HOLTIC HI

HI-3182, HI-3183, HI-3184, HI-3185
HI-3186, HI-3187, HI-3188
March 2001
GENERAL DESCRIPTION
The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187 and
HI-3188 bus interface products are silicon gate CMOS devices
designed as a line driver in accordance with the ARINC 429 bus
specifications. In addition to being functional upgrades of Holt's
HI-8382 & HI-8383 products, they are also alternate sources for
the HS-3182 ( Intersil/Harris), the RM3182 (Fairchild /Raytheon)
and a variety of similar DEI/DDC line driver products.
PIN CONFIGURATION
VREF 1
14 V1
13 CLOCK
GND (See Note * ) 2
12 DATA (B)
SYNC 3
11 CB
DATA (A) 4
10 BOUT
CA 5
Inputs are provided for clocking and synchronization. These
signals are AND'd with the DATA inputs to enhance system
performance and allow the HI-318X series of products to be
used in a variety of applications. Both logic and synchronization
inputs feature built-in 2,000V minimum ESD input protection as
well as TTL and CMOS compatibility.
The differential outputs of the HI-318X series of products are
independently programmable to either the high speed or low
speed ARINC 429 output rise and fall time specifications through
the use of two external capacitors. The output voltage swing is
also adjustable by the application of an external voltage to the
VREF input. Products with 0, 13 or 37.5 ohm resistors in series
with each ARINC output are available. In addition, the HI-3182,
HI-3184 and HI-3187 products also have a fuse in series with
each output.
(Top View)
AOUT 6
9 +V
-V 7
8 GND
HI-3184PS, HI-3185PS, HI-3186PS
& HI-3187PS
14 - PIN PLASTIC SMALL OUTLINE (ESOIC)**
Notes: * Pin 2 may be left floating
** Thermally Enhanced SOIC Package
(See Page 5 for additional package pin configurations)
FUNCTION
The HI-318X series of line drivers are intended for use where
logic signals must be converted to ARINC 429 levels such as
when using an ASIC, the HI-8282 ARINC 429 Serial Transmitter/Dual Receiver, the HI-6010 ARINC 429 Transmitter/Receiver
or the HI-8783 ARINC Interface Device. Holt products are
readily available for both industrial and military applications.
Please contact the Holt Sales Department for additional
information.
+
FEATURES
ARINC 429 DIFFERENTIAL LINE DRIVER
! Low power CMOS
TRUTH TABLE
! TTL and CMOS compatible inputs
! Programmable output voltage swing
! Adjustable ARINC rise and fall times
SYNC CLOCK DATA(A) DATA(B) AOUT
BOUT COMMENTS
X
L
X
X
0V
0V
NULL
L
X
X
X
0V
0V
NULL
H
H
L
L
0V
0V
NULL
! Operates at data rates up to 100 Kbits
H
H
L
H
-VREF
+VREF
LOW
! Overvoltage protection
H
H
H
L
+VREF
-VREF
HIGH
! Industrial and Military temperature ranges
H
H
H
H
0V
0V
NULL
! Plastic 14 & 16-pin thermally enhanced SOIC
packages available
! Pin-for-Pin alternative for DEI/DDC/Intersil/Fairchild
applications
(DS3182 Rev. B )
HOLT INTEGRATED CIRCUITS
1
03/01
HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188
FUNCTIONAL DESCRIPTION
The SYNC and CLOCK inputs establish data synchronization
utilizing two AND gates, one for each data input. Each logic
input, including the power enable (STROBE) input, are
TTL/CMOS compatible.
Figure 1 illustrates a typical ARINC 429 bus application.
Three power supplies are necessary to operate the HI-3182;
typically +15V, -15V and +5V. The chip also works with ±12V
supplies. The +5V supply can also provide a reference
voltage that determines the output voltage swing. The
differential output voltage swing will equal 2VREF. If a value of
VREF other than +5V is needed, a separate +5V power supply
is required for pin V1.
The ARINC outputs can be put in a tri-state mode by applying
a logic high to the STROBE input pin. If this feature is not
being used, the pin should be tied to ground. The STROBE
function is not available in the 14 & 16-pin SOIC package
configurations where the pin is internally connected to
ground.
The ARINC outputs of the HI-3182, HI-3184 and HI-3187 are
protected by internal fuses capable of sinking between 800 900 mA for short periods of time (125µs).
+5V
With the DATA (A) input at a logic high and DATA (B) input at a
logic low, AOUT will switch to the +VREF rail and BOUT will
switch to the -VREF rail (ARINC HIGH state). With both data
input signals at a logic low state, the outputs will both switch to
0V (ARINC NULL state).
The driver output impedance, ROUT, is nominally 75, 26 or 0
ohms depending on the option chosen. The rise and fall times
of the outputs can be calibrated through the selection of two
external capacitor values that are connected to the CA and CB
input pins. Typical values for high-speed operation
(100KBPS) are CA = CB = 75pF and for low-speed operation
(12.5 to 14KBPS) CA = CB = 500pF.
+15V
VREF
V1
SYNC
CLOCK
DATA (A)
OUT
+V
INPUTS
TO ARINC BUS
DATA (B)
C
STROBE
GND
-V
B
C
The CA and CB pins swing between +5V and ground allowing
the switching of capacitor values with an external singlesupply analog switch.
-15V
Figure 1. ARINC 429 BUS APPLICATION
REF
+V
CA
Shorted on
HI-3186, HI-3187, HI-3188
DATA (A)
LEVEL SHIFTER
AND SLOPE
CONTROL (A)
CLOCK
24.5Ω
13Ω
FA
OUTPUT
DRIVER (A)
CL
SYNC
LEVEL SHIFTER
AND SLOPE
CONTROL (B)
DATA (B)
V1
24.5Ω
STROBE
GND
-V
FB
OUTPUT
DRIVER (B)
Shorted on
HI-3183, HI-3186
HI-3187, HI-3188
CURRENT
REGULATOR
13Ω
CB
Figure 2. FUNCTIONAL BLOCK DIAGRAM
HOLT INTEGRATED CIRCUITS
2
Shorted on
HI-3183, HI-3185
HI-3186, HI-3188
B OUT
RL
HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188
SYMBOL
FUNCTION
VREF
POWER
DESCRIPTION
Reference voltage used to determine the output voltage swing
STROBE
INPUT
A logic high tri-states the ARINC outputs. Not available in the 14-pin SOIC package (tied to GND internally).
SYNC
INPUT
Synchronizes data inputs
DATA (A)
INPUT
Data input terminal A
CA
INPUT
Connection for DATA (A) slew-rate capacitor
AOUT
OUTPUT
ARINC output terminal A
-V
POWER
-12V to -15V
GND
POWER
0.0V
+V
POWER
+12V to +15V
BOUT
OUTPUT
ARINC output terminal B
CB
INPUT
Connection for DATA (B) slew-rate capacitor
DATA (B)
INPUT
Data input terminal B
CLOCK
INPUT
Synchronizes data inputs
V1
POWER
+5V ±5%
All Voltages referenced to GND, TA = Operating Temperature Range (unless otherwise specified)
PARAMETER
Differential Voltage
Supply Voltage
Voltage Reference
Input Voltage Range
SYMBOL
VDIF
CONDITIONS
For ARINC 429
For Applications other than ARINC
See Note: 1
Output Overvoltage Protection
See Note: 2
Storage Temperature Range
40
V
+10.8 to +16.5
-10.8 to -16.5
+5 ±10%
+7
V
V
V
+5 ±5%
0 to 6
6
6
V
V
> GND -0.3
< V1 +0.3
V
V
TA
Hi-temp & Military
Industrial
-55 to +125
-40 to +85
°C
°C
TSTG
Ceramic & Plastic
-65 to +150
°C
Lead Temperature
Junction Temperature
UNIT
VIN
Output Short-Circuit Duration
Operating Temperature Range
MAXIMUM
Voltage between +V and -V terminals
+V
-V
V1
VREF
OPERATING RANGE
Soldering, 10 seconds
TJ
+275
°C
+175
°C
Note 1. Heatsinking may be required for Output Short Circuit at +125°C and for 100KBPS at +125°C.
Note 2. The fuses used for Output Overvoltage Protection may be blown by the presence of a voltage at either output that is greater
than ±12.0V with respect to GND. (HI-3182, 3184 & 3187 only)
NOTE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings
only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
HOLT INTEGRATED CIRCUITS
3
HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188
+V = +15V, -V = -15V, V1 = VREF = +5.0V, TA = Operating Temperature Range (unless otherwise specified).
PARAMETER
SYMBOL
CONDITION
No Load
Output Voltage High (Output to Ground)
ICCOP (+V)
ICCOP (-V)
ICCOP (V1)
ICCOP (VREF)
ISC (+V)
ISC (-V)
IOHSC
IOLSC
IIH
IIL
VIH
VIL
VOH
No Load
(0 -100KBPS)
Output Voltage Low (Output to Ground)
VOL
No Load
VNULL
CIN
No Load
Supply Current +V (Operating)
Supply Current -V (Operating)
Supply Current V1 (Operating)
Supply Current VREF (Operating)
Supply Current +V (During Short Circuit Test)
Supply Current -V (During Short Circuit Test)
Output Short Circuit Current (Output High)
Output Short Circuit Current (Output Low)
Input Current (Input High)
Input Current (Input Low)
Input Voltage High
Input Voltage Low
Output Voltage Null
Input Capacitance
MIN
TYP
(0 - 100KBPS)
No Load
(0 - 100KBPS)
No Load
(0 - 100KBPS)
No Load, VREF = 5V (0 - 100KBPS)
Short to Ground
(See Note: 1)
Short to Ground
(See Note: 1)
Short to Ground
VMIN=0 (See Note: 2)
VMIN=0 (See Note: 2)
Short to Ground
MAX UNITS
+16
-16
mA
mA
500
-1.0
µA
mA
150
mA
-80
mA
-150
mA
+80
mA
1.0
-1.0
µA
µA
2.0
V
0.5
V
+VREF
-.25
+VREF
+.25
V
(0 -100KBPS)
-VREF
-.25
-VREF
+.25
V
(0-100KBPS)
-250
+250
mV
15
See Note 1
pF
Note 1. Not tested, but characterized at initial device design and after major process and/or design change which affects this parameter.
Note 2. Interchangeability of force and sense is acceptable.
+V = +15V, -V = -15V, V1 = VREF = +5.0V, TA = Operating Temperature Range (unless otherwise specified).
PARAMETER
SYMBOL
Rise Time ( A OUT , B OUT )
Fall Time ( A OUT , B OUT )
CONDITION
MIN
tR
C A = C B = 75pF
See Figure 3.
1.0
1.0
TYP
MAX UNITS
2.0
µs
tF
C A = C B = 75pF
See Figure 3.
2.0
µs
Propagtion Delay Input to Output
t PLH
C A = C B = 75pF
See Figure 3.
3.0
µs
Propagtion Delay Input to Output
t PHL
C A = C B = 75pF
See Figure 3.
3.0
µs
DATA (B) 0V
VREF
AOUT 0V
2.0V
0.5V
50%
DATA (A) 0V
50%
2.0V
0.5V
ADJUST
BY CA
+4.75V to +5.25V
ADJUST
BY CA
-VREF
t PHL
+VREF
BOUT 0V
-VREF
50%
50%
t PLH
-4.75V to -5.25V
ADJUST
BY CB
-4.75V to -5.25V
2VREF
tR
+4.75V to +5.25V
ADJUST
BY CB
HIGH
DIFFERENTIAL
OUTPUT 0V
+9.5V to +10.5V
NULL
(AOUT - BOUT)
NOTE: OUTPUTS UNLOADED
tF
-2VREF
LOW
Figure 3. SWITCHING WAVEFORMS
HOLT INTEGRATED CIRCUITS
4
-9.5V to -10.5V
HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188
ADDITIONAL PIN CONFIGURATIONS (See page 1 for 14-Pin Small Outline SOIC)
HI-3182PS, HI-3183PS, HI-3188PS
16 - V1
VREF - 1
GND (See Note * ) - 2
16 - PIN
PLASTIC
SMALL
OUTLINE
(ESOIC)**
SYNC - 3
DATA(A) - 4
CA - 5
AOUT - 6
-V - 7
4 3 2 1 28 27 26
15 - N/C
N/C
DATA (A)
N/C
N/C
CA
N/C
N/C
14 - CLOCK
13 - DATA(B)
12 - CB
11 - BOUT
10 - N/C
25
5
HI-3182PJ 24
HI-3183PJ 23
6
7
8
10
11
9 - +V
GND - 8
28 - PIN
PLASTIC
PLCC
9
22
21
20
19
CLOCK
N/C
DATA (B)
CB
N/C
N/C
N/C
12 13 14 15 16 17 18
Notes: * Pin 2 may be left floating
** Thermally Enhanced SOIC package
4
29 28 27 26 25 24 23 22 21
CLOCK
V1
N/C
VREF
STROBE
SYNC
N/C
30
31
32
1
20
HI-3182CR
HI-3183CR
19
18
17
32 - PIN
CERQUAD
2
3
4
5 6
16
15
14
N/C 5
DATA (A) 6
N/C 7
N/C
N/C
+V
GND
N/C
-V
N/C
N/C 11
VREF 1
STROBE 2
16 - PIN
CERAMIC
DIP
SYNC 3
DATA(A) 4
CA 5
AOUT 6
-V 7
GND 8
15 N/C
14 CLOCK
13 DATA(B)
12 CB
11 BOUT
9 +V
HOLT INTEGRATED CIRCUITS
5
1 28 27 26
28 - PIN
CERAMIC
LCC
25
24
CLOCK
N/C
DATA (B)
CB
21 N/C
23
22
20
19
12 13 14 15 16 17 18
16 V1
10 N/C
2
HI-3182CL
HI-3183CL
N/C 8
CA 9
N/C 10
7 8 9 10 11 12 13
HI-3182CD
HI-3183CD
3
N/C
N/C
HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188
ORDERING INFORMATION
PART
PACKAGE
TEMPERATURE
NUMBER
HI-3182CDI
DESCRIPTION
16 PIN CERAMIC SIDE BRAZED DIP
RANGE
-40°C TO +85°C
RESISTANCE
37.5
FUSE
YES
HI-3182CDT 16 PIN CERAMIC SIDE BRAZED DIP
-55°C TO +125°C
37.5
YES
T
NO
GOLD
HI-3182CDM 16 PIN CERAMIC SIDE BRAZED DIP
-55°C TO +125°C
37.5
YES
M
YES
SOLDER
HI-3182CLI
OUTPUT SERIES
28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -40°C TO +85°C
FLOW
I
BURN
LEAD
IN
NO
FINISH
GOLD
37.5
YES
I
NO
GOLD
HI-3182CLT 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -55°C TO +125°C
37.5
YES
T
NO
GOLD
HI-3182CLM 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -55°C TO +125°C
37.5
YES
M
YES
SOLDER
HI-3182CRI
-40°C TO +85°C
37.5
YES
I
NO
SOLDER
HI-3182CRT 32 PIN J-LEAD CERQUAD
-55°C TO +125°C
37.5
YES
T
NO
SOLDER
HI-3182PJI
28 PIN PLASTIC J -LEAD PLCC
-40°C TO +85°C
37.5
YES
I
NO
SOLDER
HI-3182PJT
28 PIN PLASTIC J -LEAD PLCC
32 PIN J-LEAD CERQUAD
-55°C TO +125°C
37.5
YES
T
NO
SOLDER
HI-3182PSI 16 PIN PLASTIC SMALL OUTLINE - WB (ESOIC)
HI-3182PST 16 PIN PLASTIC SMALL OUTLINE - WB (ESOIC)
-40°C TO +85°C
-55°C TO +125°C
37.5
37.5
YES
YES
I
T
NO
NO
SOLDER
SOLDER
HI-3183CDI
-40°C TO +85°C
13
NO
I
NO
GOLD
-55°C TO +125°C
-55°C TO +125°C
13
13
NO
NO
T
M
NO
YES
GOLD
SOLDER
16 PIN CERAMIC SIDE BRAZED DIP
HI-3183CDT 16 PIN CERAMIC SIDE BRAZED DIP
HI-3183CDM 16 PIN CERAMIC SIDE BRAZED DIP
HI-3183CLI
13
NO
I
NO
GOLD
HI-3183CLT 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -55°C TO +125°C
HI-3183CLM 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -55°C TO +125°C
28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -40°C TO +85°C
13
13
NO
NO
T
M
NO
YES
GOLD
SOLDER
HI-3183CRI 32 PIN J-LEAD CERQUAD
HI-3183CRT 32 PIN J-LEAD CERQUAD
-40°C TO +85°C
-55°C TO +125°C
13
13
NO
NO
I
T
NO
NO
SOLDER
SOLDER
HI-3183PJI
28 PIN PLASTIC J -LEAD PLCC
-40°C TO +85°C
13
NO
I
NO
SOLDER
HI-3183PJT
28 PIN PLASTIC J -LEAD PLCC
-55°C TO +125°C
13
NO
T
NO
SOLDER
HI-3183PSI
16 PIN PLASTIC SMALL OUTLINE - WB (ESOIC)
-40°C TO +85°C
13
NO
I
NO
SOLDER
HI-3183PST 16 PIN PLASTIC SMALL OUTLINE - WB (ESOIC)
-55°C TO +125°C
13
NO
T
NO
SOLDER
HI-3184PSI 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC)
HI-3184PST 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC)
-40°C TO +85°C
-55°C TO +125°C
37.5
37.5
YES
YES
I
T
NO
NO
SOLDER
SOLDER
HI-3185PSI 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC)
HI-3185PST 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC)
-40°C TO +85°C
-55°C TO +125°C
37.5
37.5
NO
NO
I
T
NO
NO
SOLDER
SOLDER
HI-3186PSI
-40°C TO +85°C
0
NO
I
NO
SOLDER
HI-3186PST 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC)
14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC)
-55°C TO +125°C
0
NO
T
NO
SOLDER
HI-3187PSI
-40°C TO +85°C
0
YES
I
NO
SOLDER
HI-3187PST 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC)
14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC)
-55°C TO +125°C
0
YES
T
NO
SOLDER
HI-3188PSI 16 PIN PLASTIC SMALL OUTLINE - NB (ESOIC)
HI-3188PST 16 PIN PLASTIC SMALL OUTLINE - NB (ESOIC)
-40°C TO +85°C
-55°C TO +125°C
0
0
NO
NO
I
T
NO
NO
SOLDER
SOLDER
Legend: ESOIC - Thermally Enhanced Small Outline Package (SOIC w/built-in heat sink)
NB
- Narrow Body
WB
- Wide Body
HOLT INTEGRATED CIRCUITS
6
HI-318X PACKAGE DIMENSIONS
inches (millimeters)
14-PIN PLASTIC SMALL OUTLINE (ESOIC) - NB
(Narrow Body, Thermally Enhanced)
.00865 ± .00115
(.220 ± .029)
.3406 ± .0039
(8.651 ± .099)
.236 ± .008
(6.00 ± .20)
Top View
.110 TYP.
(2.794) TYP.
.1535 ± .0035
(3.899 ± .089)
Package Type: 14H
14HNE
.280 TYP.
(7.112) TYP.
Bottom
View
Heat sink stud
on bottom of
package
Detail A
.0165 ± .0035
(.419 ± ..089)
.061 ± .007
(1.549 ± .178)
0°° to 8°°
.050 ± .010
(1.270 ± .254)
.033 ± .017
(.838 ± .432)
16-PIN PLASTIC SMALL OUTLINE (ESOIC) - NB
(Narrow Body, Thermally Enhanced)
.00865 ± .00115
(.220 ± .029)
.3898 ± .0039
(9.901 ± .099)
.236 ± .008
(6.00 ± .20)
Top View
.0165 ± .0035
(.419 ± ..089)
Detail A
Package Type: 16HNE
.280 TYP.
(7.112) TYP.
Bottom
View
.110 TYP.
(2.794) TYP.
.1535 ± .0035
(3.899 ± .089)
Heat sink stud
on bottom of
package
Detail A
.061 ± .007
(1.549 ± .178)
0°° to 8°°
.050 ± .010
(1.270 ± .254)
.0069 ± .0029
(.175 ± .074)
.033 ± .017
(.838 ± .432)
HOLT INTEGRATED CIRCUITS
7
Detail A
.0069 ± .0029
(.175 ± .074)
HI-318X PACKAGE DIMENSIONS
inches (millimeters)
16-PIN PLASTIC SMALL OUTLINE (ESOIC) - WB
(Wide Body, Thermally Enhanced)
.0105 ± .0015
(.2667 ± .0381)
.405 ± .008
(10.287 ± .203)
.4065 ± .0125
(10.325 ± .318)
Package Type: 16HWE
.240 ± .010
(6.096 ± .254)
.295 ± .004
(7.493 ± .102)
Top View
.190 ± .010
(4.826 ± .254)
Bottom
View
Heat sink stud
on bottom of
package
Detail A
.090 ± .010
(2.286 ± .254)
0° to 8°
.050 ± .010
(1.270 ± .254)
.0025 ± .0015
(.0635 ± .0381)
.0165 ± .0035
(.4191 ± .0889)
.033 ± .017
(.838 ± .432)
Detail A
16-PIN CERAMIC SIDE-BRAZED DIP
Package Type: 16C
.810 MAX
(20.574 MAX)
.295 ± .010
(7.493 ± .254)
PIN 1
.200 MAX
(5.080 MAX)
.050 ± .005
(1.270 ± .127)
.035 ± .010
(.889 ± .254)
BASE
PLANE
.125 MIN
(3.175 MIN)
.018 ± .002
(.457 ± .051)
.010 ± .002
(.254 ± .051)
SEATING
PLANE
.100 BSC
(2.540 BSC)
HOLT INTEGRATED CIRCUITS
8
.300 ± .010
(7.620 ± .254)
HI-318X PACKAGE DIMENSIONS
inches (millimeters)
28-PIN PLASTIC PLCC
Package Type: 28J
PIN NO. 1
PIN NO. 1 IDENT
.045 x 45°
.045 x 45°
.050 ± .005
(1.27 ± .127)
.453 ± .003
(11.506 ± .076)
SQ.
.490 ± .005
(12.446 ± .127)
SQ.
.031 ± .005
(.787 ± .127)
.017 ± .004
(.432 ± .102)
SEE DETAIL
A
.009
.011
.173 ± .008
(4.394 ± .203)
DETAIL A
.410 ± .020
(10.414 ± .508)
.015 ± .002
(.381 ± .051)
.020 MIN
(.508 ΜΙΝ)
R .025
.045
28-PIN CERAMIC LEADLESS CHIP CARRIER
Package Type: 28S
.020 INDEX
(.508 INDEX)
.080 ± .020
(2.032 ± .508)
PIN 1
PIN 1
.050 ± .005
(1.270 ± .127)
.451 ± .009
(11.455 ± .229)
SQ.
.050 BSC
(1.270 BSC)
.008R ± .006
(.203R ± .152)
.040 x 45° 3PLS
(1.016 x 45° 3PLS)
HOLT INTEGRATED CIRCUITS
9
.025 ± .003
(.635 ± .076)
HI-318X PACKAGE DIMENSIONS
inches (millimeters)
32-PIN J-LEAD CERQUAD
Package Type: 32U
31
32
1
2
.450 ± .008
(11.430 ± .203)
.488 ± .008
(12.395 ± .203)
.588 ± .008
(14.935 ± .203)
.550 ± .009
(13.970 ± .229)
.190 MAX.
(4.826) MAX.
.040 TYP.
(1.016) TYP.
.019 ± .003
.050 TYP.
(.483 ± .076)
(1.270) TYP.
.520 ± .012
(13.208 ± .305)
.083 ± .009
(2.108 ± .229)
HOLT INTEGRATED CIRCUITS
10
.420 ± .012
(10.668 ± .305)