ETC FP5101

FP5101 / FP5101A
1 Channel Synchronous PWM Controller
General Description
The FP5101 / A is a DC-DC synchronous buck converter controller IC. It comprises high, low side
NMOS gate drivers, boot diode, internal soft start, and over current protection circuit. With +2V to +12V
VIN supply voltage, it is suitable for a wide range of applications.
Features
 +12V Vcc Supply Voltage
 Feedback Reference Voltage: 0.8V (±2%)
 Fixed Frequency Oscillator: 300 / 600KHz
 Peak Output Driving Capability: 500mA
 Internal Soft Start Function
 High-Gain Voltage Mode PWM Control
 Over Current Protection by detecting Low-side MOS voltage drop
 Package: SOP8 / SOP8 (EP)
Applications
 Graphic Card
 Telecom and Datacom Applications
 High Power DC-DC Regulators
Typical Application Circuit
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Rev. 0.63
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1/21
FP5101 / FP5101A
Function Block Diagram
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Rev. 0.63
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FP5101 / FP5101A
Pin Descriptions
SOP-8L
Name
No.
I/O
Description
BOOT
1
P
UGATE
2
O
High Side Gate Driver Output
GND
3
P
Ground
LGATE
4
O
Low Side Gate Driver Output
VCC
5
P
IC Power Supply
FB
6
I
Error Amplifier Inverting Input
COMP
7
O
Error Amplifier Output
SW
8
I
Switch Signal Input
Name
No.
I/O
BOOT
1
P
UGATE
2
O
High Side Gate Driver Output
GND
3
P
Ground
LGATE
4
O
Low Side Gate Driver Output
VCC
5
P
IC Power Supply
FB
6
I
Error Amplifier Inverting Input
COMP
7
O
Error Amplifier Output
SW
8
I
Switch Signal Input
EP
9
P
Exposed PAD is GND
Boosted Power Supply Pin for High Side
MOS Gate Driving
SOP-8L (EP)
Description
Boosted Power Supply Pin for High Side
MOS Gate Driving
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Rev. 0.63
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3/21
FP5101 / FP5101A
Marking Information
SOP-8L & SOP-8L (EP)
Halogen Free: Halogen free product indicator
Lot Number: Wafer lot number’s last two digits
For Example: 132386TB  86
Internal ID: Internal Identification Code
Per-Half Month: Production period indicated in half month time unit
For Example: January → A (Front Half Month), B (Last Half Month)
February → C (Front Half Month), D (Last Half Month)
Year: Production year’s last digit
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4/21
FP5101 / FP5101A
Ordering Information
Part Number
OSC Freq.
Operating Temperature
300KHz
-40°C ~ +85°C
600KHz
-40°C ~ +85°C
FP5101DR-LF
FP5101XR-LF
FP5101ADR-LF
FP5101AXR-LF
Package
MOQ
Description
SOP-8L
2500EA
Tape & Reel
SOP-8L (EP)
2500EA
Tape & Reel
SOP-8L
2500EA
Tape & Reel
SOP-8L (EP)
2500EA
Tape & Reel
Absolute Maximum Ratings
Parameter
Symbol
Power Supply Voltage
VCC
BOOT Supply Voltage
VBOOT
Conditions
Min.
Typ.
-0.6
BOOT to SW (VBOOT-VSW)
SW Voltage
Max.
Unit
15
V
30
V
15
V
15
V
VSW
-0.6
UGATE Voltage
VUGATE
VSW -0.3
LGATE Voltage
VLGATE
-0.6
VCC + 0.3
V
-0.6
6
V
SOP-8L
0.5
W
SOP-8L (EP)
1.3
W
FB, COMP Voltage
Allowable Power Dissipation
Thermal Resistance (Junction to
Ambient)
Thermal Resistance (Junction to
Case)
θJA
θJC
VBOOT +
V
0.3
SOP-8L
+120
°C / W
SOP-8L (EP)
+50
°C / W
SOP-8L
+20
°C / W
SOP-8L (EP)
+10
°C / /W
SOP8 (EP) Lead Temperature
+260
(soldering, 10sec)
°C
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Rev. 0.63
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5/21
FP5101 / FP5101A
IR Re-flow Soldering Curve
Recommended Operating Conditions
Parameter
Symbol
Supply Voltage
Conditions
VCC
Min.
Typ.
Max.
Unit
10.8
12
13.2
V
Operating Temperature
-40
+85
°C
Operating Junction Temperature
-40
+125
°C
DC Electrical Characteristics (VCC= 12V, TA=25°C, unless otherwise specified)
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Unit
Input Supply Current
Standby Current
ISHUTDOWN VCOMP=0V
Supply Current
ISUPPLY
UGATE and LGATE open
640
µA
5
mA
Enable / Disable
UVLO Threshold Voltage
VUVLO
8.8
9.6
10.4
V
Hysteresis Voltage
VHYS
0.4
0.8
1.6
V
FP5101
250
300
350
KHz
FP5101A
500
600
700
KHz
Oscillator
Oscillation Frequency
Ramp Amplitude
f
ΔVOSC
1.5
VP-P
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6/21
FP5101 / FP5101A
DC Electrical Characteristics (Cont.)
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Unit
0.784
0.8
0.816
V
5
20
mV
Reference
Reference Voltage
VFB
VFB change with Voltage
VFB change with Temperature
ΔVFB
VCC=10.8V to 13.2V
ΔVFB / ΔT TA = -40°C to 85°C
1
%
Error Amplifier
Unity Gain Bandwidth Product
BW
15
MHz
Open Loop DC Gain
AVO
88
dB
300
mA
Gate Drivers
VBOOT ﹣VSW=12V
Upper Gate Source Current
IUGASR
Upper Gate Source Resistance
RUGSR
Upper Gate Sink Resistance
RUGSN
Lower Gate Source Current
ILGSR
VCC=12V, VLGATE =6V
Lower Gate Source Resistance
RLGSR
VCC=12V, VCC ﹣VLGATE=1V
4
6
Ω
Lower Gate Sink Resistance
RLGSN
VCC=12V, VLGATE=1V
2
4
Ω
VBOOT ﹣VUGATE=6V
VBOOT ﹣VSW=12V
VBOOT ﹣VUGATE=1V
VBOOT ﹣VSW=12V
VUGATE ﹣VSW=1V
7
10
Ω
4
8
Ω
500
mA
Protection
FB Under Voltage Protection
VFBUV
0.3
0.4
0.5
V
Over Current Threshold
VOC
-210
-250
-290
mV
Soft-Start Interval
TSS
2
3.2
4.2
ms
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Rev. 0.63
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7/21
FP5101 / FP5101A
TYPICAL CHATACTERISTICS
UGATE Rising Time
UGATE Falling Time
CH1:UGATE CH2:LGATE CH3:SW
CH1:UGATE
Load Transient Response
CH3:Vout
CH2:LGATE
CH3:SW
Power On then Trigger OCP
CH4:IL
CH1:UGATE CH4:IL
OCP then Power On
Power On then Shorted
CH1:UGATE CH4:IL
CH1:UGATE
CH4:IL
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8/21
FP5101 / FP5101A
Shorted then Power On
Power ON
CH1:UGATE CH4:IL
CH1:Vin
CH2:HGATE CH3:Vout
CH4:IL
Power OFF
CH1:Vin CH2:HGATE CH3:Vout CH4:IL
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Rev. 0.63
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9/21
FP5101 / FP5101A
Function Description
Power On Reset
The FP5101 / A automatically initializes upon input power VCC. The Power-On Reset (POR)
function continually monitors the bias voltage at the VCC pin. The POR threshold level is typically 9.6V
at VCC rising.
VIN Detection
After POR is outstripped, the FP5101 / A continuously generates a 10kHz pulse train with 1μs
pulse width to turn on the upper MOSFET for detecting the existence of VIN. FP5101 / A keeps
monitoring SW pin voltage during the detection period. When the SW voltage crosses 1.5V two times,
VIN existence is recognized and the FP5101 / A initiates its soft start cycle as described in next section.
Soft Start
After the existence of VIN is detected, the soft-start (SS) begins automatically. The feedback
voltage (VFB) is clamped by internal linear ramping up SS voltage during this period, causing PWM
pulse width increasing slowly and thus inducing little surge current. The maximum load current is
available after the soft-start cycle is completed. Soft-start completes when SS voltage exceeds internal
reference voltage (0.8V), the time duration is about 3.2ms.
Over Current Protection
The FP5101 / A senses the current flowing through lower MOSFET for over current protection
(OCP) by sensing the SW pin voltage as shown in the Functional Block Diagram.
A 30μA current source flows through the internal resistor 21.6kΩ to SW pin causing 0.65V voltage
drop across the resistor. OCP is triggered if the voltage at SW pin (drop of lower MOSFET VDS) is lower
than -0.25V when low side MOSFET conducting. Accordingly inductor current threshold for OCP is a
function of conducting resistance of lower MOSFET RDS (ON) as :
IOCSET 
0.25 V
R DS( ON)
If MOSFET with RDS (ON) = 10mΩ is used, the OCP threshold current is about 25A. Once OCP is
triggered, the FP5101 / A enters hiccup mode and re-soft starts again. The FP5101 / A shuts down
after OCP hiccups twice.
To prevent the over current protection occurs in the normal operating load range, the drift of all
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Rev. 0.63
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10/21
FP5101 / FP5101A
parameters in the above equation should be considered.
-The RDS (ON) of MOSFET varies with temperature and gate to source voltage, the user should
determine the maximum RDS (ON) in manufacturer’s datasheet.
-The parasitic series resistance in PCB’s trace must be considered and added to RDS (ON) in the
above equation.
-The minimum IOCSET (=-0.21V / RDS (ON)) should be considered over the above equation.
Note that the IOCSET is the current flow through the low side MOSFET. IOCSET must be greater than
maximum output current add the half of inductor ripple current. That is,
IOCSET  IO(MAX ) 
IL(MAX )
2
LGATE>425ns
LGATE=425ns
LGATE<425ns
LGATE<<425ns
To avoid the gate transition noise and ringing on the SW pin, the actual monitoring of the
bottom-side MOSFET's on-resistance starts 200ns (nominal) after the LGATE rising edge. The
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11/21
FP5101 / FP5101A
monitoring ends when the LGATE goes low. The OCP can be detected anywhere within the above
window. If the regulator is running at high UGATE duty cycles (around 75% for 600kHz or 87% for
300kHz operation), then the LGATE pulse width may be not wide enough for the OCP to properly
sample the VSW. For those cases, if the LGATE is too narrow (or not there at all) for 3 consecutive
pulses, then the third pulse will be stretched and/or inserted to the 425ns minimum width. This allows
for OCP monitoring every three pulses under this kind of condition. This can introduce a small
pulse-width error on the output voltage, which will be corrected on the next pulse; and the output ripple
voltage will have an unusual 3-clock pattern, which may look like jitter.
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Rev. 0.63
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12/21
FP5101 / FP5101A
Application Information
Frequency Compensation
The FP5101 / A is a voltage-mode controller for a synchronous-rectified buck converter. Figure 1
highlights the voltage-mode control loop for a synchronous-rectified buck converter. The output voltage
(VOUT) is regulated to the reference voltage level. The error amplifier (ERROR AMP) output (VCOMP) is
compared with the oscillator (OSC) triangular wave to provide a pulse-width modulated (PWM) wave
with an amplitude of VIN at the SW node. The PWM wave is smoothed by the output LC filter (LOUT and
COUT).
The modulator transfer function is the small-signal transfer function of VOUT / VCOMP. This function
is dominated by a DC gain and the output filter (LOUT and COUT), with a double-pole break frequency at
FLC and a zero at FESR. The DC gain of the modulator is the input voltage (VIN) divided by the
peak-to-peak oscillator voltage (ΔVOSC). The following equations define the modulator break
frequencies as a function of the output LC filter:
FLC 
1
2 L OUT  C OUT
The ESR zero is contributed by the ESR associated with the output capacitance. Note that this
requires the output capacitor should have enough ESR to satisfy stability requirements. The ESR zero
of the output capacitor is expressed as following
FESR 
1
2  C OUT  ESR
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13/21
FP5101 / FP5101A
VIN
OS
C
DRIVER
PWM
COMPARATO
R
_
ΔVOSC
LOUT
DRIVER
+
VOUT
COUT
ESR
ZFB
Vcomp
_
+
ERROR
ZIN
VREF
AMP
DETAILED COMPENSATION COMPONENTS
ZFB
C1
C2
R2
ZIN
C3
VOUT
R3
R1
COMP
_
FB
+
VREF
Figure 1 Voltage-mode Buck Converter Compensation Design
The compensation network consists of the error amplifier (internal to the FP5101 / A) and the
impedance networks ZIN and ZFB. The goal of the compensation network is to provide a closed-loop
transfer function with the highest 0dB crossing frequency (F0dB) and adequate phase margin. Phase
margin is the difference between the closed loop phase at F0dB and 180 degrees. The equations below
relate the compensation network’s poles, zeros, and gain to the components (R1, R2, R3, C1, C2, and
C3), shown in Figure 1.
FZ1 
FP1 
1
2R 2C2
1
CC
2R2 ( 1 2 )
C1  C2
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14/21
FP5101 / FP5101A
FZ2 
1
2C 3 (R 1  R 3 )
FP2 
1
2R 3 C 3
Use the following steps to locate the poles and zeros of the compensation network.
1. Pick gain (R2 / R1) for the desired converter bandwidth.
Choose a value for R1, usually between 1K and 10K.
Select the desired zero crossover frequency
FO : (1/ 5 ~ 1/ 10)  FS  FESR
Use the following equation to calculate R2:
R2 
VOSC FO

 R1
VIN
FLC
2. Place the first zero below the filter’s double pole (~75% FLC).
FZ1  0.75  FLC
Calculate the C2 by the equation:
C2 
1
2  R 2  FLC  0.75
3. Place the first pole at the ESR zero.
FP1  FESR
Calculate the C1 by the equation:
C1 
C2
2  R 2  C2  FESR  1
4. Place the second zero at filter’s double pole.
5. Place the second pole at half the switching frequency.
FP2  0.5  FS
FZ 2  FLC
Combine above two equations will get the following component equations
R3 
C3 
R1
FS
1
2  FLC
1
  R3  FS
6. Check the gain against the error amplifier’s open loop gain.
7. Estimate phase margin. Repeat if necessary.
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15/21
FP5101 / FP5101A
Figure 2 shows an asymptotic plot of the DC-DC converter’s gain vs. frequency. The actual
modulator gain has a high gain peak due to the high Q factor of the output filter and is not shown in
Figure 2. Using the above guidelines should give a compensation gain similar to the red curve plotted.
The open-loop error amplifier gain bounds the compensation gain. Check the compensation gain at FP2
with the capabilities of the error amplifier. The closed-loop gain is constructed on the graph of Figure 2
by adding the modulator gain (in dB) to the compensation gain (in dB). This is equivalent to multiply the
modulator transfer function by the compensation transfer function and plotting the gain. The
compensation gain uses external impedance networks ZFB and ZIN to provide a stable high bandwidth
overall loop. A stable control loop has a gain crossing with a –20dB/decade slope and a phase margin
GAIN (dB)
greater than 45°. Include worst-case component variations when determining phase margin.
Figure 2. Asymptotic Bode Plot of Converter Gain
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FP5101 / FP5101A
Component Selection
Input capacitor Selection
The voltage rating at maximum ambient temperature should be 1.25 to 1.5 times the maximum
input voltage. More conservative approaches can bring the voltage rating up to 2 times the maximum
input voltage. High frequency decoupling, which is highly recommended, is implemented through the
use of ceramic capacitors in parallel with the bulk capacitor filtering.
In switch mode, the input current is discontinuous in a buck converter. The source current of the
high-side MOSFET is a square wave. To prevent large voltage transients, a low ESR input capacitor
sized for the maximum RMS current must be used. The RMS value of input capacitor current can be
calculated by:
IRMS  IO _ MAX
VO
VIN

V 
1  O 
VIN 

It can be seen that when VO is half of VIN, CIN is under the worst current stress. The worst current
stress on CIN is IO_MAX/2.
Inductor Selection
The value of the inductor is selected based on the desired ripple current. Large inductance gives
low inductor ripple current and small inductance result in high ripple current. However, the larger value
inductor has a larger physical size, higher series resistance, and/or lower saturation current. In
experience, the value is to allow the peak-to-peak ripple current in the inductor to be 10%~20%
maximum load current. The inductance value can be calculated by:
L
( VIN  VO ) VO
( VIN  VO )
VO

f  IL VIN f  2  (10% ~ 20%)IO  VIN
The inductor ripple current can be calculated by:
IL 
VO 
V 
 1  O 
f  L 
VIN 
Choose an inductor that does not saturate under the worst-case load conditions even at the
highest operating temperature. (The load current plus half the peak-to-peak inductor ripple current).
The peak Inductor current is:
IL _ PEAK  IO 
IL
2
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FP5101 / FP5101A
MOSFET Selection
There are three major aspects of power loss that are associated with the MOSFET. These are
conduction losses, switching losses, and gate drive power losses.
PD(MOSFET )  Pconduction  Pswitching  Pgate
2
PD(HIigh _ MOSFET )  IO  R DS( ON)  D 
1
VIN  IO  ( t r  t f )  f s  Q Gate  VGS  f s
2
2
PD(HIigh _ MOSFET )  IO  R DS( ON)  (1  D) 
1
Vf  IO  ( t r  t f )  f s  Q Gate  VGS  f s
2
VIN = Input Voltage for
Vf = Lower side turn on VDS
IO = Output Current
D = Duty Cycle
tr
= MOSFET rising time
tf
fs
= MOSFET rising time
= Switching Frequency
Q Gate = MOSFET gate charge
VGS = MOSFET gate voltage
Output Capacitor Selection
The output capacitor is required to maintain the DC output voltage. Low ESR capacitors are
preferred to keep the output voltage ripple low. In a buck converter circuit, output ripple voltage is
determined by inductor value, switching frequency, output capacitor value and ESR. The output ripple
is determined by:

1
VO  IL   ESR COUT 
8  f  C OUT





Where f = operating frequency, COUT= output capacitance and ΔIL = ripple current in the inductor.
For a fixed output voltage, the output ripple is highest at maximum input voltage since ΔIL increases
with input voltage.
The most commonly used choice for output bulk capacitors is aluminum electrolytic capacitors
because of their low cost and low ESR. Due to the capacitor ESR varies with frequency, user should
consider the ESR value rated at the PWM frequency.
The output capacitance should also include a number of small capacitance value ceramic
capacitors placed as close as possible to the chip; 0.1μF and 0.01μF are recommended values.
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Rev. 0.63
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18/21
FP5101 / FP5101A
PC Board Layout Checklist
The switching power converter layout is critical to achieve low power losses, clean waveforms,
and stable operation. It needs careful attention. Following are specific recommendations for good
board layout:
1. Keep the high current traces and load connections as short as possible.
2. Use thick copper plated PCB whenever possible to achieve higher efficiency.
3. Keep the loop area between the SW node, low-side MOSFET, Inductor, and the output
capacitor as small as possible.
4. Route high DV / Dt signals, such as SW node, away from the error amplifier input/output pins.
Keep both the high DV / Dt signals and the error amplifier input/output signals as short as
possible.
5. Place VCC ceramic decoupling capacitors very close to VCC pin.
6. All input signals are referenced with respect to GND pin. Dedicate large copper area of the
PCB for a GND plane.
7. Minimize GND loops in the layout to avoid EMI-related issues.
8. Use wide traces for the lower gate drive to keep the drive impedances low.
9. Use wide land areas with appropriate thermal vias to effectively remove heat from the
MOSFETs.
10. Preserve the snubber circuit to minimize high frequency ringing at SW node for EMI issues.
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Rev. 0.63
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19/21
FP5101 / FP5101A
Package Outline
SOP-8L
UNIT: mm
Symbols
Min. (mm)
Max. (mm)
A
1.346
1.752
A1
0.101
0.254
A2
1.498
D
4.800
4.978
E
3.810
3.987
H
5.791
6.197
L
0.406
1.270
θ°
0°
8°
Note:
1. Package dimensions are in compliance with JEDEC outline: MS-012 AA.
2. Dimension “D” does not include molding flash, protrusions or gate burrs.
3. Dimension “E” does not include inter-lead flash or protrusions.
This datasheet contains new product information. Feeling Technology reserves the rights to modify the product specification without notice.
No liability is assumed as a result of the use of this product. No rights under any patent accompany the sales of the product.
Rev. 0.63
Website: http://www.feeling-tech.com.tw
20/21
FP5101 / FP5101A
SOP-8L (EP)
UNIT: mm
Symbols
Min. (mm)
Max. (mm)
A
1.346
1.752
A1
0.050
0.152
A2
1.498
D
4.800
4.978
E
3.810
3.987
H
5.791
6.197
L
0.406
1.270
θ°
0°
8°
Min. (mm)
Max. (mm)
Exposed PAD Dimensions:
Symbols
E1
2.184 REF
D1
2.971 REF
Note:
1. Package dimensions are in compliance with JEDEC outline: MS-012 AA.
2. Dimension ”D” does not include molding flash, protrusions or gate burrs.
3. Dimension “E” does not include inter-lead flash or protrusions.
This datasheet contains new product information. Feeling Technology reserves the rights to modify the product specification without notice.
No liability is assumed as a result of the use of this product. No rights under any patent accompany the sales of the product.
Rev. 0.63
Website: http://www.feeling-tech.com.tw
21/21