ETC HY514404ALJ60

HY514404A
1Mx4, Extended Data Out mode
DESCRIPTION
This family is a 4M bit dynamic RAM organized 1,048,576 x 4-bit configuration with Extended Data Out mode CMOS
DRAMs. Extended data out mode is a kind of page mode which is useful for the read operation. The circuit and process
design allow this device to achieve high performance and low power dissipation. Optional features are access time(50, 60
or 70ns) and package type(SOJ, TSOP-II) and power consumption (Normal or Low power with self refresh). Hyundai’s
advanced circuit design and process technology allow this device to achieve high bandwidth, low power consumption and
high reliability.
FEATURES
Ÿ Extended data out operation
Ÿ Read-modify-write Capability
Ÿ TTL compatible inputs and outputs
Ÿ /CAS-before-/RAS, /RAS-only, Hidden and
Self refresh capability
Ÿ Max. Active power dissipation
Ÿ JEDEC standard pinout
Ÿ 20/26-pin SOJ (300mil)
20/26-pin TSOP-II (300mil)
Ÿ Single power supply of 5V ± 10%
Ÿ Early Write or output enable controlled write
Ÿ Fast access time and cycle time
Speed
Power
Speed
tRAC
tCAC
tHPC
50
605mW
50
50ns
13ns
20ns
60
495mW
60
60ns
15ns
25ns
70
412mW
70
70ns
20ns
30ns
Ÿ Refresh cycle
Part number
Refresh
Normal
SL-part
HY514404A
1K
16ms
128ms
ORDERING INFORMATION
Part Name
Refresh
HY514404AJ
1K
HY514404ALJ
1K
HY514404AT
1K
HY514404ALT
1K
Power
Package
20/26Pin SOJ
L-part
20/26Pin SOJ
20/26Pin TSOP-II
L-part
20/26Pin TSOP-II
*SL : Low power with self refresh
This document is a general product description and is subject to change without notice. Hyundai electronics does not assume any responsibility for use of
circuits described. No patent licences are implied
Hyundai Semiconductor
Rev.10 / Jan.97
1
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HY514404A
FUNCTIONAL BLOCK DIAGRAM
DQ0 ~ DQ3
4
8
Data Input Buffer
WE
CAS
OE
Data Output Buffer
4
4
CAS Clock
Generator
4
A0
Cloumn
Predecoder
(10)
A1
10
Column Decoder
A3
A4
A5
A6
Address Buffer
A2
Sense Amp
I/O Gate
Refresh Controller
Refresh Counter
(10)
Row
Decoder
A7
A8
A9
RAS
Memory Array
1,048,576 x 4
10
Row Predecoder
(10)
RAS Clock
Generator
Substrate Bias
Generator
1Mx4,EDO DRAM
Rev.10 / Jan.97
2
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VCC
VSS
HY514404A
PIN CONFIGURATION (Marking Side)
DQ0
1
26
VSS
DQ0
1
26
VSS
DQ1
2
25
DQ3
DQ1
2
25
DQ3
WE
3
24
DQ2
WE
3
24
DQ2
RAS
4
23
CAS
RAS
4
23
CAS
A9
5
22
OE
A9
5
22
OE
A0
9
18
A8
A0
9
18
A8
A1
10
17
A7
A1
10
17
A7
A2
11
16
A6
A2
11
16
A6
A3
12
15
A5
A3
12
15
A5
Vcc
13
14
A4
Vcc
13
14
A4
20/26 Pin Plastic SOJ (300mil)
20/26 Pin Plastic TSOP- II (300mil)
PIN DESCRIPTION
Pin Name
Parameter
/RAS
Row Address Strobe
/CAS
Column Address Strobe
/WE
Write Enable
/OE
Output Enable
A0~A9
Address Input
DQ0~DQ3
Data In/Out
Vcc
Power (5V)
Vss
Ground
1Mx4,EDO DRAM
Rev.10 / Jan.97
3
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HY514404A
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Rating
Unit
TA
Ambient Temperature
0 to 70
°C
TSTG
Storage Temperature
-55 to 150
°C
VIN, VOUT
Voltage on Any Pin relative to VSS
-1.0 to 7.0
V
VCC
Voltage on VCC relative to VSS
-1.0 to 7.0
V
IOS
Short Circuit Output Current
50
mA
PD
Power Dissipation
0.9
W
TSOLDER
Soldering Temperature Ÿ Time
260 Ÿ 10
°C Ÿ sec
Note : Operation at or above Absolute Maximum Ratings can adversely affect device reliability
RECOMMENDED DC OPERATING CONDITIONS
(TA = 0°C to 70°C )
Symbol
Parameter
Min
Typ
Max
UNIT
VCC
Power Supply Voltage
4.5
5.0
5.5
V
VIH
Input High Voltage
2.4
-
VCC+1.0
V
VIL
Input Low Voltage
-1.0
-
0.8
V
Note : All voltages are referenced to VSS.
DC OPERATING CHARACTERISTICS
Symbol
Parameter
Test condition
Min
Max
Unit
ILI
Input Leakage Current
(Any input)
VSS ≤ VIN ≤ VCC + 1.0
All other pins not under test = VSS
-10
10
µA
ILO
Output Leakage Current
(Any input)
VSS ≤ VOUT ≤ VCC
/RAS & /CAS at VIH
-10
10
µA
VOL
Output Low Voltage
IOL = 4.2mA
-
0.4
V
VOH
Output High Voltage
IOH = -5.0mA
2.4
-
V
1Mx4,EDO DRAM
Rev.10 / Jan.97
4
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HY514404A
DC CHARACTERISTICS
(TA = 0°C to 70°C , VCC = 5V ± 10%, VSS = 0V, unless otherwise noted.)
Symbol
Parameter
Test condition
Speed
Max.
Unit
50
60
70
100
90
75
mA
2
mA
ICC1
Operating Current
/RAS, /CAS Cycling
tRC = tRC(min)
ICC2
TTL Standby
Current
/RAS, /CAS ≥ VIH(min)
Other inputs ≥ VSS
ICC3
/RAS-only Refresh
Current
/RAS Cycling,/CAS = VIH
tRC = tRC(min)
50
60
70
110
90
75
mA
ICC4
EDO mode Current
/CAS Cycling, /RAS = VIL
tHPC = tHPC(min)
50
60
70
115
90
75
mA
ICC5
CMOS Standby
Current
/RAS = /CAS ≥ VCC - 0.2V
SL-part
1
200
mA
µA
ICC6
/CAS-before-/RAS
Refresh Current
/RAS & /CAS = 0.2V
tRC = tRC(min.)
50
60
70
95
80
65
mA
ICC7
Battery Back-up
Current (L-part)
tRC=125µs
/CAS = CBR cycling or 0.2V
/OE & /WE = VCC - 0.2V
Address = Vcc-0.2V or 0.2V
DQ0~DQ9 = Vcc-0.2, 0.2V or Open
tRAS ≤
300ns
300
tRAS Ε
1µs
400
µA
Note
1. ICC1, ICC3, ICC4, ICC6 and ICC6 depend on output loading and cycle rates(tRC and tHPC).
2. Specified values are obtained with output unloaded.
3. ICC is specified as an average current. In ICC1, ICC3, ICC6, address can be changed only once while /RAS=VIL. In ICC4,
address can be changed maximum once while /CAS=VIH withen one EDO mode cycle time tHPC.
4. Only tRAS(max) = 1µs is applied to refresh of battery backup but tRAS(max) = 10µs is to applied to normal functional
operation.
5. Icc5(max.), Icc7 are applied to L-part only.
1Mx4,EDO DRAM
Rev.10 / Jan.97
5
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HY514404A
AC CHARACTERISTICS
(TA = 0 °C to 70 °C, VCC = 5V ± 10% , VSS = 0V, unless otherwise noted.)
60ns
50ns
Symbol
70ns
Parameter
Unit
Min
Max
Min
Max
Min
Max
Note
tRC
Random read or write cycle time
85
-
105
-
125
-
ns
tRWC
Read-modify-write cycle time
120
-
142
-
167
-
ns
tHPC
EDO mode cycle time
20
-
25
-
30
-
ns
tHPRWC
EDO mode read-modify-write cycle time
62
-
73
-
85
-
ns
tRAC
Access time from /RAS
-
50
-
60
-
70
ns
4,9,10
tCAC
Access time from /CAS
-
13
-
15
-
20
ns
4,9
tAA
Access time from column address
-
25
-
30
-
35
ns
4,10
tCPA
Access time from /CAS precharge
-
30
-
35
-
35
ns
4,15
tCLZ
/CAS to output low impedance
0
-
0
-
0
-
ns
4
tT
Transition time(rise and fall)
2.5
50
2.5
50
2.5
50
ns
3
tRP
/RAS precharge time
30
-
40
-
50
-
ns
tRAS
/RAS pulse width
50
10K
60
10K
70
10K
ns
tRASP
/RAS pulse width(EDO mode)
50
100K
60
100K
70
100K
ns
tRSH
/RAS hold time
13
-
15
-
13
-
ns
tCSH
/CAS hold time
40
-
40
-
50
-
ns
tCAS
/CAS pulse width
8
10K
10
10K
15
10K
ns
tRCD
/RAS to /CAS delay time
20
37
20
45
20
50
ns
9
tRAD
/RAS to column address delay time
15
25
15
30
15
35
ns
10
tCRP
/CAS to /RAS precharge time
5
-
5
-
5
-
ns
15
tCP
/CAS precharge time
7
-
10
-
10
-
ns
17
tASR
Row address set-up time
0
-
0
-
0
-
ns
tRAH
Row address hold time
10
-
10
-
10
-
ns
tASC
Column address set-up time
0
-
0
-
0
-
ns
14
tCAH
Column address hold time
8
-
10
-
15
-
ns
14
tRAL
Column address to /RAS lead time
25
-
30
-
35
-
ns
tRCS
Read command set-up time
0
-
0
-
0
-
ns
14
tRCH
Read command hold time referenced to /CAS
0
-
0
-
0
-
ns
6,14
tRRH
Read command hold time referenced to /RAS
0
-
0
-
0
-
ns
6
tWCH
Write command hold time
8
-
10
-
15
-
ns
14
tWP
Write command pulse width
10
-
10
-
10
-
ns
tRWL
Write command to /RAS lead time
13
-
15
-
15
-
ns
1Mx4,EDO DRAM
Rev.10 / Jan.97
6
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HY514404A
AC CHARACTERISTICS
Continued
60ns
50ns
Symbol
70ns
Parameter
Min
Max
Min
Max
Min
Max
Unit
Note
tCWL
Write command to /CAS lead time
8
-
10
-
15
-
ns
16
tDS
Data-in set-up time
0
-
0
-
0
-
ns
7
tDH
Data-in hold time
8
-
10
-
15
-
ns
7
Refresh period(1024 cycles)
16
-
16
-
16
-
ms
12
Refresh period(L-part)
128
-
128
-
128
-
ms
11
tREF
tWCS
Write command set-up time
0
-
0
-
0
-
ns
8,14
tCWD
/CAS to /WE delay time
33
-
37
-
45
-
ns
8
tRWD
/RAS to /WE delay time
70
-
80
-
95
-
ns
8
tAWD
Column address to /WE delay time
45
-
50
-
60
-
ns
8
tCSR
/CAS set-up time(CBR cycle)
5
-
5
-
5
-
ns
14
tCHR
/CAS hold time(CBR cycle)
10
-
10
-
10
-
ns
15
tRPC
/RAS to /CAS precharge time
5
-
5
-
5
-
ns
14
tCPT
/CAS precharge time(CBR counter test)
25
-
30
-
35
-
ns
17
tROH
/RAS hold time referenced to /OE
10
-
10
-
10
-
ns
tOEA
/OE access time
-
13
-
15
-
20
ns
tOED
/OE to data delay
13
-
15
-
20
-
ns
tOEZ
Output buffer turn-off delay time from /OE
0
13
0
15
0
15
ns
tOEH
/OE command hold time
13
-
15
-
20
-
ns
tCPWD
/WE delay time from /CAS precharge
50
-
55
-
65
-
ns
tRHCP
/RAS hold time from /CAS precharge
30
-
35
-
40
-
ns
tWRP
/WE to /RAS Precharge time (CBR Cycle)
10
-
10
-
10
-
ns
tWRH
/WE to /RAS Hold time(CBR Cycle)
10
-
10
-
10
-
ns
tRPS
/RAS Precharge Time
85
-
105
-
125
-
ns
tDOH
Output Data Hold Time
5
-
5
-
5
-
ns
tREZ
Output Buffer Turn Off Delay Time from /RAS
0
13
0
15
0
15
ns
tWEZ
Output Buffer Turn Off Delay Time from /WE
3
13
0
15
0
15
ns
tOEP
/OE Pulse Width
10
-
10
-
10
-
ns
tOCH
/OE to /CAS Hold Time
0
-
0
-
0
-
ns
tCHO
/CAS Hold Time to /OE
5
-
5
-
7
-
ns
tWED
/WE to Data Delay Time
13
-
15
-
15
-
ns
tWPE
/WE Pulse Width for Output Dsiable when /CASS
High
10
-
10
-
10
-
ns
1Mx4,EDO DRAM
Rev.10 / Jan.97
7
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5
8
HY514404A
NOTE
1. An initial pause of 200µs is required after power-up followed by 8 /RAS only refresh cycles before proper
device operation is achieved. In case of using internal refresh counter, a minimum of 8 CBR refresh cycles instead of
8 /RAS-only refresh cycles are required.
2. If /RAS=Vss during power-up,the HY514404A could begin an active cycle. This condition results in higher current than
necessary current which is demanded from the power supply during power-up. It is recommended that /RAS and /CAS
track with Vcc during power-up or be held at a valid VIH in other to minimize the power-up current.
3. VIH(min.) and VIL(max.) are reference levels for measuring timing of input signals. Transition times are measured
between VIH(min.) and VIL(max.),and are assumed to be 5ns for all inputs.
4. Measured at VOH=2.0V and VOL=0.8V with a load equivalent to 2TTL loads and 100pF.
5. tOFF(max.) and tOEZ define the time at which the output achieves the open circuit condition and is not referenced to
output voltage levels.
6. Either tRCH or tRRH must be satisfied for a read cycle.
7. t CEZ and t OEZ define the time at which the output achieves the open circuit condition and is not referenced
to output voltage levels.
8. tWCS, tRWD, tCWD, tAWD and tCPWD are not restrictive operating parameters. They are included in the data sheet as
electrical characteristics only. If tWCS ≥ tWCS(min.), the cycle is an early write cycle and data out pin will remain open
circuit (high impedance) through the entire cycle. If tRWD ≥ tRWD(min.), tCWD ≥ tCWD(min.), tAWD ≥ tAWD(min), and tCPWD ≥
tCPWD(min.), the cycle is a read-modify-write cycle and data out will contain data read from the selected cell. If neither
of the above sets of conditions is satisfied, the condition of the data out (at access time) is indeterminate.
9. Operation within the tRCD(max.) limit ensures that tRAC(max.) can be met. tRCD(max.) is specified as a reference point only.
If tRCD is greater than the specified tRCD(max.) limit, then access time is controlled by tCAC.
10.Operation within the tRAD(max.) limit ensures that tRAC(max.) can be met. tRAD(max.) is specified as a reference point only.
If tRAD is greater than the specified tRAD(max.) limit, then access time is controlled by tAA.
11.tREF(max.)=128ms is applied to L-parts only.
12.A burst of 1024 CBR refresh cycles must be executed within 16ms (128ms for SL-part) after exiting self refresh.
13.When CAS goes low at the same time, 4bits data are written into the device.
14.These parameters are determined by the earlier falling edge of /CAS.
15.These parameters are determined by the later rising edge of /CAS.
16.tCWL must be satisfied by /CAS for 4bits access cycle.
17.tCP and tCPT are measured when /CAS and is high state.
CAPACITANCE
(TA = 25°C, VCC = 5V ± 10%, VSS = 0V and f=1MHz, unless otherwise noted.)
Symbol
Parameter
Typ.
Max
Unit
CIN1
Input Capacitance (A0~A8)
-
5
pF
CIN2
Input Capacitance (/RAS, /CAS, /WE, /OE)
-
7
pF
CDQ
Data Input / Output Capacitance (DQ0~DQ3)
-
7
pF
1Mx4 EDO DRAM
Rev.10 / Jan.97
8
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