HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 December 2001 GENERAL DESCRIPTION The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus specifications. In addition to being functional upgrades of Holt's HI-8382 & HI-8383 products, they are also alternate sources for the HS-3182 ( Intersil/Harris), the RM3182 (Fairchild /Raytheon) and a variety of similar DEI/DDC line driver products. PIN CONFIGURATION VREF 1 14 V1 13 CLOCK GND (See Note * ) 2 12 DATA (B) SYNC 3 11 CB DATA (A) 4 10 BOUT CA 5 Inputs are provided for clocking and synchronization. These signals are AND'd with the DATA inputs to enhance system performance and allow the HI-318X series of products to be used in a variety of applications. Both logic and synchronization inputs feature built-in 2,000V minimum ESD input protection as well as TTL and CMOS compatibility. The differential outputs of the HI-318X series of products are independently programmable to either the high speed or low speed ARINC 429 output rise and fall time specifications through the use of two external capacitors. The output voltage swing is also adjustable by the application of an external voltage to the VREF input. Products with 0, 13 or 37.5 ohm resistors in series with each ARINC output are available. In addition, the HI-3182, HI-3184 and HI-3187 products also have a fuse in series with each output. (Top View) AOUT 6 9 +V -V 7 8 GND HI-3184PS, HI-3185PS, HI-3186PS & HI-3187PS 14 - PIN PLASTIC SMALL OUTLINE (ESOIC)** Notes: * Pin 2 may be left floating ** Thermally Enhanced SOIC Package (See Page 6 for additional package pin configurations) FUNCTION The HI-318X series of line drivers are intended for use where logic signals must be converted to ARINC 429 levels such as when using an ASIC, the HI-8282 ARINC 429 Serial Transmitter/Dual Receiver, the HI-6010 ARINC 429 Transmitter/Receiver or the HI-8783 ARINC Interface Device. Holt products are readily available for both industrial and military applications. Please contact the Holt Sales Department for additional information. + FEATURES ARINC 429 DIFFERENTIAL LINE DRIVER ! Low power CMOS TRUTH TABLE ! TTL and CMOS compatible inputs ! Programmable output voltage swing ! Adjustable ARINC rise and fall times SYNC CLOCK DATA(A) DATA(B) AOUT BOUT COMMENTS X L X X 0V 0V NULL L X X X 0V 0V NULL H H L L 0V 0V NULL ! Operates at data rates up to 100 Kbits H H L H -VREF +VREF LOW ! Overvoltage protection H H H L +VREF -VREF HIGH ! Industrial and Military temperature ranges H H H H 0V 0V NULL ! Plastic 14 & 16-pin thermally enhanced SOIC packages available ! Pin-for-Pin alternative for DEI/DDC/Intersil/Fairchild applications (DS3182 Rev. C ) HOLT INTEGRATED CIRCUITS www.holtic.com 12/01 HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188 FUNCTIONAL DESCRIPTION The SYNC and CLOCK inputs establish data synchronization utilizing two AND gates, one for each data input. Each logic input, including the power enable (STROBE) input, are TTL/CMOS compatible. Figure 1 illustrates a typical ARINC 429 bus application. Three power supplies are necessary to operate the HI-3182; typically +15V, -15V and +5V. The chip also works with ±12V supplies. The +5V supply can also provide a reference voltage that determines the output voltage swing. The differential output voltage swing will equal 2VREF. If a value of VREF other than +5V is needed, a separate +5V power supply is required for pin V1. The ARINC outputs can be put in a tri-state mode by applying a logic high to the STROBE input pin. If this feature is not being used, the pin should be tied to ground. The STROBE function is not available in the 14 & 16-pin SOIC package configurations where the pin is internally connected to ground. The ARINC outputs of the HI-3182, HI-3184 and HI-3187 are protected by internal fuses capable of sinking between 800 900 mA for short periods of time (125µs). +5V With the DATA (A) input at a logic high and DATA (B) input at a logic low, AOUT will switch to the +VREF rail and BOUT will switch to the -VREF rail (ARINC HIGH state). With both data input signals at a logic low state, the outputs will both switch to 0V (ARINC NULL state). The driver output impedance, ROUT, is nominally 75, 26 or 0 ohms depending on the option chosen. The rise and fall times of the outputs can be calibrated through the selection of two external capacitor values that are connected to the CA and CB input pins. Typical values for high-speed operation (100KBPS) are CA = CB = 75pF and for low-speed operation (12.5 to 14KBPS) CA = CB = 500pF. VREF DATA (A) +15V V1 SYNC CLOCK INPUTS DATA (B) C STROBE GND OUT +V TO ARINC BUS -V B C The CA and CB pins swing between +5V and ground allowing the switching of capacitor values with an external singlesupply analog switch. -15V Figure 1. ARINC 429 BUS APPLICATION REF +V CA Shorted on HI-3186, HI-3187, HI-3188 DATA (A) LEVEL SHIFTER AND SLOPE CONTROL (A) CLOCK 24.5Ω 13Ω FA OUTPUT DRIVER (A) CL SYNC LEVEL SHIFTER AND SLOPE CONTROL (B) DATA (B) V1 CURRENT REGULATOR 24.5Ω GND -V FB OUTPUT DRIVER (B) Shorted on HI-3183, HI-3186 HI-3187, HI-3188 STROBE 13Ω CB Figure 2. FUNCTIONAL BLOCK DIAGRAM HOLT INTEGRATED CIRCUITS 2 Shorted on HI-3183, HI-3185 HI-3186, HI-3188 B OUT RL HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188 SYMBOL FUNCTION VREF POWER DESCRIPTION Reference voltage used to determine the output voltage swing STROBE INPUT A logic high tri-states the ARINC outputs. Not available in the 14-pin SOIC package (tied to GND internally). SYNC INPUT Synchronizes data inputs DATA (A) INPUT Data input terminal A CA INPUT Connection for DATA (A) slew-rate capacitor AOUT OUTPUT ARINC output terminal A -V POWER -12V to -15V GND POWER 0.0V +V POWER +12V to +15V BOUT OUTPUT ARINC output terminal B CB INPUT Connection for DATA (B) slew-rate capacitor DATA (B) INPUT Data input terminal B CLOCK INPUT Synchronizes data inputs V1 POWER +5V ±5% All Voltages referenced to GND, TA = Operating Temperature Range (unless otherwise specified) PARAMETER Differential Voltage Supply Voltage Voltage Reference Input Voltage Range SYMBOL VDIF CONDITIONS For ARINC 429 For Applications other than ARINC See Note: 1 Output Overvoltage Protection See Note: 2 Storage Temperature Range 40 V +10.8 to +16.5 -10.8 to -16.5 +5 ±10% +7 V V V +5 ±5% 0 to 6 6 6 V V > GND -0.3 < V1 +0.3 V V TA Hi-temp & Military Industrial -55 to +125 -40 to +85 °C °C TSTG Ceramic & Plastic -65 to +150 °C Lead Temperature Junction Temperature UNIT VIN Output Short-Circuit Duration Operating Temperature Range MAXIMUM Voltage between +V and -V terminals +V -V V1 VREF OPERATING RANGE Soldering, 10 seconds TJ +275 °C +175 °C Note 1. Heatsinking may be required for Output Short Circuit at +125°C and for 100KBPS at +125°C. Note 2. The fuses used for Output Overvoltage Protection may be blown by the presence of a voltage at either output that is greater than ±12.0V with respect to GND. (HI-3182, 3184 & 3187 only) NOTE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. HOLT INTEGRATED CIRCUITS 3 HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188 +V = +15V, -V = -15V, V1 = VREF = +5.0V, TA = Operating Temperature Range (unless otherwise specified). PARAMETER SYMBOL CONDITION No Load Output Voltage High (Output to Ground) ICCOP (+V) ICCOP (-V) ICCOP (V1) ICCOP (VREF) ISC (+V) ISC (-V) IOHSC IOLSC IIH IIL VIH VIL VOH No Load (0 -100KBPS) Output Voltage Low (Output to Ground) VOL No Load VNULL CIN No Load Supply Current +V (Operating) Supply Current -V (Operating) Supply Current V1 (Operating) Supply Current VREF (Operating) Supply Current +V (During Short Circuit Test) Supply Current -V (During Short Circuit Test) Output Short Circuit Current (Output High) Output Short Circuit Current (Output Low) Input Current (Input High) Input Current (Input Low) Input Voltage High Input Voltage Low Output Voltage Null Input Capacitance MIN TYP (0 - 100KBPS) No Load (0 - 100KBPS) No Load (0 - 100KBPS) No Load, VREF = 5V (0 - 100KBPS) Short to Ground (See Note: 1) Short to Ground (See Note: 1) Short to Ground VMIN=0 (See Note: 2) VMIN=0 (See Note: 2) Short to Ground MAX UNITS +16 -16 mA mA 500 -1.0 µA mA 150 mA -80 mA -150 mA +80 mA 1.0 -1.0 µA µA 2.0 V 0.5 V +VREF -.25 +VREF +.25 V (0 -100KBPS) -VREF -.25 -VREF +.25 V (0-100KBPS) -250 +250 mV 15 See Note 1 pF Note 1. Not tested, but characterized at initial device design and after major process and/or design change which affects this parameter. Note 2. Interchangeability of force and sense is acceptable. +V = +15V, -V = -15V, V1 = VREF = +5.0V, TA = Operating Temperature Range (unless otherwise specified). PARAMETER SYMBOL Rise Time ( A OUT , B OUT ) Fall Time ( A OUT , B OUT ) CONDITION MIN tR C A = C B = 75pF See Figure 3. 1.0 1.0 TYP MAX UNITS 2.0 µs tF C A = C B = 75pF See Figure 3. 2.0 µs Propagtion Delay Input to Output t PLH C A = C B = 75pF See Figure 3. 3.0 µs Propagtion Delay Input to Output t PHL C A = C B = 75pF See Figure 3. 3.0 µs DATA (B) 0V VREF AOUT 0V 2.0V 0.5V 50% DATA (A) 0V 50% 2.0V 0.5V ADJUST BY CA +4.75V to +5.25V ADJUST BY CA -VREF t PHL +VREF BOUT 0V -VREF 50% 50% t PLH -4.75V to -5.25V ADJUST BY CB -4.75V to -5.25V 2VREF tR +4.75V to +5.25V ADJUST BY CB HIGH DIFFERENTIAL OUTPUT 0V +9.5V to +10.5V NULL (AOUT - BOUT) NOTE: OUTPUTS UNLOADED tF -2VREF LOW Figure 3. SWITCHING WAVEFORMS HOLT INTEGRATED CIRCUITS 4 -9.5V to -10.5V HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188 HI-318X PACKAGE THERMAL CHARACTERISTICS MAXIMUM ARINC LOAD 3, 6 HEAT SINK ØJA (°C/W) SUPPLY CURRENT 2 14-pin Thermally Enhanced Plastic SOIC (ESOIC) Unsoldered 82 Soldered 16-pin Thermally Enhanced Plastic SOIC (ESOIC) PACKAGE STYLE 1 JUNCTION TEMPERATURE, Tj TA = 25oC TA = 85oC TA=125oC 20 mA 57°C 117°C 157°C 65 20 mA 51°C 111°C 151°C Unsoldered 51 20 mA 45°C 105°C 145°C Soldered 28 20 mA 36°C 96°C 136°C AOUT and B OUT Shorted to Ground 3, 4, 5, 6 HEAT SINK ØJA (°C/W) SUPPLY CURRENT 2 14-pin Thermally Enhanced Plastic SOIC (ESOIC) Unsoldered 82 Soldered 16-pin Thermally Enhanced Plastic SOIC (ESOIC) PACKAGE STYLE 1 JUNCTION TEMPERATURE, Tj TA = 25oC TA = 85oC TA=125oC 36 mA 87°C 147°C 187°C 65 36 mA 78°C 138°C 178°C Unsoldered 51 40 mA 64°C 124°C 164°C Soldered 28 40 mA 53°C 113°C 153°C Notes: 1. All data taken in still air on devices soldered to a single layer copper PCB (3" X 4.5" X .062"). 2. At 100% duty cycle, 15V power supplies. For 12V power supplies multiply all tabulated values by 0.8. 3. High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms, C = 10 nF. Data not presented for C = 30 nF as this is considered unrealistic for high speed operation. 4. Similar results would be obtained with AOUT shorted to BOUT. 5. For applications requiring survival with continuous short circuit, operation above Tj = 175°C is not recommended. 6. Data will vary depending on air flow and the method of heat sinking employed. HEAT SINK - ESOIC PACKAGES Both the 14-pin and 16-pin thermally enhanced SOIC packages are used for HI-318X products. These ESOIC packages include a metal heat sink located on the bottom surface of the device. This heat sink should be soldered down to the printed circuit board for optimum thermal dissipation. The heat sink is electrically isolated from the chip and can be soldered to any ground or power plane. However, since the chip’s substrate is at +V, connecting the heat sink to this power plane is recommended to avoid coupling noise into the circuit. HOLT INTEGRATED CIRCUITS 5 HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188 ADDITIONAL PIN CONFIGURATIONS (See page 1 for 14-Pin Small Outline SOIC) HI-3182PS, HI-3183PS, HI-3188PS 16 - V1 VREF - 1 GND (See Note * ) - 2 16 - PIN PLASTIC SMALL OUTLINE (ESOIC)** SYNC - 3 DATA(A) - 4 CA - 5 AOUT - 6 -V - 7 4 3 2 1 28 27 26 15 - N/C 14 - CLOCK 13 - DATA(B) 12 - CB 11 - BOUT 10 - N/C N/C DATA (A) N/C N/C CA N/C N/C 25 5 HI-3182PJ 24 HI-3183PJ 23 6 7 8 9 10 11 9 - +V GND - 8 28 - PIN PLASTIC PLCC 22 21 20 19 CLOCK N/C DATA (B) CB N/C N/C N/C 12 13 14 15 16 17 18 Notes: * Pin 2 may be left floating ** Thermally Enhanced SOIC package 4 29 28 27 26 25 24 23 22 21 CLOCK V1 N/C VREF STROBE SYNC N/C 30 HI-3182CJ HI-3183CJ 31 32 1 32 - PIN CERQUAD 2 3 4 5 6 16 - PIN CERAMIC DIP 19 18 17 16 15 14 N/C N/C +V GND N/C -V N/C 7 8 9 10 11 12 13 VREF 1 HI-3182CD HI-3183CD 20 STROBE 2 SYNC 3 DATA(A) 4 CA 5 AOUT 6 -V 7 GND 8 N/C 5 DATA (A) 6 N/C 7 N/C 8 CA 9 N/C 10 N/C 11 16 V1 15 N/C 14 CLOCK 13 DATA(B) 12 CB 11 BOUT 3 2 1 28 27 26 HI-3182CL HI-3183CL 25 28 - PIN CERAMIC LCC 22 16 - PIN CERDIP 10 N/C 9 +V HOLT INTEGRATED CIRCUITS 6 STROBE 2 SYNC 3 DATA(A) 4 CA 5 AOUT 6 -V 7 GND 8 CLOCK N/C DATA (B) CB 21 N/C 23 20 19 12 13 14 15 16 17 18 VREF 1 HI-3182CR HI-3183CR 24 N/C N/C 16 V1 15 N/C 14 CLOCK 13 DATA(B) 12 CB 11 BOUT 10 N/C 9 +V HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188 ORDERING INFORMATION PART PACKAGE TEMPERATURE BURN LEAD NUMBER HI-3182CDI HI-3182CDT HI-3182CDM DESCRIPTION 16 PIN CERAMIC SIDE BRAZED DIP 16 PIN CERAMIC SIDE BRAZED DIP 16 PIN CERAMIC SIDE BRAZED DIP RANGE -40°C TO +85°C -55°C TO +125°C -55°C TO +125°C RESISTANCE 37.5 37.5 37.5 FUSE YES YES YES FLOW I T M IN NO NO YES FINISH GOLD GOLD SOLDER HI-3182CJI HI-3182CJT 32 PIN J-LEAD CERQUAD 32 PIN J-LEAD CERQUAD -40°C TO +85°C -55°C TO +125°C 37.5 37.5 YES YES I T NO NO SOLDER SOLDER HI-3182CLI 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -40°C TO +85°C HI-3182CLT 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -55°C TO +125°C HI-3182CLM 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -55°C TO +125°C 37.5 37.5 37.5 YES YES YES I T M NO NO YES GOLD GOLD SOLDER HI-3182CRI 32 PIN CERDIP HI-3182CRT 32 PIN CERDIP -40°C TO +85°C -55°C TO +125°C 37.5 37.5 YES YES I T NO NO SOLDER SOLDER HI-3182PJI HI-3182PJT -40°C TO +85°C -55°C TO +125°C 37.5 37.5 YES YES I T NO NO SOLDER SOLDER HI-3182PSI 16 PIN PLASTIC SMALL OUTLINE - WB (ESOIC) HI-3182PST 16 PIN PLASTIC SMALL OUTLINE - WB (ESOIC) -40°C TO +85°C -55°C TO +125°C 37.5 37.5 YES YES I T NO NO SOLDER SOLDER HI-3183CDI -40°C TO +85°C 13 NO I NO GOLD HI-3183CDT 16 PIN CERAMIC SIDE BRAZED DIP HI-3183CDM 16 PIN CERAMIC SIDE BRAZED DIP -55°C TO +125°C -55°C TO +125°C 13 13 NO NO T M NO YES GOLD SOLDER HI-3183CJI HI-3183CJT -40°C TO +85°C -55°C TO +125°C 13 13 NO NO I T NO NO SOLDER SOLDER HI-3183CLI 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -40°C TO +85°C HI-3183CLT 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -55°C TO +125°C HI-3183CLM 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -55°C TO +125°C 13 13 13 NO NO NO I T M NO NO YES GOLD GOLD SOLDER HI-3183CRI 32 PIN CERDIP HI-3183CRT 32 PIN CERDIP -40°C TO +85°C -55°C TO +125°C 13 13 NO NO I T NO NO SOLDER SOLDER HI-3183PJI HI-3183PJT -40°C TO +85°C -55°C TO +125°C 13 13 NO NO I T NO NO SOLDER SOLDER HI-3183PSI 16 PIN PLASTIC SMALL OUTLINE - WB (ESOIC) HI-3183PST 16 PIN PLASTIC SMALL OUTLINE - WB (ESOIC) -40°C TO +85°C -55°C TO +125°C 13 13 NO NO I T NO NO SOLDER SOLDER HI-3184PSI 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) HI-3184PST 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) -40°C TO +85°C -55°C TO +125°C 37.5 37.5 YES YES I T NO NO SOLDER SOLDER HI-3185PSI 28 PIN PLASTIC J -LEAD PLCC 28 PIN PLASTIC J -LEAD PLCC 16 PIN CERAMIC SIDE BRAZED DIP 32 PIN J-LEAD CERQUAD 32 PIN J-LEAD CERQUAD 28 PIN PLASTIC J -LEAD PLCC 28 PIN PLASTIC J -LEAD PLCC 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) OUTPUT SERIES -40°C TO +85°C 37.5 NO I NO SOLDER HI-3185PST 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) -55°C TO +125°C 37.5 NO T NO SOLDER HI-3186PSI 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) HI-3186PST 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) -40°C TO +85°C -55°C TO +125°C 0 0 NO NO I T NO NO SOLDER SOLDER HI-3187PSI 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) HI-3187PST 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) -40°C TO +85°C -55°C TO +125°C 0 0 YES YES I T NO NO SOLDER SOLDER HI-3188PSI 16 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) HI-3188PST 16 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) -40°C TO +85°C -55°C TO +125°C 0 0 NO NO I T NO NO SOLDER SOLDER Legend: ESOIC - Thermally Enhanced Small Outline Package (SOIC w/built-in heat sink) NB - Narrow Body WB - Wide Body HOLT INTEGRATED CIRCUITS 7 HI-318X PACKAGE DIMENSIONS inches (millimeters) 14-PIN PLASTIC SMALL OUTLINE (ESOIC) - NB (Narrow Body, Thermally Enhanced) .00865 ± .00115 (.220 ± .029) .3406 ± .0039 (8.651 ± .099) .236 ± .008 (6.00 ± .20) Top View .110 TYP. (2.794) TYP. .1535 ± .0035 (3.899 ± .089) Package Type: 14H 14HNE .280 TYP. (7.112) TYP. Bottom View Detail A .0165 ± .0035 (.419 ± ..089) .061 ± .007 (1.549 ± .178) 0°° to 8°° .050 ± .010 (1.270 ± .254) .033 ± .017 (.838 ± .432) 16-PIN PLASTIC SMALL OUTLINE (ESOIC) - NB (Narrow Body, Thermally Enhanced) .00865 ± .00115 (.220 ± .029) .3898 ± .0039 (9.901 ± .099) .236 ± .008 (6.00 ± .20) Top View .0165 ± .0035 (.419 ± ..089) (Connect to any ground or power plane for optimum thermal dissipation) .0069 ± .0029 (.175 ± .074) Detail A Package Type: 16HNE .280 TYP. (7.112) TYP. Bottom View .110 TYP. (2.794) TYP. .1535 ± .0035 (3.899 ± .089) Electrically isolated metal heat sink on bottom of package Detail A .061 ± .007 (1.549 ± .178) Electrically isolated metal heat sink on bottom of package (Connect to any ground or power plane for optimum thermal dissipation) 0°° to 8°° .050 ± .010 (1.270 ± .254) .033 ± .017 (.838 ± .432) HOLT INTEGRATED CIRCUITS 8 Detail A .0069 ± .0029 (.175 ± .074) HI-318X PACKAGE DIMENSIONS inches (millimeters) 16-PIN PLASTIC SMALL OUTLINE (ESOIC) - WB (Wide Body, Thermally Enhanced) .0105 ± .0015 (.2667 ± .0381) .405 ± .008 (10.287 ± .203) .4065 ± .0125 (10.325 ± .318) Package Type: 16HWE .240 ± .010 (6.096 ± .254) .295 ± .004 (7.493 ± .102) Top View .190 ± .010 (4.826 ± .254) Bottom View Detail A Electrically isolated metal heat sink on bottom of package .090 ± .010 (2.286 ± .254) 0° to 8° .050 ± .010 (1.270 ± .254) (Connect to any ground or power plane for optimum thermal dissipation) .0025 ± .0015 (.0635 ± .0381) .0165 ± .0035 (.4191 ± .0889) .033 ± .017 (.838 ± .432) Detail A 16-PIN CERAMIC SIDE-BRAZED DIP Package Type: 16C .810 MAX (20.574 MAX) .295 ± .010 (7.493 ± .254) PIN 1 .200 MAX (5.080 MAX) .050 ± .005 (1.270 ± .127) .035 ± .010 (.889 ± .254) BASE PLANE .125 MIN (3.175 MIN) .018 ± .002 (.457 ± .051) .010 ± .002 (.254 ± .051) SEATING PLANE .100 BSC (2.540 BSC) HOLT INTEGRATED CIRCUITS 9 .300 ± .010 (7.620 ± .254) HI-318X PACKAGE DIMENSIONS inches (millimeters) 16-PIN CERDIP Package Type: 16D .790 MAX. (20.006 MAX.) .005 MIN. (.127 MIN.) .050 MAX. (1.27 MAX.) .288 ± .005 (7.315 ± .125) .100 ± .010 (2.54 ± .254) .056 TYP. (1.422 TYP.) .200 MAX. (5.080 MAX.) .310 ± .010 (7.874 ± .254) .180 MAX. (4.572 MAX.) .015 MIN. (.381 MIN.) .018 ± .003 (.457 ± .760) .125 MIN. (3.175 MIN.) 0° to 15° .010 ± .002 (.254 ± .051) 28-PIN PLASTIC PLCC Package Type: 28J PIN NO. 1 PIN NO. 1 IDENT .045 x 45° .045 x 45° .050 ± .005 (1.27 ± .127) .453 ± .003 (11.506 ± .076) SQ. .490 ± .005 (12.446 ± .127) SQ. .031 ± .005 (.787 ± .127) .017 ± .004 (.432 ± .102) SEE DETAIL A .009 .011 .173 ± .008 (4.394 ± .203) DETAIL A .410 ± .020 (10.414 ± .508) HOLT INTEGRATED CIRCUITS 10 .015 ± .002 (.381 ± .051) .020 MIN (.508 ΜΙΝ) R .025 .045 HI-318X PACKAGE DIMENSIONS inches (millimeters) 28-PIN CERAMIC LEADLESS CHIP CARRIER Package Type: 28S .020 INDEX (.508 INDEX) .080 ± .020 (2.032 ± .508) PIN 1 PIN 1 .050 ± .005 (1.270 ± .127) .451 ± .009 (11.455 ± .229) SQ. .050 BSC (1.270 BSC) .008R ± .006 (.203R ± .152) .025 ± .003 (.635 ± .076) .040 x 45° 3PLS (1.016 x 45° 3PLS) 32-PIN J-LEAD CERQUAD Package Type: 32U 31 32 1 2 .450 ± .008 (11.430 ± .203) .488 ± .008 (12.395 ± .203) .588 ± .008 (14.935 ± .203) .550 ± .009 (13.970 ± .229) .190 MAX. (4.826) MAX. .040 TYP. (1.016) TYP. .019 ± .003 .050 TYP. (.483 ± .076) (1.270) TYP. .520 ± .012 (13.208 ± .305) .083 ± .009 (2.108 ± .229) HOLT INTEGRATED CIRCUITS 11 .420 ± .012 (10.668 ± .305)