ETC HA4314

HA4314B
®
Data Sheet
August 2002
FN3679.8
400MHz, 4 x 1 Video Crosspoint Switch
Features
The HA4314B is a very wide bandwidth 4 x 1 crosspoint
switch ideal for professional video switching, HDTV,
computer monitor routing, and other high performance
applications. The circuit features very low power dissipation
(105mW Enabled, 4mW Disabled), excellent differential gain
and phase, and very high off isolation. When disabled, the
output is switched to a high impedance state, making the
HA4314B ideal for routing matrix equipment.
• Low Power Dissipation . . . . . . . . . . . . . . . . . . . . . 105mW
• Symmetrical Slew Rates . . . . . . . . . . . . . . . . . . 1400V/µs
• 0.1dB Gain Flatness. . . . . . . . . . . . . . . . . . . . . . . 100MHz
• -3dB Bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . 400MHz
• Off Isolation (100MHz) . . . . . . . . . . . . . . . . . . . . . . . 70dB
• Crosstalk Rejection (30MHz) . . . . . . . . . . . . . . . . . . 80dB
• Differential Gain and Phase . . . . . . . 0.01%/0.01 Degrees
The HA4314B requires no external current source, and
features fast switching and symmetric slew rates.
• High ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . >2000V
For a 4 x 1 crosspoint with Tally outputs (channel indicators)
or with synchronous control signals, please refer to the
HA4404B and HA4344B data sheets, respectively.
• TTL Compatible Control Inputs
• Improved Replacement for GX4314 and GX4314L
Applications
For audio channels requiring larger signal swings, please
refer to the CD22M3494 (16 x 8) data sheet.
• Professional Video Switching and Routing
• HDTV
Ordering Information
TEMP.
PART NUMBER RANGE (oC)
PACKAGE
PKG.
NO.
• Computer Graphics
• RF Switching and Routing
HA4314BCP
0 to 70
14 Ld PDIP
E14.3
• PCM Data Routing
HA4314BCB
0 to 70
14 Ld SOIC
M14.15
Pinouts
HA4314BCB96
0 to 70
Tape and Reel
M14.15
HA4314BCA
0 to 70
16 Ld SSOP
M16.15A
Truth Table
CS
A1
A0
OUT
0
0
0
IN0
0
0
1
IN1
0
1
0
IN2
0
1
1
IN3
1
X
X
HIGH - Z
HA4314B (PDIP, SOIC)
TOP VIEW
IN0
1
14 V+
GND
2
13 A0
IN1
3
12 A1
GND
4
11 CS
IN2
5
10 OUT
GND
6
9 NC
IN3
7
8 V-
HA4314B (SSOP)
TOP VIEW
IN0
1
16 V+
GND
2
15 A0
IN1
3
14 A1
GND
4
13 CS
IN2
5
12 OUT
GND
6
11 NOTE
IN3
7
10 NOTE
GND
8
9 V-
NOTE: These pins must be left floating or connected to ground.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2002. All Rights Reserved
HA4314B
Absolute Maximum Ratings
Thermal Information
Voltage Between V+ and V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSUPPLY
Digital Input Current (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . ±25mA
Analog Input Current (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . ±5mA
Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20mA
ESD Rating
Human Body Model (Per MIL-STD-883 Method 3015.7). . . .2000V
Thermal Resistance (Typical, Note 1)
Operating Conditions
θJA (oC/W)
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
95
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
120
SSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . .
140
Maximum Junction Temperature (Die) . . . . . . . . . . . . . . . . . . . 175oC
Maximum Junction Temperature (Plastic Package) . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
(SOIC and SSOP - Lead Tips Only)
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
2. If an input signal is applied before the supplies are powered up, the input current must be limited to these maximum values.
Electrical Specifications
VSUPPLY = ±5V, RL = 10kΩ, VCS = 0.8V, Unless Otherwise Specified
PARAMETER
TEST CONDITIONS
(NOTE 4)
TEMP. (oC)
MIN
TYP
MAX
UNITS
Full
±4.5
±5.0
±5.5
V
DC SUPPLY CHARACTERISTICS
Supply Voltage
Supply Current (VOUT = 0V)
VCS = 0.8V
25, 70
-
10.5
13
mA
VCS = 0.8V
0
-
-
15.5
mA
VCS = 2.0V
25, 70
-
400
450
µA
VCS = 2.0V
0
-
400
580
µA
25, 70
±2.7
±2.8
-
V
0
±2.4
±2.5
-
V
Full
15
20
-
mA
ANALOG DC CHARACTERISTICS
Output Voltage Swing without Clipping
VOUT = VIN ± VIO ± 20mV
Output Current
Input Bias Current
Full
-
30
50
µA
Output Offset Voltage
Full
-10
-
10
mV
Output Offset Voltage Drift (Note 3)
Full
-
25
50
µV/oC
Turn-On Time
25
-
160
-
ns
Turn-Off Time
25
-
320
-
ns
Output Glitch During Switching
25
-
±10
-
mV
Input Logic High Voltage
Full
2
-
-
V
Input Logic Low Voltage
Full
-
-
0.8
V
Full
-2
-
2
µA
SWITCHING CHARACTERISTICS
DIGITAL DC CHARACTERISTICS
Input Current
0V to 4V
AC CHARACTERISTICS
Insertion Loss
1VP-P
2
-
0.055
0.063
dB
-
0.07
0.08
dB
Full
-
±0.004
±0.006
dB
RS = 50Ω, CL = 10pF
25
-
400
-
MHz
RS = 20Ω, CL = 20pF
25
-
280
-
MHz
RS = 16Ω, CL = 36pF
25
-
140
-
MHz
RS = 13Ω, CL = 49pF
25
-
110
-
MHz
Channel-to-Channel Insertion Loss Match
-3dB Bandwidth
25
Full
HA4314B
Electrical Specifications
VSUPPLY = ±5V, RL = 10kΩ, VCS = 0.8V, Unless Otherwise Specified (Continued)
(NOTE 4)
TEMP. (oC)
MIN
TYP
MAX
UNITS
RS = 50Ω, CL = 10pF
25
-
100
-
MHz
RS = 20Ω, CL = 20pF
25
-
100
-
MHz
RS = 16Ω, CL = 36pF
25
-
85
-
MHz
PARAMETER
TEST CONDITIONS
±0.1dB Flat Bandwidth
RS = 13Ω, CL = 49pF
Input Resistance
25
-
75
-
MHz
Full
200
400
-
kΩ
Input Capacitance
Full
-
1.5
-
pF
Enabled Output Resistance
Full
-
15
-
Ω
Disabled Output Capacitance
VCS = 2.0V
Full
-
2.5
-
pF
Differential Gain
4.43MHz, Note 3
25
-
0.01
0.02
%
Differential Phase
4.43MHz, Note 3
25
-
0.01
0.02
Degrees
Off Isolation
1VP-P, 100MHz, VCS = 2.0V,
RL = 10Ω
Full
-
70
-
dB
Crosstalk Rejection
1VP-P, 30MHz
Full
-
80
-
dB
Slew Rate (1.5VP-P, +SR/-SR)
RS = 50Ω, CL = 10pF
25
-
1425/1450
-
V/µs
RS = 20Ω, CL = 20pF
25
-
1010/1010
-
V/µs
RS = 16Ω, CL = 36pF
25
-
725/750
-
V/µs
RS = 13Ω, CL = 49pF
25
-
600/650
-
V/µs
Total Harmonic Distortion
10MHz, RL = 1kΩ, Note 3
Full
-
0.01
0.1
%
Disabled Output Resistance
VCS = 2.0V
Full
-
12
-
MΩ
NOTES:
3. This parameter is not tested. The limits are guaranteed based on lab characterization, and reflect lot-to-lot variation.
4. Units are 100% tested at 25oC; Guaranteed but not tested at 0oC and 70oC.
AC Test Circuit
500Ω
400Ω
Keep input and output traces as short as possible, because
trace inductance and capacitance can easily become the
performance limiting items.
510Ω
Application Information
HA4314
VIN
General
75Ω
-
RS
VOUT
+
HFA1100
75Ω
10kΩ
CX
NOTE:
CL = CX + Test Fixture Capacitance.
PC Board Layout
The frequency response of this circuit depends greatly on
the care taken in designing the PC board. The use of low
inductance components such as chip resistors and chip
capacitors is strongly recommended, while a solid
ground plane is a must!
Attention should be given to decoupling the power supplies.
A large value (10µF) tantalum in parallel with a small value
(0.1µF) chip capacitor works well in most cases.
The HA4314B is a 4 x 1 crosspoint switch that is ideal for the
matrix element of high performance switchers and routers.
This crosspoint’s low input capacitance and high input
resistance provide excellent video terminations when used
with an external 75Ω resistor. Nevertheless, if several
HA4314B inputs are connected together, the use of an input
buffer should be considered (see Figure 1). This crosspoint
contains no feedback or gain setting resistors, so the output
is a true high impedance load when the IC is disabled
(CS = 1).
Ground Connections
All GND pins are connected to a common point on the die,
so any one of them will suffice as the functional GND
connection. For the best isolation and crosstalk rejection,
however, all GND pins must connect to the GND plane.
Frequency Response
Most applications utilizing the HA4314B require a series
output resistor, RS, to tune the response for the specific load
3
HA4314B
matrix, and the HFA1112 (programmable gain buffer) as the
gain of two output driver. Figure 2 details a 16 x 1 switcher
(basically a 16:1 mux) which uses the HA4201 (1 x 1
crosspoint) and the HA4314B in a cascaded stage
configuration to minimize capacitive loading at each output
node, thus increasing system bandwidth.
capacitance, CL, driven. Bandwidth and slew rate degrade
as CL increases (as shown in the Electrical Specification
table), so give careful consideration to component
placement to minimize trace length. In big matrix
configurations where CL is large, better frequency response
is obtained by cascading two levels of crosspoints in the
case of multiplexed outputs (see Figure 2), or distributing the
load between two drivers if CL is due to bussing and
subsequent stage input capacitance.
Power Up Considerations
No signals should be applied to the analog or digital inputs
before the power supplies are activated. Latch-up may occur
if the inputs are driven at the time of power up. To prevent
latch-up, the input currents during power up must not exceed
the values listed in the Absolute Maximum Ratings.
Control Signals
CS - This is a TTL/CMOS compatible, active low Chip Select
input. When driven high, CS forces the output to a true high
impedance state and reduces the power dissipation by a
factor of 25. The CS input has no on-chip pull-down resistor,
so it must be connected to a logic low (recommend GND) if
the enable function isn’t utilized.
Intersil’s Crosspoint Family
Intersil offers a variety of 4 x 1 and 1 x 1 crosspoint switches.
In addition to the HA4314B, the 4 x 1 family includes the
HA4404 and HA4344. The HA4404 is a 16 lead device with
Tally outputs to indicate the selected channel. The HA4344
is a 16 lead crosspoint with synchronized control lines (A0,
A1, CS). With synchronization, the control information for the
next channel switch can be loaded into the crosspoint
without affecting the current state. On a subsequent clock
edge the stored control state effects the desired channel
switch.
A0, A1 - These are binary coded, TTL/CMOS compatible
address inputs that select which one of the four inputs
connect to the crosspoint output.
Switcher/Router Applications
Figure 1 illustrates one possible implementation of a
wideband, low power, 4 x 4 switcher/router utilizing the
HA4314B for the switch matrix. A 4 x 4 switcher/router
allows any of the four outputs to be driven by any one of the
four inputs (e.g., each of the four inputs may connect to a
different output, or an input may connect to multiple outputs).
This application utilizes the HA4600 (video buffer with output
disable) for the input buffer, the HA4314B as the switch
The 1 x 1 family is comprised of the HA4201 and HA4600.
They are essentially similar devices, but the HA4201
includes a Tally output (enable indicator). The 1 x 1s are
useful as high performance video input buffers, or in a switch
matrix requiring very high off isolation.
SWITCH MATRIX
INPUT BUFFERS
+5V
EN
SOURCE 0
75Ω
OUT
HA4600
RS
IN0
SOURCE 1
IN0
HA4314
75Ω
HA4314
CS
SOURCE 2
IN0
HA4314
CS
RS
CS
RS
OUT
IN3
HA4314
CS
RS
OUT
75Ω +5V
IN0
RS
OUT
IN3
OUT
IN3
IN3
EN
-+
-+
OUT RS
HA4600
OUTPUT BUFFERS
(HFA1112 OR HFA1115)
X2
75Ω
OUT0
-+
75Ω
X2
75Ω
OUT1
X2
75Ω
OUT2
FIGURE 1. 4 x 4 SWITCHER/ROUTER APPLICATION
4
-+
SOURCE 3
X2
75Ω
OUT3
HA4314B
HA4314
SOURCE0
SEL0:3 SEL4:7
IN0
75Ω
IN1
IN2
IN3
SOURCE3
1/4 CD74HCT00
CS
75Ω
RS
OUT
IN0
SOURCE4
75Ω
OUT
RS
HA4201
RS
IN1
IN2
EN
CS
IN3
SOURCE7
HFA1112 OR HFA1115
75Ω
75Ω
HA4314
SOURCE8
-
+
SEL8:11 SEL12:15
OUT
X2
IN0
75Ω
IN1
1/4 CD74HCT00
IN2
SOURCE11
IN3
CS
75Ω
OUT
SOURCE12
IN0
75Ω
OUT
RS
IN1
IN2
RS
EN
RS
HA4201
CS
IN3
SOURCE15
75Ω
HA4314
SWITCHING
MATRIX
ISOLATION
MUX
OUTPUT
BUFFER
FIGURE 2. 16 x 1 SWITCHER APPLICATION
Typical Performance Curves
VSUPPLY = ±5V, TA = 25oC, RL = 10kΩ, Unless Otherwise Specified
1.0
A1 (V)
0.5
OUTPUT VOLTAGE (mV)
OUTPUT VOLTAGE (V)
0.75
0.25
0
-0.25
-0.5
-0.75
2.4
IN1 = +250mV
IN3 = 0V
A0 = +3V
1.6
0.8
0
250
125
0
-1.0
TIME (5ns/DIV.)
FIGURE 3. LARGE SIGNAL PULSE RESPONSE
5
TIME (200ns/DIV.)
FIGURE 4. CHANNEL-TO-CHANNEL SWITCHING RESPONSE
HA4314B
Typical Performance Curves
VSUPPLY = ±5V, TA = 25oC, RL = 10kΩ, Unless Otherwise Specified (Continued)
VIN = 1VP-P
12
9
0.3
6
3
0
-3
0
-0.1
CL = 20pF
-0.2
-9
CL = 36pF
-0.3
-12
CL = 49pF
-0.4
10
FREQUENCY (MHz)
100
CL = 10pF
0.1
-6
1
CL = 20pF
0.2
CL = 10pF
GAIN (dB)
GAIN (dB)
VIN = 1VP-P
0.4
500
CL = 49pF
CL = 36pF
CL = 20pF
1
10
FREQUENCY (MHz)
FIGURE 5. FREQUENCY RESPONSE
-10
-30
-60
-70
PDIP
-80
-90
SSOP
SOIC
-100
OFF ISOLATION (dB)
CROSSTALK (dB)
VIN = 1VP-P
RL = 10Ω
-20
-50
-40
-60
-70
-80
-90
-120
-100
0.6
1
10
100
200
SOIC
-50
-110
PDIP
0.3
1
FREQUENCY (MHz)
10
100
200
FIGURE 8. ALL HOSTILE OFF ISOLATION
0.2
3.4
VIN = 1VP-P
RL = 1kΩ
INPUT CAPACITANCE (pF)
3.2
0.15
0.1
0.05
CH. 0
3.0
2.8
2.6
2.4
2.2
2.0
CH. 3
1.8
CH. 1
CH. 2
1.6
0
10
SSOP
FREQUENCY (MHz)
FIGURE 7. ALL HOSTILE CROSSTALK REJECTION
TOTAL HARMONIC DISTORTION (%)
200
FIGURE 6. GAIN FLATNESS
VIN = 1VP-P
RL = 10kΩ
-40
100
1.4
20
30
40
50
60
70
FREQUENCY (MHz)
80
90
100
FIGURE 9. TOTAL HARMONIC DISTORTION vs FREQUENCY
6
1
10
FREQUENCY (MHz)
100
FIGURE 10. INPUT CAPACITANCE vs FREQUENCY
500
HA4314B
Die Characteristics
DIE DIMENSIONS:
PASSIVATION:
65 mils x 118 mils x 19 mils
1640µm x 3000µm x 483µm
Type: Nitride
Thickness: 4kÅ ±0.5kÅ
METALLIZATION:
TRANSISTOR COUNT:
Type: Metal 1: AlCu (1%)/TiW
Thickness: Metal 1: 6kÅ ±0.8kÅ
Type: Metal 2: AlCu (1%)
Thickness: Metal 2: 16kÅ ±1.1kÅ
200
SUBSTRATE POTENTIAL (POWERED UP):
V-
Metallization Mask Layout
HA4314B
GND
NC
V+
IN1
A0
NC
A1
GND
CS
NC
OUT
IN2
NC
GND
NC
IN3
7
IN0
GND
NC
V-
HA4314B
FN
Dual-In-Line Plastic Packages (PDIP)
E14.3 (JEDEC MS-001-AA ISSUE D)
N
14 LEAD DUAL-IN-LINE PLASTIC PACKAGE
E1
INDEX
AREA
1 2 3
INCHES
N/2
-B-
-AE
D
BASE
PLANE
-C-
SEATING
PLANE
A2
A
L
D1
e
B1
D1
A1
eC
B
0.010 (0.25) M
C A B S
MILLIMETERS
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
C
L
B1
0.045
0.070
1.15
1.77
8
eA
C
0.008
0.014
D
0.735
0.775
C
eB
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English
and Metric dimensions, the inch dimensions control.
0.005
-
0.13
-
5
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
0.300 BSC
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
eB
-
L
0.115
7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 1.14mm).
8
5
E
eA
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
0.355
19.68
D1
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3.
0.204
18.66
N
14
2.54 BSC
7.62 BSC
0.430
-
0.150
2.93
14
6
10.92
7
3.81
4
9
Rev. 0 12/93
HA4314B
Small Outline Plastic Packages (SOIC)
M14.15 (JEDEC MS-012-AB ISSUE C)
N
INDEX
AREA
0.25(0.010) M
H
14 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
B M
E
INCHES
-B-
1
2
3
L
SEATING PLANE
-A-
h x 45o
A
D
-C-
e
µα
A1
B
0.25(0.010) M
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.3367
0.3444
8.55
8.75
3
E
0.1497
0.1574
3.80
4.00
4
e
C
0.10(0.004)
B S
0.050 BSC
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
9
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N
NOTES:
MILLIMETERS
α
14
0o
14
8o
0o
7
8o
Rev. 0 12/93
HA4314B
Shrink Small Outline Plastic Packages (SSOP)
M16.15A
N
INDEX
AREA
H
0.25(0.010) M
E
GAUGE
PLANE
-B1
2
INCHES
3
0.25
0.010
SEATING PLANE
-A-
16 LEAD SHRINK NARROW BODY SMALL OUTLINE
PLASTIC PACKAGE
B M
h x 45o
A
D
-C-
α
e
A1
B
0.17(0.007) M
L
A2
C
0.10(0.004)
C A M
B S
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
MILLIMETERS
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.053
0.069
1.35
1.75
-
A1
0.004
0.010
0.10
0.25
-
A2
-
0.061
-
1.54
-
B
0.008
0.012
0.20
0.30
9
C
0.007
0.010
0.18
0.25
-
D
0.189
0.196
4.80
4.98
3
E
0.150
0.157
3.81
3.98
4
e
H
0.025 BSC
0.228
0.244
0.635 BSC
5.80
-
6.19
-
h
0.0099
0.0196
0.26
0.49
5
L
0.016
0.050
0.41
1.27
6
8o
0o
N
α
16
0o
16
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
7
8o
Rev. 0 5/96
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.10mm (0.004 inch) total in excess of “B” dimension at maximum material condition.
10. Controlling dimension: INCHES. Converted millimeter dimensions are
not necessarily exact.
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Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from
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