ETC XB4301A

XB4301A
SUNFAN
____________________________________________________________________________________________________________________________
One Cell Lithium-ion/Polymer Battery Protection IC
GENERAL DESCRIPTION
FEATURES
The XB4301 series product is a high
integration solution for lithiumion/polymer battery protection. XB4301
contains advanced power MOSFET,
high-accuracy voltage detection circuits
and delay circuits. XB4301 is put into an
ultra-small SOT23-5 package and only
one external component makes it an
ideal solution in limited space of battery
pack.
XB4301 has all the protection functions
required in the battery application including
overcharging, overdischarging, overcurrent
and load short circuiting protection etc. The
accurate overcharging detection voltage
ensures safe and full utilization charging.
The low standby current drains little current
from the cell while in storage.
The device is not only targeted for digital
cellular phones, but also for any other
Li-Ion and Li-Poly battery-powered
information appliances requiring longterm battery life.
· Protection of Battery Cell Reverse
Connection
· Integrate Advanced Power MOSFET
with Equivalent of 54mΩ RDS(ON)
· Ultra-small SOT23-5 Package
· Only One External Capacitor
Required
· Over-temperature Protection
· Overcharge Current Protection
· Three-step Overcurrent Detection:
-Overdischarge Current 1
-Overdischarge Current 2
-Load Short Circuiting
· Charger Detection Function
· 0V Battery Charging Function
- Delay Times are generated inside
· High-accuracy Voltage Detection
· Low Current Consumption
- Operation Mode: 2.8μA typ.
- Power-down Mode: 0.1μA max.
· RoHS Compliant and Lead (Pb) Free
APPLICATIONS
•
•
One-Cell Lithium-ion Battery Pack
Lithium-Polymer Battery Pack
BAT +
XB4301
3
VDD
VM
4
Battery
1
VCC
C
0.1uF
2
GND
VM
BAT -
5
Figure 1. Typical Application Circuit
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ORDERING INFORMATION
Overcharg Overcharge Overdischarge Overdischarge Overcurrent
Release
Detection
Release
Detection
Pack e Detection
PART
Voltage
Voltage
Voltage
Voltage
Current
NUMBER age
[IOV1] (A)
[VCL] (V)
[VDL] (V)
[VDR] (V)
[VCU] (V)
XB4301A
SOT
23-5
4.300
4.10
2.40
3.0
2.5
Top Mark
4301AYW(note)
Note: “YW” is manufacture date code, “Y” means the year, “W” means the week
PIN CONFIGURATION
5
4
VM
VM
VCC GND VDD
1
2
3
SOT23-5
Figure 2. PIN Configuration
PIN DESCRIPTION
XB4301 PIN
NUMBER
PIN NAME
1
VCC
Core circuit power supply
2
GND
Ground, connect the negative terminal of the battery to this pin
3
VDD
4,5
VM
PIN DESCRIPTION
Power Supply
The negative terminal of the battery pack. The internal FET switch
connects this terminal to GND
ABSOLUTE MAXIMUM RATINGS
(Note: Do not exceed these limits to prevent damage to the device. Exposure to absolute maximum rating
conditions for long periods may affect device reliability.)
PARAMETER
VALUE
Input voltage between VCC and GND
UNIT
-0.3 to +6
V
-0.3 to VCC+0.3
V
VM input pin voltage
-6 to 10
V
Operating Ambient Temperature
-40 to 85
°C
VDD input pin voltage
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Maximum Junction Temperature
125
°C
-55 to 150
°C
Lead Temperature ( Soldering, 10 sec)
300
°C
Power Dissipation at T=25°C
0.4
W
Package Thermal Resistance (Junction to Ambient) θJA
250
°C/W
Package Thermal Resistance (Junction to Case) θJC
130
°C/W
ESD
2000
V
Storage Temperature
ELECTRICAL CHARACTERISTICS
Typicals and limits appearing in normal type apply for TA = 25oC, unless otherwise specified
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Detection Voltage
Overcharge Detection Voltage
VCU
Overcharge Release Voltage
VCL
Overdischarge Detection Voltage
VDL
Overdischarge Release Voltage
VDR
Charger Detection Voltage
VCHA
4.25
4.30
4.35
4.05
4.10
4.15
V
V
2.3
2.40
2.5
V
2.9
3.0
3.1
V
-0.07
-0.12
-0.2
V
Detection Current
Overdischarge Current1 Detection
IIOV1
VDD=3.5V
1.75
2.5
3.25
A
Overdischarge Current2 Detection
IIOV2
VDD=3.5V
4
6
9
A
ISHORT
VDD=3.5V
10
Current Consumption in Normal
Operation
IOPE
Current Consumption in power
Down
20
30
A
VDD=3.5V
VM =0V
2.8
6
μA
IPDN
VDD=2.0V
VM pin floating
0.1
Internal Resistance between
VM and VDD
RVMD
320
Internal Resistance between VM
and GND
RVMS
VDD=3.5V
VM=1.0V
VDD=2.0V
Load Short-Circuiting
Detection
Current Consumption
μA
VM Internal Resistance
100
VM=1.0V
kΩ
kΩ
FET on Resistance
Equivalent FET on Resistance
RDS(ON)
VDD=3.6V
IVM =1.0A
54
mΩ
Over Temperature Protection
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TSHD+
120
Over Temperature Recovery Degree TSHD-
100
Over Temperature Protection
oC
Detection Delay Time
Overcharge Voltage Detection
Delay Time
tCU
0.17
0.25
0.4
S
Overdischarge Voltage Detection
Delay Time
Overdischarge Current 1 Detection
Delay Time
tDL
28
40
52
mS
tIOV1
VDD=3.5V
5
8
11
mS
Overdischarge Current 2 Detection
Delay Time
tIOV2
VDD=3.5V
1
2
3
mS
Load Short-Circuiting Detection
Delay Time
tSHORT
VDD=3.5V
5
50
uS
Figure 3. Functional Block Diagram
FUNCTIONAL DESCRIPTION
The XB4301 monitors the voltage and
current of a battery and protects it from
being damaged due to overcharge voltage,
overdischarge voltage, overdischarge
current, and short circuit conditions by
disconnecting the battery from the load
or charger. These functions are required in
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-4-
order to operate the battery cell within
specified limits.
The device requires only one external
capacitor. The MOSFET is integrated and
its RDS(ON) is as low as 54 mΩ typical.
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Normal operating mode
If no exception condition is detected,
charging and discharging can be carried
out freely. This condition is called the
normal operating mode.
Overcharge Condition
When the battery voltage becomes higher
than the overcharge detection voltage (VCU)
during charging under normal condition
and the state continues for the overcharge
detection delay time (tCU) or longer, the
XB4301 turns the charging control FET off
to stop charging. This condition is called
the overcharge condition. The overcharge
condition is released in the following two
cases:
1, When the battery voltage drops below
the overcharge release voltage (VCL), the
XB4301 turns the charging control FET on
and returns to the normal condition.
2, When a load is connected and
discharging starts, the XB4301 turns the
charging control FET on and returns to the
normal condition. The release mechanism
is as follows: the discharging current flows
through an internal parasitic diode of the
charging FET immediately after a load is
connected and discharging starts, and the
VM pin voltage increases about 0.7 V
(forward voltage of the diode) from the
GND pin voltage momentarily. The XB4301
detects this voltage and releases the
overcharge condition. Consequently, in the
case that the battery voltage is equal to or
lower than the overcharge detection
voltage (VCU), the XB4301 returns to the
normal condition immediately, but in the
case the battery voltage is higher than the
overcharge detection voltage (VCU),the chip
does not return to the normal condition
until the battery voltage drops below the
overcharge detection voltage (VCU) even if
the load is connected. In addition, if the VM
pin voltage is equal to or lower than the
overcurrent 1 detection voltage when a
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load is connected and discharging starts,
the chip does not return to the normal
condition.
Remark If the battery is charged to a voltage higher
than the overcharge detection voltage (VCU) and
the battery voltage does not drops below the
overcharge detection voltage (VCU) even when a
heavy load, which causes an overcurrent, is
connected, the overcurrent 1 and overcurrent 2 do
not work until the battery voltage drops below the
overcharge detection voltage (VCU). Since an actual
battery has, however, an internal impedance of
several dozens of mΩ, and the battery voltage
drops immediately after a heavy load which causes
an overcurrent is connected, the overcurrent 1 and
overcurrent 2 work. Detection of load shortcircuiting works regardless of the battery voltage.
Overdischarge Condition
When the battery voltage drops below the
overdischarge detection voltage (VDL)
during discharging under normal condition
and it continues for the overdischarge
detection delay time (tDL) or longer, the
XB4301 turns the discharging control FET
off and stops discharging. This condition is
called overdischarge condition. After the
discharging control FET is turned off, the
VM pin is pulled up by the RVMD resistor
between VM and VDD in XB4301.
Meanwhile when VM is bigger than 1.5
V (typ.) (the load short-circuiting detection
voltage), the current of the chip is reduced
to the power-down current (IPDN). This
condition is called power-down condition.
The VM and VDD pins are shorted by the
RVMD resistor in the IC under the
overdischarge and power-down conditions.
The power-down condition is released
when a charger is connected and the
potential difference between VM and VDD
becomes 1.3 V (typ.) or higher (load shortcircuiting detection voltage). At this time,
the FET is still off. When the battery
voltage becomes the overdischarge
detection voltage (VDL) or higher (see note),
the XB4301 turns the FET on and changes
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to the normal condition from the
overdischarge condition.
delay time (tCU) or longer, the XB4301 turns
the charging control FET off and stops
charging. This action is called abnormal
charge current detection.
Abnormal charge current detection works
when the discharging control FET is on
and the VM pin voltage drops below the
charger detection voltage (VCHA). When an
abnormal charge current flows into a
battery in the overdischarge condition, the
XB4301 consequently turns the charging
control FET off and stops charging after
the battery voltage becomes the
overdischarge detection voltage and the
overcharge detection delay time (tCU)
elapses.
Abnormal charge current detection is
released when the voltage difference
between VM pin and GND pin becomes
lower than the charger detection voltage
(VCHA) by separating the charger. Since the
0 V battery charging function has higher
priority than the abnormal charge current
detection function, abnormal charge
current may not be detected by the product
with the 0 V battery charging function while
the battery voltage is low.
____________________________________________________________________________________________________________________________
Remark If the VM pin voltage is no less than the
charger detection voltage (VCHA), when the battery
under overdischarge condition is connected to a
charger, the overdischarge condition is released
(the discharging control FET is turned on) as usual,
provided that the battery voltage reaches the
overdischarge release voltage (VDU) or higher.
Overcurrent Condition
When the discharging current becomes
equal to or higher than a specified value
(the VM pin voltage is equal to or higher
than the overcurrent detection voltage)
during discharging under normal condition
and the state continues for the overcurrent
detection delay time or longer, the XB4301
turns off the discharging control FET to
stop discharging. This condition is called
overcurrent condition. (The overcurrent
includes overcurrent 1, overcurrent 2, or
load short-circuiting.)
The VM and GND pins are shorted
internally by the RVMS resistor under the
overcurrent condition. When a load is
connected, the VM pin voltage equals the
VDD voltage due to the load.
The overcurrent condition returns to the
normal condition when the load is released
and the impedance between the B+ and Bpins becomes higher than the automatic
recoverable impedance. When the load is
removed, the VM pin goes back to the
GND potential since the VM pin is shorted
the GND pin with the RVMS resistor.
Detecting that the VM pin potential is lower
than the overcurrent 1 detection voltage
(VIOV1), the IC returns to the normal
condition.
Load Short-circuiting condition
If voltage of VM pin is equal or below
short circuiting protection voltage (VSHORT),
the XB4301 will stop discharging and
battery is disconnected from load. The
maximum delay time to switch current off is
tSHORT. This status is released when voltage
of VM pin is higher than short protection
voltage (VSHORT), such as when
disconnecting the load.
Delay Circuits
The detection delay time for overdischarge
current 2 and load short-circuiting starts
when overdischarge current 1 is detected.
As soon as overdischarge current 2 or load
short-circuiting is detected over detection
Abnormal Charge Current Detection
If the VM pin voltage drops below the
charger detection voltage (VCHA) during
charging under the normal condition and it
continues for the overcharge detection
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delay time for overdischarge current 2 or
load short- circuiting, the XB4301 stops
discharging. When battery voltage falls
below overdischarge detection voltage due
to overdischarge current, the XB4301 stop
discharging by overdischarge current
detection. In this case the recovery of battery
voltage is so slow that if battery voltage
after overdischarge voltage detection delay
time is still lower than overdischarge
detection voltage, the XB4301 shifts to
power-down.
Note
(1) Some battery providers do not recommend
charging of completely discharged batteries. Please
refer to battery providers before the selection of 0 V
battery charging function.
(2) The 0V battery charging function has higher
priority than the abnormal charge current detection
function. Consequently, a product with the 0 V
battery charging function charges a battery and
abnormal charge current cannot be detected during
the battery voltage is low (at most 1.8 V or lower).
(3) When a battery is connected to the IC for the
first time, the IC may not enter the normal condition
in which discharging is possible. In this case, set
the VM pin voltage equal to the GND voltage (short
the VM and GND pins or connect a charger) to
enter the normal condition.
Figure 4. Overcurrent delay time
0V Battery Charging Function (1) (2) (3)
This function enables the charging of a
connected battery whose voltage is 0 V by
self-discharge. When a charger having 0 V
battery start charging charger voltage
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(V0CHA) or higher is connected between B+
and B- pins, the charging control FET gate
is fixed to VDD potential. When the voltage
between the gate and the source of the
charging control FET becomes equal to or
higher than the turn-on voltage by the
charger voltage, the charging control FET
is turned on to start charging. At this time,
the discharging control FET is off and the
charging current flows through the internal
parasitic diode in the discharging control
FET. If the battery voltage becomes equal
to or higher than the overdischarge release
voltage (VDU), the normal condition returns.
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TIMING CHART
1.
Overcharge and overdischarge detection
VCU
VCU-VHC
Battery
voltage
VDL+VDH
VDL
ON
DISCHARGE
OFF
ON
CHARGE
OFF
VDD
VMVov1
VSS
VCHA
Charger connection
Load connection
tCL
tCU
(1)
(2)
(1)
(1)
(3)
Figure5-1 Overcharge and Overdischarge Voltage Detection
2.
Overdischarge current detection
VCU
VCU-VHC
Battery
voltage
VDL+VDH
VDL
ON
DISCHARGE
OFF
VDD
VSHORT
VM
Vov2
Vov1
VSS
Charger connection
Load connection
tIOV2
tIOV1
(1)
(4)
(1)
tSHORT
(4)
(1)
(4)
(1)
Figure5-2 Overdischarge Current Detection
Remark: (1) Normal condition (2) Overcharge voltage condition (3) Overdischarge voltage condition (4)
Overcurrent condition
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3.
Charger Detection
VCU
VCU-VHC
Battery
voltage
VDL+VDH
VDL
ON
DISCHARGE
OFF
VDD
VM
VSS
VCHA
Charger connection
Load connection
tDL
(3)
(1)
(1)
Figure5-3 Charger Detection
4.
Abnormal Charger Detection
VCU
VCU-VHC
Battery
voltage
VDL+VDH
VDL
ON
DISCHARGE
OFF
ON
CHARGE
OFF
VDD
VM
VSS
VCHA
Charger connection
Load connection
tCU
tDL
(1)
(3)
(1)
(2)
(1)
Figure5-4 Abnormal Charger Detection
Remark: (1) Normal condition (2) Overcharge voltage condition (3) Overdischarge voltage condition (4)
Overcurrent condition
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TYPICAL CHARACTERISTICS
(Test based on XB4301A version, VBAT = 3.6V, TA= 25°C unless otherwise specified)
Internal FET On-Resistance vs. Junction Temperature
Power Dissipation vs. Charging Current
TYPICAL APPLICATION
As shown in Figure 5, the bold line is the high density current path which must be kept as
short as possible. For thermal management, ensure that these trace widths are adequate. C is
a decoupling capacitor which should be placed as close as possible to XB4301.
BAT +
( B+/P+ )
XB4301
3
VDD
VM
4
Charger
Battery
Load
1
VCC
C
0.1uF
2
GND
VM
5
( B- )
BAT ( P- )
Fig 5 XB4301 in a Typical Battery Protection Circuit
Precautions
• Pay attention to the operating conditions for input/output voltage and load current so that the
power loss in XB4301 does not exceed the power dissipation of the package.
• Do not apply an electrostatic discharge to this XB4301 that exceeds the performance
ratings of the built-in electrostatic protection circuit.
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PACKAGE OUTLINE
SOT23-5 PACKAGE OUTLINE AND DIMENSIONS
SYMB
OL
DIMENSION
DIMENSION
IN
IN INCHES
MILIMETERS
MIN
MAX
1.050
1.250 0.041 0.049
A1
0.000
0.100 0.000 0.004
A2
1.050
1.150 0.041 0.045
b
0.300
0.400 0.012 0.016
c
0.100
0.200 0.004 0.008
D
2.820
3.020
E
1.500
1.700 0.059 0.067
E1
2.650
2.950 0.104 0.116
e1
L
- 11 -
MIN
A
e
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MAX
0.950 TYP
1.800
0.300
θ
0°
0.037 TYP
2.000 0.071 0.079
0.700 REF
L1
0.111 0.119
0.028 REF
0.600 0.012 0.024
8°
0°
8°
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DISCLAIMER
The information described herein is subject to change without notice.
Xysemi Inc. is not responsible for any problems caused by circuits or
diagrams described herein whose ralated industial properties,patents,or
other rights belong to third parties. The application circuit examples
explain typical applications of the products, and do not guarantee the
success of any specific mass-production design.
When the products described herein are regulated products subject to the
Wassenaar Arrangement or other arrangements, they may not be exported
without authorization from the appropriate governmental authority.
Use of the information described herein for other purposes and/or
reproduction or copying without express permission of Xysemi Inc. is
strictly prohibited.
The products described herein cannot be used as part of any device or
equipment affecting the human body,such as exercise equipment ,medical
equipment, security systems, gas equipment,or any aparatus installed in
airplanes and other vehicles,without prior written pemission of Xysemi Inc.
Although Xysemi Inc. exerts the greatest possible effort to ensure high
quality and reliability, the failure or malfunction of semiconductor may
occur. The use of these products should therefore give thorough
consideration to safty design,including redundancy, fire-prevention
measure and malfunction prevention, to prevent any accidents,fires,or
community damage that may ensue.
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