FBI6A1M1.......FBI6M1M1 6 Amp. Glass Passivated Bridge Rectifier Voltage 50 to 1000 V. Plastic Case Dimensions in mm. 25 3.2 Current 6.0 A. 3.5 ® _ + 1 + 0.05 • Glass Passivated Junction Chips. 7.5 7.5 10 L suffix 17.5 8 –4 • UL recognized under component index file 0.7 1 • Mounting Instructions • High temperature soldering guaranteed: 260 ºC – 10 sc. • Recommended mounting torque: 8 Kg.cm. number E130180. • Lead and polarity identifications. • • • • Case: Molded Plastic. Ideal for printed circuit board (P.C.B.). High surge current capability. The plastic material carries U/L recognition 94 V-O. Maximum Ratings, according to IEC publication No. 134 FBI6A FBI6B 1M1 1M1 FBI6D 1M1 FBI6G 1M1 FBI6J 1M1 FBI6K FBI6M 1M1 1M1 VRRM Peak recurrent reverse voltage (V) 50 100 200 400 600 800 1000 VRMS Maximum RMS voltage (V) 35 70 140 280 420 560 700 IF(AV) Max. Average forward current with heatsink without heatsink 10 ms. peak forward surge current (Jedec Method) Current squared time (rating for fusing) (1ms.<t<10ms. Tc = 25ºC) Dielectric strength (terminals to case, AC 1 min.) Operating temperature range Storage temperature range IFSM I2t VDIS Tj Tstg 6.0 A at 100 ºC 3.0 A at 40 ºC 170 A 2 140 A sec 2000 V – 55 to + 150 °C – 55 to +150 ºC Electrical Characteristics at Tamb = 25°C VF IR Rth (j-c) Rth (j-a) Max. forward voltage drop per diode at IF = 3.0 A Max. instantaneous reverse current at VRRM MAXIMUM THERMAL RESISTANCE Junction-Case. With Heatsink. Junction-Ambient. Without Heatsink. 1.05 V 5 A 2.2 ºC/W 22 ºC/W Jan - 00 FBI6 - 1M1 Characteristic Curves FORWARD CURRENT DERATING CURVE TYPICAL FORWARD CHARACTERISTIC Tamb = 25° C 10 8 heatsink Tc Tc _ 6 + 1.0 on glass-epoxi substrate 4 _ sine wave R-load on heatsink + P.C.B. soldering land 5 mm ø sine wave R-load free in air 0.1 2 0 0 0.6 1.0 1.4 0 VF , instantaneous forward voltage (V) 25 50 75 100 125 150 175 Tamb, ambient temperature (°C) MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT 200 150 100 50 0 1 10 100 Number of cycles at 50 Hz. Jan - 00