Features • Single Voltage Operation • • • • • • • • • – 5V Read – 5V Reprogramming Fast Read Access Time - 90 ns Internal Program Control and Timer 8K Bytes Boot Block With Lockout Fast Erase Cycle Time - 10 seconds Byte-By-Byte Programming - 50 µs/Byte Hardware Data Protection DATA Polling For End Of Program Detection Low Power Dissipation – 50 mA Active Current – 100 µA CMOS Standby Current Typical 10,000 Write Cycles Description The AT49F020 is a 5-volt only in-system Flash Memory. Its 2 megabits of memory is organized as 262,144 words by 8 bits. Manufactured with Atmel’s advanced nonvolatile CMOS technology, the device offers access times to 90 ns with power dissipation of just 275 mW over the commercial temperature range. When the device is deselected, the CMOS standby current is less than 100 µA. To allow for simple in-system reprogrammability, the AT49F020 does not require high input voltages for programming. Five-volt-only commands determine the read and programming operation of the device. Reading data out of the device is similar to reading from an EPROM. Reprogramming the AT49F020 is performed by erasing the entire 2 megabits of memory and then programming on a byte by byte basis. The byte (continued) Pin Configurations A0 - A17 Addresses CE Chip Enable OE Output Enable WE Write Enable I/O0 - I/O7 Data Inputs/Outputs NC No Connect 29 28 27 26 25 24 23 22 21 14 15 16 17 18 19 20 5 6 7 8 9 10 11 12 13 A14 A13 A8 A9 A11 OE A10 CE I/O7 I/O1 I/O2 GND I/O3 I/O4 I/O5 I/O6 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 4 3 2 1 32 31 30 A12 A15 A16 NC VCC WE A17 Function TSOP Top View Type 1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 AT49F020 PLCC Top View Pin Name A11 A9 A8 A13 A14 A17 WE VCC NC A16 A15 A12 A7 A6 A5 A4 2-Megabit (256K x 8) 5-volt Only Flash Memory DIP Top View 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE A10 CE I/O7 I/O6 I/O5 I/O4 I/O3 GND I/O2 I/O1 I/O0 A0 A1 A2 A3 NC A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 I/O1 I/O2 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VCC WE A17 A14 A13 A8 A9 A11 OE A10 CE I/O7 I/O6 I/O5 I/O4 I/O3 Rev. 0567C–10/98 1 programming time is a fast 50 µs. The end of a program cycle can be optionally detected by the DATA polling feature. Once the end of a byte program cycle has been detected, a new access for a read or program can begin. The typical number of program and erase cycles is in excess of 10,000 cycles. The optional 8K bytes boot block section includes a reprogramming write lock out feature to provide data integrity. The boot sector is designed to contain user secure code, and when the feature is enabled, the boot sector is permanently protected from being reprogrammed. Block Diagram DATA INPUTS/OUTPUTS I/O0 - I/O7 VCC GND OE WE CE ADDRESS INPUTS OE, CE AND WE LOGIC DATA LATCH INPUT/OUTPUT BUFFERS Y DECODER Y-GATING X DECODER MAIN MEMORY (248K BYTES) OPTIONAL BOOT BLOCK (8K BYTES) 3FFFF 02000 01FFF 00000 Device Operation READ: The AT49F020 is accessed like an EPROM. When CE and OE are low and WE is high, the data stored at the memory location determined by the address pins is asserted on the outputs. The outputs are put in the high impedance state whenever CE or OE is high. This dual-line control gives designers flexibility in preventing bus contention. ERASURE: Before a byte can be reprogrammed, the 256K bytes memory array (or 248K bytes if the boot block featured is used) must be erased. The erased state of the memory bits is a logical “1”. The entire device can be erased at one time by using a 6-byte software code. The software chip erase code consists of 6-byte load commands to specific address locations with a specific data pattern (please refer to the Chip Erase Cycle Waveforms). After the software chip erase has been initiated, the device will internally time the erase operation so that no external clocks are required. The maximum time needed to erase the whole chip is tEC. If the boot block lockout feature has been enabled, the data in the boot sector will not be erased. BYTE PROGRAMMING: Once the memory array is erased, the device is programmed (to a logical “0”) on a byte-by-byte basis. Please note that a data “0” cannot be programmed back to a “1”; only erase operations can convert “0”s to “1”s. Programming is accomplished via the internal device command register and is a 4 bus cycle operation (please refer to the Command Definitions table). The device will automatically generate the required internal program pulses. The program cycle has addresses latched on the falling edge of WE or CE, whichever occurs last, and the data 2 AT49F020 latched on the rising edge of WE or CE, whichever occurs first. Programming is completed after the specified tBP cycle time. The DATA polling feature may also be used to indicate the end of a program cycle. BOOT BLOCK PROGRAMMING LOCKOUT: The device has one designated block that has a programming lockout feature. This feature prevents programming of data in the designated block once the feature has been enabled. The size of the block is 8K bytes. This block, referred to as the boot block, can contain secure code that is used to bring up the system. Enabling the lockout feature will allow the boot code to stay in the device while data in the rest of the device is updated. This feature does not have to be activated; the boot block’s usage as a write protected region is optional to the user. The address range of the boot block is 00000H to 01FFFH. Once the feature is enabled, the data in the boot block can no longer be erased or programmed. Data in the main memory block can still be changed through the regular programming method. To activate the lockout feature, a series of six program commands to specific addresses with specific data must be performed. Please refer to the Command Definitions table. BOOT BLOCK LOCKOUT DETECTION: A software method is available to determine if programming of the boot block section is locked out. When the device is in the software product identification mode (see Software Product Identification Entry and Exit sections) a read from address location 00002H will show if programming the boot block is locked out. If the data on I/O0 is low, the boot block can be programmed; if the data on I/O0 is high, the program lockout feature has been activated and the block cannot be AT49F020 TOGGLE BIT: In addition to DATA polling the AT49F020 provides another method for determining the end of a program or erase cycle. During a program or erase operation, successive attempts to read data from the device will result in I/O6 toggling between one and zero. Once the program cycle has completed, I/O6 will stop toggling and valid data will be read. Examining the toggle bit may begin at any time during a program cycle. HARDWARE DATA PROTECTION: Hardware features protect against inadvertent programs to the AT49F020 in the following ways: (a) V CC sense—if V CC is below 3.8V (typical), the program function is inhibited; (b) Program inhibit—holding any one of OE low, CE high or WE high inhibits program cycles; and (c) Noise filter—pulses of less than 15 ns (typical) on the WE or CE inputs will not initiate a program cycle. programmed. The software product identification code should be used to return to standard operation. PRODUCT IDENTIFICATION: The product identification mode identifies the device and manufacturer as Atmel. It may be accessed by hardware or software operation. The hardware operation mode can be used by an external programmer to identify the correct programming algorithm for the Atmel product. For details, see Operating Modes (for hardware operation) or Software Product Identification. The manufacturer and device code is the same for both modes. DATA POLLING: The AT49F020 features DATA polling to indicate the end of a program cycle. During a program cycle an attempted read of the last byte loaded will result in the complement of the loaded data on I/O7. Once the program cycle has been completed, true data is valid on all outputs and the next cycle may begin. DATA polling may begin at any time during the program cycle. Command Definition (in Hex) Command Sequence Bus Cycles 1st Bus Cycle Addr Data 2nd Bus Cycle 3rd Bus Cycle 4th Bus Cycle 6th Bus Cycle Addr Data Addr Data Addr Data Addr Data Addr Data 2AAA 55 5555 10 2AAA 55 5555 40 Read 1 Addr DOUT Chip Erase 6 5555 AA 2AAA 55 5555 80 5555 AA Byte Program 4 5555 AA 2AAA 55 5555 A0 Addr DIN Boot Block Lockout(1) 6 5555 AA 2AAA 55 5555 80 5555 AA Product ID Entry 3 5555 AA 2AAA 55 5555 90 Product ID Exit(2) 3 5555 AA 2AAA 55 5555 F0 Product ID Exit(2) 1 XXXX F0 Notes: 5th Bus Cycle 1. The 8K byte boot sector has the address range 00000H to 01FFFH. 2. Either one of the Product ID exit commands can be used. Absolute Maximum Ratings* Temperature Under Bias ................................ -55°C to +125°C Storage Temperature ..................................... -65°C to +150°C All Input Voltages (including NC Pins) with Respect to Ground ...................................-0.6V to +6.25V All Output Voltages with Respect to Ground .............................-0.6V to VCC + 0.6V *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Voltage on OE with Respect to Ground ...................................-0.6V to +13.5V 3 DC and AC Operating Range Com. Operating Temperature (Case) Ind. VCC Power Supply AT49F020-90 AT49F020-12 AT49F020-15 0°C - 70°C 0°C - 70°C 0°C - 70°C -40°C - 85°C -40°C - 85°C -40°C - 85°C 5V ± 10% 5V ± 10% 5V ± 10% Operating Modes Mode Read Program (2) Standby/Write Inhibit CE OE WE Ai VIL VIL VIH Ai DOUT VIL VIH VIL Ai DIN X High Z (1) VIH X X Program Inhibit X X VIH Program Inhibit X VIL X Output Disable X VIH X VIL VIL VIH I/O High Z Product Identification Hardware Software(5) Notes: A1 - A17 = VIL, A9 = VH,(3) A0 = VIL Manufacturer Code(4) A1 - A17 = VIL, A9 = VH,(3) A0 = VIH Device Code(4) A0 = VIL, A1 - A17=VIL Manufacturer Code(4) A0 = VIH, A1 - A17=VIL Device Code(4) 1. X can be VIL or VIH. 2. Refer to AC Programming Waveforms. 3. VH = 12.0V ± 0.5V. 4. Manufacturer Code: 1FH, Device Code: 0BH. 5. See details under Software Product Identification Entry/Exit. DC Characteristics Symbol Parameter Condition ILI Input Load Current ILO Max Units VIN = 0V to VCC 10 µA Output Leakage Current VI/O = 0V to VCC 10 µA Com. 100 µA ISB1 VCC Standby Current CMOS CE = VCC - 0.3V to VCC Ind. 300 µA ISB2 VCC Standby Current TTL CE = 2.0V to VCC 3 mA ICC(1) VCC Active Current f = 5 MHz; IOUT = 0 mA 50 mA VIL Input Low Voltage 0.8 V VIH Input High Voltage VOL Output Low Voltage IOL = 2.1 mA VOH1 Output High Voltage IOH = -400 µA 2.4 V VOH2 Output High Voltage CMOS IOH = -100 µA; VCC = 4.5V 4.2 V Note: 4 Min 2.0 1. In the erase mode, ICC is 90 mA. AT49F020 V 0.45 V AT49F020 AC Read Characteristics AT49F020-90 Symbol Parameter tACC Min AT49F020-12 Max Min Max AT49F020-15 Min Max Units Address to Output Delay 90 120 150 ns (1) CE to Output Delay 90 120 150 ns (2) OE to Output Delay 0 40 0 50 0 70 ns tDF(3)(4) CE or OE to Output Float 0 25 0 30 0 40 ns tOH Output Hold from OE, CE or Address, whichever occurred first 0 tCE tOE 0 0 ns AC Read Waveforms(1)(2)(3)(4) Notes: 1. CE may be delayed up to tACC - tCE after the address transition without impact on tACC. 2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE or by tACC - tOE after an address change without impact on tACC. 3. tDF is specified from OE or CE whichever occurs first (CL = 5 pF). 4. This parameter is characterized and is not 100% tested. Input Test Waveforms and Measurement Level Output Test Load tR, tF < 5 ns Pin Capacitance f = 1 MHz, T = 25°C(1) Symbol Typ Max Units Conditions CIN 4 6 pF VIN = 0V COUT 8 12 pF VOUT = 0V Note: 1. This parameter is characterized and is not 100% tested. 5 AC Byte Load Characteristics Symbol Parameter Min tAS, tOES Address, OE Set-up Time 0 ns tAH Address Hold Time 50 ns tCS Chip Select Set-up Time 0 ns tCH Chip Select Hold Time 0 ns tWP Write Pulse Width (WE or CE) 90 ns tDS Data Set-up Time 50 ns tDH, tOEH Data, OE Hold Time 0 ns tWPH Write Pulse Width High 90 ns AC Byte Load Waveforms WE Controlled CE Controlled 6 AT49F020 Max Units AT49F020 Program Cycle Characteristics Symbol Parameter Min Typ Max Units tBP Byte Programming Time 10 50 µs tAS Address Set-up Time 0 ns tAH Address Hold Time 50 ns tDS Data Set-up Time 50 ns tDH Data Hold Time 0 ns tWP Write Pulse Width 90 ns tWPH Write Pulse Width High 90 ns tEC Erase Cycle Time 10 seconds Program Cycle Waveforms Chip Erase Cycle Waveforms Note: 1. OE must be high only when WE and CE are both low. 7 Data Polling Characteristics(1) Symbol Parameter Min tDH Data Hold Time 10 ns tOEH OE Hold Time 10 ns Max (2) tOE OE to Output Delay tWR Write Recovery Time Notes: Typ Units ns 0 ns 1. These parameters are characterized and not 100% tested. 2. See tOE spec in AC Read Characteristics. Data Polling Waveforms Toggle Bit Characteristics(1) Symbol Parameter Min tDH Data Hold Time 10 ns tOEH OE Hold Time 10 ns tOE OE to Output Delay(2) tOEHP OE High Pulse tWR Write Recovery Time Notes: Typ Max Units ns 150 ns 0 ns 1. These parameters are characterized and not 100% tested. 2. See tOE spec in AC Read Characteristics. Toggle Bit Waveforms(1)(2)(3) Notes: 8 1. Toggling either OE or CE or both OE and CE will operate toggle bit. The tOEHP specification must be met by the toggling input(s). 2. Beginning and ending state of I/O6 will vary. 3. Any address location may be used but the address should not vary. AT49F020 AT49F020 Software Product Identification Entry(1) LOAD DATA AA TO ADDRESS 5555 Boot Block Lockout Feature Enable Algorithm(1) LOAD DATA AA TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA 90 TO ADDRESS 5555 LOAD DATA 80 TO ADDRESS 5555 ENTER PRODUCT IDENTIFICATION MODE(2)(3)(5) LOAD DATA AA TO ADDRESS 5555 Software Product Identification Exit(1) LOAD DATA AA TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA OR LOAD DATA F0 TO ANY ADDRESS EXIT PRODUCT IDENTIFICATION MODE(4) LOAD DATA F0 TO ADDRESS 5555 EXIT PRODUCT IDENTIFICATION MODE(4) LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA 40 TO ADDRESS 5555 PAUSE 1 second(2) Notes for boot block lockout feature enable: 1. Data Format: I/O7 - I/O0 (Hex); Address Format: A14 - A0 (Hex). 2. Boot block lockout feature enabled. Notes for software product identification: 1. Data Format: I/O7 - I/O0 (Hex); Address Format: A14 - A0 (Hex). 2. A1 - A17 = VIL. Manufacturer Code is read for A0 = VIL; Device Code is read for A0 = VIH. 3. The device does not remain in identification mode if powered down. 4. The device returns to standard operation mode. 5. Manufacturer Code is 1FH. The Device Code is 0BH. 9 Ordering Information(1) ICC (mA) tACC (ns) Active Standby Ordering Code Package 90 50 0.1 AT49F020-90JC AT49F020-90PC AT49F020-90TC 32J 32P6 32T Commercial (0° to 70°C) 50 0.3 AT49F020-90JI AT49F020-90PI AT49F020-90TI 32J 32P6 32T Industrial (-40° to 85°C) 50 0.1 AT49F020-12JC AT49F020-12PC AT49F020-12TC 32J 32P6 32T Commercial (0° to 70°C) 50 0.3 AT49F020-12JI AT49F020-12PI AT49F020-12TI 32J 32P6 32T Industrial (-40° to 85°C) 50 0.1 AT49F020-15JC AT49F020-15PC AT49F020-15TC 32J 32P6 32T Commercial (0° to 70°C) 50 0.3 AT49F020-15JI AT49F020-15PI AT49F020-15TI 32J 32P6 32T Industrial (-40° to 85°C) 120 150 Note: 1. The AT49F020 has an optional boot block feature. The part number shown in the Ordering Information table is for devices with the boot block in the lower address range (i.e., 00000H to 01FFFH). Users requiring the boot block to be in the higher address range should contact Atmel. Package Type 32J 32-Lead, Plastic, J-Leaded Chip Carrier Package (PLCC) 32P6 32-Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP) 32T 32-Lead, Thin Small Outline Package (TSOP) 10 Operation Range AT49F020 AT49F020 Packaging Information 32J, 32-Lead, Plastic J-Leaded Chip Carrier (PLCC) Dimensions in Inches and (Millimeters) JEDEC OUTLINE MS-016 AE .045(1.14) X 45˚ PIN NO. 1 IDENTIFY .050(1.27) TYP 1.67(42.4) 1.64(41.7) .025(.635) X 30˚ - 45˚ .012(.305) .008(.203) .553(14.0) .547(13.9) .595(15.1) .585(14.9) .032(.813) .026(.660) 32P6, 32-Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP) Dimensions in Inches and (Millimeters) .300(7.62) REF .430(10.9) .390(9.90) AT CONTACT POINTS PIN 1 .566(14.4) .530(13.5) .530(13.5) .490(12.4) .021(.533) .013(.330) .030(.762) .015(.381) .095(2.41) .060(1.52) .140(3.56) .120(3.05) .022(.559) X 45˚ MAX (3X) .453(11.5) .447(11.4) .495(12.6) .485(12.3) .090(2.29) MAX 1.500(38.10) REF .220(5.59) MAX .005(.127) MIN SEATING PLANE .065(1.65) .015(.381) .022(.559) .014(.356) .161(4.09) .125(3.18) .110(2.79) .090(2.29) .012(.305) .008(.203) .065(1.65) .041(1.04) .630(16.0) .590(15.0) 0 REF 15 .690(17.5) .610(15.5) 32T, 32-Lead, Plastic Thin Small Outline Package (TSOP) Dimensions in Millimeters and (Inches)* JEDEC OUTLINE MO-142 BD INDEX MARK 18.5(.728) 18.3(.720) 0.50(.020) BSC 7.50(.295) REF 20.2(.795) 19.8(.780) 0.25(.010) 0.15(.006) 8.20(.323) 7.80(.307) 1.20(.047) MAX 0.15(.006) 0.05(.002) 0 5 REF 0.20(.008) 0.10(.004) 0.70(.028) 0.50(.020) *Controlling dimension: millimeters 11 Atmel Headquarters Atmel Operations Corporate Headquarters Atmel Colorado Springs 2325 Orchard Parkway San Jose, CA 95131 TEL (408) 441-0311 FAX (408) 487-2600 Europe 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TEL (719) 576-3300 FAX (719) 540-1759 Atmel Rousset Atmel U.K., Ltd. Coliseum Business Centre Riverside Way Camberley, Surrey GU15 3YL England TEL (44) 1276-686677 FAX (44) 1276-686697 Zone Industrielle 13106 Rousset Cedex, France TEL (33) 4 42 53 60 00 FAX (33) 4 42 53 60 01 Asia Atmel Asia, Ltd. Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon, Hong Kong TEL (852) 27219778 FAX (852) 27221369 Japan Atmel Japan K.K. Tonetsu Shinkawa Bldg., 9F 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan TEL (81) 3-3523-3551 FAX (81) 3-3523-7581 Fax-on-Demand North America: 1-(800) 292-8635 International: 1-(408) 441-0732 e-mail [email protected] Web Site http://www.atmel.com BBS 1-(408) 436-4309 © Atmel Corporation 1998. Atmel Cor poration makes no warranty for the use of its products, other than those expressly contained in the Company’s standard warranty which is detailed in Atmel’s Terms and Conditions located on the Company’s website. The Company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual proper ty of Atmel are granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use as critical components in life suppor t devices or systems. Marks bearing ® and/or ™ are registered trademarks and trademarks of Atmel Corporation. Terms and product names in this document may be trademarks of others. Printed on recycled paper. 0567C–10/98/xM