LITTELFUSE 523

M INIA
TURE F USEHOLDERS
INIATURE
No. 523 / PIPclip
lead free
Specifications
Packaging
S00
blister tape (1x800 pcs.)
reel diameter 380 mm
tape width 16 mm
Mounting
PC Board, 5,2 mm pin spacing
Solder pins 0.4 x 1.2 mm
Materials
copper alloy, solderable tinned
Electrical Data (23 ºC)
Rated Voltage:
250 V
Max. Current/Power: 6.3 A/2.5 W
Minimum Cross Section
Conducting path - 0.2 mm 2
Solderability
235 °C, 2 s (IEC 60068-2-20)
Soldering Heat Resistance
260 ºC, 10 s (IEC 60068-2-20)
Unit Weight
0.4 g
Example for PC Board
OrderInformation
Qty.
OrderNumber
Series
523
0000
Packaging
S00
Specifications are subject
to change without notice
Note: 1.00 means the number one with two decimal places. 1,000 means the number one thousand.
050304
In our continuing strategy to deliver unparalleled circuit protection solutions,
technical expertise and application leadership, we proudly introduce the
WICKMANN Group and its products to the Littelfuse portfolio.
WebSite www.littelfuse.com