 0.8 PROGRESSIVE DIRECTION EMPTY PARTS MOUNTED LEADER (400 mm MIN.) (40 mm MIN.) LABEL EMPTY (40 mm MIN.) 2 16.4 + 0 OPTION # DIMENSION A (± 1 mm) DIMENSION B (± 2 mm) QUANTITY (POS/REEL) 0S1 0L1 178 330 60 80 500 2500 2 ± 0.5 6 Reflow Profile MAX. 245°C T – TEMPERATURE – (°C) 230 R3 200 183 170 150 R2 90 sec. MAX. ABOVE 183°C 125 R1 100 R4 R5 50 25 0 50 100 150 200 250 300 t-TIME (SECONDS) P1 HEAT UP P2 SOLDER PASTE DRY P3 SOLDER REFLOW P4 COOL DOWN PROCESS ZONE SYMBOL ∆T HEAT UP P1, R1 25°C TO 125°C 4°C/s SOLDER PASTE DRY SOLDER REFLOW P2, R2 P3, R3 P3, R4 125°C TO 170°C 170°C TO 230°C (245°C MAX.) 230°C TO 170°C COOL DOWN P4, R5 170°C TO 25°C 0.5°C/s 4°C/s -4°C/s -3°C/s The reflow profile is a straight line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different ∆T/∆time temperature change rates. The ∆T/∆time rates are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and HSDL-3200 castellation I/O pins are heated to a temperature of 125˚C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 4˚C per second to allow for even heating of both the PC board and HSDL-3200 castellation I/O pins. MAXIMUM ∆T/∆TIME Process zone P2 should be of sufficient time duration (> 60 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 170˚C (338˚F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 230˚C (446˚F) for optimum results. The dwell time above the liquidus point of solder should be between 15 and 90 seconds. It usually takes about 15 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 90 seconds, the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 170˚C (338˚F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25˚C (77˚F) should not exceed 3˚C per second maximum. This limitation is necessary to allow the PC board and HSDL-3200 castellation I/O pins to change dimensions evenly, putting minimal stresses on the HSDL-3200 transceiver. 7 Moisture Proof Packaging Solder Pad, Mask and Metal Stencil The HSDL-3200 is shipped in moisture proof packaging. Once opened, moisture absorption begins. STENCIL APERTURE METAL STENCIL FOR SOLDER PASTE PRINTING Recommended Storage Conditions Storage Temperature 10˚C to 30˚C Relative Humidity below 60% LAND PATTERN SOLDER MASK Time from Unsealing to Soldering PCB After removal from the bag, the parts should be soldered within 2 days if stored at the recommended storage conditions. If times longer than 2 days are needed, the parts must be stored in a dry box. Recommended Land Pattern Baking If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Tx LENS Rx LENS e SHIELD SOLDER PAD d g In Reels b 60˚C, t ≥ 48 hours Y f 100˚C, t ≥ 4 hours In Bulk 125˚C, T ≥ 2 hours a X 150˚C, T ≥ 1 hour theta Baking should only be done once. c 8x PAD FIDUCIAL DIMENSION mm INCHES a 1.75 0.069 b 0.60 0.024 c (PITCH) 0.95 0.037 d 1.25 0.049 e 2.70 0.106 f 2.20 0.087 g 2.28 0.089 FIDUCIAL 8 Recommended Metal Solder Stencil Aperture It is recommended that only 0.152 mm (0.006 inches) or 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no shorting. The following combination of metal stencil aperture and metal stencil thickness should be used: w, the width of aperture is fixed at 0.55 mm (0.022 inches). APERTURES AS PER LAND DIMENSIONS t w l t, nominal stencil thickness Aperture opening for shield pad is 2.7 mm x 1.25 mm as per land. l, length of aperture mm inches mm inches 0.152 0.006 2.60 ± 0.05 0.102 ± 0.002 0.127 0.005 3.00 ± 0.05 0.118 ± 0.002 Adjacent Land Keepout and Solder Mask Areas Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. k Recommended Solder Paste/Cream Volume for Castellation Joints h “h” is the minimum solder resist strip width required to avoid solder bridging adjacent pads. It is recommended that two fiducial crosses be placed at midlength of the pads for unit alignment. Note: Wet/Liquid PhotoImageable solder resist/mask is recommended. j Y X m DIMENSION mm INCHES h MIN. 0.2 MIN. 0.008 k 8.2 0.323 j 2.6 0.102 m 3.0 0.118 Based on calculation and experiment, the printed solder paste volume required per castellation pad is 0.22 cubic mm (based on either no-clean or aqueous solder cream types with typically 60% to 65% solid content by volume). Using the recommended stencil will result in this volume of solder paste. 9 Pick and Place Misalignment Tolerance and Self-Alignment after Solder Reflow If the printed solder paste volume is adequate, the HSDL-3200 will self-align after solder reflow. Units should be properly reflowed in IR/Hot Air convection oven using the recommended reflow profile. The direction of board travel does not matter. Tolerance for Rotational (Theta) Misalignment Units when mounted should not be rotated more than ± 3 degrees with reference to center X-Y as shown in the recommended land pattern. Units with rotational misalignment of more than ± 3 degrees will not completely self-align after reflow. Units with less than a ± 3 degree misalignment will self-align after solder reflow. Marking Information The unit is marked with the datecode “YYWW” on the shield. YY is the year, and WW is the workweek. Ordering Information Specify the part number followed by an option number. HSDL-3200 #XXX There are three options available: Allowable Misalignment Direction Tolerance x ≤ 0.2 mm (0.008 inches) Theta ± 3 degrees Tolerance for X-Axis Alignment of Castellation Misalignment of castellation to the land pad should not exceed 0.2 mm (0.008 in.), or about one half the width of the castellation during placement of the unit. The castellations will self-align to the pads during solder reflow. Y-Axis Misalignment of Castellation In the Y direction, the HSDL-3200 does not self-align after solder reflow. It is recommended that it be placed in line with the fiducial mark (midlength of land pad). This will enable sufficient land length (minimum of 1/2 land length) to form a good joint. See the drawing below. LENS EDGE MINIMUM 1/2 THE LENGTH OF THE LAND PAD FIDUCIAL 011 Taped in a short strip (no reel), 10 per strip 001 Taped and 7” Reel packaging, 500 per reel 021 Taped and 13” Reel Packaging, 2500 per reel 10 Window Design Minimum and Maximum Window Sizes To insure IrDA compliance, there are some constraints on the height and width of the optical window. The minimum dimensions ensure that the IrDA cone angles are met, and there is no vignetting, and the maximum dimensions ensure that the effects of stray light are minimized. The minimum size corresponds to a cone angle of 30 degrees, the maximum to a cone angle of 60 degrees. Dimensions are in mm. The drawing below shows the module positioned in front of a window. Depth (Z) Y Min. X Min. Y Max. X Max. 0 1.70 6.80 3.66 8.76 1 2.23 7.33 4.82 9.92 2 2.77 7.87 5.97 11.07 3 3.31 8.41 7.12 12.22 4 3.84 8.94 8.28 13.38 5 4.38 9.48 9.43 14.53 6 4.91 10.01 10.59 15.69 7 5.45 10.55 11.74 16.84 8 5.99 11.09 12.90 18.00 9 6.52 11.62 14.05 19.15 10 7.06 12.16 15.21 20.31 Window Height Y vs. Module Depth Z Z 16 X X is the width of the window, Y is the height of the window, and Z is the distance from the HSDL-3200 to the back of the window. WINDOW HEIGHT Y – mm 14 Y 12 10 ACCEPTABLE RANGE 8 6 4 2 0 0 2 4 6 8 10 MODULE DEPTH Z – mm The distance from the center of the LED lens to the center of the photodiode lens is 5.1 mm. Window Width X vs. Module Depth Z The equations that determine the size of the window are as follows: Where θ is the required half angle for viewing. For the IrDA minimum, it is 15 degrees, for the IrDA maximum it is 30 degrees. (D is the depth of the LED image inside the part, 3.17 mm.) These equations result in the following tables and graphs: 20 WINDOW WIDTH X – mm X = 5.1 + 2(Z + D) tan θ Y = 2(Z + D) tan θ 22 18 16 14 ACCEPTABLE RANGE 12 10 8 6 0 2 4 6 8 MODULE DEPTH Z – mm 10 11 Shape of the Window Flat Window From an optics standpoint, the window should be flat. This ensures that the window will not alter either the radiation pattern of the LED, or the receive pattern of the photodiode. If the window must be curved for mechanical design reasons, place a curve on the back side of the window that has the same radius as the front side. While this will not completely eliminate the lens effect of the front curved surface, it will reduce the effects. The amount of change in the radiation pattern is dependent upon the material chosen for the window, the radius of the front and back curves, and the distance from the back surface to the transceiver. Once these items are known, a lens design can be made which will eliminate the effect of the front surface curve. The following drawings show the effects of a curved window on the radiation pattern. In all cases, the center thickness of the window is 1.5 mm, the window is made of polycarbonate plastic, and the distance from the transceiver to the back surface of the window is 3 mm. Curved Front, Flat Back Curved Front and Back Test Methods Background Light and Electromagnetic Field There are four ambient interference conditions in which the receiver is to operate correctly. The conditions are to be applied separately: 1. Electromagnetic field: 3 V/m maximum (please refer to IEC 801-3, severity level 3 for details). 2. Sunlight: 10 kilolux maximum at the optical port. This is simulated with an IR source having a peak wavelength within the range of 850 nm to 900 nm and a spectral width of less than 50 nm biased to provide 490 µW/cm2 (with no modulation) at the optical port. The light source faces the optical port. This simulates sunlight within the IrDA spectral range. The effect of longer wavelength radiation is covered by the incandescent condition. 3. Incandescent Lighting: 1000 lux maximum. This is produced with general service, tungsten-filament, gas-filled, inside frosted lamps in the 60 Watt to 100 Watt range to generate 1000 lux over the horizontal surface on which the equipment under test rests. The light sources are above the test area. The source is expected to have a filament temperature in the 2700 to 3050 Kelvin range and a spectral peak in the 850 to 1050 nm range. surface on which the equipment under test rests. The light sources are above the test area. The frequency of the optical signal is swept over the frequency range from 20 kHz to 200 kHz. Due to the variety of fluorescent lamps and the range of IR emissions, this condition is not expected to cover all circumstances. It will provide a common floor for IrDA operation. 4. Fluorescent Lighting: 1000 lux maximum. This is simulated with an IR source having a peak wavelength within the range of 850 nm to 900 nm and a spectral width of less than 50 nm biased and modulated to provide an optical square wave signal (0 µW/cm2 minimum and 0.3 µW/cm2 peak amplitude with 10% to 90% rise and fall times less than or equal to 100 ns) over the horizontal www.semiconductor.agilent.com Data subject to change. Copyright © 2001 Agilent Technologies, Inc. November 28, 2001 Obsoletes 5980-2915EN (11/00) 5988-5012EN