05170 ULC0408FC3.3C thru ULC0408FC24C . . . engineered solutions for the transient environment™ BIDIRECTIONAL UNBUMPED LOW CAPACITANCE FLIP CHIP APPLICATIONS ✔ Cellular Phones ✔ Handheld Electronics ✔ Personal Digital Assistants (PDAs) ✔ Notebook Computers ✔ SMART Cards IEC COMPATIBILITY (EN61000-4) U0408 ✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV ✔ 61000-4-4 (EFT): 40A - 5/50ns (Single Chip Shown) FEATURES ✔ ESD Protection > 25 kilovolts ✔ Available in Six Voltage Types Ranging From 3.3V to 24V ✔ 200 Watts Peak Pulse Power per Line (8/20µs) ✔ Low Clamping Voltage ✔ Monolithic Structure ✔ LOW CAPACITANCE ✔ LOW STANDBY CURRENT MECHANICAL CHARACTERISTICS ✔ Standard EIA Chip Size: 0408 ✔ Weight 0.73 milligrams (Approximate) ✔ Flammability Rating UL 94V-0 ✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 ✔ Device Marking On Reel CIRCUIT DIAGRAM 5170.R1 11/02 1 www.protekdevices.com ULC0408FC3.3C thru ULC0408FC24C DEVICE CHARACTERISTICS MAXIMUN RATINGS @ 25°C Unless Otherwise Specified SYMBOL VALUE UNITS Peak Pulse Power (tp = 8/20µs) - See Figure 1 PPP 200 Watts Operating Temperature TJ -55°C to 150°C °C TSTG -55°C to 150°C °C PARAMETER Storage Temperature ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified PART NUMBER (See Note 1) ULC0408FC3.3C ULC0408FC05C ULC0408FC08C ULC0408FC12C ULC0408FC15C ULC0408FC24C RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM CLAMPING VOLTAGE (See Fig. 2) VWM VOLTS @ 1mA V(BR) VOLTS @ IP = 1A VC VOLTS 3.3 5.9 8.0 12.0 15.0 24.0 4.0 6.0 8.0 13.3 16.7 26.7 7.0 11.0 13.2 19.8 25.4 37.2 MAXIMUM LEAKAGE CURRENT TYPICAL CAPACITANCE @8/20µs VC @ IPP @VWM ID µA 0V @ 1 MHz C pF 12.5V @ 16A 13V @ 15A 18V @ 11A 26.9V @ 7.4A 34.5V @ 5.8A 50.6V @ 4A 75 10 1 1 1 1 70 35 32 30 25 20 Note 1: All devices are bidirectional. Electrical characteristics apply in both directions. Electrical characteristics for the 3V, 8V, 12V, 15V and 24V devices are preliminary. FIGURE 1 PEAK PULSE POWER VS PULSE TIME 120 IPP - Peak Pulse Current - % of IPP PPP - Peak Pulse Current - Watts 10,000 1,000 200W, 8/20µs Waveform 100 10 0.01 5170.R1 11/02 FIGURE 2 PULSE WAVE FORM tf 100 Peak Value IPP 80 e-t TEST WAVEFORM PARAMETERS tf = 8µs td = 20µs 60 40 td = t I /2 PP 20 0 1 10 100 td - Pulse Duration - µs 1,000 10,000 2 0 5 10 15 t - Time - µs 20 25 www.protekdevices.com 30 ULC0408FC3.3C thru ULC0408FC24C GRAPHS FIGURE 3 POWER DERATING CURVE 100 Peak Pulse Power 8/20µs 80 % Of Rated Power FIGURE 4 REFLOW SOLDER PROFILE 225°C 5-10 sec 60 200°C Instantaneous to 200°C 40 1-2 Minutes to 150°C 20 1-2 Minutes to 25°C 100°C Average Power 0 0 25 50 75 100 125 TL - Lead Temperature - °C 150 Pre-Heat Time Soldering Time Cool Down Time Note: This reflow profile does not take into account the printed circuit board (PCB) material heating time. Additional time may be required for the preheat time and cool down time upon the PCB or board material. FIGURE 5 OVERSHOOT & CLAMPING VOLTAGE FOR ULC0408FC05C 40 5 Volts per Division 30 20 10 0 ESD Test Pulse - 12 kilovolt, 1/30ns (waveform) FIGURE 6 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT VC - Clamping Voltage - Volts 14 12 10 ULC0408FC05C 8 6 4 2 0 0 5 10 15 20 IPP - Peak Pulse Current - Amps 5170.R1 11/02 3 www.protekdevices.com ULC0408FC3.3C thru ULC0408FC24C PACKAGE OUTLINE & DIMENSIONS PACKAGE OUTLINE U0408 Picture Not Available PACKAGE DIMENSIONS SIDE A B C TOP E DIM MILLIMETERS INCHES A 0.56 NOM 0.022 NOM B 0.86 NOM 0.034 NOM C 0.99 ± 0.0254 0.039 ± 0.001 E 0.15 SQ 0.006 SQ F 2.0 ± 0.0254 0.079 ± 0.001 I 0.406 NOM 0.016 NOM F Metalized Die Contact END I MOUNTING PAD - Option 1 PAD DIMENSIONS DIM Millimeters D A C 0.51 0.30 0.46 0.20 0.15 SQ 0.71 0.99 0.5 Inches 0.020 0.012 0.018 0.008 0.006 SQ 0.028 0.039 0.02 TAPE & REEL ORIENTATION NOTE: Preferred: Using 0.1mm (0.004”) stencil. H G E DIE SOLDER CONTACT A C D E F G H I NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). I F Quad Die - 0408 SOLDER PADS NOTE: 1. Top view of tape. Solder bumps are face down in tape package. SOLDER PRINT 0.010” - 0.012” DIA. SOLDER MASK 06026 Rev 2 - 11/02 TAPE & REEL ORDERING INFORMATION: Surface mount product is taped and reeled in accordance with EIA-481. Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., ULC0408FC05C-T75-1). Paper Tape: 7 Inch Reels - 10,000 pieces per reel. Ordering Suffix: -T710-2 (i.e., ULC0408FC05C-T710-2). 5170.R1 11/02 4 www.protekdevices.com ULC0408FC3.3C thru ULC0408FC24C PACKAGE OUTLINE & DIMENSIONS MOUNTING PAD LAYOUT - Option 2 COPPER CONTACT 0.009” [0.23] DIA. PAD DIMENSIONS A DIE SOLDER CONTACT DIM Millimeters Inches A F 0.51 0.15 SQ 0.020 0.006 SQ G H 0.71 0.99 0.028 0.039 I 0.51 0.020 H G NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). 3. Preferred: Using 0.1mm (0.004”) I F stencil. SOLDER PRINT 0.014” [0.36] DIA. SOLDER MASK 06026 Rev 2 - 11/02 COPYRIGHT ® ProTek Devices 2003 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. 5170.R1 11/02 5 ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: [email protected] Web Site: www.protekdevices.com www.protekdevices.com