CY7C1327B 256K x 18 Synchronous-Pipelined Cache RAM Features The CY7C1327B I/O pins can operate at either the 2.5V or the 3.3V level. The I/O pins are 3.3V tolerant when VDDQ=2.5V. • Supports 100-MHz bus for Pentium and PowerPC™ operations with zero wait states • Fully registered inputs and outputs for pipelined operation • 256K by 18 common I/O architecture • 3.3V core power supply • 2.5V / 3.3V I/O operation • Fast clock-to-output times — 3.5 ns (for 166-MHz device) All synchronous inputs pass through input registers controlled by the rising edge of the clock. All data outputs pass through output registers controlled by the rising edge of the clock. Maximum access delay from the clock rise is 3.5 ns (166-MHz device). The CY7C1327B supports either the interleaved burst sequence used by the Intel Pentium processor or a linear burst sequence used by processors such as the PowerPC. The burst sequence is selected through the MODE pin. Accesses can be initiated by asserting either the Processor Address Strobe (ADSP) or the Controller Address Strobe (ADSC) at clock rise. Address advancement through the burst sequence is controlled by the ADV input. A 2-bit on-chip wraparound burst counter captures the first address in a burst sequence and automatically increments the address for the rest of the burst access. — 4.0 ns (for 133-MHz device) • • • • • • — 5.5 ns (for 100-MHz device) User-selectable burst counter supporting Intel Pentium interleaved or linear burst sequences Separate processor and controller address strobes Synchronous self-timed writes Asynchronous Output Enable JEDEC-standard 100 TQFP pinout “ZZ” Sleep Mode option and Stop Clock option Byte write operations are qualified with the four Byte Write Select (BW[1:0]) inputs. A Global Write Enable (GW) overrides all byte write inputs and writes data to all four bytes. All writes are conducted with on-chip synchronous self-timed write circuitry. Functional Description Three synchronous Chip Selects (CE1, CE2, CE3) and an asynchronous Output Enable (OE) provide for easy bank selection and output three-state control. In order to provide proper data during depth expansion, OE is masked during the first clock of a read cycle when emerging from a deselected state. The CY7C1327B is a 3.3V, 256K by 18 synchronous-pipelined cache SRAM designed to support zero wait state secondary cache with minimal glue logic. Logic Block Diagram MODE (A[1;0]) 2 BURST Q0 CE COUNTER Q1 CLR CLK ADV ADSC ADSP A[17:0] GW Q 18 16 ADDRESS CE REGISTER D 18 16 256KX18 MEMORY ARRAY D DQ[15:8], DP[1] Q BYTEWRITE REGISTERS D DQ[7:0], DP[0] Q BYTEWRITE REGISTERS BWE BW 1 BW0 18 CE1 CE2 CE3 D ENABLE CE CE REGISTER 18 Q D ENABLE DELAY Q REGISTER OUTPUT REGISTERS CLK INPUT REGISTERS CLK OE ZZ SLEEP CONTROL DQ[15:0] DP[1:0] Intel and Pentium are registered trademarks of Intel Corporation. PowerPC is a trademark of IBM Corporation. Cypress Semiconductor Corporation • 3901 North First Street • San Jose • CA 95134 • 408-943-2600 September 7, 2000 CY7C1327B Selection Guide 7C1327-166 Maximum Access Time (ns) 7C1327-133 7C1327-100 3.5 4.0 5.5 Maximum Operating Current (mA) Commercial 420 375 325 Maximum CMOS Standby Current (mA) Commercial 10 10 10 Pin Configurations A8 A9 81 82 ADSP ADV 83 84 BWE GW CLK VSS OE ADSC 85 86 87 88 89 CE3 BWS0 VDD 90 91 92 NC NC CE2 CE1 A7 BWS1 93 94 95 96 97 98 1 80 NC 2 79 NC 3 4 78 77 NC VSS NC NC 5 76 6 7 75 74 VSS NC DQ8 8 73 DP0 DQ7 DQ9 VSS 9 72 DQ6 VDDQ 10 11 71 70 VSS VDDQ DQ10 12 69 DQ5 DQ11 NC 13 14 68 67 VDD NC 15 66 DQ4 VSS NC VSS 16 17 65 64 VDD ZZ DQ12 18 63 DQ3 DQ13 VDDQ 19 20 62 61 DQ2 VSS 21 60 VDDQ VSS DQ14 22 59 DQ1 DQ15 DP1 NC 23 24 58 57 DQ0 NC 25 56 NC VSS 26 27 55 54 VSS 28 53 29 30 52 51 34 35 36 37 38 39 40 41 42 45 46 47 48 49 50 A3 A2 A1 A0 DNU DNU VSS VDD DNU DNU A11 A12 A13 A14 A15 A16 A17 44 33 A4 2 43 32 NC NC CY7C1327B MODE A5 VDDQ NC 31 NC VDDQ BYTE1 99 100 A6 100-Lead TQFP A10 NC VDDQ VDDQ NC NC NC BYTE0 CY7C1327B Pin Configurations (continued) 119-Ball BGA 1 2 3 4 5 6 7 A VDDQ A A ADSP A A VDDQ B C NC NC CE2 A A A ADSC VDD A A CE3 A NC NC D DQb NC VSS NC VSS DQPa NC E F NC DQ b VSS CE1 VSS NC DQa VDDQ NC VSS OE VSS DQa VDDQ NC DQ b BWb ADV Vss NC DQa J DQb VDDQ NC VDD VSS NC GW VDD VSS NC DQa VDD NC VDDQ K NC DQ b VSS CLK VSS NC DQa G H L DQb NC Vss NC BWa DQa NC M N VDDQ DQb DQ b NC VSS VSS BWE A1 VSS VSS NC DQa VDDQ NC P NC DQPb VSS A0 VSS NC DQa R NC A MODE VDD VSS A NC T NC A A NC A A ZZ U VDDQ NC NC NC NC NC VDDQ Pin Definitions Name A[17:0] BW[1:0] GW BWE CLK CE1 CE2 CE3 OE ADV ADSP I/O InputSynchronous Description Address Inputs used to select one of the 64K address locations. Sampled at the rising edge of the CLK if ADSP or ADSC is active LOW, and CE1, CE2, and CE3 are sampled active. A[1:0] feed the 2-bit counter. InputByte Write Select Inputs, active LOW. Qualified with BWE to conduct byte writes to the SRAM. Synchronous Sampled on the rising edge of CLK. InputGlobal Write Enable Input, active LOW. When asserted LOW on the rising edge of CLK, a global Synchronous write is conducted (ALL bytes are written, regardless of the values on BW[1:0] and BWE). InputByte Write Enable Input, active LOW. Sampled on the rising edge of CLK. This signal must be Synchronous asserted LOW to conduct a byte write. Input-Clock Clock Input. Used to capture all synchronous inputs to the device. Also used to increment the burst counter when ADV is asserted LOW, during a burst operation. InputChip Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE2 Synchronous and CE3 to select/deselect the device. ADSP is ignored if CE1 is HIGH. InputChip Enable 2 Input, active HIGH. Sampled on the rising edge of CLK. Used in conjunction with CE1 Synchronous and CE3 to select/deselect the device. InputChip Enable 3 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE1 Synchronous and CE2 to select/deselect the device. InputOutput Enable, asynchronous input, active LOW. Controls the direction of the I/O pins. When LOW, Asynchronous the I/O pins behave as outputs. When deasserted HIGH, I/O pins are three-stated, and act as input data pins. OE is masked during the first clock of a read cycle when emerging from a deselected state. InputAdvance Input Signal, sampled on the rising edge of CLK. When asserted, it automatically increSynchronous ments the address in a burst cycle. InputAddress Strobe from Processor, sampled on the rising edge of CLK. When asserted LOW, A [17:0] Synchronous is captured in the address registers. A[1:0] are also loaded into the burst counter. When ADSP and ADSC are both asserted, only ADSP is recognized. ASDP is ignored when CE1 is deasserted HIGH. 3 CY7C1327B Pin Definitions (continued) Name ADSC ZZ DQ[15:0] DP[1:0] VDD VSS VDDQ VSSQ MODE NC I/O InputSynchronous Description Address Strobe from Controller, sampled on the rising edge of CLK. When asserted LOW, A [17:0] is captured in the address registers. A[1:0] are also loaded into the burst counter. When ADSP and ADSC are both asserted, only ADSP is recognized. InputZZ “sleep” Input. This active HIGH input places the device in a non-time critical “sleep” condition Asynchronous with data integrity preserved. Leaving ZZ floating or NC will default the device into an active state. ZZ pin has an internal pull-down. I/OBidirectional Data I/O lines. As inputs, they feed into an on-chip data register that is triggered by the Synchronous rising edge of CLK. As outputs, they deliver the data contained in the memory location specified by A[17:0] during the previous clock rise of the read cycle. The direction of the pins is controlled by OE. When OE is asserted LOW, the pins behave as outputs. When HIGH, DQ [15:0] and DP[1:0] are placed in a three-state condition. Power Supply Power Supply inputs to the core of the device. Should be connected to 3.3V power supply. Ground Ground for the core of the device. Should be connected to ground of the system. I/O Power Power Supply for the I/O circuitry. Should be connected to a 3.3V or 2.5V power supply. Supply I/O Ground Ground for the I/O circuitry. Should be connected to ground of the system. InputSelects Burst Order. When tied to GND selects linear burst sequence. When tied to VDDQ or left Static floating selects interleaved burst sequence. This is a strap pin and should remain static during device operation. When left floating or NC, defaults to interleaved burst order. Mode pin has an internal pull-up. No Connects. is HIGH. The address presented to the address inputs (A [17:0]) is stored into the address advancement logic and the Address Register while being presented to the memory core. The corresponding data is allowed to propagate to the input of the Output Registers. At the rising edge of the next clock the data is allowed to propagate through the output register and onto the data bus within 3.5 ns (166-MHz device) if OE is active LOW. The only exception occurs when the SRAM is emerging from a deselected state to a selected state, its outputs are always three-stated during the first cycle of the access. After the first cycle of the access, the outputs are controlled by the OE signal. Consecutive single read cycles are supported. Once the SRAM is deselected at clock rise by the chip select and either ADSP or ADSC signals, its output will three-state immediately. Introduction Functional Overview All synchronous inputs pass through input registers controlled by the rising edge of the clock. All data outputs pass through output registers controlled by the rising edge of the clock. Maximum access delay from the clock rise (tCO) is 3.5 ns (166-MHz device). The CY7C1327B supports secondary cache in systems utilizing either a linear or interleaved burst sequence. The interleaved burst order supports Pentium and i486 processors. The linear burst sequence is suited for processors that utilize a linear burst sequence. The burst order is user selectable, and is determined by sampling the MODE input. Accesses can be initiated with either the Processor Address Strobe (ADSP) or the Controller Address Strobe (ADSC). Address advancement through the burst sequence is controlled by the ADV input. A two-bit on-chip wraparound burst counter captures the first address in a burst sequence and automatically increments the address for the rest of the burst access. Single Write Accesses Initiated by ADSP This access is initiated when both of the following conditions are satisfied at clock rise: (1) ADSP is asserted LOW, and (2) CE 1, CE2, CE3 are all asserted active. The address presented to A[17:0] is loaded into the address register and the address advancement logic while being delivered to the RAM core. The write signals (GW, BWE, and BW[1:0]) and ADV inputs are ignored during this first cycle. Byte write operations are qualified with the Byte Write Enable (BWE) and Byte Write Select (BW[1:0]) inputs. A Global Write Enable (GW) overrides all byte write inputs and writes data to all four bytes. All writes are simplified with on-chip synchronous self-timed write circuitry. ADSP-triggered write accesses require two clock cycles to complete. If GW is asserted LOW on the second clock rise, the data presented to the DQ[15:0] and DP[1:0] inputs is written into the corresponding address location in the RAM core. If GW is HIGH, then the write operation is controlled by BWE and BW[1:0] signals. The CY7C1327B provides byte write capability that is described in the Write Cycle Description table. Asserting the Byte Write Enable input (BWE) with the selected Byte Write (BW[1:0]) input will selectively write to only the desired bytes. Bytes not selected during a byte write operation will remain unaltered. A synchronous self-timed write mechanism has been provided to simplify the write operations. Three synchronous Chip Selects (CE1, CE2, CE3) and an asynchronous Output Enable (OE) provide for easy bank selection and output three-state control. ADSP is ignored if CE1 is HIGH. Single Read Accesses This access is initiated when the following conditions are satisfied at clock rise: (1) ADSP or ADSC is asserted LOW, (2) CE1, CE2, CE3 are all asserted active, and (3) the write signals (GW, BWE) are all deasserted HIGH. ADSP is ignored if CE1 4 CY7C1327B ear burst sequence. The burst sequence is user selectable through the MODE input. Because the CY7C1327B is a common I/O device, the Output Enable (OE) must be deasserted HIGH before presenting data to the DQ[15:0] and DP[1:0] inputs. Doing so will three-state the output drivers. As a safety precaution, DQ[15:0] and DP[1:0] are automatically three-stated whenever a write cycle is detected, regardless of the state of OE. Asserting ADV LOW at clock rise will automatically increment the burst counter to the next address in the burst sequence. Both read and write burst operations are supported. Interleaved Burst Sequence Single Write Accesses Initiated by ADSC First Address ADSC write accesses are initiated when the following conditions are satisfied: (1) ADSC is asserted LOW, (2) ADSP is deasserted HIGH, (3) CE1, CE2, CE3 are all asserted active, and (4) the appropriate combination of the write inputs (GW, BWE, and BW[1:0]) are asserted active to conduct a write to the desired byte(s). ADSC-triggered write accesses require a single clock cycle to complete. The address presented to A[17:0] is loaded into the address register and the address advancement logic while being delivered to the RAM core. The ADV input is ignored during this cycle. If a global write is conducted, the data presented to the DQ [15:0] and DP[1:0] is written into the corresponding address location in the RAM core. If a byte write is conducted, only the selected bytes are written. Bytes not selected during a byte write operation will remain unaltered. A synchronous self-timed write mechanism has been provided to simplify the write operations. A[1:0] 00 01 10 11 Second Address Third Address A[1:0] 01 00 11 10 A[1:0] 10 11 00 01 Fourth Address A[1:0] 11 10 01 00 Linear Burst Sequence First Address Because the CY7C1327B is a common I/O device, the Output Enable (OE) must be deasserted HIGH before presenting data to the DQ[15:0] and DP[1:0] inputs. Doing so will three-state the output drivers. As a safety precaution, DQ[15:0] and DP[1:0] are automatically three-stated whenever a write cycle is detected, regardless of the state of OE. Second Address Third Address Fourth Address A[1:0] A[1:0] A[1:0] A[1:0] 00 01 10 11 01 10 11 00 10 11 00 01 11 00 01 10 Sleep Mode The ZZ input pin is an asynchronous input. Asserting ZZ places the SRAM in a power conservation “sleep” mode. Two clock cycles are required to enter into or exit from this “sleep” mode. While in this mode, data integrity is guaranteed. Accesses pending when entering the “sleep” mode are not considered valid nor is the completion of the operation guaranteed. The device must be deselected prior to entering the “sleep” mode. CE 1, CE2, CE3, ADSP, and ADSC must remain inactive for the duration of tZZREC after the ZZ input returns LOW. Burst Sequences The CY7C1327B provides a two-bit wraparound counter, fed by A[1:0], that implements either an interleaved or linear burst sequence. The interleaved burst sequence is designed specifically to support Intel Pentium applications. The linear burst sequence is designed to support processors that follow a lin- ZZ Mode Electrical Characteristics Parameter IDDZZ tZZS tZZREC Description Test Conditions Max. Unit Snooze mode standby current ZZ > VDD − 0.2V Min. 3 mA Device operation to ZZ ZZ > VDD − 0.2V 2tCYC ns ZZ recovery time ZZ < 0.2V 2tCYC 5 ns CY7C1327B Cycle Descriptions[1, 2, 3] Next Cycle Add. Used ZZ CE3 CE2 CE1 ADSP ADSC ADV OE DQ Write Unselected None L X X 1 X 0 X X Hi-Z X Unselected None L 1 X 0 0 X X X Hi-Z X Unselected None L X 0 0 0 X X X Hi-Z X Unselected None L 1 X 0 1 0 X X Hi-Z X Unselected None L X 0 0 1 0 X X Hi-Z X Begin Read External L 0 1 0 0 X X X Hi-Z X Begin Read External L 0 1 0 1 0 X X Hi-Z Read Continue Read Next L X X X 1 1 0 1 Hi-Z Read Continue Read Next L X X X 1 1 0 0 DQ Read Continue Read Next L X X 1 X 1 0 1 Hi-Z Read Continue Read Next L X X 1 X 1 0 0 DQ Read Suspend Read Current L X X X 1 1 1 1 Hi-Z Read Suspend Read Current L X X X 1 1 1 0 DQ Read Suspend Read Current L X X 1 X 1 1 1 Hi-Z Read Suspend Read Current L X X 1 X 1 1 0 DQ Read Begin Write Current L X X X 1 1 1 X Hi-Z Write Begin Write Current L X X 1 X 1 1 X Hi-Z Write Begin Write External L 0 1 0 1 0 X X Hi-Z Write Continue Write Next L X X X 1 1 0 X Hi-Z Write Continue Write Next L X X 1 X 1 0 X Hi-Z Write Suspend Write Current L X X X 1 1 1 X Hi-Z Write Suspend Write Current L X X 1 X 1 1 X Hi-Z Write ZZ “Sleep” None H X X X X X X X Hi-Z X Notes: 1. X = “Don't Care,” 1 = HIGH, 0 = LOW. 2. Write is defined by BWE, BW[1:0], and GW. See Write Cycle Description table. 3. The DQ pins are controlled by the current cycle and the OE signal. OE is asynchronous and is not sampled with the clock. 6 CY7C1327B Write Cycle Description[4, 5, 6] Function GW BWE BW3 BW2 BW1 BW0 Read 1 1 X X X X Read 1 0 1 1 1 1 Write Byte 0 - DQ[7:0] 1 0 1 1 1 0 Write Byte 1 - DQ[15:8] Write Bytes 1, 0 1 0 1 1 0 1 1 0 1 1 0 0 Write Byte 2 - DQ[23:16] 1 0 1 0 1 1 Write Bytes 2, 0 1 0 1 0 1 0 Write Bytes 2, 1 1 0 1 0 0 1 Write Bytes 2, 1, 0 1 0 1 0 0 0 Write Byte 3 - DQ[31:24] 1 0 0 1 1 1 Write Bytes 3, 0 1 0 0 1 1 0 Write Bytes 3, 1 1 0 0 1 0 1 Write Bytes 3, 1, 0 1 0 0 1 0 0 Write Bytes 3, 2 1 0 0 0 1 1 Write Bytes 3, 2, 0 1 0 0 0 1 0 Write Bytes 3, 2, 1 1 0 0 0 0 1 Write All Bytes 1 0 0 0 0 0 Write All Bytes 0 X X X X X Maximum Ratings Current into Outputs (LOW)......................................... 20 mA Static Discharge Voltage .......................................... >2001V (per MIL-STD-883, Method 3015) (Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature ..................................... −65°C to +150°C Latch-Up Current .................................................... >200 mA Ambient Temperature with Power Applied .................................................. −55°C to +125°C Operating Range Supply Voltage on VDD Relative to GND .........−0.5V to +4.6V DC Voltage Applied to Outputs in High Z State[7] ....................................... −0.5V to VDD + 0.5V Range Com’l DC Input Voltage[7] .................................... −0.5V to VDD + 0.5V Industrial Ambient Temperature[8] 0°C to +70°C –40°C to +85°C VDD VDDQ 3.3V −5%/+10% 2.5V −5% 3.3V +10% Notes: 4. X = “Don't Care,” 1 = Logic HIGH, 0 = Logic LOW. 5. The SRAM always initiates a read cycle when ADSP asserted, regardless of the state of GW, BWE, or BW[1:0]. Writes may occur only on subsequent clocks after the ADSP or with the assertion of ADSC. As a result, OE must be driven HIGH prior to the start of the write cycle to allow the outputs to three-state. OE is a don't care for the remainder of the write cycle. 6. OE is asynchronous and is not sampled with the clock rise. It is masked internally during write cycles. During a read cycle DQ[15:0];DP[1:0] = High-Z when OE is inactive or when the device is deselected, and DQ[15:0];DP[1:0] = data when OE is active. 7. Minimum voltage equals −2.0V for pulse durations of less than 20 ns. 8. TA is the case temperature. 7 CY7C1327B Electrical Characteristics Over the Operating Range Parameter Description Test Conditions Min. Max. Unit VDD Power Supply Voltage 3.3V −5%/+10% 3.135 3.6 V VDDQ I/O Supply Voltage 2.5V −5% to 3.3V +10% 2.375 3.6 V VOH Output HIGH Voltage VDDQ = 3.3V, VDD = Min., IOH = –4.0 mA 2.4 V VDDQ = 2.5V, VDD = Min., IOH = –2.0 mA 2.0 V VOL Output LOW Voltage VDDQ = 3.3V, VDD = Min., IOL = 8.0 mA 0.4 V VDDQ = 2.5V, VDD = Min., IOL = 2.0 mA 0.7 V VIH Input HIGH Voltage VDDQ = 3.3V 2.0 VDD + 0.3V V VIH Input HIGH Voltage VDDQ = 2.5V 1.7 VDD + 0.3V V VIL Input LOW Voltage [7] VDDQ = 3.3V –0.3 0.8 V VIL Input LOW Voltage[7] VDDQ = 2.5V –0.3 0.7 V IX Input Load Current except ZZ and MODE GND ≤ V I ≤ VDDQ −5 5 µA Input Current of MODE Input = VSS Input = VDDQ −30 Input Current of ZZ −5 Input = VSS Input = VDDQ Output Leakage Current GND ≤ V I ≤ VDDQ, Output Disabled IDD VDD Operating Supply Current VDD = Max., IOUT = 0 mA, f = fMAX = 1/tCYC Automatic CS Power-Down Current—TTL Inputs Max. V DD, Device Deselected, VIN ≥ VIH or VIN ≤ V IL f = fMAX = 1/tCYC ISB2 Automatic CS Max. V DD, Device Deselected, VIN Power-Down ≤ 0.3V or VIN > VDDQ – 0.3V, f = 0 Current—CMOS Inputs ISB3 Automatic CS Max. VDD, Device Deselected, or Power-Down VIN ≤ 0.3V or VIN > VDDQ – 0.3V Current—CMOS Inputs f = fMAX = 1/tCYC ISB4 Automatic CS Power-Down Current—TTL Inputs µA 5 IOZ ISB1 µA −5 µA 30 µA 5 µA 6-ns cycle, 166 MHz 420 mA 7.5-ns cycle, 133 MHz 375 mA 10-ns cycle, 100 MHz 325 mA 6-ns cycle, 166 MHz 150 mA 7.5-ns cycle, 133 MHz 125 mA 10-ns cycle, 100 MHz 115 mA 10 mA 6-ns cycle, 166 MHz 120 mA 7.5-ns cycle, 133 MHz 95 mA 10-ns cycle, 100 MHz 85 mA 18 mA Max. V DD, Device Deselected, VIN ≥ VIH or VIN ≤ V IL, f = 0 Capacitance[9] Parameter Description CIN Input Capacitance CCLK Clock Input Capacitance CI/O Input/Output Capacitance Test Conditions TA = 25°C, f = 1 MHz, VDD = 3.3V, VDDQ = 3.3V Note: 9. Tested initially and after any design or process changes that may affect these parameters. 8 Max. Unit 4 pF 4 pF 4 pF CY7C1327B AC Test Loads and Waveforms R=317Ω 3.3V OUTPUT ALL INPUT PULSES OUTPUT Z0 =50Ω 2.5V 5 pF R=351Ω VL = 1.5V INCLUDING JIG AND SCOPE (a) 90% 10% 90% 10% RL =50Ω [10] GND ≤ 2.5 ns ≤ 2.5 ns (c) (b) Switching Characteristics Over the Operating Range[11, 12, 13] -166 Parameter Description Min. -133 Max. Min. -100 Max. Min. Max. Unit tCYC Clock Cycle Time 6.0 7.5 10 ns tCH Clock HIGH 1.7 1.9 3.5 ns tCL Clock LOW 1.7 1.9 3.5 ns tAS Address Set-Up Before CLK Rise 2.0 2.5 2.5 ns tAH Address Hold After CLK Rise 0.5 0.5 0.5 ns tCO Data Output Valid After CLK Rise tDOH Data Output Hold After CLK Rise 1.5 2.0 2.0 ns tADS ADSP, ADSC Set-Up Before CLK Rise 2.0 2.5 2.5 ns tADH ADSP, ADSC Hold After CLK Rise 0.5 0.5 0.5 ns tWES BWE, GW, BW[1:0] Set-Up Before CLK Rise 2.0 2.5 2.5 ns tWEH BWE, GW, BW[1:0] Hold After CLK Rise 0.5 0.5 0.5 ns tADVS ADV Set-Up Before CLK Rise 2.0 2.5 2.5 ns tADVH ADV Hold After CLK Rise 0.5 0.5 0.5 ns tDS Data Input Set-Up Before CLK Rise 2.0 2.5 2.5 ns tDH Data Input Hold After CLK Rise 0.5 0.5 0.5 ns tCES Chip Select Set-Up 2.0 2.5 2.5 ns tCEH Chip Select Hold After CLK Rise 0.5 0.5 0.5 ns [12] tCHZ Clock to High-Z tCLZ Clock to Low-Z[12] tEOHZ tEOLZ tEOV 3.5 3.5 0 OE HIGH to Output High-Z OE LOW to Output Low-Z OE LOW to Output Valid 4.0 [12, 13] 3.5 0 [12, 13] 3.5 0 3.5 3.5 0 3.5 0 [12] 5.5 ns ns 5.5 0 4.0 ns ns ns 5.5 ns Notes: 10. Input waveform should have a slew rate of 1 V/ns. 11. Unless otherwise noted, test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified IOL /IOH and load capacitance. Shown in (a) and (b) of AC Test Loads. 12. t CHZ, t CLZ, tEOV, t EOLZ , and tEOHZ are specified with a load capacitance of 5 pF as in part (b) of AC Test Loads. Transition is measured ± 200 mV from steady-state voltage. 13. At any given voltage and temperature, t EOHZ is less than tEOLZ and tCHZ is less than tCLZ. 9 CY7C1327B Switching Waveforms Write Cycle Timing[14, 15] Single Write Burst Write Pipelined Write tCH Unselected tCYC CLK tADH tADS tCL ADSP ignored with CE1 inactive ADSP tADH tADS ADSC initiated write ADSC tADVH tADVS ADV tAS ADD ADV Must Be Inactive for ADSP Write WD1 WD3 WD2 tAH GW tWS tWH WE tCES tWH tWS tCEH CE1 masks ADSP CE1 tCES tCEH Unselected with CE2 CE2 CE3 tCES tCEH OE tDH tDS Data In High-Z 1a 1a 2a 2b 2c = UNDEFINED 2d 3a = DON’T CARE Notes: 14. WE is the combination of BWE, BW[1:0], and GW to define a write cycle (see Write Cycle Description table). 15. WDx stands for Write Data to Address X. 10 High-Z CY7C1327B Switching Waveforms (continued) Read Cycle Timing[14, 16] Single Read tCYC Burst Read Unselected tCH Pipelined Read CLK tADH tADS tCL ADSP ignored with CE1 inactive ADSP tADS ADSC initiated read ADSC tADVS tADH Suspend Burst ADV tADVH tAS ADD RD1 RD3 RD2 tAH GW tWS tWS tWH WE tCES tCEH tWH CE1 masks ADSP CE1 Unselected with CE2 CE2 tCES tCEH CE3 tCES OE tCEH tEOV tOEHZ tDOH Data Out tCO 1a 1a 2a 2b 2c 2c 2d 3a tCLZ tCHZ = DON’T CARE = UNDEFINED Note: 16. RDx stands for Read Data from Address X. 11 CY7C1327B Switching Waveforms (continued) Read/Write Cycle Timing[14, 15, 16, 17] Single Read tCYC Single Write Unselected Burst Read tCH Pipelined Read CLK tADH tADS tCL ADSP ignored with CE1 inactive ADSP tADS ADSC tADVS tADH ADV tAS ADD tADVH RD1 WD2 RD3 tAH GW tWS tWS tWH WE tCES tCEH tWH CE1 masks ADSP CE1 CE2 tCES tCEH CE3 tCES tCEH tEOV OE tEOHZ See Note 17 Data In/Out tEOLZ tCO 1a 1a Out tDS tDH 2a In 2a Out = DON’T CARE = UNDEFINED Note: 17. Data bus is driven by SRAM, but data is not guaranteed. 12 3a Out tDOH 3b Out 3c Out 3d Out tCHZ CY7C1327B Switching Waveforms (continued) Pipeline Timing[18, 19] tCH tCYC tCL CLK tAS ADD RD1 tADS RD2 RD3 WD1 RD4 WD2 WD3 WD4 tADH ADSC initiated Reads ADSC ADSP initiated Reads ADSP ADV tCEH tCES CE1 CE tWES tWEH WE ADSP ignored with CE1 HIGH OE tCLZ Data In/Out 1a Out 2a Out 3a Out 1a In 4a Out 2a In 3a In tCO tDOH Back to Back Reads tCHZ = UNDEFINED = DON’T CARE Notes: 18. Device originally deselected. 19. CE is the combination of CE2 and CE3. All chip selects need to be active in order to select the device. 13 4a D(C) In CY7C1327B Switching Waveforms (continued) ZZ Mode Timing[20, 21] CLK ADSP HIGH ADSC CE1 CE2 LOW HIGH CE3 ZZ IDD tZZS IDD(active) IDDZZ tZZREC I/Os Three-state Notes: 20. Device must be deselected when entering “ZZ” mode. See Cycle Description table for all possible signal conditions to deselect the device. 21. I/Os are in three-state when exiting “ZZ” sleep mode. 14 CY7C1327B Ordering Information Speed (MHz) 166 Ordering Code CY7C1327B-166AC CY7C1327B-166BGC 133 CY7C1327B-133AC CY7C1327B-133BGC CY7C1327B-133AI 100 Package Name A101 BG119 A101 BG119 A101 CY7C1327B-133BGI BG119 CY7C1327B-100AC A101 CY7C1327B-100BGC CY7C1327B-100AI CY7C1327B-100BGI BG119 A101 BG119 Package Type 100-Lead Thin Quad Flat Pack Operating Range Commercial 119-Ball BGA 100-Lead Thin Quad Flat Pack Commercial 119-Ball BGA 100-Lead Thin Quad Flat Pack Industrial 119-Ball BGA 100-Lead Thin Quad Flat Pack Commercial 119-Ball BGA 100-Lead Thin Quad Flat Pack Industrial 119-Ball BGA Document #: 38-00935-*B Package Diagrams 100-Pin Thin Plastic Quad Flatpack (14 x 20 x 1.4 mm) A101 51-85050-A 15 CY7C1327B Package Diagrams (continued) 119-Lead FBGA (14 x 22 x 2.4 mm) BG119 51-85115 © Cypress Semiconductor Corporation, 2000. The information contained herein is subject to change without notice. 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