05156 P0408FC3.3C* thru P0408FC36C* . . . engineered solutions for the transient environment™ BIDIRECTIONAL FLIP CHIP APPLICATIONS ✔ Cellular Phones ✔ MCM Boards ✔ Wireless Communication Circuits ✔ IR LEDs ✔ SMART Cards & PCMCIA Cards IEC COMPATIBILITY (EN61000-4) 0408 ✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV ✔ 61000-4-4 (EFT): 40A - 5/50ns (Single Chip Shown) FEATURES ✔ ESD Protection > 25 kilovolts ✔ Available in Multiple Voltage Types Ranging From 3.3V to 36V ✔ 250 Watts Peak Pulse Power Dissipation per Line (8/20µs) ✔ Monolithic Structure MECHANICAL CHARACTERISTICS ✔ Standard EIA Chip Size: 0408 ✔ Weight 0.73 milligrams (Approximate) ✔ Flammability Rating UL 94V-0 ✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 ✔ Device Marking On Reel ✔ Top Contacts: Solder Bump 0.004” in Height (Nominal) CIRCUIT DIAGRAM * U.S. Patent No. Des. “D456,367 S” 05156.R2 11/02 1 www.protekdevices.com P0408FC3.3C* thru P0408FC36C* DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25°C Unless Otherwise Specified SYMBOL VALUE UNITS Peak Pulse Power (tp = 8/20µs) - See Figure 1 PPP 250 Watts Operating Temperature TJ -55°C to 150°C °C TSTG -55°C to 150°C °C PARAMETER Storage Temperature ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified PART NUMBER (See Note 1) RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM CLAMPING VOLTAGE (See Fig. 2) VWM VOLTS @ 1mA V(BR) VOLTS @ IP = 1A VC VOLTS 3.3 5.0 8.0 12.0 15.0 24.0 36.0 4.0 6.0 8.5 13.3 16.7 26.7 40.0 7.0 9.8 13.4 19.0 24.0 43.0 64.0 P0408FC3.3C P0408FC05C P0408FC08C P0408FC12C P0408FC15C P0408FC24C P0408FC36C MAXIMUM LEAKAGE CURRENT TYPICAL CAPACITANCE @8/20µs VC @ IPP @VWM ID µA 0V @ 1 MHz C pF 12.5V @ 20A 14.7V @ 17A 19.2V @ 13A 29.7V @ 9.0A 35.7V @ 7.0A 55.0V @ 5.0A 84.0V @ 3.0A 75 10 10 1 1 1 1 150 100 75 50 40 30 25 Note 1: All devices are bidirectional. Electrical characteristics apply in both directions. FIGURE 1 PEAK PULSE POWER VS PULSE TIME 120 1,000 250W, 8/20µs Waveform 100 IPP - Peak Pulse Current - % of IPP PPP - Peak Pulse Current - Watts 10,000 10 0.01 FIGURE 2 PULSE WAVE FORM tf 100 Peak Value IPP 80 e-t TEST WAVEFORM PARAMETERS tf = 8µs td = 20µs 60 40 td = t I /2 PP 20 0 1 10 td - Pulse Duration - µs 100 1,000 0 5 10 15 t - Time - µs 20 25 * U.S. Patent No. Des. “D456,367 S” 05156.R2 11/02 2 www.protekdevices.com 30 P0408FC3.3C* thru P0408FC36C* GRAPHS FIGURE 3 POWER DERATING CURVE 100 Peak Pulse Power 8/20µs 80 % Of Rated Power FIGURE 4 REFLOW SOLDER PROFILE 225°C 5-10 sec 60 200°C Instantaneous to 200°C 40 1-2 Minutes to 150°C 20 1-2 Minutes to 25°C 100°C Average Power 0 0 25 50 75 100 125 TL - Lead Temperature - °C 150 Pre-Heat Time Soldering Time Cool Down Time Note: This reflow profile does not take into account the printed circuit board (PCB) material heating time. Additional time may be required for the preheat time and cool down time upon the PCB or board material. FIGURE 5 OVERSHOOT & CLAMPING VOLTAGE FOR P0408FC05C 40 5 Volts per Division 30 20 10 0 ESD Test Pulse - 12 kilovolt, 1/30ns (waveshape) FIGURE 6 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR P0408FC05C VC - Clamping Voltage - Volts 14 12 10 8 6 4 2 0 0 5 10 15 20 IPP - Peak Pulse Current - Amps * U.S. Patent No. Des. “D456,367 S” 05156.R2 11/02 3 www.protekdevices.com P0408FC3.3C* thru P0408FC36C* PACKAGE OUTLINE & DIMENSIONS PACKAGE OUTLINE 0408 Picture Not Available PACKAGE DIMENSIONS SIDE A B C G TOP E F H END I DIM MILLIMETERS INCHES A 0.56 NOM 0.022 NOM B 0.86 NOM 0.034 NOM C 0.99 ± 0.0254 0.039 ± 0.001 E 0.15 SQ 0.006 SQ F 2.0 ± 0.0254 0.079 ± 0.001 G 0.15 NOM 0.006 NOM H 0.127 MAX 0.005 MAX I MOUNTING PAD - Option 1 PAD DIMENSIONS DIM Millimeters D A C 0.51 0.30 0.46 0.20 0.15 SQ 0.71 0.99 0.5 Inches 0.020 0.012 0.018 0.008 0.006 SQ 0.028 0.039 0.02 0.003 MIN 0.406 NOM 0.016 NOM NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). TAPE & REEL ORIENTATION NOTE: Preferred: Using 0.1mm (0.004”) stencil. H G E DIE SOLDER BUMP A C D E F G H I 0.076 MIN I F Quad Die - 0408 SOLDER PADS NOTE: 1. Top view of tape. Solder bumps are face down in tape package. SOLDER PRINT 0.010” - 0.012” DIA. SOLDER MASK 06021 Rev 3 - 11/02 TAPE & REEL ORDERING INFORMATION: Surface mount product is taped and reeled in accordance with EIA-481. Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., P0408FC05C-T75-1). Paper Tape: 7 Inch Reels - 10,000 pieces per reel. Ordering Suffix: -T710-2 (i.e., P0408FC05C-T710-2). * U.S. Patent No. Des. “D456,367 S” 05156.R2 11/02 4 www.protekdevices.com P0408FC3.3C* thru P0408FC36C* PACKAGE OUTLINE & DIMENSIONS MOUNTING PAD LAYOUT - Option 2 COPPER CONTACT 0.009” [0.23] DIA. PAD DIMENSIONS A DIE SOLDER BUMP DIM Millimeters Inches A F 0.51 0.15 SQ 0.020 0.006 SQ G H 0.71 0.99 0.028 0.039 I 0.51 0.020 H G NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). 3. Preferred: Using 0.1mm (0.004”) I F stencil. SOLDER PRINT 0.014” [0.36] DIA. SOLDER MASK 06021 Rev 3 - 11/02 COPYRIGHT © ProTek Devices 2003 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: [email protected] Web Site: www.protekdevices.com * U.S. Patent No. Des. “D456,367 S” 05156.R2 11/02 5 www.protekdevices.com