Surface Mount Microwave Schottky Mixer Diodes Technical Data Features HSMS-8101 Single HSMS-8202 Series Pair HSMS-8207 Ring Quad HSMS-8209 Crossover Quad Plastic SOT-23 Package • Optimized for use at 10-14 GHz • Low Capacitance Package Lead Code Identification (Top View) SINGLE 3 • Low Conversion Loss SERIES 3 • Low RD • Low Cost Surface Mount Plastic Package 1 Plastic SOT-143 Package Description/Applications These low cost microwave Schottky diodes are specifically designed for use at X/Ku-bands and are ideal for DBS and VSAT downconverter applications. They are available in SOT-23 and SOT-143 standard package configurations. #1 2 RING QUAD 3 4 1 #7 2 1 #2 2 CROSS-OVER QUAD 3 4 1 #9 2 Note that Agilent's manufacturing techniques assure that dice found in pairs and quads are taken from adjacent sites on the wafer, assuring the highest degree of match. Absolute Maximum Ratings [1], TA = +25°C Symbol Parameter PT PIV TJ TSTG, Top Total Device Dissipation[2] Peak Inverse Voltage Junction Temperature Storage and Operating Temperature Unit Min. Max. mW V °C °C — — — -65 75 4 +150 +150 ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge. Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. Measured in an infinite heat sink at TCASE = 25°C. Derate linearly to zero at 150°C per diode. 2 DC Electrical Specifications, TA = 25°C Symbol Parameters and Test Conditions HSMS-8101 Units Min. Max. HSMS-8209 Min. Max. Breakdown Voltage IR = 10 µA V CT Total Capacitance VR = 0 V, f = 1 MHz pF 0.26 0.26 0.26 0.26 ∆C T Capacitance Difference VR = 0 V, f = 1 MHz pF — 0.04 0.04 0.04 Dynamic Resistance IF = 5 mA Ω 14 14 14 14 Dynamic Resistance Difference IF = 5 mA Ω — 2 2 2 ∆RD VF ∆VF Forward Voltage IF = 1 mA mV Forward Voltage Difference IF = 1 mA mV Lead Code Package Marking Code in White where x is date code 4 HSMS-8207 Min. Max. VBR RD 4 HSMS-8202 Min. Max. 250 350 4 250 350 — 4 250 350 20 250 350 20 20 1 2 7 9 R1x 2Rx R7x R9x RF Electrical Parameters, TA = 25°C Symbol Parameter Units Typical Lc Conversion Loss at 12 GHz dB 6.3 Z IF IF Impedance Ω 150 SWR SWR at 12 GHz 1.2 Note: DC Load Resistance = 0 Ω; LO Power = 1 mW. SPICE Parameters IS = 4.6 E-8 RS = 6 N = 1.09 BV = 7.3 IBV = 10E-5 EG = 0.69 CJO = 0.18 E-12 PB (VJ) = 0.5 M = 0.5 FC = 0.5 Linear Equivalent Circuit TT = 0 0.08 pF 1.0 nH 1.3 nH 6Ω 0.17 pF Rj Self Bias Rj 1 mA 263 2.5 mA 142 3 1 TA = +125°C TA = +25°C TA = –55°C 0.1 0 0.2 0.4 0.6 0.8 IF (Left Scale) 10 10 ∆VF (Right Scale) 1 1 0.3 0.3 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 FORWARD VOLTAGE (V) 9 CONVERSION LOSS (dB) 10 0.01 30 30 IF - FORWARD CURRENT (mA) FORWARD CURRENT (mA) 100 ∆VF - FORWARD VOLTAGE DIFFERENCE (mV) Typical Performance, TC = 25°C 7 6 –7 –5 –3 –1 1 3 5 9 11 13 Figure 3. Typical Conversion Loss vs. Local Oscillator Power. Figure 2. Typical VF Match, HSMS820X Pairs and Quads. Ordering Information Profile Option Descriptions Specify part number followed by option. For example: -BLK = Bulk -TR1 = 3K pc. Tape and Reel, Device Orientation Figures 4, 5 -TR2 = 10K pc. Tape and Reel, Device Orientation Figures 4, 5 Tape and Reeling conforms to Electronic Industries RS-481, “Taping of Surface Mounted Components for Automated Placement.” HSMS - 8101 - XXX Bulk or Tape and Reel Option Part Number Surface Mount Schottky Device Orientation TOP VIEW END VIEW 4 mm REEL 8 mm CARRIER TAPE 7 LOCAL OSCILLATOR POWER (dBm) V - FORWARD VOLTAGE (V) Figure 1. Typical Forward Current vs. Forward Voltage at Three Temperatures. 8 Figure 4. Option -TR1/-TR2 for SOT-23 Packages. USER FEED DIRECTION 4 mm COVER TAPE 8 mm Figure 5. Option -TR1/-TR2 for SOT-143 Packages. Package Characteristics Lead Material ...................................................................................... Alloy 42 Lead Finish ............................................................................ Tin-Lead 85-15% Maximum Soldering Temperature .............................. 260°C for 5 seconds Minimum Lead Strength .......................................................... 2 pounds pull Typical Package Inductance .................................................................. 2 nH Typical Package Capacitance .............................. 0.08 pF (opposite leads) Package Dimensions Outline 23 (SOT-23) 1.02 (0.040) 0.89 (0.035) * 1.03 (0.041) 0.89 (0.035) 0.54 (0.021) 0.37 (0.015) PACKAGE MARKING CODE (XX) DATE CODE (X) 3 1.40 (0.055) 1.20 (0.047) XXX 2 1 0.60 (0.024) 0.45 (0.018) * 2.65 (0.104) 2.10 (0.083) 2.04 (0.080) 1.78 (0.070) 2.05 (0.080) 1.78 (0.070) TOP VIEW (0.007) * 0.180 0.085 (0.003) 0.152 (0.006) 0.086 (0.003) 3.06 (0.120) 2.80 (0.110) 1.04 (0.041) 0.85 (0.033) 0.69 (0.027) 0.45 (0.018) 0.10 (0.004) 0.013 (0.0005) SIDE VIEW END VIEW * THESE DIMENSIONS FOR HSMS-280X AND -281X FAMILIES ONLY. DIMENSIONS ARE IN MILLIMETERS (INCHES) Outline 143 (SOT-143) 0.92 (0.036) 0.78 (0.031) DATE CODE (X) E PACKAGE MARKING CODE (XX) C 1.40 (0.055) 1.20 (0.047) XXX B 2.65 (0.104) 2.10 (0.083) E 0.60 (0.024) 0.45 (0.018) 2.04 (0.080) 1.78 (0.070) 0.54 (0.021) 0.37 (0.015) 3.06 (0.120) 2.80 (0.110) 0.15 (0.006) 0.09 (0.003) 1.04 (0.041) 0.85 (0.033) 0.10 (0.004) 0.013 (0.0005) DIMENSIONS ARE IN MILLIMETERS (INCHES) 0.69 (0.027) 0.45 (0.018) www.semiconductor.agilent.com Data subject to change. Copyright © 2001 Agilent Technologies, Inc. Obsoletes 5968-3886E July 10, 2001 5988-3328EN