ANP030 - Diodes Incorporated

ANP030
Application Note
AP2014/A Synchronous PWM Controller
Contents
1. AP2014/A Specification
1.1 Features
1.2
1.3
1.4
1.5
General Description
Pin Assignments
Pin Descriptions
Block Diagram
1.6 Absolute Maximum Ratings
2. Hardware
2.1 Introduction
2.2
2.3
2.4
2.5
Description of the built-in function circuit
Schematic
Board of Materials
Board Layout
2.6 Layout Notice
3. Design Procedure
3.1 Introduction
3.2 Operating Specifications
3.3 Design Procedures
4. Design Example
4.1 Summary of Target Specifications
4.2 Calculating and Component Selections
4.3 Efficiency Calculation
This application note contains new product information. Diodes, Inc. reserves the right to modify the product specification without notice. No liability is
assumed as a result of the use of this product. No rights under any patent accompany the sale of the product.
1/13
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ANP030
Application Note
AP2014/A Synchronous PWM Controller
1. AP2014/A Specification
1.1 Features
- Synchronous Controller in 8-Pin Package
- Operating with single 5V or 12V supply voltage
- Internal 200KHz Oscillator(400KHz for AP2014A)
- Soft-Start Function
- Fixed Frequency Voltage Mode
- 500mA Peak Output Drive Capability
- Protects the output when control FET is shorted
- SOP-8L/PDIP-8L Pb-Free package
1.2 General Description
The AP2014 controller IC is designed to provide a low cost synchronous Buck regulator for on-board DC to
DC converter applications. With the migration of today’s ASIC products requiring low supply voltages such as
1.8V and lower, together with currents in excess of 3A, traditional linear regulators are simply too consumptive
to be used when input supply is 5V or even in some cases with 3.3V input supply. The AP2014 together with
dual N-channel MOSFETs provide a low cost solution for such applications. This device features an internal
200KHz oscillator(400KHz for “A” version), under-voltage lockout for both Vcc and Vc supplies, an external
programmable soft-start function as well as output under-voltage detection that latches off the device when an
output short is detected.
1.3 Pin Assignments
1.4 Pin Descriptions
Pin
Name
Pin
No.
FB
1
Vcc
2
LDrv
3
GND
4
HDrv
5
Vc
6
Comp
7
SS
8
(Top View)
FB
1
8
SS
Vcc 2
7 Comp
AP2014/A
LDrv 3
6 Vc
GND 4
5 HDrv
SOP-8L/PDIP-8L
Description
This pin is connected directly to the output of the
switching regulator via resistor divider to provide
feedback to the Error amplifier.
This pin provides biasing for the internal blocks of
the IC as well as power for the low side driver. A
minimum of 1uF, high frequency capacitor must be
connected from this pin to ground to provide peak
drive current capability.
Output driver for the synchronous power MOSFET.
This pin serves as the ground pin and must be
connected directly to the ground plane. A high
frequency capacitor (0.1 to 1uF) must be connected
from V5 and V12 pins to this pin for noise free
operation.
Output driver for the high side power MOSFET.
This pin is connected to a voltage that must be at
least 4V higher than the bus voltage of the switcher
(assuming 5V threshold MOSFET) and powers the
high side output driver. A minimum of 1uF, high
frequency capacitor must be connected from this pin
to ground to provide peak drive current capability.
Compensation pin of the error amplifier. An external
resistor and capacitor network is typically connected
from this pin to ground to provide loop
compensation.
This pin provides soft-start for the switching
regulator. An internal current source charges an
external capacitor that is connected from this pin to
ground which ramps up the output of the switching
regulator, preventing it from overshooting as well as
limiting the input current. The converter can be
shutdown by pulling this pin below 0.5V.
This application note contains new product information. Diodes, Inc. reserves the right to modify the product specification without notice. No liability is
assumed as a result of the use of this product. No rights under any patent accompany the sale of the product.
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Application Note
AP2014/A Synchronous PWM Controller
1.5 Block Diagram
Vc
6
3V
20uA
SS
FbLo Comp
-
0.5V
+
8
64uA
Max
POR
Ct
1.25V
25K
Fb
1
Comp
7
Error Amp
+
25K
POR
Oscillator
+
5 HDrv
S
Error Comp
R
-
+ 0.2V
Bias
Generator
Vcc
3
LDrv
3V
1.25V
POR
-
4.0V
2
Reset Dom
-
Vcc
Q
+ 0.2V
Vc
-
3.5V
4
GND
1.6 Absolute Maximum Ratings
Symbol
Parameter
Range.
Unit
V
VCC
Vcc Supply Voltage
20
VC
Vc Supply Voltage (not rated for inductive load)
32
TST
Storage Temperature Range
TJ
Operating Junction Temperature Range
θJC
Thermal Resistance Junction to Case(Note1)
V
-65 to 150
o
C
0 to 125
o
C
7
o
C/W
o
θJA
Thermal Resistance Junction to Ambient(Note1)
160
C/W
Note:1.Test conditions for SOP-8L:Device mounted on 2oz copper, minimum recommended pad layout,
FR-4 PCB.
This application note contains new product information. Diodes, Inc. reserves the right to modify the product specification without notice. No liability is
assumed as a result of the use of this product. No rights under any patent accompany the sale of the product.
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Application Note
AP2014/A Synchronous PWM Controller
2. Hardware
2.1 Introduction
The AP2014 is a fixed frequency, voltage mode synchronous controller and consists of a precision reference
voltage, an error amplifier, an internal oscillator, a PWM comparator, 0.5A peak gate driver, soft-start and
shutdown circuits (see Block Diagram).
The output voltage of the synchronous converter is set and controlled by the output of the error amplifier; this
is the amplified error signal from the sensed output voltage and the reference voltage.
This voltage is compared to a fixed frequency linear saw-tooth ramp and generates fixed frequency pulses of
variable duty-cycle, which drives two N-channel external MOSFETs. The timing of the IC is provided through
an internal oscillator circuit which uses on-chip capacitor to set the oscillation frequency to 200 KHz (400 KHz
for “A” version).
2.2 Description of the built-in function circuit
Under Voltage Lock Out (UVLO)
The under-voltage lockout circuit assures that the MOSFET driver outputs remain in the off state whenever the
supply voltage drops below set parameters. Lockout occurs if VC and VCC fall below 3.3V and 4.2V respectively.
Normal operation resumes once VC and VCC rise above the set values.
Soft-Start and Shutdown
The AP2014 has a programmable soft-start to control the output voltage rise and limit the current surge at the
start-up. To ensure correct start-up, the soft-start sequence initiates when the VC and VCC rise above their
threshold (3.3V and 4.2V respectively) and generates the Power On Reset (POR) signal. Soft-start function
operates by sourcing an internal current to charge an external capacitor to about 3V. Initially, the soft-start
function clamps the E/A’s output of the PWM converter. As the charging voltage of the external capacitor
ramps up, the PWM signals increase from zero to the point the feedback loop takes control.
Short-Circuit Protection
The outputs are protected against the short circuit. The AP2014 protects the circuit for shorted output by
sensing the output voltage (through the external resistor divider). The AP2014 shuts down the PWM signals,
when the output voltage drops below 0.6V (0.4V for AP2014A).
The AP2014 also protects the output from over-voltage when the control FET is shorted. This is done by
turning on the sync FET with the maximum duty cycle.
IC Quiescent Power Dissipation
Power dissipation for IC controller is a function of applied voltage, gate driver loads and switching frequency.
The IC's maximum power dissipation occurs when the IC operating with single 12V supply voltage (Vcc=12V
and Vc≅24V) at 400KHz switching frequency and maximum gate loads.
Show the voltage vs. current in page 10 of data sheet, when the gate drivers loaded with 1500pF capacitors.
The IC's power dissipation results to an excessive temperature rise. This should be considered when using
AP2014A for such application.
This application note contains new product information. Diodes, Inc. reserves the right to modify the product specification without notice. No liability is
assumed as a result of the use of this product. No rights under any patent accompany the sale of the product.
4/13
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Application Note
AP2014/A Synchronous PWM Controller
2.3 Schematic
+12V
R4
0R
+5V
C7
470u
C3
1u
C9
470u
C10
470u
+12V or +5V
R1
2.2K
C4
0.1u
R7
0R
1
2
3
4
R3
11
U1
FB
SS
Vcc Comp
LDrv
Vc
GND HDrv
R9
0R
8
7
6
5
R2
1K
Q1
AP70T03GH
L1
4.7u
AP2014A
C11
0.1u
C5
1u
C6
5600pF
Vout +1.26V
Q2
C12
470u
AP70T03GH
C13
470u
C15
470u
C17
0.1u
C20
10p
R6
39k
Dual Supply 5V and 12V Input
+12V
R4
0R
+5V
Vin = +12V or +5V
R5
0R
C1
0.1u
D1
12V Vin ~ Short
O pen
5V Vin ~ Short
O pen
+12V
R7
0R
R4
R5
R5
R4
and
and
and
and
R7
R8
R8
R7
C3
1u
C7
470u
B0530W
C9
470u
C10
470u
+5V
R8
0R
C4
0.1u
R3
11
1
2
3
4
R1
2.2K
R9
0R
U1
8
FB
SS 7
Vcc Com p 6
LDrv
Vc 5
G ND HDrv
R2
1K
Q1
AP70T03G H
L1
4.7u
AP2014A
C11
0.1u
C5
1u
C6
5600pF
Q2
AP70T03G H
R6
39k
Vout +1.6V
C12
470u
C 13
470u
C15
470u
C17
0.1u
C20
10p
optinal
Single Supply, 5V or 12V Input Voltage
This application note contains new product information. Diodes, Inc. reserves the right to modify the product specification without notice. No liability is
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Application Note
AP2014/A Synchronous PWM Controller
2.4 Board of Materials
No.
1
Value
Q'ty Part Reference
AP2014/A
1
U4
2
0.1uF/50V
4
3
470uF/16V
6
Description
AP2014/A
Manufacturers
Diodes Inc
0805 ceramic SMD capacitor
Viking Tech
Low ESR
OST
4
1uF/50V
2
C1, C4,C11, C17
C7, C9, C10,
C12,C13,C15
C3,C5
0805 ceramic SMD capacitor
Viking Tech
5
5600pF/50V
1
C6
0805 ceramic SMD capacitor
Viking Tech
6
10pF/50V
1
C20
0805 ceramic SMD capacitor
Viking Tech
7
2.2K
1
R1
1% 0805 SMD resistor
Viking Tech
8
1K
11Ω
1
R2
1% 0805 SMD resistor
Viking Tech
1
R3
1% 0805 SMD resistor
Viking Tech
1
R6
1% 0805 SMD resistor
Viking Tech
11
39K
0Ω
3
R5,R8,R9
1% 0805 SMD resistor
Viking Tech
12
0.5A 30V
2
D1
SMD shottky diode
Diodes Inc
13
4.7uH
1
L1
ring core inductor 15A
2
Q1, Q2
30V/60A N-MOSFET
Wurth Elektronik
Advanced Power
Electronics Corp.
9
10
14 AP70T03GH
Part Number
AP2014/A
B0530W
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Application Note
AP2014/A Synchronous PWM Controller
2.5 Board Layout
Top Side
Bottom Side
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2.6 Layout Notice
Introduction
When designing a high frequency switching regulated power supply, layout is very important. Using a good
layout can solve many problems associated with these types of supplies. The problems due to a bad layout
are often seen at high current levels and are usually more obvious at large input to output voltage differentials.
Some of the main problems are loss of regulation at high output current and/or large input to output voltage
differentials, excessive noise on the output and switch waveforms, and instability. Using the simple guidelines
that follow will help minimize these problems.
Inductor
Always try to use a low EMI inductor with a ferrite type closed core. Open core can be used if they have low
EMI characteristics and are located a bit more away from the low power traces and components. It would also
be a good idea to make the poles perpendicular to the PCB as well if using an open core. Stick cores usually
emit the most unwanted noise.
Feedback
Try to put the feedback trace as far from the inductor and noisy power traces as possible. You would also like
the feedback trace to be as direct as possible and somewhat thick. These two sometimes involve a trade-off,
but keeping it away from inductor EMI and other noise sources is the more critical of the two. It is often a good
idea to run the feedback trace on the side of the PCB opposite of the inductor with a ground plane separating
the two.
Filter Capacitors
When using a low value ceramic input filter capacitor, it should be located as close to the VIN pin of the IC as
possible. This will eliminate as much trace inductance effects as possible and give the internal IC rail a cleaner
voltage supply. Sometimes using a small resistor between VCC and IC VIN pin will more useful because the RC
will be a low-pass filter. Some designs require the use of a feed-forward capacitor connected from the output
to the feedback pin as well, usually for stability reasons. Using surface mount capacitors also reduces lead
length and lessens the chance of noise coupling into the effective antenna created by through-hole
components.
Compensation
If external compensation components are needed for stability, they should also be placed closed to the IC.
Surface mount components are recommended here as well for the same reasons discussed for the filter
capacitors. These should not be located very close to the inductor as well.
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Traces and Ground Plane
Make all of the power (high current) traces as short, direct, and thick as possible. It is a good practice on a
standard PCB board to make the traces an absolute minimum of 20 mils (0.5mm) per Ampere. The inductor,
output capacitors, and output diode (In synchronous case, means the low side switch) should be as close to
each other possible. This helps reduce the EMI radiated by the power traces due to the high switching
currents through them. This will also reduce lead inductance and resistance as well which in turn reduces
noise spikes, ringing, and resistive losses which produce voltage errors. The grounds of the IC, input
capacitors, output capacitors, and output diode (or switch, if applicable) should be connected close together
directly to a ground plane. It would also be a good idea to have a ground plane on both sides of the PCB. This
will reduce noise as well by reducing ground loop errors as well as by absorbing more of the EMI radiated by
the inductor. For multi-layer boards with more than two layers, a ground plane can be used to separate the
power plane (where the power traces and components are) and the signal plane (where the feedback and
compensation and components are) for improved performance. On multi-layer boards the use of vias will be
required to connect traces and different planes. It is good practice to use one standard via per 200mA of
current if the trace will need to conduct a significant amount of current from one plane to the other. Arrange the
components so that the switching current loops curl in the same direction. Due to the way switching regulators
operate, there are two power states. One state the switch is on and the other the switch is off. During each
state there will be a current loop made by the power components that are currently conducting. Place the
power components so that during each of the two states the current loop is conducting in the same direction.
This prevents magnetic field reversal caused by the traces between the two half-cycles and reduces radiated
EMI.
Heat Sinking
When using a surface mount power IC or external power switches, the PCB can often be used as the
heat-sink. This is done by simply using the copper area of the PCB to transfer heat from the device. Refer to
the device datasheet for information on using the PCB as a heat-sink for that particular device. This can often
eliminate the need for an externally attached heat-sink. These guidelines apply for any inductive switching
power supply. These include Step-down (Buck), Step-up (Boost), Fly-back, inverting Buck/Boost, and SEPIC
among others. The guidelines are also useful for linear regulators, which also use a feedback control scheme,
that are used in conjunction with switching regulators or switched capacitor converters.
This application note contains new product information. Diodes, Inc. reserves the right to modify the product specification without notice. No liability is
assumed as a result of the use of this product. No rights under any patent accompany the sale of the product.
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3. Design Procedure
3.1 Output Capacitor Selection
A. The output capacitor is required to filter the output and provide regulator loop stability. When selecting
an output capacitor, the important capacitor parameters are; the 100KHz Equivalent Series Resistance
(ESR), the RMS ripples current rating, voltage rating, and capacitance value. For the output capacitor,
the ESR value is the most important parameter. The ESR can be calculated from the following formula.


ESR =  V RIPPLE 
 2× I

LOAD (min) 

An aluminum electrolytic capacitor's ESR value is related to the capacitance and its voltage rating. In
most case, higher voltage electrolytic capacitors have lower ESR values. Most of the time, capacitors
with much higher voltage ratings may be needed to provide the low ESR values required for low output
ripple voltage. If the selected capacitor's ESR is extremely low, resulting in an oscillation at the output. It
is recommended to replace this low ESR capacitor by using two general standard capacitors in parallel.
B. The capacitor voltage rating should be at least 1.5 times greater than the output voltage, and often
much higher voltage ratings are needed to satisfy the low ESR requirements needed for low output
ripple voltage.
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assumed as a result of the use of this product. No rights under any patent accompany the sale of the product.
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3.2 Output N-channel MOSFETs Selection
A. The current ability of the output N-channel MOSFETs must be at least more than the peak switch
current IPK. The voltage rating VDS of the N-channel MOSFETs should be at least 1.25 times the
maximum input voltage.
B. The MOSFETs must be fast (switch time) and must be located close to the AP2014 using short leads
and short printed circuit traces. In case of a large output current, we must layout a copper to
reduce the temperature of these two MOSFETs.
Because of their fast switching speed and low DS(ON) resistor (RDS(ON)), the APEC AP70T03GH series
provide the best performance and efficiency, and especially in low output voltage applications.
3.3 Input Capacitor Selection
A. The RMS current rating of the input capacitor can be calculated from the following formula table. The
capacitor manufactured by data sheet must be checked to assure that this current rating is not
exceeded.
Calculation
δ
Step-down (buck) regulator
PK
Ton/(Ton+Toff)
I LOAD (max) − I LOAD (min)
m
I
I
I
∆I
I
LOAD (max)
2 × I LOAD (min)
L
IN ( rms )
+ I LOAD (min)
δ × (I PK × I m ) +


1
(∆ I L )2 
3

B. This capacitor should be located close to the IC using short leads and the voltage rating should be
approximately 1.5 times the maximum input voltage.
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AP2014/A Synchronous PWM Controller
4. Design Example
4.1 Summary of Target Specifications
Input Power
V
V
V
Regulated Output Power
Output Ripple Voltage
Output Voltage Load Regulation
Efficiency
Switching Frequency
V
= + 1.6V; I
IN (max)
OUT
RIPPLE
= +5V;
IN (min)
= +5V
LOAD(max)
= 5A;
I
LOAD(min)
= 0.5A
≤ 50 mV peak-to-peak
1% (0.2A to 5A)
85% minimum at 5A load.
F = 400KHz ± 10 %
4.2 Calculating and Components Selections
Calculation Formula
Select Condition
100Ω ≤ R2 ≤ 1KΩ
VOUT=VFB x ((R1/R2) + 1)
L(min) ≥
[V
IN (min)
]
− V SAT − V OUT × T ON (max)
2 × I LOAD (min)
I
PK
=
I
LOAD (max)
I
− I LOAD (min)


ESR =  V RIPPLE 

 2× I
LOAD (min) 

V WVDC ≥ 1.5 ×V OUT
1
2

I IN ( rms ) = δ × (I PK × I m ) + 3 (∆ I L ) 
V WVDC ≥ 1.5 ×V IN (max)
L
(min)
rms
≥
≥ 3.5uH
I
PK
= 4.5A
ESR ≤ 50mΩ
V WVDC ≥ 2.4V
I
ripple
≥
V
I
Component spec.
R2=1KΩ; R1=2.2KΩ
IN ( rms )
WVDC
Select L1=4.7uH
Select C12, C13,C15
470uF/16V*2pcs
=2.83A
≥ 7.5V
Select C7, C9,C10
470uF/16V*2pcs
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4.3 Efficiency Calculation
Temperature: room Temperature
★ Highside nMOS: AP70T03GH :VDS=30V; RDS=9mΩ;ID=60A
★ Lowside nMOS: AP70T03GH :VDS=30V; RDS=9mΩ; ID=60A
Vc = 12V
Temp(℃)
VIN(V)
IIN(A)
VOUT
IOUT(A)
Efficiency
5.00
0.019
1.617
0.0
0.00%
45
5.00
0.189
1.616
0.5
85.46%
42
5.00
0.363
1.615
1.0
88.94%
43
5.00
1.085
1.611
3.0
89.01%
44
5.00
1.849
1.606
5.0
86.80%
46
5.00
3.083
1.598
8.0
82.89%
52
5.00
3.965
1.593
10.0
80.34%
56
5.00
4.907
1.588
12.0
77.68%
58
5.00
6.428
1.582
15.0
73.82%
62
Efficiency
Efficiency
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0%
0
1
1
3
5
8
10
12
15
Iout(A)
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