ETC REG1117A-25

REG1117
REG1117A
REG
111
7
SBVS001B – OCTOBER 2001
800mA and 1A Low Dropout Positive Regulator
1.8V, 2.5V, 2.85V, 3.3V, 5V, and Adjustable
FEATURES
DESCRIPTION
● FIXED AND ADJUSTABLE VERSIONS
● 2.85V MODEL FOR SCSI-2 ACTIVE TERMINATION
● OUTPUT CURRENT:
REG1117: 800mA max
REG1117A: 1A max
● OUTPUT TOLERANCE: ±1% max
● DROPOUT VOLTAGE:
REG1117: 1.2V max at IO = 800mA
REG1117A: 1.3V max at IO = 1A
● INTERNAL CURRENT LIMIT
● THERMAL OVERLOAD PROTECTION
● SOT-223 AND DDPAK SURFACE-MOUNT PACKAGES
The REG1117 is a family of easy-to-use three-terminal
voltage regulators. The family includes a variety of fixedand adjustable-voltage versions, two currents (800mA and
1A) and two package types (SOT-223 and DDPAK). See the
chart below for available options.
Output voltage of the adjustable versions is set with two
external resistors. The REG1117’s low dropout voltage
allows its use with as little as 1V input-output voltage
differential.
Laser trimming assures excellent output voltage accuracy
without adjustment. An NPN output stage allows output
stage drive to contribute to the load current for maximum
efficiency.
800mA
APPLICATIONS
VOLTAGE
●
●
●
●
●
SCSI-2 ACTIVE TERMINATION
HAND-HELD DATA COLLECTION DEVICES
HIGH EFFICIENCY LINEAR REGULATORS
BATTERY POWERED INSTRUMENTATION
BATTERY MANAGEMENT CIRCUITS FOR
NOTEBOOK AND PALMTOP PCs
● CORE VOLTAGE SUPPLY: FPGA, PLD, DSP, CPU
SOT-223
1A
DDPAK
1.8V
2.5V
2.85V
✔
3.3V
✔
5V
✔
Adj.
✔
SOT-223
DDPAK
✔
✔
✔
✔
✔
✔
✔
✔
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 1992, Burr-Brown Corporation
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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PACKAGE/ORDERING INFORMATION
VO /IO
PACKAGE-LEAD
PACKAGE
DESIGNATOR
2.85 /800mA
"/ "
SOT223-3
DCY
3.3 /800mA
"/ "
SOT223-3
3.3 /800mA
"/ "
DDPAK-3
5V/800mA
"/ "
SOT223-3
Adj./800mA
"/ "
SOT223-3
1.8V/1A
"/ "
SOT223-3
1.8/1A
"/ "
DDPAK-3
2.5/1A
"/ "
SOT223-3
2.5/1A
"/ "
DDPAK-3
5/1A
"/ "
DDPAK-3
Adj./1A
"/ "
SOT223-3
Adj./1A
"/ "
DDPAK-3
PRODUCT
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
0°C to +125°C
BB11172
"
"
REG1117-2.85
REG1117-2.85
Rails, 80
Tape and Reel, 2500
0°C to +125°C
BB11174
"
"
REG1117-3.3
REG1117-3.3
Rails, 80
Tape and Reel, 2500
0°C to +125°C
BB1117F4
"
"
REG1117F-3.3
REG1117F-3.3
Rails, 49
Tape and Reel, 500
0°C to +125°C
BB11175
"
"
REG1117-5
REG1117-5
Rails, 80
Tape and Reel, 2500
0°C to +125°C
BB1117
"
"
REG1117
REG1117
Rails, 80
Tape and Reel, 2500
0°C to +125°C
R111718
"
"
REG1117A-1.8
REG1117A-1.8
Rails, 80
Tape and Reel, 2500
0°C to +125°C
REG1117FA1.8
"
"
REG1117FA-1.8
REG1117FA-1.8
Rails, 49
Tape and Reel, 500
0°C to +125°C
R111725
"
"
REG1117A-2.5
REG1117A-2.5
Rails, 80
Tape and Reel, 2500
0°C to +125°C
REG1117FA2.5
"
"
REG1117FA-2.5
REG1117FA-2.5
Rails, 49
Tape and Reel, 500
0°C to +125°C
REG1117FA5.0
"
"
REG1117FA-5.0
REG1117FA-5.0
Rails, 49
Tape and Reel, 500
0°C to +125°C
BB1117A
"
"
REG1117A
REG1117A
Rails, 80
Tape and Reel, 2500
0°C to +125°C
REG1117FA
"
"
REG1117FA
REG1117FA
Rails, 49
Tape and Reel, 500
800mA Output
REG1117-2.85
"
REG1117-3.3
"
REG1117F-3.3
"
REG1117-5
"
REG1117
"
"
DCY
"
KTT
"
DCY
"
DCY
"
1A Output
REG1117A-1.8
"
REG1117FA-1.8
"
REG1117A-2.5
"
REG1117FA-2.5
"
REG1117FA-5
"
REG1117A
"
REG1117FA
"
DCY
"
KTT
"
DCY
"
KTT
"
KTT
"
DCY
"
KTT
"
ABSOLUTE MAXIMUM RATINGS(1)
Power Dissipation ........................................................... Internally Limited
Input Voltage ........................................................................................ 15V
Operating Junction Temperature Range ............................. 0°C to +125°C
Storage Temperature Range .......................................... –65°C to +150°C
Lead Temperature (soldering, 10s)(2) ............................................ +300°C
NOTE: (1) Stresses above these ratings may cause permanent damage. (2) See
“Soldering Methods.”
CONNECTION DIAGRAM
Front View
Plastic SOT-223
Plastic DDPAK
Tab is
VOUT
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
Tab is VOUT
Ground VOUT
(Adj.)(1)
VIN
Ground VOUT
(Adj.)(1)
VIN
NOTE: (1) Adjustable-Voltage Model.
2
REG1117, REG1117A
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SBVS001B
ELECTRICAL CHARACTERISTICS
At TJ = +25°C, unless otherwise noted.
REG1117, REG1117A
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
OUTPUT VOLTAGE
REG1117-2.85
See Note 1
IO = 10mA, VIN = 4.85V
IO = 0 to 800mA, VIN = 4.05 to 10V
2.820
2.790
2.85
2.85
2.880
2.910
V
V
REG1117-3.3
See Note 1
IO = 10mA, VIN = 5.3V
IO = 0 to 800mA, VIN = 4.8 to 10V
3.270
3.240
3.30
3.30
3.330
3.360
V
V
REG1117-5
See Note 1
IO = 10mA, VIN = 7V
IO = 0 to 800mA, VIN = 6.5 to 10V
4.950
4.900
5.00
5.00
5.050
5.100
V
V
REG1117A-1.8
See Note 1
IO = 10mA, VIN = 3.8V
IO = 0 to 1A, VIN = 3.8V to 10V
1.782
1.764
1.8
1.8
1.818
1.836
V
V
REG1117A-2.5
See Note 1
IO = 10mA, VIN = 4.5V
IO = 0 to 1A, VIN = 4.5V to 10V
2.475
2.450
2.5
2.5
2.525
2.550
V
V
REG1117A-5
See Note 1
IO = 10mA, VIN = 7V
IO = 0 to 1A, VIN = 7V to 10V
4.950
4.900
5.0
5.0
5.050
5.100
V
V
IO = 10mA, VIN – VO = 2V
IO = 10 to 800mA, VIN – VO = 1.4 to 10V
1.238
1.225
1.250
1.250
1.262
1.280
V
V
IO = 10mA, VIN – VO = 2V
IO = 10mA to 1A, VIN – VO = 1.4 to 10V
1.238
1.225
1.250
1.250
1.262
1.280
V
V
IO = 0, VIN = 4.25 to 10V
IO = 0, VIN = 4.8 to 10V
IO = 0, VIN = 6.5 to 15V
IO = 10mA, VIN – VO = 1.5 to 13.75V
IO = 10mA, VIN – VO = 1.5 to 13.75V
IO = 0, VIN = 3.8V to 10V
IO = 0, VIN = 4.5V to 10V
IO = 0, VIN = 7V to 15V
1
2
3
0.1
0.1
1
1
3
7
7
10
0.4
0.4
7
7
10
mV
mV
mV
%
%
mV
mV
mV
IO = 0 to 800mA, VIN = 4.25V
IO = 0 to 800mA, VIN = 4.8V
IO = 0 to 800mA, VIN = 6.5V
IO = 10 to 800mA, VIN – VO = 3V
IO = 10mA to 1A, VIN – VO = 3V
IO = 0 to 1A, VIN = 3.8V
IO = 0 to 1A, VIN = 4.5V
IO = 0 to 1A, VIN = 7.0V
2
3
3
0.1
0.1
2
2
3
10
12
15
0.4
0.4
10
10
15
mV
mV
mV
%
%
mV
mV
mV
IO = 100mA
IO = 500mA
IO = 800mA
IO = 1A
IO = 1A
1.00
1.05
1.10
1.2
1.2
1.10
1.15
1.20
1.30
1.55
V
V
V
V
V
950
1250
1200
1600
mA
mA
1.7
5
mA
REFERENCE VOLTAGE
REG1117 (Adjustable)
See Note 1
REG1117A (Adjustable)
See Note 1
LINE REGULATION
REG1117-2.85(1)
REG1117-3.3(1)
REG1117-5(1)
REG1117 (Adjustable)(1)
REG1117A (Adjustable)(1)
REG1117A-1.8(1)
REG1117A-2.5(1)
REG1117A-5.0(1)
LOAD REGULATION
REG1117-2.85(1)
REG1117-3.3(1)
REG1117-5(1)
REG1117 (Adjustable)(1)(2)
REG1117A (Adjustable)(1)(2)
REG1117A-1.8
REG1117A-2.5
REG1117A-5
DROPOUT VOLTAGE(3)
All Models(1)
See Note 1
REG1117 Models(1)
REG1117A
See Note 1
CURRENT LIMIT
REG1117 Models
REG1117A
VIN – VO = 5V
VIN – VO = 5V
MINIMUM LOAD CURRENT
Adjustable Models(1)(2)
VIN – VO = 13.75V
QUIESCENT CURRENT
Fixed-Voltage Models(1)
Adjust Pin Current(1)(2)
vs Load Current, REG1117(1)
vs Load Current, REG1117A(1)
THERMAL REGULATION
All Models(4)
RIPPLE REJECTION
All Models
TEMPERATURE DRIFT
Fixed-Voltage Models
Adjustable Models
VIN – VO = 5V
4
10
mA
IO = 10mA, VIN – VO = 1.4 to 10V
IO = 10mA to 800mA, VIN – VO = 1.4 to 10V
IO = 10mA to 1A, VIN – VO = 1.4 to 10V
50
0.5
0.5
120
5
5
µA
µA
µA
30ms Pulse
0.01
0.1
%/W
f = 120Hz, VIN – VOUT = 3V + 1Vp-p Ripple
62
dB
TJ = 0°C to +125°C
TJ = 0°C to +125°C
0.5
2
%
%
REG1117, REG1117A
SBVS001B
800
1000
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3
ELECTRICAL CHARACTERISTICS (Cont.)
At TJ = +25°C, unless otherwise noted.
REG1117, REG1117A
PARAMETER
CONDITIONS
LONG-TERM STABILITY
All Models
OUTPUT NOISE
r ms Noise, All Models
THERMAL RESISTANCE
Operating Junction Temperature Range
Storage Range
Thermal Resistance, θJC
3-Lead SOT-223 Surface-Mount
3-Lead DDPAK Surface-Mount
Thermal Resistance, θJA
3-Lead DDPAK Surface-Mount
MIN
TYP
MAX
UNITS
TA = +125°C, 1000Hr
0.3
%
f = 10Hz to 10kHz
0.003
%
0
–65
°C
°C
+125
+150
(Junction-to-Case at Tab)
f > 50Hz
dc
(Junction-to-Case at Tab)
No Heat Sink
15
2
3
°C/W
°C/W
°C/W
65
°C/W
NOTES: (1) Specification applies over the full operating Junction temperature range, 0°C to +125°C. (2) REG1117 and REG1117A adjustable versions require a
minimum load current for ±3% regulation. (3) Dropout voltage is the input voltage minus output voltage that produces a 1% decrease in output voltage.
(4) Percentage change in unloaded output voltage before versus after a 30ms power pulse of IO = 800mA (REG1117 models), IO = 1A (REG1117A), VIN – VO =
1.4V (Reading taken 10ms after pulse).
SIMPLIFIED SCHEMATIC
VIN
+
Current
Limit
Thermal
Limit
VOUT
10X
(Substrate)
Ground (Fixed-Voltage Models)
Adj. (Adjustable-Voltage Model)
4
REG1117, REG1117A
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SBVS001B
TYPICAL CHARACTERISTICS
At TJ = +25°C, all models, unless otherwise specified.
LOAD REGULATION
(∆ILOAD = 800mA)
1400
1
1300
0
1200
Output Voltage Deviation (mV)
Short-Circuit Current (mA)
SHORT-CIRCUIT CURRENT vs TEMPERATURE
REG1117A
1100
REG1117 Models
1000
900
800
–50
–25
0
25
50
75
REG1117-2.85
–1
REG1117A-1.8
–2
–3
–4
REG1117-5
–5
–6
–7
–50
100
–25
0
Temperature (°C)
LINE REGULATION vs TEMPERATURE
VIN = 6.5V to 15V
REG1117-5
100
IOUT = 100mA
VRIPPLE = 1.0Vp-p
4
80
Ripple Rejection (dB)
Output Voltage Change (mV)
75
RIPPLE REJECTION vs FREQUENCY
90
5
3
2
1
REG1117-1.8
VIN = 3.8V to 10V
0
70
60
50
40
30
20
–1
10
0
–25
0
25
50
75
100
10
100
1k
Temperature (°C)
10k
100k
Frequency (Hz)
OUTPUT VOLTAGE vs TEMPERATURE
QUIESCENT CURRENT vs TEMPERATURE
2.0
8
IO = 10mA
7
Quiescent Current (mA)
Output Voltage Change (%)
50
100
6
–2
–50
25
Temperature (°C)
1.0
0
–1.0
Fixed-Voltage Models
6
5
4
3
2
1
–2.0
–50
–25
0
25
50
75
0
–50
100
REG1117, REG1117A
SBVS001B
–25
0
25
50
75
100
Temperature (°C)
Temperature (°C)
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5
TYPICAL CHARACTERISTICS (Cont.)
At TJ = +25°C, all models, unless otherwise specified.
LINE TRANSIENT RESPONSE
LOAD TRANSIENT RESPONSE
Output Voltage
Deviation (mV)
Output Voltage
Deviations (V)
60
0.1
0
–0.1
CIN = 1µF
COUT = 10µF Tantalum
IOUT = 0.1A
40
20
0
0.5
0
–0.5
0
20
40
60
Time (µs)
80
Input Voltage (V)
Load Current (A)
–20
CIN = 10µF
COUT = 10µF
Tantalum
VIN = 4.25V
Preload = 0.1A
100
–40
5.25
4.25
3.25
0
20
40
60
80
100
120
140 160 180
200
Time (µs)
APPLICATIONS INFORMATION
Figure 1 shows the basic hookup diagram for fixed-voltage
models. All models require an output capacitor for proper
operation and to improve high frequency load regulation. A
10µF tantalum capacitor is recommended. Aluminum electrolytic types of 50µF or greater can also be used. A high
quality capacitor should be used to assure that the ESR
(Effective Series Resistance) is less than 0.5Ω.
Figure 2 shows a hookup diagram for the adjustable voltage
model. Resistor values are shown for some commonly used
output voltages. Values for other voltages can be calculated
from the equation shown in Figure 2. For best load regulation, connect R1 close to the output pin and R2 close to the
ground side of the load as shown.
VIN
C1 +
10µF
3
REG1117
(Adj)
1
C3(1) +
10µF
VIN
10µF
Tantalum
+
R1
+ C2
10µF
Load
VO =
R1 + R 2
R1
R2
+ 10µF
Tantalum
FIGURE 1. Fixed-Voltage Model—Basic Connections.
VO
2
VO
REG1117
• (1.25V) + (50µA) (R2)
This term is negligible with
proper choice of values—see
table at right.
VOUT (V)
R1 (Ω) (2)
R2 (Ω) (2)
1.25
1.5
2.1
2.85
3
3.3
5
10
Open
750
158
169
137
115
113
113
Short
147
107
215
191
187
340
787
NOTE: (1) C3 optional. Improves high-frequency line rejection. (2) Resistors are standard 1% values.
FIGURE 2. Adjustable-Voltage Model—Basic Connections.
6
REG1117, REG1117A
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SBVS001B
THERMAL CONSIDERATIONS
The REG1117 has current limit and thermal shutdown
circuits that protect it from overload. The thermal shutdown
activates at approximately TJ = 165°C. For continuous operation, however, the junction temperature should not be
allowed to exceed 125°C. Any tendency to activate the
thermal shutdown in normal use is an indication of an
inadequate heat sink or excessive power dissipation. The
power dissipation is equal to:
PD = (VIN – VOUT) IOUT
The junction temperature can be calculated by:
TJ = TA + PD (θJA)
where TA is the ambient temperature, and
θJA is the junction-to-ambient thermal resistance
A simple experiment will determine whether the maximum
recommended junction temperature is exceeded in an actual
circuit board and mounting configuration: Increase the ambient temperature above that expected in normal operation
until the device’s thermal shutdown is activated. If this
occurs at more than 40°C above the maximum expected
ambient temperature, then the TJ will be less than 125°C
during normal operation.
The internal protection circuitry of the REG1117 was designed to protect against overload conditions. It was not
intended to replace proper heat sinking. Continuously running the REG1117 into thermal shutdown will degrade
reliability.
LAYOUT CONSIDERATIONS
The DDPAK (REG1117F-3.3 and REG1117FA) is a surface-mount power package that has excellent thermal characteristics. For best thermal performance, its mounting tab
should be soldered directly to a circuit board copper area, as
shown in Figure 3. Increasing the copper area improves heat
dissipation. Figure 4 shows typical thermal resistance from
junction-to-ambient as a function of the copper area.
3-Lead DDPAK(1)
0.2
0.085
0.45
0.51
All measurements
in inches.
0.05
0.155
0.10
NOTE: (1) For improved thermal performance increase
footprint area. See Figure 4, “Thermal Resistance vs
Circuit Board Copper Area”.
FIGURE 3. DDPAK Thermal Resistance versus Circuit Board Copper Area.
THERMAL RESISTANCE vs
CIRCUIT BOARD COPPER AREA
Thermal Resistance, θJA (°C/W)
60
Circuit Board Copper Area
REG1117F
DDPAK Surface Mount Package
1oz copper
50
40
30
20
REG1117F
DDPAK Surface-Mount Package
10
0
1
2
3
4
5
Copper Area (inches2)
FIGURE 4. DDPAK Thermal Resistance versus Circuit Board Copper Area.
REG1117, REG1117A
SBVS001B
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7
The SOT-223 package derives heat sinking from conduction
through its copper leads, especially the large mounting tab.
These must be soldered to a circuit board with a substantial
amount of copper remaining, as shown in Figure 5. Circuit
board traces connecting the tab and the leads should be made
as large as practical. The mounting tab of both packages is
electrically connected to VOUT.
TOTAL PC BOARD
AREA
TOPSIDE(1)
COPPER
AREA
BACKSIDE
COPPER
AREA
SOT-223
THERMAL RESISTANCE
JUNCTION-TO-AMBIENT
2500mm2
2500mm2
2500mm2
46°C/W
2500mm2
1250mm2
2500mm2
47°C/W
2500mm2
950mm2
2500mm2
49°C/W
2500mm2
2500mm2
0
51°C/W
2500mm2
1800mm2
0
53°C/W
1600mm2
600mm2
1600mm2
55°C/W
2500mm2
1250mm2
0
58°C/W
2500mm2
915mm2
0
59°C/W
1600mm2
600mm2
0
67°C/W
900mm2
340mm2
900mm2
72°C/W
900mm2
340mm2
0
85°C/W
Total Area: 50 x 50mm
35 x 17 mm
NOTE: (1) Tab is attached to the topside copper.
TABLE I.
16 x 10 mm
16 x 10 mm
INSPEC Abstract Number: B91007604, C91012627
Kelly, E.G. “Thermal Characteristics of Surface 5WK9Ω
Packages.” The Proceedings of SMTCON. Surface Mount
Technology Conference and Exposition: Competitive Surface
Mount Technology, April 3-6, 1990, Atlantic City, NJ, USA.
Abstract Publisher: IC Manage, 1990, Chicago, IL, USA.
Without back-side copper: θJA ≈ 59°C/W
With solid back-side copper: θJA ≈ 49°C/W
FIGURE 5. SOT-223 Circuit Board Layout Example.
Other nearby circuit traces, including those on the back side
of the circuit board, help conduct heat away from the device,
even though they may not be electrically connected. Make
all nearby copper traces as wide as possible and leave only
narrow gaps between traces.
Table I shows approximate values of θJA for various circuit
board and copper areas for the SOT-223 package. Nearby
heat dissipating components, circuit board mounting conditions, and ventilation can dramatically affect the actual θJA.
Proper heat sinking significantly increases the maximum
power dissipation at a given ambient temperature, as shown
in Figure 6.
MAXIMUM POWER DISSIPATION
vs AMBIENT TEMPERATURE
Power Dissipation (Watts)
6
θJA = 27°C/W
(4in2 one oz copper
mounting pad)
5
PD = (TJ (max) – TA) / θ JA
TJ (max) = 150°C
θJA = 46°C/W
(2500mm2 topside and
backside copper)
4
DDPAK
SOT-223
3
θJA = 65°C/W
(no heat sink)
2
θJA = 85°C/W
(340mm2 topside copper,
no backside copper)
1
0
SOLDERING METHODS
Both REG1117 packages are suitable for infrared reflow and
vapor-phase reflow soldering techniques. The high rate of
temperature change that occurs with wave soldering, or hand
soldering can damage the REG1117.
8
0
25
50
75
100
125
Ambient Temperature (°C)
FIGURE 6. Maximum Power Dissipation versus Ambient
Temperature.
REG1117, REG1117A
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SBVS001B
TERMPWR
5V
TERMPWR
110Ω
2.85V
1N5817
110Ω
2.85V
REG1117-2.85
10µF
5V
1N5817
REG1117-2.85
10µF
10µF
(Up to 27 Lines)
110Ω
10µF
110Ω
FIGURE 7. SCSI Active Termination Configuration.
REG1117-5
In
VIN > 12V
10µF
REG1117-5
Out
+
5V to 10V
+
GND
In
VIN > 9.0V
100µF
10µF
+
Out
7.5V
+
GND
100µF
2.5VOUT
10µF
+
1kΩ
REF1004-2.5
FIGURE 8. Adjusting Output of Fixed Voltage Models.
FIGURE 9. Regulator with Reference.
REG1117-5
VIN
In
10µF
5.2V Line
5.0V Battery
Out
+
GND
50Ω
1kΩ
REG1117-5
In
6.5V
10µF
Out
GND
+
+
100µF
FIGURE 10. Battery Backed-Up Regulated Supply.
REG1117-5
In
VIN
10µF
+
Out
GND
+
100µF
VOUT = –5V
Floating Input
FIGURE 11. Low Dropout Negative Supply.
REG1117, REG1117A
SBVS001B
www.ti.com
9
PACKAGE DRAWINGS
MPDS094 – APRIL 2001
DCY (R-PDSO-G4)
PLASTIC SMALL-OUTLINE
0.264 (6,70)
0.248 (6,30)
0.124 (3,15)
0.116 (2,95)
0.287 (7,30)
0.264 (6,70)
0.146 (3,70)
0.130 (3,30)
0.0905 (2,30) NOM
0.041 (1,05)
0.033 (0,85)
0.181 (4,60)
NOM
0.067 (1,70)
0.060 (1,50)
0.051 (1,30)
0.043 (1,09)
0.014 (0,36)
0.010 (0,25)
10° MAX
0.004 (0,10)
0.0008 (0,02)
0.033 (0,84)
0.026 (0,66)
0.012 (0,30) MIN
4202506/A 03/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
10
REG1117, REG1117A
www.ti.com
SBVS001B
PACKAGE DRAWINGS
MPSF006A – SEPTEMBER 1999 – REVISED SEPTEMBER 2000
KTT (R-PSFM-G3)
PLASTIC FLANGE-MOUNT
0.170 (4,31)
0.180 (4,57)
0.396 (10,05)
0.406 (10,31)
0.055 (1,40)
0.066 (1,68)
0.045 (1,14)
0.055 (1,40)
0.326 (8,28)
0.098 (2,49)
0.108 (2,74)
0.336 (8,53)
0.580 (14,73)
0.620 (15,75)
0.000 (0,00)
0.010 (0,25)
0.026 (0,66)
0.036 (0,91)
0.100 (2,54)
0.010 (0,25)
0.017 (0,43)
0.023 (0,58)
0.090 (2,29)
0.110 (2,79)
0° – 8°
4200577-2/B 09/00
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Dimensions do not include mold protrusions, not to exceed 0.006 (0,15).
REG1117, REG1117A
SBVS001B
www.ti.com
11
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