ETC IS93C56A-3PI

IS93C46A IS93C56A IS93C66A
ISSI
1,024/2,048/4,096-BIT SERIAL ELECTRICALLY
ERASABLE PROM
NOVEMBER
®
2002
FEATURES
DESCRIPTION
• Industry-standard Microwire Interface
— Non-volatile data storage
— Low voltage operation:
Vcc = 2.5V to 5.5V
— Full TTL compatible inputs and outputs
— Auto increment for efficient data dump
• User Configured Memory Organization
— By 16-bit or by 8-bit
• Hardware and software write protection
— Defaults to write-disabled state at power-up
— Software instructions for write-enable/disable
• Enhanced low voltage CMOS E2PROM
technology
• Versatile, easy-to-use Interface
— Self-timed programming cycle
— Automatic erase-before-write
— Programming status indicator
— Word and chip erasable
— Stop SK anytime for power savings
• Durable and reliable
— 40-year data retention after 1M write cycles
— 1 million write cycles
— Unlimited read cycles
— Schmitt-trigger inputs
• Industrial and Automotive Temperature Grade
The IS93C46A/56A/66A is a low-cost 1kb/2kb/
4kb non-volatile, ISSI ® serial EEPROM. It is
fabricated using an enhanced CMOS design and
process. The IS93C46A/56A/66A contain powerefficient read/write memory, and organziation of
either 128/256/512 bytes of 8 bits or 64/128/256
words of 16 bits. When the ORG pin is
connected to Vcc or left unconnected, x16 is
selected; when it is connected to ground, x8 is
selected. The IS93C46A/56A/66A is fully
backwards compatible with IS93C46/56/66.
An instruction set controls the operation of the
devices, including read, write, and mode-enable
functions. The data out pin (Dout) indicates the
status of the device during the self-timed nonvolatile programming cycle. The self-timed write
cycle includes an automatic erase-before-write
capability. To protect against inadvertent writes,
the WRITE instruction is accepted only while the
chip is in the write-enabled state. Data is written
once per WRITE instruction to the x8 byte or x16
word selected. If Chip Select (CS) is brought
HIGH just after initiation of the write cycle, the
Dout pin would indicate the Ready/Busy status of
the write activity.
FUNCTIONAL BLOCK DIAGRAM
DATA
REGISTER
INSTRUCTION
REGISTER
DIN
CS
SK
DUMMY
BIT
DOUT
R/W
AMPS
INSTRUCTION
DECODE,
CONTROL,
AND
CLOCK
GENERATION
ADDRESS
REGISTER
ADDRESS
DECODER
EEPROM
ARRAY
128/256/512x16
64/128/256/x8
WRITE
ENABLE
HIGH VOLTAGE
GENERATOR
Copyright © 2002 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. A
11/12/02
1
IS93C46A
IS93C56A
ISSI
IS93C66A
®
PIN CONFIGURATIONS
8-Pin JEDEC SOIC “GR”
8-Pin JEDEC SOIC “G”
8-Pin DIP, 8-Pin TSSOP
CS
1
8
VDD
NC
1
8
ORG
CS
1
8
VCC
SK
2
7
NC
VCC
2
7
GND
SK
2
7
NC
DIN
3
6
ORG
CS
3
6
DOUT
DIN
3
6
ORG
DOUT
4
5
GND
SK
4
5
DIN
DOUT
4
5
GND
(Rotated)
PIN DESCRIPTIONS
instruction begins with a start bit of the logical “1” or
HIGH. Following this are the opcode (2 bits),
address field (6, 7, 8, or 9 bits), and data, if
appropriate. The clock signal may be held stable at
any moment to suspend the device at its last state.
This allows clock-speed flexibility as well as
CS
Chip Select
SK
Serial Data Clock
DIN
Serial Data Input
DOUT
Serial Data Output
maximum power conservation.
ORG
Organization Select
Read (READ)
NC
Not Connected
Vcc
Power
GND
Ground
The READ instruction is the only instruction that outputs
serial data on the DOUT pin. After the read instruction and
address have been decoded, data is transferred from the
selected memory register into a serial shift register. (Please
note that one logical “0” bit precedes the actual 8 or 16-bit
output data string.) The output on DOUT changes during the
low-to-high transitions of SK (see Figure 3).
Applications
The IS93C46A/56A/66A is very popular in many highvolume applications which require low-power, lowdensity storage. Applications using this device
include industrial controls, networking, and numerous
other consumer electronics.
Low Voltage Read
Endurance and Data Retention
Auto Increment Read Operations
The IS93C46A/56A/66A is designed for applications requiring up to 1M programming cycles (WRITE, WRALL,
ERASE and ERAL). It provides 40 years of secure data
retention without power after the execution of 1M programming cycles.
In the interest of memory transfer operation applications,
the IS93C46A/56A/66A has been designed to output a
continuous stream of memory content in response to a
single read operation instruction. To utilize this function, the
system asserts a read instruction specifying a start location
address. Once the 8 or16 bits of the addressed register have
been clocked out, the data in consecutively higher address
locations is output. The address will wrap around continuously with CS HIGH until the chip select (CS) control pin is
brought LOW. This allows for single instruction data dumps
to be executed with a minimum of firmware overhead.
Device Operations
The IS93C46A/56A/66A are controlled by a set of
instructions which are clocked-in serially on the Din pin.
Before each low-to-high transition of the clock (SK), the
CS pin must have already been raised to HIGH, and the
Din value must be stable at either LOW or HIGH. Each
2
The IS93C46A/56A/66A have been designed to ensure that
data read operations are reliable in low voltage environments. They provide accurate operation with Vcc as low
as 2.5V.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. A
11/12/02
IS93C46A
IS93C56A
ISSI
IS93C66A
®
Write Enable (WEN)
Write All (WRALL)
The write enable (WEN) instruction must be executed
before any device programming (WRITE, WRALL,
ERASE, and ERAL) can be done. When Vcc is applied,
this device powers up in the write disabled state. The
device then remains in a write disabled state until a WEN
instruction is executed. Thereafter, the device remains
enabled until a WDS instruction is executed or until Vcc
is removed. (See Figure 4.) (Note: Chip select must
remain LOW until Vcc reaches its operational value.)
The write all (WRALL) instruction programs all registers
with the data pattern specified in the instruction. As with
the WRITE instruction, the falling edge of CS must occur
to initiate the self-timed programming cycle. If CS is then
brought HIGH after a minimum wait of 250 ns (tCS), the
DOUT pin indicates the READY/BUSY status of the chip (see
Figure 6).
Write (WRITE)
The WRITE instruction includes 8 or 16 bits of data to be
written into the specified register. After the last data bit
has been applied to DIN, and before the next rising edge
of SK, CS must be brought LOW. The falling edge of CS
initiates the self-timed programming cycle.
If CS is brought HIGH, after a minimum wait of 250 ns
(5V operation) after the falling edge of CS (tCS) DOUT will
indicate the READY/BUSY status of the chip. Logical
“0” means programming is still in progress, logical “1”
means the selected register has been written, and the
part is ready for another instruction (see Figure 5).
(NOTE: The combination of CS HIGH, DIN HIGH and
the rising edge of the SK clock, resets the READY/
BUSY flag. Therefore, to access the READY/BUSY
flag, this combination of control signals should be
avoided.) Before a WRITE instruction can be executed,
the device must be write enabled (see WEN).
Write Disable (WDS)
The write disable (WDS) instruction disables all programming
capabilities. This protects the entire device against accidental modification of data until a WEN instruction is
executed. (When Vcc is applied, this part powers up in the
write disabled state.) To protect data, a WDS instruction
should be executed upon completion of each programming
operation.
Erase Register (ERASE)
After the erase instruction is entered, CS must be brought
LOW. The falling edge of CS initiates the self-timed internal
programming cycle. Bringing CS HIGH after a minimum of
tCS, will cause DOUT to indicate the READ/BUSY status of the
chip: a logical “0” indicates programming is still in progress;
a logical “1” indicates the erase cycle is complete and the
part is ready for another instruction (see Figure 8).
Erase All (ERAL)
Full chip erase is provided for ease of programming. Erasing
the entire chip involves setting all bits in the entire memory
array to a logical “1” (see Figure 9).
INSTRUCTION SET - IS93C46A
Instruction
8-bit Organization
(ORG = GND)
Address (1) Input Data
16-bit Organization
(ORG = Vcc)
Address (1) Input Data
Start Bit
OP Code
READ
1
10
(A6-A0)
—
(A5-A0)
—
WEN (Write Enable)
1
00
11xxxxx
—
11xxxx
—
WRITE
1
01
(A6-A0)
(D7-D0)
(3)
(A5-A0)
(D15-D0)
(2)
WRALL (Write All Registers)
1
00
01xxxxx
(D7-D0)
(3)
01xxxx
(D15-D0)
(2)
WDS (Write Disable)
1
00
00xxxxx
—
00xxxx
—
ERASE
1
11
(A6-A0)
—
(A5-A0)
—
ERAL (Erase All Registers)
1
00
10xxxxx
—
10xxxx
—
Notes:
1. x = Don't care bit.
2. If input data is not 16 bits exactly, the last 16 bits will be taken as input data.
3. If input data is not 8 bits exactly, the last 8 bits will be taken as input data.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. A
11/12/02
3
IS93C46A
IS93C56A
ISSI
IS93C66A
®
INSTRUCTION SET - IS93C56A
Instruction
8-bit Organization
(ORG = GND)
Address (1) Input Data
16-bit Organization
(ORG = Vcc)
Address (1) Input Data
Start Bit
OP Code
READ
1
10
x(A7-A0)
—
x(A6-A0)
—
WEN (Write Enable)
1
00
11xxxxxxx
—
11xxxxxx
—
(D7-D0) (3)
x(A6-A0)
(D15-D0)
(2)
(3)
01xxxxxx
(D15-D0)
(2)
WRITE
1
01
x(A7-A0)
WRALL (Write All Registers)
1
00
01xxxxxxx
WDS (Write Disable)
1
00
00xxxxxxx
—
00xxxxxx
—
ERASE
1
11
x(A7-A0)
—
x(A6-A0)
—
ERAL (Erase All Registers)
1
00
10xxxxxxx
—
10xxxxxx
—
(D7-D0)
Notes:
1. x = Don't care bit.
2. If input data is not 16 bits exactly, the last 16 bits will be taken as input data.
3. If input data is not 8 bits exactly, the last 8 bits will be taken as input data.
INSTRUCTION SET - IS93C66A
Instruction
Start Bit
OP Code
8-bit Organization
(ORG = GND)
Address (1) Input Data
16-bit Organization
(ORG = Vcc)
Address (1) Input Data
READ
1
10
(A8-A0)
—
(A7-A0)
—
WEN (Write Enable)
1
00
11xxxxxxx
—
11xxxxxx
—
WRITE
1
01
(A8-A0)
(D7-D0)
(3)
(A7-A0)
(D15-D0)
(2)
WRALL (Write All Registers)
1
00
01xxxxxxx
(D7-D0)
(3)
01xxxxxx
(D15-D0)
(2)
WDS (Write Disable)
1
00
00xxxxxxx
—
00xxxxxx
—
ERASE
1
11
(A8-A0)
—
(A7-A0)
—
ERAL (Erase All Registers)
1
00
10xxxxxxx
—
10xxxxxx
—
Notes:
1. x = Don't care bit.
2. If input data is not 16 bits exactly, the last 16 bits will be taken as input data.
3. If input data is not 8 bits exactly, the last 8 bits will be taken as input data.
4
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. A
11/12/02
IS93C46A
IS93C56A
ISSI
IS93C66A
®
ABSOLUTE MAXIMUM RATINGS(1)
Symbol
VGND
TBIAS
TBIAS
TSTG
Parameter
Voltage with Respect to GND
Temperature Under Bias (Industrial)
Temperature Under Bias (Automotive)
Storage Temperature
Value
–0.3 to +6.5
–40 to +85
–40 to +125
–65 to +150
Unit
V
°C
°C
°C
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation of the
device at these or any other conditions above those indicated in the operational sections
of this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect reliability.
OPERATING RANGE
Range
Industrial
Automotive
Ambient Temperature
–40°C to +85°C
VCC
2.5V to 5.5V
–40°C to +125°C
2.7V to 5.5V or 4.5V to 5.5V
CAPACITANCE
Symbol
Parameter
CIN
Input Capacitance
COUT
Output Capacitance
Conditions
Max.
Unit
VIN = 0V
5
pF
VOUT = 0V
5
pF
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Rev. A
11/12/02
5
IS93C46A
IS93C56A
ISSI
IS93C66A
®
DC ELECTRICAL CHARACTERISTICS
TA = –40°C to +85°C for Industrial and –40°C to +125°C for Automotive.
Symbol
Parameter
Test Conditions
VOL
Output LOW Voltage
IOL = 100 µA
VOL1
Output LOW Voltage
VOH
Vcc
Min.
Max.
Unit
2.5V to 5.5V
—
0.2
V
IOL = 2.1 mA
4.5V to 5.5V
—
0.4
V
Output HIGH Voltage
IOH = –100 µA
2.5V to 5.5V
VCC – 0.2
—
V
VOH1
Output HIGH Voltage
IOH = –400 µA
4.5V to 5.5V
2.4
—
V
VIH
Input HIGH Voltage
2.5V to 5.5V
4.5V to 5.5V
0.7XVCC
0.7XVCC
VCC+1
VCC+1
V
VIL
Input LOW Voltage
2.5V to 5.5V
4.5V to 5.5V
–0.3
–0.3
0.2XVCC
0.8
V
ILI
Input Leakage
VIN = 0V to VCC (CS, SK,DIN,ORG)
0
2.5
µA
ILO
Output Leakage
VOUT = 0V to VCC, CS = 0V
0
2.5
µA
Notes:
Automotive grade devices in this table are tested with Vcc = 2.7V to 5.5V and 4.5V to 5.5V.
POWER SUPPLY CHARACTERISTICS
TA = –40°C to +85°C for Industrial
Symbol
Parameter
Test Conditions
I CC1
Vcc Read Supply Current
CS = VIH, SK = 1 MHz
CMOS input levels
I CC2
Vcc Write Supply Current
I SB
Standby Current
Vcc
Min.
Typ.
Max.
Unit
2.7V
5.0V
—
—
40
100
100
500
µA
µA
CS = VIH, SK = 1 MHz
CMOS input levels
2.7V
5.0V
—
—
0.4
1.5
1
3
mA
mA
CS = VIH, SK = 0V
2.7V
5.0V
—
—
0.4
2
2
4
µA
µA
Min.
Typ.
Max.
Unit
POWER SUPPLY CHARACTERISTICS
TA = –40°C to +125°C for Automotive
6
Symbol
Parameter
Test Conditions
Vcc
I CC1
Vcc Read Supply Current
CS = VIH, SK = 1 MHz
CMOS input levels
2.7V
5.0V
—
—
40
100
100
500
µA
µA
I CC2
Vcc Write Supply Current
CS = VIH, SK = 1 MHz
CMOS input levels
2.7V
5.0V
—
—
0.4
1.5
1
3
mA
mA
I SB
Standby Current
CS = VIH, SK = 0V
2.7V
5.0V
—
—
0.5
4
3
8
µA
µA
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Rev. A
11/12/02
IS93C46A
IS93C56A
ISSI
IS93C66A
®
AC ELECTRICAL CHARACTERISTICS
TA = –40°C to +125°C for Automotive
Symbol Parameter
fSK
tSKH
tSKL
tCS
tCSS
tDIS
tCSH
tDIH
tPD1
tPD0
tSV
tDF
tWP
Test Conditions
SK Clock Frequency
SK HIGH Time
SK LOW Time
Minimum CS LOW Time
CS Setup Time
Din Setup Time
CS Hold Time
Din Hold Time
Output Delay to “1”
Output Delay to “0”
CS to Status Valid
CS to Dout in 3-state
Write Cycle Time
Relative to SK
Relative to SK
Relative to SK
Relative to SK
AC Test
AC Test
AC Test
AC Test, CS=VIL
Vcc
Min.
Max.
Unit
2.7V to 5.5V
0
1
Mhz
4.5V to 5.5V
0
2
Mhz
2.7V to 5.5V
500
—
ns
4.5V to 5.5V
250
—
ns
2.7V to 5.5V
500
—
ns
4.5V to 5.5V
250
—
ns
2.7V to 5.5V
250
—
ns
4.5V to 5.5V
250
—
ns
2.7V to 5.5V
100
—
ns
4.5V to 5.5V
50
—
ns
2.7V to 5.5V
100
—
ns
4.5V to 5.5V
100
—
ns
2.7V to 5.5V
0
—
ns
4.5V to 5.5V
0
—
ns
2.7V to 5.5V
100
—
ns
4.5V to 5.5V
100
—
ns
2.7V to 5.5V
—
400
ns
4.5V to 5.5V
—
250
ns
2.7V to 5.5V
—
400
ns
4.5V to 5.5V
—
250
ns
2.7V to 5.5V
—
250
ns
4.5V to 5.5V
—
250
ns
2.7V to 5.5V
—
200
ns
4.5V to 5.5V
—
100
ns
2.7V to 5.5V
—
10
ms
4.5V to 5.5V
—
5
ms
Notes:
1. C L = 100pF
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. A
11/12/02
7
IS93C46A
IS93C56A
ISSI
IS93C66A
®
AC ELECTRICAL CHARACTERISTICS
TA = –40°C to +85°C for Industrial
Symbol Parameter
Test Conditions
Vcc
Min.
Max.
Unit
fSK
SK Clock Frequency
2.5V to 5.5V
2.7V to 5.5V
4.5V to 5.5V
0
0
0
1
1
2
Mhz
Mhz
Mhz
tSKH
SK HIGH Time
2.5V to 5.5V
2.7V to 5.5V
4.5V to 5.5V
500
350
250
—
—
—
ns
ns
ns
tSKL
SK LOW Time
2.5V to 5.5V
2.7V to 5.5V
4.5V to 5.5V
500
350
250
—
—
—
ns
ns
ns
tCS
Minimum CS LOW Time
2.5V to 5.5V
2.7V to 5.5V
4.5V to 5.5V
500
250
250
—
—
—
ns
ns
ns
tCSS
CS Setup Time
Relative to SK
2.5V to 5.5V
2.7V to 5.5V
4.5V to 5.5V
100
50
50
—
—
—
ns
ns
ns
tDIS
Din Setup Time
Relative to SK
2.5V to 5.5V
2.7V to 5.5V
4.5V to 5.5V
100
100
100
—
—
—
ns
ns
ns
tCSH
CS Hold Time
Relative to SK
2.5V to 5.5V
2.7V to 5.5V
4.5V to 5.5V
0
0
0
—
—
—
ns
ns
ns
tDIH
Din Hold Time
Relative to SK
2.5V to 5.5V
2.7V to 5.5V
4.5V to 5.5V
100
100
100
—
—
—
ns
ns
ns
tPD1
Output Delay to “1”
AC Test
2.5V to 5.5V
2.7V to 5.5V
4.5V to 5.5V
—
—
—
400
350
250
ns
ns
ns
tPD0
Output Delay to “0”
AC Test
2.5V to 5.5V
2.7V to 5.5V
4.5V to 5.5V
—
—
—
400
350
250
ns
ns
ns
tSV
CS to Status Valid
AC Test
2.5V to 5.5V
2.7V to 5.5V
4.5V to 5.5V
—
—
—
400
250
250
ns
ns
ns
tDF
CS to Dout in 3-state
AC Test, CS=VIL
2.5V to 5.5V
2.7V to 5.5V
4.5V to 5.5V
—
—
—
200
200
100
ns
ns
ns
tWP
Write Cycle Time
2.5V to 5.5V
2.7V to 5.5V
4.5V to 5.5V
—
—
—
10
10
5
ms
ms
ms
Notes:
1. C L = 100pF
8
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. A
11/12/02
IS93C46A
IS93C56A
ISSI
IS93C66A
®
AC WAVEFORMS
FIGURE 2. SYNCHRONOUS DATA TIMING
CS
T
tCSS
tSKH
tSKL
tCSH
SK
tDIS
tDIH
DIN
tPD0
tPD1
tDF
DOUT
(READ)
tSV
tDF
DOUT
(WRITE)
(WRALL)
(ERASE)
(ERAL)
STATUS VALID
FIGURE 3. READ CYCLE TIMING
tCS
CS
SK
DIN
DOUT
1
1
0
An
A0
0
Dm
D0
*
*Address Pointer Cycles to the Next Register
Notes:
To determine address bits An-A0 and data bits Dm-Do, see Instruction Set for the specific device.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. A
11/12/02
9
IS93C46A
IS93C56A
ISSI
IS93C66A
®
AC WAVEFORMS
FIGURE 4. SYNCHRONOUS DATA TIMING
tCS
CS
SK
DIN
1
0
0
1
1
DOUT = 3-state
FIGURE 5. WRITE (WRITE) CYCLE TIMING
tCS
CS
SK
DIN
1
0
1
An
A0
Dm
D0
tSV
DOUT
BUSY
tDF
READY
tWP
Notes:
To determine address bits An-A0 and data bits Dm-Do, see Instruction Set for the specific device.
10
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Rev. A
11/12/02
IS93C46A
IS93C56A
ISSI
IS93C66A
®
AC WAVEFORMS
FIGURE 6. WRITE ALL (WRALL) TIMING
tCS
CS
SK
DIN
1
0
0
0
1
Dm
D0
tSV
BUSY
DOUT
READY
tWP
Notes:
To determine data bits Dm - D0, see Instruction Set for the appropriate device.
FIGURE 7. WRITE DISABLE (WDS) CYCLE TIMING
tCS
CS
SK
DIN
1
0
0
0
0
DOUT = 3-STATE
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Rev. A
11/12/02
11
IS93C46A
IS93C56A
ISSI
IS93C66A
®
AC WAVEFORMS
FIGURE 8. ERASE (REGISTER ERASE) CYCLE TIMING
SK
tCS
CS
DIN
1
1
1
An
An-1
A0
tSV
DOUT
tDF
BUSY
READY
tWP
Notes:
To determine data bits An - A0, see Instruction Set for the appropriate device.
FIGURE 9. ERASE ALL (ERAL) CYCLE TIMING
SK
tCS
CS
DIN
1
0
0
1
0
tSV
DOUT
BUSY
tDF
READY
tWP
Note for Figures 8 and 9:
After the completion of the instruction (DOUT is in READY status) then it may perform another instruction. If device is in BUSY status
(DOUT indicates BUSY status) then performs another instruction that would cause device malfunction.
12
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. A
11/12/02
IS93C46A
IS93C56A
ISSI
IS93C66A
®
ORDERING INFORMATION
Industrial Range: -40ºC to +85ºC
Speed
1Mhz
Voltage Range
2.5V to 5.5V
1Mhz
2.5V to 5.5V
1Mhz
2.5V to 5.5V
Order Part No.
IS93C46A-3PI
IS93C46A-3GI
IS93C46A-3GRI
IS93C46A-3ZI
IS93C56A-3PI
IS93C56A-3GI
IS93C56A-3GRI
IS93C56A-3ZI
IS93C66A-3PI
IS93C66A-3GI
IS93C66A-3GRI
IS93C66A-3ZI
Package
300-mil Plastic DIP
SOIC (rotated) JEDEC
SOIC JEDEC
169-mil TSSOP
300-mil Plastic DIP
SOIC (rotated) JEDEC
SOIC JEDEC
169-mil TSSOP
300-mil Plastic DIP
SOIC (rotated) JEDEC
SOIC JEDEC
169-mil TSSOP
Order Part No.
IS93C46A-3PA
IS93C46A-3GRA
IS93C56A-3PA
IS93C56A-3GRA
IS93C66A-3PA
IS93C66A-3GRA
IS93C46A-PA
IS93C46A-GRA
IS93C56A-PA
IS93C56A-GRA
IS93C66A-PA
IS93C66A-GRA
Package
300-mil Plastic DIP
SOIC JEDEC
300-mil Plastic DIP
SOIC JEDEC
300-mil Plastic DIP
SOIC JEDEC
300-mil Plastic DIP
SOIC JEDEC
300-mil Plastic DIP
SOIC JEDEC
300-mil Plastic DIP
SOIC JEDEC
ORDERING INFORMATION
Automotive Range: -40ºC to +125ºC
Speed
1Mhz
Voltage Range
2.7V to 5.5V
1Mhz
2.7V to 5.5V
1Mhz
2.7V to 5.5V
2Mhz
4.5V to 5.5V
2Mhz
4.5V to 5.5V
2Mhz
4.5V to 5.5V
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. A
11/12/02
13