ETC SN74LS673

SN54LS673. SN54LS674. SN74LS673.
kpb
预告
-
S 帽74LS674
16位移位寄存器
'LS673
·带有 16 位并行输出存贮寄存器的 16 位串行
输入串行输出的移位寄存器
合·实归，自行到并行的转换
'L S6 74
• 16 位开行输入串行输出移位寄存器
.实现并行到串行的转换
6
说明
SN54L S6 73 , SN74L S6 73
'L S 673 是采用 24 条管脚封装自916 位移位寄存
器和一个 16 位存贮寄存器。移位寄存器的三态输入/
输出 0/0) 端口允许数据串行输入与/或读出。
存贮寄存器以一个并行数据环方式和移位寄存器相
.、
F·.
，
·监
,,
连接。该寄存器在清除输入端为低电平时，异步清
除。移位寄存器的数据可以并行置入存贮器以便通
过并行输出提供移位寄存器的状态。在命令作用下，
?马
:
存贮寄存器数据能够并行置入移位寄存器。
片选输入cs 为高电平时，移位寄存器的时钟
和存贮寄存器的时钟禁止，并将数据1/0 端置于高
阻抗状态。存贮器清除功能不为片选输入禁止。
FE--ur
必须防止经片选输入端出现在移位奇存器或存贮寄存器的假时钟。当片选输入从低向高电平跳变时移位寄
存器时钟应为低电平 z 而当片选输入从高到低电平跳度时，存贮器时钟应为低电平。
SN54L S6 74 , SN74l岛 74
'L S 674是一种 16 位并行输入、串行输出移位寄存器。→个三态输入/输出(1 /0) 端口提供了-个以再循
环回路方式置入串行数据或读出移位寄存器字的存取通路。
忡 '1
该器件有四种基本工作方式 z
( 1 )保持(空操作)
(2 )写(经输入/输出串行写入)
(3 )读(串行读出)
(4 )置数(经数据输入并行置入)
为防止假时钟，只有当时钟输入为低电平时方能使片选输入作低到高电平跳变。
'
35
v
SN54LS&13 , SN54LS174, SI74LS&73, SN74LS&74
16位移位寄存器
功能方框图
SN54LS673.SN74LS673
1/0
(6)
'LS673
16
(7-11 , 13-23)
。0-015
00-015
YO-Y15
16
16
一-一一-一一~ (2)
CK
移位时钟
16 位存贮寄存器
ã15
CLR
16 位磊佳蓄存嚣
SN54LS674.SN74LS674
'LS674
PO- P15
(7-11 , 13-23)
言言
CK
(2)
ã15
16 位存在寄存器
悔当 PE 为低电平时，数据从 16 个 P 输入端同步并行置入移位寄存器，此时不发生移位。
•
36
YO-Y15
1/0
lhFUJif--k'h
以防队
SN54LS673 , SN54LS674 , SN74LS673 , SNJ4LS674
16 位移位寄存器
I
L
S673 功能表
输入瑞
R川丽钟
x
L
H
x
串行
1/0
选通
清除、时钟， 噩噩百
片选 l移位寄存器
匾'飞
L
H
H
X
x
x
x
x
L
L
L
L
H
L
x
x
x
L
014n
L
H
•
L
H
L
L
H
•
H
H
Y15n
L
L
x
"
T
z
L
L
L
操作
z
z
x
x
x
x
x
015
L睡输主入圭到和
S T」C血L事R真清-除 I
于 CS 和 R /W。
z
z
没有移位和置数
移位和写(置数)
移位和读
从存贮器再置数到
移位寄存器，不移位
民移位寄主壁置数至幡贮器
、 4·
I
L
S674 功能表
输入端
'"
方式 i 时钟
臼
R /W
H
x
L
L
L
H
L
&
L
H
H
L
x
x
•
1/0
操作
通道口
x
Z
4
Z
空操作
移位和写(串行置数)十
。14n 移位和读
|
叫并行置数
|
H= 高电平(嗅盔)
L= 丽国平(塾盔L一二二
↑=从低电平到高电平踵虔
↓二豆画?闸，低血平坦ι一­
x 二三无关(任一输入，包括跳变主
I! O 心于输入模式
寄存器第 14 位的内容
>
υ'h凶''
存一疆军面位的丙睿
输入端和输出端的线路图
串行 I!O塑lHr输λ端
其它输入端的等效电路'
的等妓电路
1/0输出端的典型电路
Vcc
Vcc
Vcc
输入
YO 雪山'1~撞出遗困县型电路
(只
'L S673) 也
--τ±τ「t-- Vcc
120
n 最E 移1\;
输出
输出
庐E
,
一唱，
,
,
随时 F
F
31
SN54LS673, SN54LS674, SN74LS673, SN74LS674
16-BIT SHIFT REGISTERS
SDLS195 – MARCH 1985 – REVISED MARCH 1988
Copyright  1988, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN54LS673, SN54LS674, SN74LS673, SN74LS674
16-BIT SHIFT REGISTERS
SDLS195 – MARCH 1985 – REVISED MARCH 1988
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54LS673, SN54LS674, SN74LS673, SN74LS674
16-BIT SHIFT REGISTERS
SDLS195 – MARCH 1985 – REVISED MARCH 1988
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN54LS673, SN54LS674, SN74LS673, SN74LS674
16-BIT SHIFT REGISTERS
SDLS195 – MARCH 1985 – REVISED MARCH 1988
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54LS673, SN54LS674, SN74LS673, SN74LS674
16-BIT SHIFT REGISTERS
SDLS195 – MARCH 1985 – REVISED MARCH 1988
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SN54LS673, SN54LS674, SN74LS673, SN74LS674
16-BIT SHIFT REGISTERS
SDLS195 – MARCH 1985 – REVISED MARCH 1988
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-88602013A
ACTIVE
LCCC
FK
28
1
TBD
5962-8860201JA
ACTIVE
CDIP
J
24
1
TBD
Call TI
N / A for Pkg Type
1
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
5962-8860201JA
ACTIVE
CDIP
J
24
TBD
Call TI
N / A for Pkg Type
5962-8860201KA
OBSOLETE
CFP
W
24
TBD
Call TI
Call TI
5962-8860201KA
OBSOLETE
CFP
W
24
TBD
Call TI
Call TI
5962-8860201LA
ACTIVE
CDIP
JT
24
1
TBD
A42
N / A for Pkg Type
5962-8860201LA
ACTIVE
CDIP
JT
24
1
TBD
A42
N / A for Pkg Type
5962-88607013A
ACTIVE
LCCC
FK
28
1
TBD
POST-PLATE N / A for Pkg Type
5962-88607013A
ACTIVE
LCCC
FK
28
1
TBD
POST-PLATE N / A for Pkg Type
5962-8860701JA
ACTIVE
CDIP
J
24
1
TBD
Call TI
N / A for Pkg Type
5962-8860701JA
ACTIVE
CDIP
J
24
1
TBD
Call TI
N / A for Pkg Type
5962-8860701KA
OBSOLETE
CFP
W
24
TBD
Call TI
Call TI
5962-8860701KA
OBSOLETE
CFP
W
24
TBD
Call TI
Call TI
SN54LS673J
ACTIVE
CDIP
J
24
1
TBD
Call TI
N / A for Pkg Type
SN54LS673J
ACTIVE
CDIP
J
24
1
TBD
Call TI
N / A for Pkg Type
SN54LS674J
ACTIVE
CDIP
J
24
1
TBD
Call TI
N / A for Pkg Type
SN54LS674J
ACTIVE
CDIP
J
24
1
TBD
Call TI
N / A for Pkg Type
SN74LS673DW
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS673DW
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS673DWE4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS673DWE4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS673DWG4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS673DWG4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS673N
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS673N
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS673NE4
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS673NE4
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS674DW
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS674DW
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS674DWG4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS674DWG4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS674N
ACTIVE
PDIP
N
24
15
Pb-Free
CU NIPDAU
N / A for Pkg Type
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LS674N
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS674NE4
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS674NE4
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SNJ54LS673FK
ACTIVE
LCCC
FK
28
1
TBD
POST-PLATE N / A for Pkg Type
SNJ54LS673FK
ACTIVE
LCCC
FK
28
1
TBD
POST-PLATE N / A for Pkg Type
SNJ54LS673J
ACTIVE
CDIP
J
24
1
TBD
Call TI
N / A for Pkg Type
SNJ54LS673J
ACTIVE
CDIP
J
24
1
TBD
Call TI
N / A for Pkg Type
SNJ54LS673JT
ACTIVE
CDIP
JT
24
1
TBD
A42
N / A for Pkg Type
SNJ54LS673JT
ACTIVE
CDIP
JT
24
1
TBD
A42
N / A for Pkg Type
SNJ54LS673W
OBSOLETE
CFP
W
24
TBD
Call TI
Call TI
SNJ54LS673W
OBSOLETE
CFP
W
24
TBD
Call TI
Call TI
SNJ54LS674FK
ACTIVE
LCCC
FK
28
1
TBD
POST-PLATE N / A for Pkg Type
SNJ54LS674FK
ACTIVE
LCCC
FK
28
1
TBD
POST-PLATE N / A for Pkg Type
SNJ54LS674J
ACTIVE
CDIP
J
24
1
TBD
Call TI
N / A for Pkg Type
SNJ54LS674J
ACTIVE
CDIP
J
24
1
TBD
Call TI
N / A for Pkg Type
SNJ54LS674JT
ACTIVE
CDIP
JT
24
1
TBD
A42
N / A for Pkg Type
SNJ54LS674JT
ACTIVE
CDIP
JT
24
1
TBD
A42
N / A for Pkg Type
SNJ54LS674W
OBSOLETE
CFP
W
24
TBD
Call TI
Call TI
SNJ54LS674W
OBSOLETE
CFP
W
24
TBD
Call TI
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
(RoHS)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
MECHANICAL DATA
MPDI006B – SEPTEMBER 2001 – REVISED APRIL 2002
N (R–PDIP–T24)
PLASTIC DUAL–IN–LINE
1.222 (31,04) MAX
24
13
0.360 (9,14) MAX
1
12
0.070 (1,78) MAX
0.200 (5,08) MAX
0.425 (10,80) MAX
0.020 (0,51) MIN
Seating Plane
0.125 (3,18) MIN
0.100 (2,54)
0’–15’
0.021 (0,53)
0.015 (0,38)
0.010 (0,25)
0.010 (0,25) NOM
4040051–3/D 09/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS–010
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MCDI004A – JANUARY 1995 – REVISED NOVEMBER 1997
J (R-GDIP-T**)
CERAMIC DUAL-IN-LINE PACKAGE
24 PINS SHOWN
B
13
24
C
1
12
0.065 (1,65)
0.045 (1,14)
Lens Protrusion (Lens Optional)
0.010 (0.25) MAX
0.175 (4,45)
0.140 (3,56)
0.090 (2,29)
0.060 (1,53)
A
Seating Plane
0.018 (0,46) MIN
24
PINS **
DIM
”A”
”B”
”C”
NARR
0.125 (3,18) MIN
0.022 (0,56)
0.014 (0,36)
0.100 (2,54)
0.012 (0,30)
0.008 (0,20)
28
WIDE
NARR
40
32
WIDE
NARR
WIDE
NARR
WIDE
MAX
0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85)
MIN
0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99)
MAX
1.265(32,13) 1.265(32,13) 1.465(37,21) 1.465(37,21) 1.668(42,37) 1.668(42,37) 2.068(52,53) 2.068(52,53)
MIN
1.235(31,37) 1.235(31,37) 1.435(36,45) 1.435(36,45) 1.632(41,45) 1.632(41,45) 2.032(51,61) 2.032(51,61)
MAX
0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19)
MIN
0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50)
4040084/C 10/97
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Window (lens) added to this group of packages (24-, 28-, 32-, 40-pin).
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI008 – OCTOBER 1994
N (R-PDIP-T**)
PLASTIC DUAL-IN-LINE PACKAGE
24 PIN SHOWN
A
24
13
0.560 (14,22)
0.520 (13,21)
1
12
0.060 (1,52) TYP
0.200 (5,08) MAX
0.610 (15,49)
0.590 (14,99)
0.020 (0,51) MIN
Seating Plane
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0.125 (3,18) MIN
0.010 (0,25) M
PINS **
0°– 15°
0.010 (0,25) NOM
24
28
32
40
48
52
A MAX
1.270
(32,26)
1.450
(36,83)
1.650
(41,91)
2.090
(53,09)
2.450
(62,23)
2.650
(67,31)
A MIN
1.230
(31,24)
1.410
(35,81)
1.610
(40,89)
2.040
(51,82)
2.390
(60,71)
2.590
(65,79)
DIM
4040053 / B 04/95
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Falls within JEDEC MS-011
Falls within JEDEC MS-015 (32 pin only)
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MCFP007 – OCTOBER 1994
W (R-GDFP-F24)
CERAMIC DUAL FLATPACK
0.375 (9,53)
0.340 (8,64)
Base and Seating Plane
0.006 (0,15)
0.004 (0,10)
0.090 (2,29)
0.045 (1,14)
0.045 (1,14)
0.026 (0,66)
0.395 (10,03)
0.360 (9,14)
0.360 (9,14)
0.240 (6,10)
1
0.360 (9,14)
0.240 (6,10)
24
0.019 (0,48)
0.015 (0,38)
0.050 (1,27)
0.640 (16,26)
0.490 (12,45)
0.030 (0,76)
0.015 (0,38)
12
13
30° TYP
1.115 (28,32)
0.840 (21,34)
4040180-5 / B 03/95
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Falls within MIL-STD-1835 GDFP2-F24 and JEDEC MO-070AD
Index point is provided on cap for terminal identification only.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MCER004A – JANUARY 1995 – REVISED JANUARY 1997
JT (R-GDIP-T**)
CERAMIC DUAL-IN-LINE
24 LEADS SHOWN
PINS **
A
13
24
B
1
24
28
A MAX
1.280
(32,51)
1.460
(37,08)
A MIN
1.240
(31,50)
1.440
(36,58)
B MAX
0.300
(7,62)
0.291
(7,39)
B MIN
0.245
(6,22)
0.285
(7,24)
DIM
12
0.070 (1,78)
0.030 (0,76)
0.100 (2,54) MAX
0.320 (8,13)
0.290 (7,37)
0.015 (0,38) MIN
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0.023 (0,58)
0.015 (0,38)
0°–15°
0.014 (0,36)
0.008 (0,20)
0.100 (2,54)
4040110/C 08/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
Falls within MIL STD 1835 GDIP3-T24, GDIP4-T28, and JEDEC MO-058 AA, MO-058 AB
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-88602013A
ACTIVE
LCCC
FK
28
1
TBD
5962-8860201JA
ACTIVE
CDIP
J
24
1
TBD
Call TI
N / A for Pkg Type
1
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
5962-8860201JA
ACTIVE
CDIP
J
24
TBD
Call TI
N / A for Pkg Type
5962-8860201KA
OBSOLETE
CFP
W
24
TBD
Call TI
Call TI
5962-8860201KA
OBSOLETE
CFP
W
24
TBD
Call TI
Call TI
5962-8860201LA
ACTIVE
CDIP
JT
24
1
TBD
A42
N / A for Pkg Type
5962-8860201LA
ACTIVE
CDIP
JT
24
1
TBD
A42
N / A for Pkg Type
5962-88607013A
ACTIVE
LCCC
FK
28
1
TBD
POST-PLATE N / A for Pkg Type
5962-88607013A
ACTIVE
LCCC
FK
28
1
TBD
POST-PLATE N / A for Pkg Type
5962-8860701JA
ACTIVE
CDIP
J
24
1
TBD
Call TI
N / A for Pkg Type
5962-8860701JA
ACTIVE
CDIP
J
24
1
TBD
Call TI
N / A for Pkg Type
5962-8860701KA
OBSOLETE
CFP
W
24
TBD
Call TI
Call TI
5962-8860701KA
OBSOLETE
CFP
W
24
TBD
Call TI
Call TI
SN54LS673J
ACTIVE
CDIP
J
24
1
TBD
Call TI
N / A for Pkg Type
SN54LS673J
ACTIVE
CDIP
J
24
1
TBD
Call TI
N / A for Pkg Type
SN54LS674J
ACTIVE
CDIP
J
24
1
TBD
Call TI
N / A for Pkg Type
SN54LS674J
ACTIVE
CDIP
J
24
1
TBD
Call TI
N / A for Pkg Type
SN74LS673DW
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS673DW
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS673DWE4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS673DWE4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS673DWG4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS673DWG4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS673N
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS673N
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS673NE4
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS673NE4
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS674DW
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS674DW
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS674DWG4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS674DWG4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS674N
ACTIVE
PDIP
N
24
15
Pb-Free
CU NIPDAU
N / A for Pkg Type
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LS674N
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS674NE4
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS674NE4
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SNJ54LS673FK
ACTIVE
LCCC
FK
28
1
TBD
POST-PLATE N / A for Pkg Type
SNJ54LS673FK
ACTIVE
LCCC
FK
28
1
TBD
POST-PLATE N / A for Pkg Type
SNJ54LS673J
ACTIVE
CDIP
J
24
1
TBD
Call TI
N / A for Pkg Type
SNJ54LS673J
ACTIVE
CDIP
J
24
1
TBD
Call TI
N / A for Pkg Type
SNJ54LS673JT
ACTIVE
CDIP
JT
24
1
TBD
A42
N / A for Pkg Type
SNJ54LS673JT
ACTIVE
CDIP
JT
24
1
TBD
A42
N / A for Pkg Type
SNJ54LS673W
OBSOLETE
CFP
W
24
TBD
Call TI
Call TI
SNJ54LS673W
OBSOLETE
CFP
W
24
TBD
Call TI
Call TI
SNJ54LS674FK
ACTIVE
LCCC
FK
28
1
TBD
POST-PLATE N / A for Pkg Type
SNJ54LS674FK
ACTIVE
LCCC
FK
28
1
TBD
POST-PLATE N / A for Pkg Type
SNJ54LS674J
ACTIVE
CDIP
J
24
1
TBD
Call TI
N / A for Pkg Type
SNJ54LS674J
ACTIVE
CDIP
J
24
1
TBD
Call TI
N / A for Pkg Type
SNJ54LS674JT
ACTIVE
CDIP
JT
24
1
TBD
A42
N / A for Pkg Type
SNJ54LS674JT
ACTIVE
CDIP
JT
24
1
TBD
A42
N / A for Pkg Type
SNJ54LS674W
OBSOLETE
CFP
W
24
TBD
Call TI
Call TI
SNJ54LS674W
OBSOLETE
CFP
W
24
TBD
Call TI
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
(RoHS)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
MECHANICAL DATA
MPDI006B – SEPTEMBER 2001 – REVISED APRIL 2002
N (R–PDIP–T24)
PLASTIC DUAL–IN–LINE
1.222 (31,04) MAX
24
13
0.360 (9,14) MAX
1
12
0.070 (1,78) MAX
0.200 (5,08) MAX
0.425 (10,80) MAX
0.020 (0,51) MIN
Seating Plane
0.125 (3,18) MIN
0.100 (2,54)
0’–15’
0.021 (0,53)
0.015 (0,38)
0.010 (0,25)
0.010 (0,25) NOM
4040051–3/D 09/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS–010
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MCDI004A – JANUARY 1995 – REVISED NOVEMBER 1997
J (R-GDIP-T**)
CERAMIC DUAL-IN-LINE PACKAGE
24 PINS SHOWN
B
13
24
C
1
12
0.065 (1,65)
0.045 (1,14)
Lens Protrusion (Lens Optional)
0.010 (0.25) MAX
0.175 (4,45)
0.140 (3,56)
0.090 (2,29)
0.060 (1,53)
A
Seating Plane
0.018 (0,46) MIN
24
PINS **
DIM
”A”
”B”
”C”
NARR
0.125 (3,18) MIN
0.022 (0,56)
0.014 (0,36)
0.100 (2,54)
0.012 (0,30)
0.008 (0,20)
28
WIDE
NARR
40
32
WIDE
NARR
WIDE
NARR
WIDE
MAX
0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85)
MIN
0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99)
MAX
1.265(32,13) 1.265(32,13) 1.465(37,21) 1.465(37,21) 1.668(42,37) 1.668(42,37) 2.068(52,53) 2.068(52,53)
MIN
1.235(31,37) 1.235(31,37) 1.435(36,45) 1.435(36,45) 1.632(41,45) 1.632(41,45) 2.032(51,61) 2.032(51,61)
MAX
0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19)
MIN
0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50)
4040084/C 10/97
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Window (lens) added to this group of packages (24-, 28-, 32-, 40-pin).
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI008 – OCTOBER 1994
N (R-PDIP-T**)
PLASTIC DUAL-IN-LINE PACKAGE
24 PIN SHOWN
A
24
13
0.560 (14,22)
0.520 (13,21)
1
12
0.060 (1,52) TYP
0.200 (5,08) MAX
0.610 (15,49)
0.590 (14,99)
0.020 (0,51) MIN
Seating Plane
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0.125 (3,18) MIN
0.010 (0,25) M
PINS **
0°– 15°
0.010 (0,25) NOM
24
28
32
40
48
52
A MAX
1.270
(32,26)
1.450
(36,83)
1.650
(41,91)
2.090
(53,09)
2.450
(62,23)
2.650
(67,31)
A MIN
1.230
(31,24)
1.410
(35,81)
1.610
(40,89)
2.040
(51,82)
2.390
(60,71)
2.590
(65,79)
DIM
4040053 / B 04/95
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Falls within JEDEC MS-011
Falls within JEDEC MS-015 (32 pin only)
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MCFP007 – OCTOBER 1994
W (R-GDFP-F24)
CERAMIC DUAL FLATPACK
0.375 (9,53)
0.340 (8,64)
Base and Seating Plane
0.006 (0,15)
0.004 (0,10)
0.090 (2,29)
0.045 (1,14)
0.045 (1,14)
0.026 (0,66)
0.395 (10,03)
0.360 (9,14)
0.360 (9,14)
0.240 (6,10)
1
0.360 (9,14)
0.240 (6,10)
24
0.019 (0,48)
0.015 (0,38)
0.050 (1,27)
0.640 (16,26)
0.490 (12,45)
0.030 (0,76)
0.015 (0,38)
12
13
30° TYP
1.115 (28,32)
0.840 (21,34)
4040180-5 / B 03/95
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Falls within MIL-STD-1835 GDFP2-F24 and JEDEC MO-070AD
Index point is provided on cap for terminal identification only.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MCER004A – JANUARY 1995 – REVISED JANUARY 1997
JT (R-GDIP-T**)
CERAMIC DUAL-IN-LINE
24 LEADS SHOWN
PINS **
A
13
24
B
1
24
28
A MAX
1.280
(32,51)
1.460
(37,08)
A MIN
1.240
(31,50)
1.440
(36,58)
B MAX
0.300
(7,62)
0.291
(7,39)
B MIN
0.245
(6,22)
0.285
(7,24)
DIM
12
0.070 (1,78)
0.030 (0,76)
0.100 (2,54) MAX
0.320 (8,13)
0.290 (7,37)
0.015 (0,38) MIN
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0.023 (0,58)
0.015 (0,38)
0°–15°
0.014 (0,36)
0.008 (0,20)
0.100 (2,54)
4040110/C 08/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
Falls within MIL STD 1835 GDIP3-T24, GDIP4-T28, and JEDEC MO-058 AA, MO-058 AB
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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Applications
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amplifier.ti.com
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www.ti.com/audio
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dataconverter.ti.com
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www.ti.com/automotive
DLP® Products
www.dlp.com
Communications and
Telecom
www.ti.com/communications
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
www.ti.com/clocks
Consumer Electronics
www.ti.com/consumer-apps
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interface.ti.com
Energy
www.ti.com/energy
Logic
logic.ti.com
Industrial
www.ti.com/industrial
Power Mgmt
power.ti.com
Medical
www.ti.com/medical
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
www.ti.com/video
Wireless
www.ti.com/wireless-apps
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