REG1117 REG1117A REG 111 7 SBVS001B – OCTOBER 2001 800mA and 1A Low Dropout Positive Regulator 1.8V, 2.5V, 2.85V, 3.3V, 5V, and Adjustable FEATURES DESCRIPTION ● FIXED AND ADJUSTABLE VERSIONS ● 2.85V MODEL FOR SCSI-2 ACTIVE TERMINATION ● OUTPUT CURRENT: REG1117: 800mA max REG1117A: 1A max ● OUTPUT TOLERANCE: ±1% max ● DROPOUT VOLTAGE: REG1117: 1.2V max at IO = 800mA REG1117A: 1.3V max at IO = 1A ● INTERNAL CURRENT LIMIT ● THERMAL OVERLOAD PROTECTION ● SOT-223 AND DDPAK SURFACE-MOUNT PACKAGES The REG1117 is a family of easy-to-use three-terminal voltage regulators. The family includes a variety of fixedand adjustable-voltage versions, two currents (800mA and 1A) and two package types (SOT-223 and DDPAK). See the chart below for available options. Output voltage of the adjustable versions is set with two external resistors. The REG1117’s low dropout voltage allows its use with as little as 1V input-output voltage differential. Laser trimming assures excellent output voltage accuracy without adjustment. An NPN output stage allows output stage drive to contribute to the load current for maximum efficiency. 800mA APPLICATIONS VOLTAGE ● ● ● ● ● SCSI-2 ACTIVE TERMINATION HAND-HELD DATA COLLECTION DEVICES HIGH EFFICIENCY LINEAR REGULATORS BATTERY POWERED INSTRUMENTATION BATTERY MANAGEMENT CIRCUITS FOR NOTEBOOK AND PALMTOP PCs ● CORE VOLTAGE SUPPLY: FPGA, PLD, DSP, CPU SOT-223 1A DDPAK 1.8V 2.5V 2.85V ✔ 3.3V ✔ 5V ✔ Adj. ✔ SOT-223 DDPAK ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright © 1992, Burr-Brown Corporation PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. www.ti.com PACKAGE/ORDERING INFORMATION VO /IO PACKAGE-LEAD PACKAGE DESIGNATOR 2.85 /800mA "/ " SOT223-3 DCY 3.3 /800mA "/ " SOT223-3 3.3 /800mA "/ " DDPAK-3 5V/800mA "/ " SOT223-3 Adj./800mA "/ " SOT223-3 1.8V/1A "/ " SOT223-3 1.8/1A "/ " DDPAK-3 2.5/1A "/ " SOT223-3 2.5/1A "/ " DDPAK-3 5/1A "/ " DDPAK-3 Adj./1A "/ " SOT223-3 Adj./1A "/ " DDPAK-3 PRODUCT SPECIFIED TEMPERATURE RANGE PACKAGE MARKING ORDERING NUMBER TRANSPORT MEDIA, QUANTITY 0°C to +125°C BB11172 " " REG1117-2.85 REG1117-2.85 Rails, 80 Tape and Reel, 2500 0°C to +125°C BB11174 " " REG1117-3.3 REG1117-3.3 Rails, 80 Tape and Reel, 2500 0°C to +125°C BB1117F4 " " REG1117F-3.3 REG1117F-3.3 Rails, 49 Tape and Reel, 500 0°C to +125°C BB11175 " " REG1117-5 REG1117-5 Rails, 80 Tape and Reel, 2500 0°C to +125°C BB1117 " " REG1117 REG1117 Rails, 80 Tape and Reel, 2500 0°C to +125°C R111718 " " REG1117A-1.8 REG1117A-1.8 Rails, 80 Tape and Reel, 2500 0°C to +125°C REG1117FA1.8 " " REG1117FA-1.8 REG1117FA-1.8 Rails, 49 Tape and Reel, 500 0°C to +125°C R111725 " " REG1117A-2.5 REG1117A-2.5 Rails, 80 Tape and Reel, 2500 0°C to +125°C REG1117FA2.5 " " REG1117FA-2.5 REG1117FA-2.5 Rails, 49 Tape and Reel, 500 0°C to +125°C REG1117FA5.0 " " REG1117FA-5.0 REG1117FA-5.0 Rails, 49 Tape and Reel, 500 0°C to +125°C BB1117A " " REG1117A REG1117A Rails, 80 Tape and Reel, 2500 0°C to +125°C REG1117FA " " REG1117FA REG1117FA Rails, 49 Tape and Reel, 500 800mA Output REG1117-2.85 " REG1117-3.3 " REG1117F-3.3 " REG1117-5 " REG1117 " " DCY " KTT " DCY " DCY " 1A Output REG1117A-1.8 " REG1117FA-1.8 " REG1117A-2.5 " REG1117FA-2.5 " REG1117FA-5 " REG1117A " REG1117FA " DCY " KTT " DCY " KTT " KTT " DCY " KTT " ABSOLUTE MAXIMUM RATINGS(1) Power Dissipation ........................................................... Internally Limited Input Voltage ........................................................................................ 15V Operating Junction Temperature Range ............................. 0°C to +125°C Storage Temperature Range .......................................... –65°C to +150°C Lead Temperature (soldering, 10s)(2) ............................................ +300°C NOTE: (1) Stresses above these ratings may cause permanent damage. (2) See “Soldering Methods.” CONNECTION DIAGRAM Front View Plastic SOT-223 Plastic DDPAK Tab is VOUT ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. Tab is VOUT Ground VOUT (Adj.)(1) VIN Ground VOUT (Adj.)(1) VIN NOTE: (1) Adjustable-Voltage Model. 2 REG1117, REG1117A www.ti.com SBVS001B ELECTRICAL CHARACTERISTICS At TJ = +25°C, unless otherwise noted. REG1117, REG1117A PARAMETER CONDITIONS MIN TYP MAX UNITS OUTPUT VOLTAGE REG1117-2.85 See Note 1 IO = 10mA, VIN = 4.85V IO = 0 to 800mA, VIN = 4.05 to 10V 2.820 2.790 2.85 2.85 2.880 2.910 V V REG1117-3.3 See Note 1 IO = 10mA, VIN = 5.3V IO = 0 to 800mA, VIN = 4.8 to 10V 3.270 3.240 3.30 3.30 3.330 3.360 V V REG1117-5 See Note 1 IO = 10mA, VIN = 7V IO = 0 to 800mA, VIN = 6.5 to 10V 4.950 4.900 5.00 5.00 5.050 5.100 V V REG1117A-1.8 See Note 1 IO = 10mA, VIN = 3.8V IO = 0 to 1A, VIN = 3.8V to 10V 1.782 1.764 1.8 1.8 1.818 1.836 V V REG1117A-2.5 See Note 1 IO = 10mA, VIN = 4.5V IO = 0 to 1A, VIN = 4.5V to 10V 2.475 2.450 2.5 2.5 2.525 2.550 V V REG1117A-5 See Note 1 IO = 10mA, VIN = 7V IO = 0 to 1A, VIN = 7V to 10V 4.950 4.900 5.0 5.0 5.050 5.100 V V IO = 10mA, VIN – VO = 2V IO = 10 to 800mA, VIN – VO = 1.4 to 10V 1.238 1.225 1.250 1.250 1.262 1.280 V V IO = 10mA, VIN – VO = 2V IO = 10mA to 1A, VIN – VO = 1.4 to 10V 1.238 1.225 1.250 1.250 1.262 1.280 V V IO = 0, VIN = 4.25 to 10V IO = 0, VIN = 4.8 to 10V IO = 0, VIN = 6.5 to 15V IO = 10mA, VIN – VO = 1.5 to 13.75V IO = 10mA, VIN – VO = 1.5 to 13.75V IO = 0, VIN = 3.8V to 10V IO = 0, VIN = 4.5V to 10V IO = 0, VIN = 7V to 15V 1 2 3 0.1 0.1 1 1 3 7 7 10 0.4 0.4 7 7 10 mV mV mV % % mV mV mV IO = 0 to 800mA, VIN = 4.25V IO = 0 to 800mA, VIN = 4.8V IO = 0 to 800mA, VIN = 6.5V IO = 10 to 800mA, VIN – VO = 3V IO = 10mA to 1A, VIN – VO = 3V IO = 0 to 1A, VIN = 3.8V IO = 0 to 1A, VIN = 4.5V IO = 0 to 1A, VIN = 7.0V 2 3 3 0.1 0.1 2 2 3 10 12 15 0.4 0.4 10 10 15 mV mV mV % % mV mV mV IO = 100mA IO = 500mA IO = 800mA IO = 1A IO = 1A 1.00 1.05 1.10 1.2 1.2 1.10 1.15 1.20 1.30 1.55 V V V V V 950 1250 1200 1600 mA mA 1.7 5 mA REFERENCE VOLTAGE REG1117 (Adjustable) See Note 1 REG1117A (Adjustable) See Note 1 LINE REGULATION REG1117-2.85(1) REG1117-3.3(1) REG1117-5(1) REG1117 (Adjustable)(1) REG1117A (Adjustable)(1) REG1117A-1.8(1) REG1117A-2.5(1) REG1117A-5.0(1) LOAD REGULATION REG1117-2.85(1) REG1117-3.3(1) REG1117-5(1) REG1117 (Adjustable)(1)(2) REG1117A (Adjustable)(1)(2) REG1117A-1.8 REG1117A-2.5 REG1117A-5 DROPOUT VOLTAGE(3) All Models(1) See Note 1 REG1117 Models(1) REG1117A See Note 1 CURRENT LIMIT REG1117 Models REG1117A VIN – VO = 5V VIN – VO = 5V MINIMUM LOAD CURRENT Adjustable Models(1)(2) VIN – VO = 13.75V QUIESCENT CURRENT Fixed-Voltage Models(1) Adjust Pin Current(1)(2) vs Load Current, REG1117(1) vs Load Current, REG1117A(1) THERMAL REGULATION All Models(4) RIPPLE REJECTION All Models TEMPERATURE DRIFT Fixed-Voltage Models Adjustable Models VIN – VO = 5V 4 10 mA IO = 10mA, VIN – VO = 1.4 to 10V IO = 10mA to 800mA, VIN – VO = 1.4 to 10V IO = 10mA to 1A, VIN – VO = 1.4 to 10V 50 0.5 0.5 120 5 5 µA µA µA 30ms Pulse 0.01 0.1 %/W f = 120Hz, VIN – VOUT = 3V + 1Vp-p Ripple 62 dB TJ = 0°C to +125°C TJ = 0°C to +125°C 0.5 2 % % REG1117, REG1117A SBVS001B 800 1000 www.ti.com 3 ELECTRICAL CHARACTERISTICS (Cont.) At TJ = +25°C, unless otherwise noted. REG1117, REG1117A PARAMETER CONDITIONS LONG-TERM STABILITY All Models OUTPUT NOISE r ms Noise, All Models THERMAL RESISTANCE Operating Junction Temperature Range Storage Range Thermal Resistance, θJC 3-Lead SOT-223 Surface-Mount 3-Lead DDPAK Surface-Mount Thermal Resistance, θJA 3-Lead DDPAK Surface-Mount MIN TYP MAX UNITS TA = +125°C, 1000Hr 0.3 % f = 10Hz to 10kHz 0.003 % 0 –65 °C °C +125 +150 (Junction-to-Case at Tab) f > 50Hz dc (Junction-to-Case at Tab) No Heat Sink 15 2 3 °C/W °C/W °C/W 65 °C/W NOTES: (1) Specification applies over the full operating Junction temperature range, 0°C to +125°C. (2) REG1117 and REG1117A adjustable versions require a minimum load current for ±3% regulation. (3) Dropout voltage is the input voltage minus output voltage that produces a 1% decrease in output voltage. (4) Percentage change in unloaded output voltage before versus after a 30ms power pulse of IO = 800mA (REG1117 models), IO = 1A (REG1117A), VIN – VO = 1.4V (Reading taken 10ms after pulse). SIMPLIFIED SCHEMATIC VIN + Current Limit Thermal Limit VOUT 10X (Substrate) Ground (Fixed-Voltage Models) Adj. (Adjustable-Voltage Model) 4 REG1117, REG1117A www.ti.com SBVS001B TYPICAL CHARACTERISTICS At TJ = +25°C, all models, unless otherwise specified. LOAD REGULATION (∆ILOAD = 800mA) 1400 1 1300 0 1200 Output Voltage Deviation (mV) Short-Circuit Current (mA) SHORT-CIRCUIT CURRENT vs TEMPERATURE REG1117A 1100 REG1117 Models 1000 900 800 –50 –25 0 25 50 75 REG1117-2.85 –1 REG1117A-1.8 –2 –3 –4 REG1117-5 –5 –6 –7 –50 100 –25 0 Temperature (°C) LINE REGULATION vs TEMPERATURE VIN = 6.5V to 15V REG1117-5 100 IOUT = 100mA VRIPPLE = 1.0Vp-p 4 80 Ripple Rejection (dB) Output Voltage Change (mV) 75 RIPPLE REJECTION vs FREQUENCY 90 5 3 2 1 REG1117-1.8 VIN = 3.8V to 10V 0 70 60 50 40 30 20 –1 10 0 –25 0 25 50 75 100 10 100 1k Temperature (°C) 10k 100k Frequency (Hz) OUTPUT VOLTAGE vs TEMPERATURE QUIESCENT CURRENT vs TEMPERATURE 2.0 8 IO = 10mA 7 Quiescent Current (mA) Output Voltage Change (%) 50 100 6 –2 –50 25 Temperature (°C) 1.0 0 –1.0 Fixed-Voltage Models 6 5 4 3 2 1 –2.0 –50 –25 0 25 50 75 0 –50 100 REG1117, REG1117A SBVS001B –25 0 25 50 75 100 Temperature (°C) Temperature (°C) www.ti.com 5 TYPICAL CHARACTERISTICS (Cont.) At TJ = +25°C, all models, unless otherwise specified. LINE TRANSIENT RESPONSE LOAD TRANSIENT RESPONSE Output Voltage Deviation (mV) Output Voltage Deviations (V) 60 0.1 0 –0.1 CIN = 1µF COUT = 10µF Tantalum IOUT = 0.1A 40 20 0 0.5 0 –0.5 0 20 40 60 Time (µs) 80 Input Voltage (V) Load Current (A) –20 CIN = 10µF COUT = 10µF Tantalum VIN = 4.25V Preload = 0.1A 100 –40 5.25 4.25 3.25 0 20 40 60 80 100 120 140 160 180 200 Time (µs) APPLICATIONS INFORMATION Figure 1 shows the basic hookup diagram for fixed-voltage models. All models require an output capacitor for proper operation and to improve high frequency load regulation. A 10µF tantalum capacitor is recommended. Aluminum electrolytic types of 50µF or greater can also be used. A high quality capacitor should be used to assure that the ESR (Effective Series Resistance) is less than 0.5Ω. Figure 2 shows a hookup diagram for the adjustable voltage model. Resistor values are shown for some commonly used output voltages. Values for other voltages can be calculated from the equation shown in Figure 2. For best load regulation, connect R1 close to the output pin and R2 close to the ground side of the load as shown. VIN C1 + 10µF 3 REG1117 (Adj) 1 C3(1) + 10µF VIN 10µF Tantalum + R1 + C2 10µF Load VO = R1 + R 2 R1 R2 + 10µF Tantalum FIGURE 1. Fixed-Voltage Model—Basic Connections. VO 2 VO REG1117 • (1.25V) + (50µA) (R2) This term is negligible with proper choice of values—see table at right. VOUT (V) R1 (Ω) (2) R2 (Ω) (2) 1.25 1.5 2.1 2.85 3 3.3 5 10 Open 750 158 169 137 115 113 113 Short 147 107 215 191 187 340 787 NOTE: (1) C3 optional. Improves high-frequency line rejection. (2) Resistors are standard 1% values. FIGURE 2. Adjustable-Voltage Model—Basic Connections. 6 REG1117, REG1117A www.ti.com SBVS001B THERMAL CONSIDERATIONS The REG1117 has current limit and thermal shutdown circuits that protect it from overload. The thermal shutdown activates at approximately TJ = 165°C. For continuous operation, however, the junction temperature should not be allowed to exceed 125°C. Any tendency to activate the thermal shutdown in normal use is an indication of an inadequate heat sink or excessive power dissipation. The power dissipation is equal to: PD = (VIN – VOUT) IOUT The junction temperature can be calculated by: TJ = TA + PD (θJA) where TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance A simple experiment will determine whether the maximum recommended junction temperature is exceeded in an actual circuit board and mounting configuration: Increase the ambient temperature above that expected in normal operation until the device’s thermal shutdown is activated. If this occurs at more than 40°C above the maximum expected ambient temperature, then the TJ will be less than 125°C during normal operation. The internal protection circuitry of the REG1117 was designed to protect against overload conditions. It was not intended to replace proper heat sinking. Continuously running the REG1117 into thermal shutdown will degrade reliability. LAYOUT CONSIDERATIONS The DDPAK (REG1117F-3.3 and REG1117FA) is a surface-mount power package that has excellent thermal characteristics. For best thermal performance, its mounting tab should be soldered directly to a circuit board copper area, as shown in Figure 3. Increasing the copper area improves heat dissipation. Figure 4 shows typical thermal resistance from junction-to-ambient as a function of the copper area. 3-Lead DDPAK(1) 0.2 0.085 0.45 0.51 All measurements in inches. 0.05 0.155 0.10 NOTE: (1) For improved thermal performance increase footprint area. See Figure 4, “Thermal Resistance vs Circuit Board Copper Area”. FIGURE 3. DDPAK Thermal Resistance versus Circuit Board Copper Area. THERMAL RESISTANCE vs CIRCUIT BOARD COPPER AREA Thermal Resistance, θJA (°C/W) 60 Circuit Board Copper Area REG1117F DDPAK Surface Mount Package 1oz copper 50 40 30 20 REG1117F DDPAK Surface-Mount Package 10 0 1 2 3 4 5 Copper Area (inches2) FIGURE 4. DDPAK Thermal Resistance versus Circuit Board Copper Area. REG1117, REG1117A SBVS001B www.ti.com 7 The SOT-223 package derives heat sinking from conduction through its copper leads, especially the large mounting tab. These must be soldered to a circuit board with a substantial amount of copper remaining, as shown in Figure 5. Circuit board traces connecting the tab and the leads should be made as large as practical. The mounting tab of both packages is electrically connected to VOUT. TOTAL PC BOARD AREA TOPSIDE(1) COPPER AREA BACKSIDE COPPER AREA SOT-223 THERMAL RESISTANCE JUNCTION-TO-AMBIENT 2500mm2 2500mm2 2500mm2 46°C/W 2500mm2 1250mm2 2500mm2 47°C/W 2500mm2 950mm2 2500mm2 49°C/W 2500mm2 2500mm2 0 51°C/W 2500mm2 1800mm2 0 53°C/W 1600mm2 600mm2 1600mm2 55°C/W 2500mm2 1250mm2 0 58°C/W 2500mm2 915mm2 0 59°C/W 1600mm2 600mm2 0 67°C/W 900mm2 340mm2 900mm2 72°C/W 900mm2 340mm2 0 85°C/W Total Area: 50 x 50mm 35 x 17 mm NOTE: (1) Tab is attached to the topside copper. TABLE I. 16 x 10 mm 16 x 10 mm INSPEC Abstract Number: B91007604, C91012627 Kelly, E.G. “Thermal Characteristics of Surface 5WK9Ω Packages.” The Proceedings of SMTCON. Surface Mount Technology Conference and Exposition: Competitive Surface Mount Technology, April 3-6, 1990, Atlantic City, NJ, USA. Abstract Publisher: IC Manage, 1990, Chicago, IL, USA. Without back-side copper: θJA ≈ 59°C/W With solid back-side copper: θJA ≈ 49°C/W FIGURE 5. SOT-223 Circuit Board Layout Example. Other nearby circuit traces, including those on the back side of the circuit board, help conduct heat away from the device, even though they may not be electrically connected. Make all nearby copper traces as wide as possible and leave only narrow gaps between traces. Table I shows approximate values of θJA for various circuit board and copper areas for the SOT-223 package. Nearby heat dissipating components, circuit board mounting conditions, and ventilation can dramatically affect the actual θJA. Proper heat sinking significantly increases the maximum power dissipation at a given ambient temperature, as shown in Figure 6. MAXIMUM POWER DISSIPATION vs AMBIENT TEMPERATURE Power Dissipation (Watts) 6 θJA = 27°C/W (4in2 one oz copper mounting pad) 5 PD = (TJ (max) – TA) / θ JA TJ (max) = 150°C θJA = 46°C/W (2500mm2 topside and backside copper) 4 DDPAK SOT-223 3 θJA = 65°C/W (no heat sink) 2 θJA = 85°C/W (340mm2 topside copper, no backside copper) 1 0 SOLDERING METHODS Both REG1117 packages are suitable for infrared reflow and vapor-phase reflow soldering techniques. The high rate of temperature change that occurs with wave soldering, or hand soldering can damage the REG1117. 8 0 25 50 75 100 125 Ambient Temperature (°C) FIGURE 6. Maximum Power Dissipation versus Ambient Temperature. REG1117, REG1117A www.ti.com SBVS001B TERMPWR 5V TERMPWR 110Ω 2.85V 1N5817 110Ω 2.85V REG1117-2.85 10µF 5V 1N5817 REG1117-2.85 10µF 10µF (Up to 27 Lines) 110Ω 10µF 110Ω FIGURE 7. SCSI Active Termination Configuration. REG1117-5 In VIN > 12V 10µF REG1117-5 Out + 5V to 10V + GND In VIN > 9.0V 100µF 10µF + Out 7.5V + GND 100µF 2.5VOUT 10µF + 1kΩ REF1004-2.5 FIGURE 8. Adjusting Output of Fixed Voltage Models. FIGURE 9. Regulator with Reference. REG1117-5 VIN In 10µF 5.2V Line 5.0V Battery Out + GND 50Ω 1kΩ REG1117-5 In 6.5V 10µF Out GND + + 100µF FIGURE 10. Battery Backed-Up Regulated Supply. REG1117-5 In VIN 10µF + Out GND + 100µF VOUT = –5V Floating Input FIGURE 11. Low Dropout Negative Supply. REG1117, REG1117A SBVS001B www.ti.com 9 PACKAGE DRAWINGS MPDS094 – APRIL 2001 DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE 0.264 (6,70) 0.248 (6,30) 0.124 (3,15) 0.116 (2,95) 0.287 (7,30) 0.264 (6,70) 0.146 (3,70) 0.130 (3,30) 0.0905 (2,30) NOM 0.041 (1,05) 0.033 (0,85) 0.181 (4,60) NOM 0.067 (1,70) 0.060 (1,50) 0.051 (1,30) 0.043 (1,09) 0.014 (0,36) 0.010 (0,25) 10° MAX 0.004 (0,10) 0.0008 (0,02) 0.033 (0,84) 0.026 (0,66) 0.012 (0,30) MIN 4202506/A 03/01 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. 10 REG1117, REG1117A www.ti.com SBVS001B PACKAGE DRAWINGS MPSF006A – SEPTEMBER 1999 – REVISED SEPTEMBER 2000 KTT (R-PSFM-G3) PLASTIC FLANGE-MOUNT 0.170 (4,31) 0.180 (4,57) 0.396 (10,05) 0.406 (10,31) 0.055 (1,40) 0.066 (1,68) 0.045 (1,14) 0.055 (1,40) 0.326 (8,28) 0.098 (2,49) 0.108 (2,74) 0.336 (8,53) 0.580 (14,73) 0.620 (15,75) 0.000 (0,00) 0.010 (0,25) 0.026 (0,66) 0.036 (0,91) 0.100 (2,54) 0.010 (0,25) 0.017 (0,43) 0.023 (0,58) 0.090 (2,29) 0.110 (2,79) 0° – 8° 4200577-2/B 09/00 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Dimensions do not include mold protrusions, not to exceed 0.006 (0,15). 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