AD AD9869BCPZ

Broadband Modem Mixed-Signal Front End
AD9869
Broadband wireline networking
AD9869
2-4X
PWRDWN
MODE
TXEN/TXSYNC
TXCLK/TXQUIET
IAMP
TxDAC
10
0 TO –7.5dB
IOUTN–
0 TO –12dB
CLKOUT1
CLKOUT2
CLK
SYNC.
ADIO[11:6]/
Tx[5:0]
IOUTN+
2M CLK
MULTIPLIER
OSCIN
XTAL
ADIO[5:0]/
Rx[5:0]
10
RXEN/RXSYNC
RXCLK
AGC[5:0]
PORT
SPI
PORT
ADC
80MSPS
2-POLE
LPF
RX+
1-POLE
LPF
RX–
6
0 TO 6dB
4
REGISTER Δ = 1dB
CONTROL
–6 TO +18dB –6 TO +24dB
Δ = 6dB
Δ = 6dB
06736-001
APPLICATIONS
FUNCTIONAL BLOCK DIAGRAM
IOUTP–
Low cost 3.3 V CMOS MxFE for broadband modems
12-bit DAC converter
2×/4× interpolation filter
200 MSPS DAC update rate
Integrated 17 dBm line driver with 19.5 dB gain control
12-bit, 80 MSPS, ADC converter
−12 dB to +48 dB low noise RxPGA (<3 nV/√Hz)
Third-order, programmable low-pass filter
Flexible digital data path interface
Half- and full-duplex operation
Pin compatible with the AD9866
Various power-down/reduction modes
Internal clock multiplier (PLL)
2 auxiliary programmable clock outputs
Available in a 64-lead LFCSP_VQ
IOUTP+
FEATURES
Figure 1.
GENERAL DESCRIPTION
The AD9869 is a mixed-signal front-end (MxFE®) IC for
transceiver applications requiring Tx path and Rx path
functionality with data rates up to 80 MSPS. A lower cost, pincompatible version of the AD9866, the AD9869 removes the
current amplifier (IAMP) IOUTP functionality and limits the
PLL VCO operating range of 80 MHz to 200 MHz.
The part is well suited for half- and full-duplex applications.
The digital interface is extremely flexible, allowing simple
interfacing to digital back ends that support half- or full-duplex
data transfers, often allowing the AD9869 to replace discrete
ADC and DAC solutions. Power-saving modes include the
ability to reduce power consumption of individual functional
blocks or power down unused blocks in half-duplex applications.
A serial port interface (SPI) allows software programming of
the various functional blocks. An on-chip PLL clock multiplier
and synthesizer provide all the required internal clocks, as well
as two external clocks, from a single crystal or clock source.
The Tx signal path consists of a 2×/4× low-pass interpolation
filter, a 12-bit TxDAC, and a line driver. The transmit path
signal bandwidth can be as high as 34 MHz at an input data rate
of 80 MSPS. The TxDAC provides differential current outputs
that can be steered directly to an external load or to an internal
low distortion current amplifier (IAMP) capable of delivering
17 dBm peak signal power. Tx power can be digitally controlled
over a 19.5 dB range in 0.5 dB steps.
The receive path consists of a programmable amplifier (RxPGA),
a tunable low-pass filter (LPF), and a 12-bit ADC. The low noise
RxPGA has a programmable gain range of −12 dB to +48 dB in
1 dB steps. Its input referred noise is less than 3 nV/√Hz for gain
settings beyond 36 dB. The receive path LPF cutoff frequency
can be set over a 15 MHz to 35 MHz range or it can be simply
bypassed. The 12-bit ADC achieves excellent dynamic performance
up to an 80 MSPS span. Both the RxPGA and the ADC offer
scalable power consumption allowing power/performance
optimization.
The AD9869 provides a highly integrated solution for many
broadband modems. It is available in a space-saving package, a
16-lead LFCSP, and is specified over the commercial temperature
range (−40°C to +85°C).
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2007 Analog Devices, Inc. All rights reserved.
AD9869
TABLE OF CONTENTS
Features .............................................................................................. 1
Full-Duplex Mode ...................................................................... 17
Applications....................................................................................... 1
RxPGA Control .......................................................................... 19
Functional Block Diagram .............................................................. 1
TxPGA Control .......................................................................... 20
General Description ......................................................................... 1
Transmit Path.................................................................................. 21
Revision History ............................................................................... 2
Digital Interpolation Filters ...................................................... 21
Specifications..................................................................................... 3
TxDAC and IAMP Architecture .............................................. 22
Tx Path Specifications.................................................................. 3
Tx Programmable Gain Control .............................................. 23
Rx Path Specifications.................................................................. 4
TxDAC Output Operation........................................................ 23
Power Supply Specifications........................................................ 6
IAMP Current-Mode Operation.............................................. 23
Digital Specifications ................................................................... 7
Receive Path .................................................................................... 24
Serial Port Timing Specifications............................................... 7
Rx Programmable Gain Amplifier........................................... 24
Half-Duplex Data Interface (ADIO Port) Timing
Specifications ................................................................................ 8
Low-Pass Filter............................................................................ 25
Full-Duplex Data Interface (Tx and Rx Port) Timing
Specifications ................................................................................ 8
AGC Timing Considerations.................................................... 27
Absolute Maximum Ratings............................................................ 9
Thermal Characteristics .............................................................. 9
Explanation of Test Levels ........................................................... 9
ESD Caution.................................................................................. 9
Pin Configuration and Function Descriptions........................... 10
Serial Port ........................................................................................ 12
Register Map Description.......................................................... 14
Serial Port Interface (SPI).......................................................... 14
Digital Interface .............................................................................. 16
Half-Duplex Mode ..................................................................... 16
Analog-to-Digital Converter (ADC)....................................... 26
Clock Synthesizer ........................................................................... 28
Power Control and Dissipation .................................................... 30
Power-Down ............................................................................... 30
Half-Duplex Power Savings ...................................................... 30
Power Reduction Options ......................................................... 31
Power Dissipation....................................................................... 33
Mode Select upon Power-Up and Reset.................................. 33
Analog and Digital Loopback Test Modes.............................. 34
Outline Dimensions ....................................................................... 35
Ordering Guide .......................................................................... 35
REVISION HISTORY
5/07—Revision 0: Initial Version
Rev. 0 | Page 2 of 36
AD9869
SPECIFICATIONS
Tx PATH SPECIFICATIONS
AVDD = 3.3 V ± 5%, DVDD = CLKVDD = DRVDD = 3.3 V ± 10%, fOSCIN = 50 MHz, fDAC = 200 MHz, RSET = 2.0 kΩ, unless otherwise noted.
Table 1.
Parameter
TxDAC DC CHARACTERISTICS
Resolution
Update Rate
Full-Scale Output Current (IOUTP_FS)
Gain Error 2
Offset Error
Voltage Compliance Range
TxDAC GAIN CONTROL CHARACTERISTICS
Minimum Gain
Maximum Gain
Gain Step Size
Gain Step Accuracy
Gain Range Error
TxDAC AC CHARACTERISTICS 3
Fundamental
Signal-to-Noise and Distortion (SINAD)
Signal-to-Noise Ratio (SNR)
Total Harmonic Distortion (THD)
Spurious-Free Dynamic Range (SFDR)
IAMP DC CHARACTERISTICS
IOUTN Full-Scale Current = IOUTN+ + IOUTN−
AC Voltage Compliance Range
IAMPN AC CHARACTERISTICS 4
Fundamental
IOUTN SFDR (Third Harmonic)
REFERENCE
Internal Reference Voltage 5
Reference Error
Reference Drift
Tx DIGITAL FILTER CHARACTERISTICS (2× Interpolation)
Latency (Relative to 1/fDAC)
−0.2 dB Bandwidth
−3 dB Bandwidth
Stop-Band Rejection (0.289 fDAC to 0.711 fDAC)
Tx DIGITAL FILTER CHARACTERISTICS (4× Interpolation)
Latency (Relative to 1/fDAC)
−0.2 dB Bandwidth
−3 dB Bandwidth
Stop Band Rejection (0.289 fOSCIN to 0.711 fOSCIN)
PLL CLK MULTIPLIER
OSCIN Frequency Range
PLL M Factor Set to 2
PLL M Factor Set to 4
PLL M Factor Set to 8
Internal VCO Frequency Range
Duty Cycle
Temp
Test Level 1
Full
Full
Full
25°C
25°C
Full
II
IV
I
V
25°C
25°C
25°C
25°C
25°C
V
V
V
IV
V
Full
Full
Full
Full
IV
IV
IV
IV
66.6
68.4
Full
Full
IV
IV
2
1
25°C
Full
IV
43.3
25°C
I
1.23
Full
Full
V
V
0.7
30
Full
Full
Full
Full
V
V
V
V
43
0.2187
0.2405
50
Cycles
fOUT/fDAC
fOUT/fDAC
dB
Full
Full
Full
Full
V
V
V
V
96
0.1095
0.1202
50
Cycles
fOUT/fDAC
fOUT/fDAC
dB
Full
Full
Full
Full
Full
IV
IV
IV
IV
II
Rev. 0 | Page 3 of 36
Min
Typ
Max
12
200
25
2
±2
2
−1
68.5
40
20
10
80
40
+1.5
Unit
Bits
MSPS
mA
% FS
μA
V
−7.5
0
0.5
Monotonic
±2
dB
dB
dB
dB
dB
0.5
69.2
69.8
−79
81
dBm
dBc
dBc
dBc
dBc
−68.7
105
3.9
13
45.2
mA
V
dBm
dBc
V
3.4
80
50
25
200
60
%
ppm/oC
MHz
MHz
MHz
MHz
%
AD9869
Parameter
OSCIN Impedance
CLKOUT1 Jitter 6
CLKOUT2 Jitter 7
CLKOUT1 and CLKOUT2 Duty Cycle 8
Temp
25°C
25°C
Test Level 1
V
III
25°C
Full
III
III
Min
Typ
10||03
12
Max
6
45
Unit
ΜΩ||pF
ps rms
ps rms
%
55
1
See the Explanation of Test Levels section.
Gain error and gain temperature coefficients are based on the ADC only (with a fixed 1.23 V external reference and a 1 V p-p differential analog input).
3
TxDAC IOUTP_FS = 20 mA, differential output with 1:1 transformer with source and load termination of 50 Ω, fOUT = 5 MHz, 4x interpolation.
4
IOUTN full-scale current = 80 mA, fOSCIN = 80 MHz, fDAC =160 MHz, 2x interpolation.
5
Use external amplifier to drive additional load.
6
Internal VCO operates at 200 MHz; set to divide-by-1.
7
Because CLKOUT2 is a divided-down version of OSCIN, its jitter is typically equal to OSCIN.
8
CLKOUT2 is an inverted replica of OSCIN, if set to divide-by-1.
2
Rx PATH SPECIFICATIONS
AVDD = 3.3 V ± 5%, DVDD = CLKVDD = DRVDD = 3.3 V ± 10%, half- or full-duplex operation with CONFIG = 0 default power bias settings,
unless otherwise noted.
Table 2.
Parameter
Rx INPUT CHARACTERISTICS
Input Voltage Span
RxPGA Gain = −10 dB
RxPGA Gain = +48 dB
Input Common-Mode Voltage
Differential Input Impedance
Input Bandwidth with RxLPF Disabled, RxPGA = 0 dB
Input Voltage Noise Density
RxPGA Gain = 36 dB, f−3 dBF = 26 MHz
RxPGA Gain = 48 dB, f−3 dBF = 26 MHz
RxPGA CHARACTERISTICS
Minimum Gain
Maximum Gain
Gain Step Size
Gain Step Accuracy
Gain Range Error
RxLPF CHARACTERISTICS
Cutoff Frequency (f−3 dBF ) Range
Attenuation at 55.2 MHz with f−3 dBF = 21 MHz
Pass-Band Ripple
Settling Time
5 dB RxPGA Gain Step @ fADC = 50 MSPS
60 dB RxPGA Gain Step @ fADC = 50 MSPS
ADC DC CHARACTERISTICS
Resolution
Conversion Rate
Rx PATH LATENCY 2
Full-Duplex Interface
Half-Duplex Interface
Rx PATH COMPOSITE AC PERFORMANCE @ fADC = 50 MSPS 3
RxPGA Gain = 48 dB (Full-Scale = 8.0 mV p-p)
Signal-to-Noise and Distortion (SINAD)
Total Harmonic Distortion (THD)
Rev. 0 | Page 4 of 36
Temp
Test Level 1
Full
Full
25°C
25°C
25°C
III
III
III
III
III
6.33
8
1.3
400||4.0
53
V p-p
mV p-p
25°C
25°C
III
III
2.7
2.4
nV/√Hz
nV/√Hz
25°C
25°C
25°C
25°C
25°C
III
III
III
III
III
Full
25°C
25°C
III
III
III
25°C
25°C
III
III
N/A
Full
N/A
II
Full
Full
V
V
10.5
10.0
Cycles
Cycles
25°C
25°C
III
III
43.7
−71
dBc
dBc
Min
Typ
Max
V
Ω||pF
MHz
−12
48
1
Monotonic
0.5
15
Unit
dB
dB
dB
dB
dB
20
±1
35
MHz
dB
dB
20
100
ns
ns
12
20
80
Bits
MSPS
AD9869
Parameter
RxPGA Gain = 24 dB (Full-Scale = 126 mV p-p)
Signal-to-Noise Ratio (SNR)
Total Harmonic Distortion (THD)
RxPGA Gain = 0 dB (Full-Scale = 2.0 V p-p)
Signal-to-Noise and Distortion (SINAD)
Total Harmonic Distortion (THD)
Rx PATH COMPOSITE AC PERFORMANCE @ fADC = 80 MSPS 4
RxPGA Gain = 48 dB (Full-Scale = 8.0 mV p-p)
Signal-to-Noise Ratio (SNR)
Total Harmonic Distortion (THD)
RxPGA Gain = 24 dB (Full-Scale = 126 mV p-p)
Signal-to-Noise Ratio (SNR)
Total Harmonic Distortion (THD)
RxPGA Gain = 0 dB (Full-Scale = 2.0 V p-p)
Signal-to-Noise Ratio (SNR)
Total Harmonic Distortion (THD)
Rx-to-Tx PATH FULL-DUPLEX ISOLATION (1 V p-p, 10 MHz Sine Wave Tx Output)
RxPGA Gain = 40 dB
IOUTP± Pins to RX± Pins
RxPGA Gain = 0 dB
IOUTP± Pins to RX± Pins
1
See the Explanation of Test Levels section.
Includes RxPGA, ADC pipeline, and ADIO bus delay relative to fADC.
fIN = 5 MHz, AIN = −1.0 dBFS, LPF cutoff frequency set to 15.5 MHz with Register 0x08 = 0x80.
4
fIN = 5 MHz, AIN = −1.0 dBFS, LPF cutoff frequency set to 26 MHz with Register 0x08 = 0x80.
2
3
Rev. 0 | Page 5 of 36
Temp
Test Level 1
25°C
25°C
III
III
63.1
−67.2
dBc
dBc
Full
Full
IV
IV
64.3
−67.3
dBc
dBc
25°C
25°C
III
III
41.8
−67
dBc
dBc
25°C
25°C
III
III
58.6
−62.9
dBc
dBc
25°C
25°C
II
II
25°C
III
83
dBc
25°C
III
123
dBc
Min
61.1
Typ
62.9
−70.8
Max
−60.8
Unit
dBc
dBc
AD9869
POWER SUPPLY SPECIFICATIONS
AVDD = 3.3 V, DVDD = CLKVDD = DRVDD = 3.3 V, RSET = 2 kΩ, full-duplex operation with fDATA = 80 MSPS 1 , unless otherwise noted.
Table 3.
Parameter
SUPPLY VOLTAGES
AVDD
CLKVDD
DVDD
DRVDD
IS_TOTAL (Total Supply Current)
POWER CONSUMPTION
IAVDD + ICLKVDD (Analog Supply Current)
IDVDD + IDRVDD (Digital Supply Current)
POWER CONSUMPTION (Half-Duplex Operation with fDATA = 50 MSPS) 3
Tx Mode
IAVDD + ICLKVDD
IDVDD + IDRVDD
Rx Mode
IAVDD + ICLKVDD
IDVDD + IDRVDD
POWER CONSUMPTION OF FUNCTIONAL BLOCKS1 (IAVDD + ICLKVDD)
RxPGA and LPF
ADC
TxDAC
IAMP (Programmable)
Reference
CLK PLL and Synthesizer
MAXIMUM ALLOWABLE POWER DISSIPATION
STANDBY POWER CONSUMPTION
IS_TOTAL (Total Supply Current)
POWER-DOWN DELAY (Using PWRDWN Pin)
RxPGA and LPF
ADC
TxDAC
IAMP
CLK PLL and Synthesizer
POWER-UP DELAY (Using PWRDWN Pin)
RxPGA and LPF
ADC
TxDAC
IAMP
CLK PLL and Synthesizer
1
Temp
Test Level 2
Min
Typ
Max
Unit
Full
Full
Full
Full
Full
V
V
V
V
II
3.135
3.0
3.0
3.0
3.3
3.3
3.3
3.3
406
3.465
3.6
3.6
3.6
475
V
V
V
V
mA
Full
Full
IV
IV
311
95
342
133
mA
mA
25°C
25°C
IV
IV
112
46
130
49.5
mA
mA
25°C
25°C
IV
IV
225
36.5
253
39
mA
mA
25°C
25°C
25°C
25°C
25°C
25°C
Full
III
III
III
III
III
III
IV
87
108
38
100
mA
mA
mA
mA
mA
mA
W
Full
10
170
107
1.66
13
mA
25°C
25°C
25°C
25°C
25°C
III
III
III
III
III
440
12
20
20
27
ns
ns
ns
ns
ns
25°C
25°C
25°C
25°C
25°C
III
III
III
III
III
7.8
88
13
20
20
μs
ns
μs
ns
μs
Default power-up settings for MODE = high and CONFIG = low, IOUTP_FS = 20 mA, does not include IAMP current consumption, which is application dependent.
See the Explanation of Test Levels section.
3
Default power-up settings for MODE = low and CONFIG = low.
2
Rev. 0 | Page 6 of 36
AD9869
DIGITAL SPECIFICATIONS
AVDD = 3.3 V ± 5%, DVDD = CLKVDD = DRVDD = 3.3 V ± 10%, RSET = 2 kΩ, unless otherwise noted.
Table 4.
Parameter
CMOS LOGIC INPUTS
High Level Input Voltage
Low Level Input Voltage
Input Leakage Current
Input Capacitance
CMOS LOGIC OUTPUTS (CLOAD = 5 pF)
High Level Output Voltage (IOH = 1 mA)
Low Level Output Voltage (IOH = 1 mA)
Output Rise/Fall Time
High Strength Mode and CLOAD = 15 pF
Low Strength Mode and CLOAD = 15 pF
High Strength Mode and CLOAD = 5 pF
Low Strength Mode and CLOAD = 5 pF
RESET
Minimum Low Pulse Width (Relative to fADC)
1
Temp
Test Level 1
Min
Full
Full
VI
VI
DRVDD − 0.7
Full
VI
Full
Full
VI
VI
Full
Full
Full
Full
VI
VI
VI
VI
Typ
Max
Unit
0.4
12
V
V
μA
pF
3
DRVDD − 0.7
V
V
0.4
1.5/2.3
1.9/2.7
0.7/0.7
1.0/1.0
ns
ns
ns
ns
1
Clock cycles
See the Explanation of Test Levels section.
SERIAL PORT TIMING SPECIFICATIONS
AVDD = 3.3 V ± 5%, DVDD = CLKVDD = DRVDD = 3.3 V ± 10%, unless otherwise noted.
Table 5.
Parameter
WRITE OPERATION (See Figure 5)
SCLK Clock Rate (fSCLK)
SCLK Clock High (tHI)
SCLK Clock Low (tLOW)
SDIO to SCLK Setup Time (tDS)
SCLK to SDIO Hold Time (tDH)
SEN to SCLK Setup Time (tS)
SCLK to SEN Hold Time (tH)
READ OPERATION (See Figure 6 and Figure 7)
SCLK Clock Rate (fSCLK)
SCLK Clock High (tHI)
SCLK Clock Low (tLOW)
SDIO to SCLK Setup Time (tDS)
SCLK to SDIO Hold Time (tDH)
SCLK to SDIO (or SDO) Data Valid Time (tDV)
SEN to SDIO Output Valid to High-Z (tEZ)
1
Temp
Test Level 1
Min
Full
Full
Full
Full
Full
Full
Full
IV
IV
IV
IV
IV
IV
IV
14
14
14
0
14
0
Full
Full
Full
Full
Full
Full
Full
IV
IV
IV
IV
IV
IV
IV
See the Explanation of Test Levels section.
Rev. 0 | Page 7 of 36
Typ
Max
Unit
32
MHz
ns
ns
ns
ns
ns
ns
32
MHz
ns
ns
ns
ns
ns
ns
14
14
14
0
14
2
AD9869
HALF-DUPLEX DATA INTERFACE (ADIO PORT) TIMING SPECIFICATIONS
AVDD = 3.3 V ± 5%, DVDD = CLKVDD = DRVDD = 3.3 V ± 10%, unless otherwise noted.
Table 6.
Parameter
READ OPERATION 2 (See Figure 9)
Output Data Rate
Three-State Output Enable Time (tPZL)
Three-State Output Disable Time (tPLZ)
Rx Data Valid Time (tVT)
Rx Data Output Delay (tOD)
WRITE OPERATION (See Figure 8)
Input Data Rate (2× Interpolation)
Input Data Rate (4× Interpolation)
Tx Data Setup Time (tDS)
Tx Data Hold Time (tDH)
Latch Enable Time (tEN)
Latch Disable Time (tDIS)
1
2
Temp
Test Level 1
Min
Full
Full
Full
Full
Full
II
II
II
II
II
20
Full
Full
Full
Full
Full
Full
II
II
II
II
II
II
Typ
Max
Unit
80
3
3
MSPS
ns
1.5
4
40
20
1
2.5
80
50
ns
ns
ns
3
3
MSPS
MSPS
ns
ns
ns
ns
Max
Unit
See the Explanation of Test Levels section.
CLOAD = 5 pF for digital data outputs.
FULL-DUPLEX DATA INTERFACE (Tx AND Rx PORT) TIMING SPECIFICATIONS
AVDD = 3.3 V ± 5%, DVDD = CLKVDD = DRVDD = 3.3 V ± 10%, unless otherwise noted.
Table 7.
Parameter
Tx PATH INTERFACE (See Figure 12)
Input Nibble Rate (2× Interpolation)
Input Nibble Rate (4× Interpolation)
Tx Data Setup Time (tDS)
Tx Data Hold Time (tDH)
Rx PATH INTERFACE 2 (See Figure 13)
Output Nibble Rate
Rx Data Valid Time (tDV)
Rx Data Hold Time (tDH)
1
2
Temp
Test Level 1
Min
Full
Full
Full
Full
II
II
II
II
80
40
2.5
1.5
160
100
MSPS
MSPS
ns
ns
Full
Full
Full
II
II
II
40
3
0
160
MSPS
ns
ns
See the Explanation of Test Levels section.
CLOAD = 5 pF for digital data outputs.
Rev. 0 | Page 8 of 36
Typ
AD9869
ABSOLUTE MAXIMUM RATINGS
Table 8.
Parameter
ELECTRICAL
AVDD, CLKVDD Voltage
DVDD, DRVDD Voltage
RX+, RX−, REFT, REFB
IOUTP+, IOUTP−
IOUTN+, IOUTN−
OSCIN, XTAL
REFIO, REFADJ
Digital Input and Output Voltage
Digital Output Current
ENVIRONMENTAL
Operating Temperature Range
(Ambient)
Maximum Junction Temperature
Lead Temperature (Soldering, 10 sec)
Storage Temperature Range (Ambient)
Rating
THERMAL CHARACTERISTICS
3.9 V maximum
3.9 V maximum
−0.3 V to AVDD + 0.3 V
−1.5 V to AVDD + 0.3 V
−0.3 V to +3.9 V
−0.3 V to CLVDD + 0.3 V
−0.3 V to AVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
5 mA maximum
Thermal Resistance: 64-lead LFCSP (4-layer board).
θJA = 24°C/W (paddle soldered to ground plane, 0 LPM air).
θJA = 30.8°C/W (paddle not soldered to ground plane, 0 LPM air).
EXPLANATION OF TEST LEVELS
I.
100% production tested.
II.
100% production tested at 25°C and guaranteed by design
and characterization at specified temperatures.
III.
Sample tested only.
IV.
Parameter is guaranteed by design and characterization
testing.
V.
Parameter is a typical value only.
VI.
100% production tested at 25°C and guaranteed by design
and characterization for industrial temperature range.
−40°C to +85°C
125°C
150°C
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. 0 | Page 9 of 36
AD9869
DRVSS
PWRDWN
CLKOUT2
DVDD
DVSS
CLKVDD
OSCIN
XTAL
CLKVSS
CONFIG
MODE
IOUTP+
IOUTP–
IOUTN+
NC
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
ADIO11/Tx[5]
1
48
AVSS
ADIO10/Tx[4]
2
47
AVSS
46
IOUTN–
PIN 1
IDENTIFIER
ADIO9/Tx[3]
3
ADIO8/Tx[2]
4
45
NC
ADIO7/Tx[1]
5
44
AVSS
ADIO6/Tx[0]
6
43
AVDD
ADIO5/Tx[5]
7
42
REFIO
ADIO4/Tx[4]
8
41
REFADJ
ADIO3/Rx[3]
9
40
AVDD
ADIO2/Rx[2] 10
39
AVSS
11
38
RX+
ADIO0/Rx[0] 12
37
RX–
RXEN/RXSYNC 13
36
AVSS
TXEN/TXSYNC 14
35
AVDD
TXCLK/TXQUIET 15
34
AVSS
RXCLK 16
33
REFT
24
25
CLKOUT1
SDIO
SDO
SCLK
SEN
GAIN/PGA[5]
PGA[4]
26
27
28
29
30
31
32
REFB
23
AVSS
22
RESET
21
PGA[0]
20
PGA[1]
19
PGA[2]
18
PGA[3]
17
DRVSS
TOP VIEW
(Not to Scale)
DRVDD
ADIO1/Rx[1]
AD9869
Figure 2. Pin Configuration
Table 9. Pin Function Descriptions
Pin No.
1
2 to 5
6
7
8, 9
10
11
12
13
14
15
16
Mnemonic
ADIO11
Tx[5]
ADIO10 to ADIO7
Tx[4:1]
ADIO6
Tx[0]
ADIO5
Rx[5]
ADIO4, ADIO3
Rx[4:3]
ADIO2
Rx[2]
ADIO1
Rx[1]
ADIO0
Rx[0]
RXEN
RXSYNC
TXEN
TXSYNC
TXCLK
TXQUIET
RXCLK
Mode 1
HD
FD
HD
FD
HD
FD
HD
FD
HD
FD
HD
FD
HD
FD
HD
FD
HD
FD
HD
FD
HD
FD
HD
FD
Description
MSB of ADIO Buffer.
MSB of Tx Nibble Input.
Bit 10 to Bit 7 of ADIO Buffer.
Bit 4 to Bit 1 of Tx Nibble Input.
Bit 6 of ADIO Buffer.
LSB of Tx Nibble Input.
Bit 5 of ADIO Buffer.
MSB of Rx Nibble Output.
Bit 4 to Bit 3 of ADIO Buffer.
Bit 4 to Bit 3 of Rx Nibble Output.
Bit 2 of ADIO Buffer.
Bit 2 of Rx Nibble Output.
Bit 1 of ADIO Buffer.
Bit 1 of Rx Nibble Output.
LSB of ADIO Buffer.
LSB of Rx Nibble Output.
ADIO Buffer Control Input.
Rx Data Synchronization Output.
Tx Path Enable Input.
Tx Data Synchronization Input.
ADIO Sample Clock Input.
Fast TxDAC/IAMP Power-Down.
ADIO Request Clock Input.
Rx and Tx Clock Output at 2 x fADC.
Rev. 0 | Page 10 of 36
06736-002
DRVDD
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
AD9869
Pin No.
17, 64
18, 63
19
20
21
22
23
24
25 to 29
30
31, 34, 36, 39, 44, 47, 48
32, 33
35, 40, 43
37, 38
41
42
45, 49
46
50
51
52
53
54
55
56
57
58
59
60
61
62
1
Mnemonic
DRVDD
DRVSS
CLKOUT1
SDIO
SDO
SCLK
SEN
GAIN
PGA[5]
PGA[4:0]
RESET
AVSS
REFB, REFT
AVDD
RX−, RX+
REFADJ
REFIO
NC
IOUTN−
IOUTN+
IOUTP−
IOUTP+
MODE
CONFIG
CLKVSS
XTAL
OSCIN
CLKVDD
DVSS
DVDD
CLKOUT2
PWRDWN
Mode 1
FD
HD or FD
HD or FD
Description
Digital Output Driver Supply Input.
Digital Output Driver Supply Return.
fADC/N Clock Output (R = 1, 2, or 3).
Serial Port Data Input/Output.
Serial Port Data Output.
Serial Port Clock Input.
Serial Port Enable Input.
Tx Data Port (Tx[5:0]) Mode Select.
MSB of PGA Input Data Port.
Bit 4 to Bit 0 of PGA Input Data Port.
Reset Input (Active Low).
Analog Supply Return.
ADC Reference Decoupling Nodes.
Analog Power Supply Input.
Receive Path − and + Analog Inputs.
TxDAC Full-Scale Current Adjust.
TxDAC Reference Input/Output.
Do Not Connect; Leave Open.
−Tx Mirror Current Output Sink.
+Tx Mirror Current Output Sink.
−TxDAC Current Output Source.
+TxDAC Current Output Source.
Digital Interface Mode Select Input, Low = HD, High = FD.
Power-Up SPI Register Default Setting Input.
Clock Oscillator/Synthesizer Supply Return.
Crystal Oscillator Inverter Output.
Crystal Oscillator Inverter Input.
Clock Oscillator/Synthesizer Supply.
Digital Supply Return.
Digital Supply Input.
fOSCIN/L Clock Output (L = 1, 2, or 4).
Power-Down Input.
HD = half-duplex mode; FD = full-duplex mode.
Rev. 0 | Page 11 of 36
AD9869
SERIAL PORT
Table 10. SPI Register Mapping
Address
Bit 1
Description
Width
(Hex)
SPI PORT CONFIGURATION AND SOFTWARE RESET
0x00
7
4-Wire SPI
1
6
SPI LSB First
1
5
Software Reset
1
POWER CONTROL REGISTERS (Via PWRDWN Pin)
0x01
7
CLK Synthesizer
1
6
TxDAC/IAMP
1
5
Tx Digital
1
4
REF
1
3
ADC CML
1
2
ADC
1
1
PGA Bias
1
0
RxPGA
1
0x02
7
CLK Synthesizer
1
6
TxDAC/IAMP
1
5
Tx Digital
1
4
REF
1
3
ADC CML
1
2
ADC
1
1
PGA Bias
1
0
RxPGA
1
HALF-DUPLEX POWER CONTROL
0x03
7:3
Tx OFF Delay
5
2
Rx_TXEN
1
1
Tx PWRDN
1
0
Rx PWRDN
1
PLL CLOCK MULTIPLIER/SYNTHESIZER CONTROL
0x04
4
fADC from PLL
1
3:2
PLL Divide-N
2
1:0
PLL Multiplier-M
2
0x05
2
OSCIN to RXCLK
1
1
Invert RXCLK
1
0
Disable RXCLK
1
0x06
7:6
CLKOUT2 Divide
2
5
CLKOUT2 Invert
1
4
CLKOUT2 Disable
1
3:2
CLKOUT1 Divide
2
1
CLKOUT1 Invert
1
0
CLKOUT1 Disable
1
Rx PATH CONTROL
0x07
5
Initiate Offset Cal. 1
4
Rx Low Power
1
0
Enable Rx LPF
1
0x08
7:0
8
Rx Filter Target
Cutoff Frequency
Power-Up Default Value
MODE = 0
MODE = 1
(Half-Duplex)
(Full-Duplex)
CONFIG = 0 CONFIG = 1 CONFIG = 0
Comments
0
0
0
0
0
0
0
0
0
Default SPI configuration is 3-wire,
MSB first.
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
PWRDWN = 0.
Default setting is for all blocks powered on.
0xFF
0xFF
0xFF
0xFF
0xFF
0xFF
0xFF
0xFF
0
00
01
0
0
0
01
0
0
01
0
0
0
00
10
0
0
0
01
0
0
01
0
0
0
00
01
0
0
0
01
0
0
01
0
0
0
0
1
0x80
0
1
1
0x61
0
0
1
0x80
Rev. 0 | Page 12 of 36
N/A
N/A
N/A
N/A
PWRDWN = 1.
Default setting is for all functional blocks
powered down except PLL.
Default setting is for TXEN input to
control power-on/power-off of Tx/Rx
path. Tx driver delayed by 31 1/fDATA clock
cycles.
Full-duplex RXCLK normally at nibble rate.
Default setting is CLKOUT2 and
CLKOUT1 enabled with divide-by-2.
Default setting has LPF on.
Rx path at nominal power bias setting for
CONFIG = 0 and low power for CONFIG = 1.
Refer to the Low-Pass Filter section.
AD9869
Power-Up Default Value
MODE = 0
MODE = 1
(Half-Duplex)
(Full-Duplex)
CONFIG = 0 CONFIG = 1 CONFIG = 0
Address
Bit 1
Description
Width
(Hex)
Tx/Rx PATH GAIN CONTROL
0x09
6
Enable SPI Rx Gain
1
0x00
5:0
Rx Gain Code
6
0x00
0x0A
6
Enable SPI Tx Gain 1
0x7F
5:0
Tx Gain Code
6
0x7F
TxPGA AND RxPGA CONTROL
0x0B
6
PGA Code for Tx
1
0
5
PGA Code for Rx
1
1
3
Force Gain Strobe
1
0
2
Rx Gain on Tx Port
1
0
1
3-Bit RxPGA Port
1
0
Tx DIGITAL FILTER AND INTERFACE
0x0C
7:6
2
01
Interpolation
Factor
4
1
0
Invert
TXEN/TXSYNC
3
Tx 5/5 Nibble 2
1
N/A
2
LS Nibble First2
1
N/A
1
TXCLK Neg. Edge
1
0
0
Twos Complement 1
0
Rx INTERFACE AND ANALOG/DIGITAL LOOPBACK
0x0D
7
Analog Loopback
1
0
6
Digital Loopback2
1
0
5
Rx Port Three-State 1
N/A
4
1
0
Invert
RXEN/RXSYNC
3
Rx 5/5 Nibble
1
N/A
2
LS Nibble First
1
N/A
1
RXCLK Neg. Edge
1
0
0
Twos Complement 1
0
DIGITAL OUTPUT DRIVE STRENGTH, TxDAC OUTPUT, AND REV ID
0x0E
7
1
0
Low Digital Drive
Strength
0
TxDAC Output
1
0
0x0F
3:0
REV ID Number
4
0x00
Tx IAMP GAIN AND BIAS CONTROL
0x10
7
Select Tx Gain
1
0x04
2:0
N
3
0x04
0x12
6:4
Standing Current
3
0x01
2:0
3
0x01
IOFF1 Standing
Current
0x13
7:5
CPGA Bias Adjust
3
0x00
4:3
SPGA Bias Adjust
2
2:0
ADC Bias Adjust
4
1
2
Comments
0x00
0x00
0x7F
0x7F
0x00
0x00
0x7F
0x7F
Default setting is for hardware Rx gain
code via PGA or Tx data port.
0
1
0
0
1
0
1
0
1
0
Default setting is RxPGA control active via
PGA port.
00
01
0
0
Default setting is 2× interpolation with
LPF response. Data format is straight
binary for half-duplex and twos
complement for full-duplex interface.
N/A
N/A
0
0
0
0
0
1
0
0
N/A
0
0
0
0
0
N/A
N/A
0
0
0
0
0
1
0
0
0
0x00
0
0x00
0x04
0x04
0x01
0x01
0x04
0x04
0x01
0x01
N = 0, 1, 2, 3, 4.
0x00
0x00
Current bias setting for Rx path’s
functional blocks. Refer to the Power
Reduction Options section.
Bits that are undefined should always be assigned a 0.
Full-duplex only.
Rev. 0 | Page 13 of 36
Default setting is for Tx gain code via
SPI control.
Data format is straight binary for
half-duplex and twos complement for
full-duplex interface. Analog loopback:
ADC Rx data fed back to TxDAC. Digital
loopback: Tx input data to Rx output port.
Default setting is for high drive strength
and IAMP enabled.
Standing current.
AD9869
The AD9869 contains a set of programmable registers (see
Table 10) that are used to optimize its numerous features,
interface options, and performance parameters from its default
register settings. Registers pertaining to similar functions have
been grouped together and assigned adjacent addresses to
minimize the update time when using the multibyte serial port
interface (SPI) read/write feature. Bits that are undefined within
a register should be assigned a 0 when writing to that register.
The default register settings are intended to allow some applications to operate without using an SPI. The AD9869 can be
configured to support a half- or full-duplex digital interface via
the MODE pin, with each interface having two possible default
register settings determined by the setting of the CONFIG pin.
For instance, applications that need to use only the Tx or Rx path
functionality can configure the AD9869 for a half-duplex interface
(MODE = 0), and use the TXEN pin to select between the Tx or
Rx signal path with the unused path remaining in a reduced
power state. The CONFIG pin can be used to select the default
interpolation ratio of the Tx path and RxPGA gain mapping.
SERIAL PORT INTERFACE (SPI)
The serial port of the AD9869 has 3-wire or 4-wire SPI capability
allowing read/write access to all registers that configure the device’s
internal parameters. Registers pertaining to the SPI are listed in
Table 11. The default 3-wire serial communication port consists
of a clock (SCLK), serial port enable (SEN), and a bidirectional
data (SDIO) signal. SEN is an active low, control gating, read
and write cycle. When SEN is high, SDO and SDIO are threestated. The inputs to SCLK, SEN, and SDIO contain a Schmitt
trigger with a nominal hysteresis of 0.4 V centered about
DRVDD/2. The SDO pin remains three-stated in a 3-wire SPI
interface.
An 8-bit instruction header must accompany each read and
write operation. The instruction header is shown in Table 12.
The MSB is an R/W indicator bit with logic high indicating a
read operation. The next two bits, N1 and N0, specify the
number of bytes (one to four bytes) to be transferred during the
data transfer cycle. The remaining five bits specify the address
bits to be accessed during the data transfer portion. The data
bits immediately follow the instruction header for both read
and write operations.
Table 12. Instruction Header Information
MSB
17
R/W
16
N1
15
N0
14
A4
13
A3
12
A2
11
A1
LSB
10
A0
The AD9869 serial port can support both MSB (most significant
bit) first and LSB (least significant bit) first data formats. Figure 3
illustrates how the serial port words are built for the MSB first
and Figure 4 illustrates LSB first modes. The bit order is
controlled by the SPI LSB first bit (Register 0x00, Bit 6). The
default value is 0, MSB first. Multibyte data transfers in MSB
format can be completed by writing an instruction byte that
includes the register address of the last address to be accessed.
The AD9869 automatically decrements the address for each
successive byte required for the multibyte communication cycle.
INSTRUCTION CYCLE
SEN
DATA TRANSFER CYCLE
SCLK
SDATA
R/W N1 N2 A4
A3 A2
A1 A0 D71 D61
D1N D0N
06736-003
REGISTER MAP DESCRIPTION
Figure 3. SPI Timing, MSB First
INSTRUCTION CYCLE
SEN
DATA TRANSFER CYCLE
SCLK
Table 11. SPI Registers Pertaining to SPI Options
Bit
7
6
SDATA
Description
Enable 4-wire SPI.
Enable SPI LSB first.
A0
A1
A2 A3
A4 N2
N1 R/W D01 D11
D6N D7N
06736-004
Address (Hex)
0x00
Figure 4. SPI Timing, LSB First
A 4-wire SPI can be enabled by setting the 4-wire SPI bit high,
causing the output data to appear on the SDO pin instead of on the
SDIO pin. The SDIO pin serves as an input-only throughout the
read operation. Note that the SDO pin is active only during the
transmission of data and remains three-stated at any other time.
When the SPI LSB first bit is set high, the serial port interprets
both instruction and data bytes LSB first. Multibyte data transfers
in LSB format can be completed by writing an instruction byte
that includes the register address of the first address to be accessed.
The AD9869 automatically increments the address for each
successive byte required for the multibyte communication cycle.
Rev. 0 | Page 14 of 36
AD9869
Figure 5 illustrates the timing requirements for a write operation to the SPI port. After the serial port enable (SEN) signal
goes low, data (SDIO) pertaining to the instruction header is
read on the rising edges of the clock (SCLK). To initiate a write
operation, the read/not-write bit is set low. After the instruction
header is read, the eight data bits pertaining to the specified
register are shifted into the SDIO pin on the rising edge of the
next eight clock cycles. If a multibyte communication cycle is
specified, the destination address is decremented (MSB first)
and shifts in another eight bits of data. This process repeats until
all the bytes specified in the instruction header (N1 bit, N0 bit)
are shifted into the SDIO pin. SEN must remain low during the
data transfer operation, only going high after the last bit is
shifted into the SDIO pin.
Figure 6 illustrates the timing for a 3-wire read operation to the
SPI port. After SEN goes low, data (SDIO) pertaining to the
instruction header is read on the rising edges of SCLK. A read
operation occurs if the read/not-write indicator is set high.
After the address bits of the instruction header are read, the
eight data bits pertaining to the specified register are shifted out
of the SDIO pin on the falling edges of the next eight clock
cycles. If a multibyte communication cycle is specified in the
instruction header, a similar process as previously described for
a multibyte SPI write operation applies. The SDO pin remains
three-stated in a 3-wire read operation.
Figure 7 illustrates the timing for a 4-wire read operation to the
SPI port. The timing is similar to the 3-wire read operation with
the exception of the data appearing at the SDO pin, while the
SDIO pin remains at high impedance throughout the operation.
The SDO pin is an active output only during the data transfer
phase and remains three-stated at all other times.
tS 1/fSCLK
SEN
tH
tLOW
tHI
tDS
tDH
SDIO
R/W
N1
N0
A0
D6 D1
D7
D0
06736-005
SCLK
Figure 5. SPI Write Operation Timing
tS 1/fSCLK
SEN
tLOW
tHI
tDS
tDV
tDH
SDIO
R/W
N1
A2
A1
A0
tEZ
D7
D6
D1
D0
06736-006
SCLK
Figure 6. SPI 3-Wire Read Operation Timing
tS 1/fSCLK
SEN
tLOW
tHI
SCLK
SDIO
tEZ
tDH
R/W
N1
A2
A1
A0
tEZ
tDV
D7
SDO
D6
Figure 7. SPI 4-Wire Read Operation Timing
Rev. 0 | Page 15 of 36
D1
D0
06736-007
tDS
AD9869
DIGITAL INTERFACE
The output from the receive path is driven onto the ADIO bus
when the RXEN pin is high and when a clock is present on the
RXCLK pin. While the output latch is enabled by RXEN, valid
data appears on the bus after a 6-clock-cycle delay due to the
internal FIFO delay. Note that Rx data is not latched back into
the Tx path if TXEN is high during this interval with TXCLK
present. The ADIO bus becomes three-stated once the RXEN
pin returns low. Figure 9 shows the receive path output timing.
RXCLK
RXEN
Internally, the ADIO port consists of an input latch for the Tx
path in parallel with an output latch with three-state outputs for
the Rx path. TXEN is used to enable the input latch; RXEN is
used to three-state the output latch. A five-sample-deep FIFO is
used on the Tx and Rx paths to absorb any phase difference
between the AD9869 internal clocks and the externally supplied
clocks (TXCLK, RXCLK). The ADIO bus accepts input datawords into the transmit path when the TXEN pin is high, the
RXEN pin is low, and a clock is present on the TXCLK pin, as
shown in Figure 8.
TX0
TX1
TX2
TX3
TX4
06736-008
ADIO[11:0]
RXEN
Figure 8. Transmit Data Input Timing Diagram
The Tx interpolation filter(s) following the ADIO port can be
flushed with zeros if the clock signal into the TXCLK pin is
present for 33 clock cycles after TXEN goes low. Note that the
data on the ADIO bus is irrelevant over this interval.
RX2
RX3
Table 13. SPI Registers for Half-Duplex Interface
Address (Hex)
0x0C
0x0D
0x0E
tDIS
tDH
RX1
To add flexibility to the digital interface port, several programming options are available in the SPI registers. These options
are listed in Table 13. The default Tx and Rx data input formats
are straight binary, but can be changed to twos complement.
The default TXEN and RXEN settings are active high, but can
be set to opposite polarities, thus allowing them to share the
same control. In this case, the ADIO port can still be placed
onto a shared bus by disabling its input latch via the control
signal, and disabling the output driver via the SPI register. The
clock timing can be independently changed on the transmit and
receive paths by selecting either the rising or falling clock edge
as the validating/sampling edge of the clock. Lastly, the output
driver strength can be reduced for lower data rate applications.
tDS
tEN
RX0
Figure 9. Receive Data Output Timing Diagram
TXCLK
TXEN
tOD
tPLZ
tVT
ADIO[11:0]
HALF-DUPLEX MODE
The half-duplex mode is selected when the MODE pin is tied
low. In this mode, the bidirectional ADIO port is typically
shared in burst fashion between the transmit path and receive
path. Two control signals, TXEN and RXEN, from a DSP (or
digital ASIC) control the bus direction by enabling the ADIO
port’s input latch and output driver, respectively. Two clock
signals are also used, TXCLK to latch the Tx input data, and
RXCLK to clock the Rx output data. The ADIO port can be
disabled by setting TXEN and RXEN low (default setting), thus
allowing it to be connected to a shared bus.
tPZL
06736-009
The digital interface port is configurable for half-duplex or fullduplex operation by pin strapping the MODE pin low or high,
respectively. In half-duplex mode, the digital interface port
becomes a 12-bit bidirectional bus called the ADIO port. In
full-duplex mode, the digital interface port is divided into two
6-bit ports called Tx[5:0] and Rx[5:0] for simultaneous Tx and
Rx operations. In this mode, data is transferred between the
ASIC and AD9869 in 6-bit (or 5-bit) nibbles. The AD9869 also
features a flexible digital interface for updating the RxPGA and
TxPGA gain registers via a 6-bit PGA port or Tx[5:0] port for
fast updates, or via the SPI port for slower updates. See the
RxPGA Control section for more information.
Bit
4
1
0
5
4
1
0
7
Description
Invert TXEN.
TXCLK negative edge.
Twos complement.
Rx port three-state.
Invert RXEN.
RXCLK negative edge.
Twos complement.
Low digital drive strength.
The half-duplex interface can be configured to act as a slave or a
master to the digital ASIC. An example of a slave configuration
is shown in Figure 10. In this example, the AD9869 accepts all
the clock and control signals from the digital ASIC. Because the
sampling clocks for the DAC and ADC are derived internally
from the OSCIN signal, the TXCLK and RXCLK signals must
be at exactly the same frequency as the OSCIN signal. The
phase relationships among the TXCLK, RXCLK, and OSCIN
signals can be arbitrary. If the digital ASIC cannot provide a low
jitter clock source to OSCIN, use the AD9869 to generate the
clock for its DAC and ADC and to pass the desired clock signal
to the digital ASIC via CLKOUT1 or CLKOUT2.
Rev. 0 | Page 16 of 36
AD9869
AD9869
10
ADIO
[11:0]
Tx/Rx
DATA[11:0]
RXEN
RXEN
TXEN
TXEN
DACCLK
TXCLK
ADCCLK
RXCLK
CLKOUT
OSCIN
FROM
Rx ADC
06736-010
10
TO
Tx DIGITAL
FILTER
Figure 10. Example of a Half-Duplex Digital Interface
with AD9869 Serving as the Slave
Figure 11 shows a half-duplex interface with the AD9869 acting
as the master, generating all the required clocks. CLKOUT1
provides a clock equal to the bus data rate that is fed to the
ASIC as well as back to the TXCLK and RXCLK inputs. This
interface has the advantage of reducing the digital ASIC pin
count by three. The ASIC needs only to generate a bus control
signal that controls the data flow on the bidirectional bus.
DIGITAL ASIC
In either application, Tx data and Rx data are transferred
between the ASIC and AD9869 in 6-bit (or 5-bit) nibbles at
twice the internal input/output word rates of the Tx interpolation
filter and ADC. Note that the TxDAC update rate must not be
less than the nibble rate. Therefore, the 2× or 4× interpolation
filter must be used with a full-duplex interface.
The AD9869 acts as the master, providing RXCLK as an output
clock that is used for the timing of both the Tx[5:0] and Rx[5:0]
ports. RXCLK always runs at the nibble rate and can be inverted
or disabled via an SPI register. Because RXCLK is derived from
the clock synthesizer, it remains active provided that this
functional block remains powered on. A buffered version of the
signal appearing at OSCIN can also be directed to RXCLK by
setting Bit 2 of Register 0x05. This feature allows the AD9869 to
be completely powered down (including the clock synthesizer)
while serving as the master.
The Tx[5:0] port operates in the following manner with the SPI
register default settings:
1.
Two consecutive nibbles of the Tx data are multiplexed
together to form a 12-bit data-word in twos complement
format.
The clock appearing on the RXCLK pin is a buffered
version of the internal clock used by the Tx[5:0] port’s
input latch with a frequency that is always twice the ADC
sample rate (2 × fADC).
Data from the Tx[5:0] port is read on the rising edge of this
sampling clock, as illustrated in the timing diagram shown
in Figure 12. Note that TXQUIET must remain high for the
reconstructed Tx data to appear as an analog signal at the
output of the TxDAC or IAMP.
The TXSYNC signal is used to indicate which word
belongs to which nibble. While TXSYNC is low, the first
nibble of every word is read as the most significant nibble.
The second nibble of that same word is read on the
following TXSYNC high level as the least significant
nibble. If TXSYNC is low for more than one clock cycle,
the last transmit data is read continuously until TXSYNC is
brought high for the second nibble of a new transmit word.
This feature can be used to flush the interpolator filters
with zeros. Note that the GAIN signal must be kept low
during a Tx operation.
AD9869
ADIO
[11:0]
Tx/Rx
DATA[11:0]
10
10
2.
TO
Tx DIGITAL
FILTER
FROM
Rx ADC
3.
RXEN
TXEN
BUS_CTR
TXCLK
RXCLK
CLKIN
CLKOUT1
4.
FROM
CRYSTAL
OR MASTER CLK
06736-011
OSCIN
Figure 11. Example of a Half-Duplex Digital Interface
with AD9869 Serving as the Master
FULL-DUPLEX MODE
The full-duplex mode interface is selected when the MODE pin
is tied high. It can be used for full- or half-duplex applications.
The digital interface port is divided into two 6-bit ports called
Tx[5:0] and Rx[5:0], allowing simultaneous Tx and Rx operations
for full-duplex applications. In half-duplex applications, the Tx[5:0]
port can also be used to provide a fast update of the RxPGA
during an Rx operation. This feature is enabled by default and
can be used to reduce the required pin count of the ASIC (refer
to RxPGA Control section for details).
ttDS
SU
RXCLK
tDHtHD
TXSYNC
Tx[5:0]
Tx0LSB
Tx1MSB
Tx1LSB
Tx2MSB
Tx3LSB
Tx
2 LSB
Tx3MSB
Figure 12. Tx[5:0] Port Full-Duplex Timing Diagram
Rev. 0 | Page 17 of 36
06736-012
DIGITAL ASIC
AD9869
The Rx[5:0] port operates in the following manner with the SPI
register default settings:
1.
2.
3.
Two consecutive nibbles of the Rx data are multiplexed
together to form a 12-bit data-word in twos complement
format.
The Rx data is valid on the rising edge of RXCLK, as
illustrated in the timing diagram shown in Figure 13.
The RXSYNC signal is used to indicate which word belongs
to which nibble. While RXSYNC is low, the first nibble of
every word is transmitted as the most significant nibble.
The second nibble of that same word is transmitted on the
following RXSYNC high level as the least significant nibble.
tDH
The default Tx and Rx data input formats are twos complement,
but can be changed to straight binary. The default TXSYNC and
RXSYNC settings can be changed such that the first nibble of the
word appears while either TXSYNC, RXSYNC, or both are high.
In addition, the least significant nibble can be selected as the
first nibble of the word (least significant nibble first). The
output driver strength can also be reduced for lower data rate
applications.
For the AD9869, the most significant nibble defaults to 6 bits,
and the least significant nibble defaults to 4 bits. This can be
changed so that the least significant nibble and most significant
nibble have 5 bits each. To accomplish this, set the 5/5 nibble bit
(Bit 3 in Register 0x0C and Bit 3 in Register 0x0D), and use the
Tx[5:1] and Rx[5:1] data pins.
RXCLK
Rx0LSB
Rx1MSB
Rx1LSB
Rx2MSB
Rx3LSB
Rx3MSB
Figure 13. Full-Duplex Rx Port Timing
To add flexibility to the full-duplex digital interface port, several
programming options are available in the SPI registers. These
options are listed in Table 14. The timing for the Tx[5:0] and/or
Rx[5:0] ports can be independently changed by selecting either
the rising or falling clock edge as the sampling/validating edge
of the clock. Inverting RXCLK (via Bit 1 of Register 0x05) affects
both the Rx and Tx interface because they both use RXCLK.
Figure 14 shows a possible digital interface between an ASIC
and the AD9869. The AD9869 serves as the master generating
the required clocks for the ASIC. This interface requires that the
ASIC reserve 16 pins for the interface, assuming a 6-bit nibble
width and the use of the Tx port for RxPGA gain control. Note
that the ASIC pin allocation can be reduced by 3 if a 5-bit nibble
width is used and the gain (or gain strobe) of the RxPGA is
controlled via the SPI port.
AD9868/AD9869
DIGITAL ASIC
OPTIONAL
6
GAIN
Tx[5:0]
Tx DATA[5:0]
DEMUX
Rx[5:0]
06736-013
tDV
RXSYNC
10/12
TO
RxPGA
TO
Tx DIGITAL
FILTER
Table 14. SPI Registers for Full-Duplex Interface
0x0D
0x0E
Description
OSCIN to RXCLK.
Invert RXCLK.
Disable RXCLK.
Rx gain on Tx port.
Invert TXSYNC.
Tx 5/5 nibble.
LS nibble first.
TXCLK negative edge.
Twos complement.
Rx port three-state.
Invert RXSYNC.
Rx 5/5 nibble.
LS nibble first.
RXCLK negative edge.
Twos complement.
Low digital drive strength.
Rx[5:0]
Rx DATA[5:0]
RX_SYNC
RXSYNC
TX_SYNC
TXSYNC
CLKIN
10/12
FROM
RxADC
RXCLK
CLKOUT1
CLKOUT2
OSCIN
FROM
CRYSTAL
OR MASTER CLK
Figure 14. Example of a Full-Duplex Digital Interface
with Optional RxPGA Gain Control via Tx[5:0]
Rev. 0 | Page 18 of 36
06736-014
0x0B
0x0C
Bit
2
1
0
2
4
3
2
1
0
5
4
3
2
1
0
7
MUX
Address (Hex)
0x05
AD9869
RxPGA CONTROL
The AD9869 contains a digital PGA in the Rx path that is used
to extend the dynamic range. The RxPGA can be programmed
over −12 dB to +48 dB with 1 dB resolution using a 6-bit word,
and with a 0 dB setting corresponding to a 2 V p-p input signal.
The 6-bit word is fed into a look-up table (LUT) that is used to
distribute the desired gain over three amplification stages within
the Rx path. Upon power-up, the RxPGA gain register is set to
its minimum gain of −12 dB. The RxPGA gain mapping is
shown in Figure 15.
48
42
Updating the RxPGA via the Tx[5:0] port is an option only in
full-duplex mode 1 . In this case, a high level on the GAIN pin 2
with TXSYNC low programs the PGA setting on either the
rising edge or falling edge of RXCLK, as shown in Figure 16.
The GAIN pin must be held high, TXSYNC must be held low,
and gain data must be stable for one or more clock cycles to
update the RxPGA gain setting.
A low level on the GAIN pin enables data to be fed to the digital
interpolation filter. This interface should be considered when
upgrading existing designs from the AD9875/AD9876 MxFE
products or from half-duplex applications trying to minimize
an ASIC pin count.
36
tSU
30
RXCLK
tHD
TXSYNC
18
12
Tx[5:0]
GAIN
6
0
GAIN
–6
Figure 16. Updating RxPGA via Tx[5:0] in Full-Duplex Mode
0
6
12
18
24
30
36
42
48
54
6-BIT DIGITAL WORD-DECIMAL EQUIVALENT
60
66
06736-015
–12
Figure 15. Digital Gain Mapping of RxPGA
Table 15 lists the SPI registers pertaining to the RxPGA.
Table 15. SPI Registers for RxPGA Control
Address
(Hex)
0x09
0x0B
06736-016
GAIN (dB)
24
Bit
6
5:0
6
5
3
2
1
Description
Enable RxPGA update via SPI.
RxPGA gain code.
Select TxPGA via PGA[5:0].
Select RxPGA via PGA[5:0].
Enable software gain strobe, full-duplex.
Enable RxPGA update via Tx[5:0], full-duplex.
3-Bit RxPGA gain mapping, half-duplex.
The RxPGA gain register can be updated via the Tx[5:0] port,
the PGA[5:0] port, or the SPI port. The first two methods allow
fast updates of the RxPGA gain register and should be considered
for digital AGC functions requiring a fast closed-loop response.
The SPI port allows direct update and readback of the RxPGA
gain register via Register 0x09 with an update rate limited to 1.6
MSPS (with SCLK = 32 MHz). Note that Bit 6 of Register 0x09
must be set for a read or write operation.
Updating the RxPGA (or TxPGA) via the PGA[5:0] port is
an option for both the half-duplex 3 and full-duplex interface.
The PGA port consists of an input buffer that passes the 6-bit
data appearing at its input directly to the RxPGA (or TxPGA)
gain register with no gating signal required. Bit 5 or Bit 6 of
Register 0x0B is used to select whether the data updates the
RxPGA or TxPGA gain register. In applications that switch
between RxPGA and TxPGA gain control via PGA[5:0], be
sure that the RxPGA (or TxPGA) is not inadvertently loaded
with the wrong data during a transition. In the case of an
RxPGA-to-TxPGA transition, first deselect the RxPGA gain
register, update the PGA[5:0] port with the desired TxPGA gain
setting, and then select the TxPGA gain register.
Note that a silicon bug exists with the full-duplex interface
(MODE = 1), which requires that the GAIN/PGA[5] pin
remains low for the digital Tx path to remain enabled. Fullduplex protocol applications must use the SPI port to control
the Tx and Rx gain. Half-duplex protocol applications using the
function can use an AND gate with TXQUIET and the PGA5
bit serving as inputs to ensure that the GAIN/PGA[5] pin
remains low during a Tx operation.
1
Default setting for full-duplex mode (MODE = 1).
The gain strobe can also be set in software via Register 0x0B, Bit 3 for
continuous updating. This eliminates the requirement for the external gain
signal, reducing the ASIC pin count by 1.
3
Default setting for half-duplex mode (MODE = 0).
2
Rev. 0 | Page 19 of 36
AD9869
TxPGA CONTROL
0
–1
–2
–3
–4
–5
–6
–7
–8
–9
–10
–11
–12
–13
–14
–15
–16
–17
–18
–19
–20
Table 16 lists the SPI registers pertaining to the TxPGA. The
TxPGA control register default setting is for minimum attenuation (0 dBFS) with the PGA[5:0] port disabled for Tx gain control.
Table 16. SPI Registers TxPGA Control
Address (Hex)
0x0A
TxDACs IOUTP OUTPUT
HAS 7.5dB RANGE
0x0B
0x0E
IAMPs IOUTN OUTPUT
HAS 19.5dB RANGE
0
8
16
24
32
06736-017
Tx ATTENUATION (dBFS)
The AD9869 also contains a digital PGA in the Tx path distributed between the TxDAC and IAMP. The TxPGA is used to
control the peak current from the TxDAC and IAMP over a
7.5 dB and 19.5 dB span, respectively, with 0.5 dB resolution.
A 6-bit word is used to set the TxPGA attenuation according to
the mapping shown in Figure 17. The TxDAC gain mapping is
applicable only when Bit 0 of Register 0x0E is set, and only
when the 4 LSBs of the 6-bit gain word are relevant.
The TxPGA register can be updated via the PGA[5:0] port or
SPI port. The first method should be considered for fast updates
of the TxPGA register. Its operation is similar to the description
in the RxPGA Control section. The SPI port allows direct
update and readback of the TxPGA register via Register 0x0A
with an update rate limited to 1.6 MSPS (SCLK = 32 MHz).
Bit 6 of Register 0x0A must be set for a read or write operation.
40
48
56
64
6-BIT DIGITAL CODE (Decimal Equivalent)
Figure 17. Digital Gain Mapping of TxPGA
Rev. 0 | Page 20 of 36
Bit
6
5:0
6
5
0
Description
Enable TxPGA update via SPI.
TxPGA gain code.
Select TxPGA via PGA[5:0].
Select RxPGA via PGA[5:0].
TxDAC output (IAMP disabled).
AD9869
TRANSMIT PATH
IOUTP–
IOUTP+
The transmit path of the AD9869 (or its related part, the AD9868)
consists of a selectable digital 2×/4× interpolation filter, a 12-bit
(or 10-bit) TxDAC, and a current-output amplifier, IAMP (see
Figure 18). Note that the additional two bits of resolution offered
by the AD9869 result in a 10 dB to 12 dB reduction in the passband noise floor. The digital interpolation filter relaxes the Tx
analog filtering requirements by simultaneously reducing the
images from the DAC reconstruction process while increasing the
analog filter’s transition band. The digital interpolation filter can
also be bypassed, resulting in lower digital current consumption.
These responses also include the inherent sinc(x) from the TxDAC
reconstruction process and can be used to estimate any post
analog filtering requirements.
The pipeline delays of the 2× and 4× filter responses are
21.5 clock cycles and 24 clock cycles, respectively, relative to
fDATA. The filter delay is also taken into consideration for
applications configured for a half-duplex interface with the halfduplex power-down mode enabled. This feature allows the user
to set a programmable delay that powers down the TxDAC and
IAMP only after the last Tx input sample has propagated
through the digital filter. See the Power Control and Dissipation
section for more details.
2.5
10
0 TO –7.5dB
ADIO[5:0]/
Rx[5:0]
IAMP
0 TO –12dB
AD9869
06733-018
TXEN/SYNC
TXCLK
Figure 18. Functional Block Diagram of Tx Path
DIGITAL INTERPOLATION FILTERS
Table 17. Interpolation Factor Set via SPI Register 0x0C
Bits[7:6]
00
01
10
11
Interpolation Factor
4
2
Do not use
Do not use
–10
1.5
–20
1.0
0.5
–30
PASS BAND
–40
–50
0
–0.5
–1.0dB @ 0.441 fDATA
–60
–1.0
–70
–1.5
–80
–2.0
–90
0
0.25
0.50
0.75
1.00
1.25
1.75
1.50
NORMALIZED FREQUENCY (Relative to fDATA)
–2.5
2.00
Figure 19. Frequency Response of 2× Interpolation Filter
(Normalized to fDATA)
2.5
10
WIDE BAND
WIDEBAND RESPONSE (dB)
The input data from the Tx port can be fed into a selectable
2×/4× interpolation filter. The interpolation factor for the
digital filter is set via SPI Register 0x0C with the settings shown
in Table 17. The maximum input word rate, fDATA, into the
interpolation filter is 80 MSPS; the maximum DAC update rate
is 200 MSPS. Therefore, applications with input word rates at or
below 50 MSPS can benefit from 4× interpolation, whereas
applications with input word rates between 50 MSPS and
80 MSPS can benefit from 2× interpolation.
2.0
06736-019
TxDAC
0
PASS-BAND RESPONSE (dB)
WIDE BAND
IOUTN+
IOUTN–
The interpolation filter consists of two cascaded half-band filter
stages with each stage providing 2× interpolation. The first
stage filter consists of 43 taps. The second stage filter, operating
at the higher data rate, consists of 11 taps. The normalized
wideband and pass-band filter responses (relative fDATA) for the
2× low-pass interpolation filter and 4× low-pass interpolation
filter are shown in Figure 19 and Figure 20, respectively.
Rev. 0 | Page 21 of 36
0
2.0
–10
1.5
–20
1.0
0.5
–30
PASS BAND
0
–40
–1.0dB @ 0.45 fDATA
–50
–0.5
–60
–1.0
–70
–1.5
–80
–2.0
–90
0
0.5
1.0
1.5
2.0
2.5
3.5
3.0
NORMALIZED FREQUENCY (Relative to fDATA)
–2.5
4.0
Figure 20. Frequency Response of 4× Interpolation Filter
(Normalized to fDATA)
PASS-BAND RESPONSE (dB)
2-4×
06736-020
10
WIDEBAND RESPONSE (dB)
ADIO[11:6]/
Tx[5:0]
AD9869
TxDAC AND IAMP ARCHITECTURE
The Tx path contains a TxDAC with a current amplifier, IAMP.
The TxDAC reconstructs the output of the interpolation filter
and sources a differential current output that can be directed to
an external load or fed into the IAMP for further amplification.
The TxDAC and IAMP peak current outputs are digitally
programmable over a 0 dB to −7.5 dB and 0 dB to −19.5 dB
range, respectively, in 0.5 dB increments. Note that this assumes
default register settings for Register 0x10 and Register 0x11.
Applications demanding the highest spectral performance
and/or lowest power consumption can use the TxDAC output
directly. The TxDAC is capable of delivering a peak signal
power-up to 10 dBm while maintaining respectable linearity
performance. For power-sensitive applications requiring the
highest Tx power efficiency, the TxDAC full-scale current
output can be reduced to as low as 2 mA, and its load resistors
sized to provide a suitable voltage swing that can be amplified
by a low power, op amp-based driver.
Most applications requiring higher peak signal powers (up to
17 dBm) should use the IAMP. The IAMP can be configured
as a current source for loads having a well-defined impedance
(50 Ω or 75 Ω systems).
±ΔIS
I
IOUTN–
REFADJ
IOUTN+
TxDAC
I
N × (I – ΔI)
N × (I + ΔI)
Figure 21 shows the equivalent schematic of the TxDAC and
IAMP. The TxDAC provides a differential current output
appearing at IOUTP+ and IOUTP−. The TxDAC can also be
modeled as a differential current source generating a signaldependent ac current, when ΔIS has a peak current of I along
with two dc current sources, sourcing a standing current equal
to I. The full-scale output current, IOUTP_FS, is equal to the
sum of these standing current sources (IOUTP_FS = 2 × I).
xN
xN
REFIO
RSET 0.1µF
IOUTP+
I – ΔI
IOUTP–
IOFF1
IOFF1
IAMP
Figure 21. Equivalent Schematic of TxDAC and IAMP
I = 16 × (1.23/RSET)
(1)
For example, an RSET value of 1.96 kΩ results in I equal to 10.0 mA
with IOUTP_FS equal to 20.0 mA. Note that the REFIO pin
provides a nominal band gap reference voltage of 1.23 V and
should be decoupled to analog ground via a 0.1 μF capacitor.
The differential current output of the TxDAC is always
connected to the IOUTP pins, but it can be directed to the
IAMP by clearing Bit 0 of Register 0x0E. As a result, the
IOUTP pins must remain completely open if the IAMP is to
be used. The IAMP consists of programmable current mirrors
providing a gain factor of N that is programmable from 0 to 4 in
steps of 1 (via Bits[2:0] of Register 0x10 with a default setting of
N = 4). Bit 7 of this register must be set to overwrite the default
settings of this register. The maximum peak current per output
is 100 mA and occurs when the TxDAC standing current, I, is
set for 12.5 mA (IOUTP_FS = 25 mA).
Because the current mirrors consist of NMOS devices, they sink
current. Therefore, each output pin requires a dc current path to
a positive supply. The voltage output of each output pin is
allowed to swing between 0.5 V and 3.9 V. Lastly, both the
standing current, I, and the ac current, ΔIS, from the TxDAC are
amplified by the gain factor (N) with the total standing current
drawn from the positive supply being equal to
2 × (N) × I
(2)
Programmable current sources, IOFF1 via Register 0x12, can be
used to improve the linearity performance under certain
conditions by increasing their signal-to-standing current ratios.
This feature provides a marginal improvement in distortion
performance under large signal conditions when the peak ac
current of the reconstructed waveform frequently approaches
the dc standing current within the TxDAC (0 dBFS to −1 dBFS
sine wave) causing the internal mirrors to turn off. However, the
improvement in distortion performance diminishes as the crest
factor (peak-to-rms ratio) of the ac signal increases. Most
applications can disable these current sources (set to 0 mA via
Register 0x12) to reduce the IAMP current consumption.
Table 18. SPI Registers for TxDAC and IAMP
06736-021
I + ΔI
The value of I is determined by the RSET value at the REFADJ
pin along with the Tx path’s digital attenuation setting. With
0 dB attenuation, the value of I is
Address (Hex)
0x0E
0x10
Bit
0
7
2:0
0x12
2:0
Rev. 0 | Page 22 of 36
Description
TxDAC output.
Enable current mirror gain settings.
Primary path NMOS gain of 0 to 4
with ∆ = 1.
IOFF1 standing current.
AD9869
Applications demanding higher output voltage swings and
power drive capabilities can benefit from using the IAMP.
IAMP CURRENT-MODE OPERATION
The IAMP can be configured for the current-mode operation
(see Figure 23) for loads remaining relatively constant. In this
mode, the IAMP delivers the signal-dependent current to the
load via a center-tap transformer. Because the mirrors exhibit a
high output impedance, they can be easily back-terminated (if
required).
AVDD
0.1µF
1:1
IOUTN+
0 TO –12dB
IBIAS = 2 × N × I
T:1
IOUTPK
RL
IOUTN–
TxDAC
Figure 23. Current-Mode Operation
IOUTN+
IAMP
0 TO –12dB
IOUTN–
06736-022
0 TO –7.5dB
IOUTP–
IOUTPK = N × I
POUTPK = (IOUTPK)2 × T2 × RL
IOUTP+
REFIO
0.1µF
IAMP
0 TO –7.5dB
RSET
REFADJ
RCM
TxDAC
RL
RS
0.1µF
RSET
06736-023
The differential current output of the TxDAC is available at the
IOUTP+ and IOUTP− pins, and the IAMP should be disabled
by setting Bit 0 of Register 0x0E. Any load connected to these
pins must be ground referenced to provide a dc path for the
current sources. Figure 22 shows the outputs of the TxDAC
driving a doubly terminated 1:1 transformer with its center tap
tied to ground. The peak-to-peak voltage, V p-p, across RL (and
IOUTP+ to IOUTP−) is equal to 2 × I × (RL||RS). With I = 10 mA
and RL = RS = 50 Ω, V p-p is equal to 0.5 V with 1 dBm of peak
power being delivered to RL and 1 dBm being dissipated in RS.
•
IOUTP–
TxDAC OUTPUT OPERATION
Limiting the peak positive VIOUTP+ and VIOUTP− to 0.8 V to
avoid onset of TxDAC output compression (TxDAC
voltage compliance is around 1.2 V).
Limiting V p-p seen at IOUTP+ and IOUTP− to less
than 1.6 V.
IOUTP+
The TxPGA can be considered as two cascaded attenuators with
the TxDAC providing a 7.5 dB range in 0.5 dB increments, and
the IAMP providing a 12 dB range in 6 dB increments. As a result,
the IAMP composite 19.5 dB span is valid only if Register 0x10
remains at its default setting of 0x04. Modifying this register
setting corrupts the LUT and results in an invalid gain mapping.
•
REFADJ
TxPGA functionality is also available to set the peak output
current from the TxDAC or IAMP. The TxDAC and IAMP are
digitally programmable via the PGA[5:0] port or SPI over a 0 dB
to −7.5 dB range and 0 dB to −19.5 dB range, respectively, in
0.5 dB increments.
Optimum distortion performance can typically be achieved by
performing both of the following:
REFIO
Tx PROGRAMMABLE GAIN CONTROL
Figure 22. TxDAC Output Directly via Center-Tap Transformer
The TxDAC is capable of delivering up to 10 dBm peak power
to a load, RL. To increase the peak power for a fixed standing
current, users must increase V p-p across IOUTP+ and IOUTP−
by increasing one or more of the following parameters: RS, RL
(if possible), and/or the turns ratio, N, of the transformer. For
example, removing the RS from Figure 22 and applying a 2:1
impedance ratio transformer results in 10 dBm of peak power
capabilities to the load. Note that increasing the power output
capabilities of the TxDAC reduces the distortion performance
due to the higher voltage swings seen at IOUTP+ and IOUTP−.
The IAMP gain, N, can be set between 0 and 4, while the
TxDAC standing current, I, can be set between 2 mA and
12.5 mA (with the IOUTP outputs left open). The IOUTN
outputs should be connected to the transformer, which needs to
be specified to handle the dc standing current, IBIAS, that is
drawn by the IAMP. In addition, because IBIAS remains signal
independent, a series resistor should be inserted between
AVDD and the center-tap transformer to provide provisions
such that the IAMP common-mode voltage, VCM, can be
reduced since its optimum linearity performance is sensitive to
both the Tx signal’s peak-to-rms characteristics as well as the
IAMP VCM. Note that the VCM bias should not exceed 3.3 V. The
power dissipated in the IAMP alone is as follows:
Rev. 0 | Page 23 of 36
PIAMP = 2 × N × I × VCM
(3)
AD9869
RECEIVE PATH
CLKOUT1
CLKOUT2
CLK
SYNC.
2M CLK
MULTIPLIER
ADIO[5:0]/
Rx[5:0]
10/12
ADC
80MSPS
SPGA
0 TO 6dB
Δ = 1dB
PGA[5:0]
PORT
SPI
PORT
–6 TO 18dB
Δ = 6dB
RX+
1-POLE
LPF
RX–
–6 TO 24dB
Δ = 6dB
GAIN
MAPPING
LUT
6
4
2-POLE
LPF
REGISTER
CONTROL
AD9869
06733-024
RXEN/SYNC
RXCLK
OSCIN
XTAL
Figure 24. Functional Block Diagram of Rx Path
Rx PROGRAMMABLE GAIN AMPLIFIER
The RxPGA has a digitally programmable gain range from
−12 dB to +48 dB with 1 dB resolution via a 6-bit word. Its
purpose is to extend the dynamic range of the Rx path such that
the input of the ADC is presented with a signal that scales
within its fixed 2 V input span. There are multiple ways of
setting the RxPGA gain as discussed in the RxPGA Control
section, as well as an alternative 3-bit gain mapping having a
range of −12 dB to +36 dB with a +8 dB resolution.
The RxPGA is comprised of two sections: a continuous time
PGA (CPGA) for course gain and a switched capacitor PGA
(SPGA) for fine gain resolution. The CPGA consists of two
cascaded gain stages providing a gain range of −12 dB to +42 dB
with a 6 dB resolution. The first stage features a low noise
preamplifier (<3.0 nV/√Hz), thereby eliminating the need for
an external preamplifier. The SPGA provides a gain range of
0 dB to 6 dB with a 1 dB resolution. A look-up table (LUT) is
used to select the appropriate gain setting for each stage.
The nominal differential input impedance of the RxPGA input
appearing at the device RX+ and RX− input pins is 400 Ω||4 pF
(±20%) and remains relatively independent of gain setting.
AC-coupling the input signal to this stage via 0.1 μF coupling
capacitors is recommended to ensure that any external dc offset
does not become amplified with high RxPGA gain settings,
potentially exceeding the ADC input range.
To limit the RxPGA self-induced input offset, an offset cancellation loop is included. This cancellation loop is automatically
performed upon power-up and can also be initiated via the SPI.
During calibration, the RxPGA first stage is internally shorted,
and each gain stage set to a high gain setting. A digital servo
loop slaves a calibration DAC, which forces the Rx input offset
to be within ±32 LSBs for this particular high gain setting.
Although the offset varies for other gain settings, the offset is
typically limited to ±5% of the ADC’s 2 V input span. Note that
the offset cancellation circuitry is intended to reduce the voltage
offset attributed to only the RxPGA input stage, not to any dc
offsets attributed to an external source.
The gain of the RxPGA should be set to minimize clipping of
the ADC while utilizing most of its dynamic range. The maximum
peak-to-peak differential voltage that does not result in ADC
clipping is shown in Figure 25. Although the graph suggests that
the maximum input signal for a gain setting of −12 dB is 8.0 V p-p,
the maximum input voltage into the PGA should be limited to
less than 6 V p-p to prevent turning on ESD protection diodes.
For applications having higher maximum input signals, consider
adding an external resistive attenuator network. While the input
sensitivity of the Rx path is degraded by the amount of attenuation
on a dB-to-dB basis, the low noise characteristics of the RxPGA
provide some design margin such that the external line noise
remains the dominant source.
8.0000
4.0000
2.0000
1.0000
0.5000
0.2500
0.1250
0.0625
0.0312
0.0156
0.0100
–12
06736-025
ADIO[11:6]/
Tx[5:0]
The PGA input is self-biased at a 1.3 V common-mode level, allowing maximum input voltage swings of ±1.5 V at RX+ and RX−.
FULL-SCALE PEAK-TO-PEAK INPUT SPAN (V)
The receive signal path for the AD9869 (or its related part, the
AD9868) consists of a 3-stage RxPGA, a 3-pole programmable
LPF, and a 12-bit (or 10-bit) ADC (see Figure 24). Note that the
additional two bits of resolution offered by the AD9869 result in
a 3 dB to 5 dB lower noise floor, depending on the RxPGA gain
setting and LPF cutoff frequency. Also working in conjunction with
the receive path is an offset correction circuit. These blocks are
discussed in detail in the following sections. Note that the power
consumption of the RxPGA can be modified via Register 0x13
as discussed in the Power Control and Dissipation section.
–6
0
6
12
18
24
30
36
42
48
GAIN (dB)
Figure 25. Maximum Peak-to-Peak Input vs. RxPGA Gain Setting that
Does Not Result in ADC Clipping
Rev. 0 | Page 24 of 36
AD9869
Although the default setting specifies that the LPF be active, it
can also be bypassed providing a nominal f−3 dB of 55 MHz.
Table 19 shows the SPI registers pertaining to the LPF.
Table 19. SPI Registers for Rx Low-Pass Filter
Address (Hex)
0x07
0x08
Bit
0
7:0
1.15
–0.75
1.10
–1.00
1.05
–1.25
1.00
–1.50
0.95
–1.75
0.90
–2.00
0.85
0.80
NORMALIZED GROUP DELAY
–2.50
0.75
0.70
–2.75
–3.00
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
NORMALIZED FREQUENCY
Figure 27. LPF Normalized Pass-Band Gain and Group Delay Responses
The f−3 dB is programmable by writing an 8-bit word, referred to
as the target, to Register 0x08. The cutoff frequency is a function
of the ADC sample rate, fADC, and to a lesser extent, the RxPGA
gain setting (in dB). Figure 28 shows how f−3 dB varies as a
function of the RxPGA gain setting.
Description
Enable Rx LPF.
Target value.
3
–6dB GAIN
0dB GAIN
+6dB GAIN
+18dB GAIN
+30dB GAIN
+42dB GAIN
0
FUNDAMENTAL (dB)
B
Actual GDT = Normalized GDT/(2.45 × f−3dB)
0.65
1.0
0.9
06736-027
GAIN (dB)
1.20
–0.50
–2.25
The normalized wideband gain response is shown in Figure 26.
The normalized pass-band gain and group delay responses are
shown in Figure 27. The −3 dB cutoff frequency, f−3 dB, results in
−3 dB attenuation. In addition, the actual group delay time
(GDT) response can be calculated given a programmed cutoff
frequency using the following equation:
–3
–6
–9
–12
(4)
–18
0
0
5
10
15
20
25
30
35
40
45
50
INPUT FREQUENCY (MHz)
–5
06736-028
–15
5
Figure 28. Effects of RxPGA Gain on LPF Frequency Response
(f−3 dB = 32 MHz @ 0 dB and fADC = 80 MSPS)
–10
The following formula 1 can be used to estimate f−3 dB for a
RxPGA gain setting of 0 dB:
–15
B
–20
f−3dB_0dB = (128/target) × (fADC/80) ×(fADC/30 + 23.83) f
–25
(5)
Figure 29 compares the measured and calculated f−3 dB using this
formula.
–30
0
0.5
1.0
1.5
FREQUENCY
2.0
2.5
3.0
06736-026
GAIN (dB)
1.25
NORMALIZED GAIN RESPONSE
–0.25
NORMALIZED GROUP DELAY
TIME RESPONSE (GDT)
0
The low-pass filter (LPF) provides a third-order response with a
cutoff frequency that is typically programmable over a 15 MHz
to 35 MHz span. The first real pole is implemented within the
first CPGA gain stage (see Figure 24), and the complex pole pair
is implemented in the second CPGA gain stage. Capacitor
arrays are used to vary the different RC time constants within
these two stages in a manner that changes the cutoff frequency
while preserving the normalized frequency response. Because
absolute resistor and capacitor values are process-dependent, a
calibration routine lasting less than 100 μs automatically occurs
each time the target cutoff frequency register (Register 0x08) is
updated, ensuring a repeatable cutoff frequency from device to
device.
–35
1.30
0.25
LOW-PASS FILTER
Figure 26. LPF Normalized Wideband Gain Response
1
Empirically derived for an f−3 dB range of 15 MHz to 35 MHz and an fADC of
40 MSPS to 80 MSPS with an RxPGA = 0 dB.
Rev. 0 | Page 25 of 36
AD9869
35
ANALOG-TO-DIGITAL CONVERTER (ADC)
33
The AD9869 features a 12-bit analog-to-digital converter
(ADC) capable of up to 80 MSPS. As shown in Figure 24, the
ADC is driven by the SPGA stage, which performs both the
sample-and-hold and the fine gain adjust functions. A buffer
amplifier (not shown) isolates the last CPGA gain stage from
the dynamic load presented by the SPGA stage. The full-scale
input span of the ADC is 2 V p-p, and depending on the PGA
gain setting, the full-scale input span into the SPGA is adjustable
from 1 V to 2 V in 1 dB increments.
FREQUENCY (MHz)
31
29
27
80MSPS MEASURED
25
80MSPS CALCULATED
23
21
19
50MSPS MEASURED
15
48
50MSPS CALCULATED
64
80
96
112
128
144
160
176
192
208
A pipelined, multistage ADC architecture is used to achieve high
sample rates while consuming low power. The ADC distributes the
conversion over several smaller ADC subblocks, refining the
conversion with progressively higher accuracy as it passes the
results from stage to stage on each clock edge. The ADC typically
performs best when driven internally by a 50% duty cycle clock.
06736-029
17
224
TARGET-DECIMAL EQUIVALENT
Figure 29. Measured and Calculated f−3 dB vs. Target Value for
fADC = 50 MSPS and 80 MSPS
The following scaling factor can be applied to the previous
formula to compensate for the RxPGA gain setting on f−3 dB:
Scale Factor = 1 − (RxPGA in dB)/382
(6)
This scaling factor reduces the calculated f−3 dB as the RxPGA
increases. Applications that need to maintain a minimum cutoff
frequency, f−3 dB_MIN, for all RxPGA gain settings should first
determine the scaling factor for the highest RxPGA gain setting
to be used. Next, the f−3 dB_MIN should be divided by this scale
factor to normalize to the 0 dB RxPGA gain setting, f−3 dB_0 dB.
Equation 5 can then be used to calculate the target value.
The LPF frequency response shows a slight sensitivity to
temperature, as shown in Figure 30. Applications sensitive to
temperature drift can recalibrate the LPF by rewriting the target
value to Register 0x08.
35
FREQUENCY (MHz)
30
The ADC power consumption can be reduced by 25 mA with
minimal effect on its performance by setting Bit 4 of Register 0x07.
Alternative power bias settings are also available via Register 0x13,
as discussed in the Power Control and Dissipation section.
Lastly, the ADC can be completely powered down for half-duplex
operation, further reducing the peak power consumption of the
AD9869.
The ADC has an internal voltage reference and reference amplifier
as shown in Figure 31. The internal band gap reference generates
a stable 1 V reference level that is converted to a differential 1 V
reference centered about midsupply (AVDD/2). The outputs of
the differential reference amplifier are available at the REFT and
REFB pins and must be properly decoupled for optimum performance. The REFT and REFB pins are conveniently situated at
the corners of the LFCSP package such that C1 (0603 type)
can be placed directly across its pins. C3 and C4 can be placed
underneath C1, and C2 (10 μF tantalum) can be placed furthest
from the package.
fOUT ACTUAL 80MHz AND –40°C
REFT
fOUT ACTUAL 80MHz AND +25°C
25
TO
ADCs
fOUT ACTUAL 80MHz AND +85°C
20
C1
0.1µF
128
144
160
176
192
208
TARGET-DECIMAL EQUIVALENT
224
240
06736-030
112
C2
10µF
C4
0.1µF
REFB
1.0V
15
96
C3
0.1µF
Figure 30. f−3 dB Temperature Drift for fADC = 80 MSPS and RxPGA = 0 dB
TOP
VIEW
C3
C4
C2
Figure 31. ADC Reference and Decoupling
Rev. 0 | Page 26 of 36
06736-031
C1
AD9869
Table 20 shows the SPI registers pertaining to the ADC.
AGC TIMING CONSIDERATIONS
Table 20. SPI Registers for Rx ADC
When implementing a digital AGC timing loop, it is important
to consider the Rx path latency and settling time of the Rx path
in response to a change in gain setting. While the RxPGA
settling time may also show a slight dependency on the LPF
cutoff frequency, the ADC pipeline delay, along with the ADIO
bus interface, presents a more significant delay. The amount of
delay or latency is dependent on whether a half-duplex or fullduplex is selected. An impulse response at the RxPGA input can
be observed after 10.0 ADC clock cycles (1/fADC) in the case of a
half-duplex interface, and 10.5 ADC clock cycles in the case of a
full-duplex interface. This latency, along with the RxPGA settling
time, should be considered to ensure stability of the AGC loop.
Address (Hex)
0x04
0x07
0x13
Bit
4
4
2:0
Description
ADC clock from PLL.
ADC low power mode.
ADC power bias adjust.
Rev. 0 | Page 27 of 36
AD9869
CLOCK SYNTHESIZER
The AD9869 generates all its internal sampling clocks, as well as
two user-programmable clock outputs appearing at CLKOUT1
and CLKOUT2, from a single reference source (see Figure 32).
The reference source can either be a fundamental frequency or
an overtone quartz crystal connected between OSCIN and
XTAL, with the parallel resonant load components specified by
the crystal manufacturer. It can also be a TTL-level clock
applied to OSCIN with XTAL left unconnected.
XTAL
XTAL
C1
÷2N
2M
CLK
MULTIPLIER
OSCIN
C2
CLKOUT2
TO ADC
06736-032
RXCLK
(FULL-DUPLEX ONLY)
Figure 32. Clock Oscillator and Synthesizer
Special consideration should be given to the design of crystal
oscillators using the AD9869 internal CMOS inverter. This is
especially true when designing third overtone oscillators where
crystal power dissipation and negative resistance upon start-up
are a few of the issues to consider. For this reason, a 40 MHz or
lower fundamental crystal is preferred with the AD9869.
The CMOS inverter device characteristics are listed in Table 21. It
is recommended to consult with the selected crystal manufacturer
to ensure that a robust design can be realized with the selected
crystal and AD9869 CMOS inverter.
where M = 0, 1, 2, or 3.
M is the PLL multiplication factor set in Register 0x04. The
value of M is determined by the Tx path’s word rate, fDATA, and
digital interpolation factor, F, as shown in the following
equation:
Nominal
Value
1.2 MΩ
17 mA/V
1.6 kΩ
2.5 pF
2.0 pF
(8)
Note that if the reference frequency appearing at OSCIN is
chosen to be equal to the Tx path and Rx path word rates, M is
equal to log2(F). Also note that the RXCLK frequency for fullduplex mode (MODE = 1) is a function of the 2M CLK
multiplier setting, as well as the interpolation factor, F. Fullduplex mode requires that RXCLK be equal to 2 × fDATA because
data is transferred in nibbles.
The clock source for the ADC can be selected in Register 0x04
as a buffered version of the reference frequency appearing at
OSCIN (default setting) or a divided version of the VCO
output, fDAC. The first option is the default setting and most
desirable if fOSCIN is equal to fADC. This option typically results in
the best jitter/phase noise performance for the ADC sampling
clock. The second option is suitable in cases where fOSCIN is a
factor of 2 or 4 less than the fADC. In this case, the divider ratio,
N, is chosen such that the divided down VCO output is equal to
the ADC sample rate, as shown in the following equation:
fADC = fDAC/2N
Table 21. CMOS Inverter Device Characteristics
Parameter
RF
gm
ZOUT
CIN
COUT
(7)
M = log2 (F × fDATA/fOSCIN)
CLKOUT1
÷F/2
fDAC = 2M × fOSCIN
TO TxDAC
÷2L
÷2R
frequency between 100 MHz and 200 MHz. The VCO output
drives the TxDAC directly such that its update rate, fDAC, is
related to fOSCIN by the following equation:
(9)
where N = 0, 1, or 2.
Tolerance %
±25
±20
±50
±25
±25
Description
Feedback resistor.
At midsupply.
At midsupply.
Parasitic capacitance.
Parasitic capacitance.
The data rate, fDATA, for the Tx and Rx data paths must always be
equal. Therefore, the ADC sample rate, fADC, is always equal to
fDATA, while the TxDAC update rate is a factor of 1, 2, or 4 of
fDATA, depending on the selected interpolation factor. The data
rate refers to the word rate and should not be confused with the
nibble rate in full-duplex interface.
The 2M CLK multiplier contains a PLL (with integrated loop
filter) and a VCO capable of generating an output frequency
that is a multiple of 1, 2, 4, or 8 of its input reference frequency,
fOSCIN, appearing at OSCIN. The input frequency range of fOSCIN
is between 20 MHz and 80 MHz, and the VCO can operate over
an 80 MHz to 200 MHz span. For the best phase noise/jitter
characteristics, it is advisable to operate the VCO with a
The CLK synthesizer also has two clock outputs appearing at
CLKOUT1 and CLKOUT2. They are programmable via
Register 0x06. Both outputs can be inverted or disabled. The
voltage levels appearing at these outputs are relative to DRVDD
and remain active during a hardware or software reset. Table 22
shows the SPI registers pertaining to the CLK synthesizer.
Table 22. SPI Registers for CLK Synthesizer
Address (Hex)
0x04
0x06
Rev. 0 | Page 28 of 36
Bit
4
3:2
1:0
7:6
5
4
3:2
1
0
Description
ADC CLK from PLL.
PLL divide factor (N).
PLL multiplication factor (M).
CLKOUT2 divide number.
CLKOUT2 invert.
CLKOUT2 disable.
CLKOUT1 divide number.
CLKOUT1 invert.
CLKOUT1 disable.
AD9869
CLKOUT1 is a divided version of the VCO output and can be
set to be a submultiple integer of fDAC (fDAC/2R, where R = 0, 1, 2,
or 3). Because this clock is derived from the same set of dividers
used within the PLL core, it is phase-locked to the dividers such
that its phase relationship relative to the signal appearing at
OSCIN (or RXCLK) can be determined upon power-up. In
addition, this clock has a near 50% duty cycle because it is
derived from the VCO. As a result, CLKOUT1 should be
selected before CLKOUT2 as the primary source for system
clock distribution.
CLKOUT2 is a divided version of the reference frequency, fOSCIN,
and can be set to be a submultiple integer of fOSCIN (fOSCIN/2L,
where L = 0, 1, or 2). With L set to 0, the output of CLKOUT2 is
a delayed version of the signal appearing at OSCIN, exhibiting
the same duty cycle characteristics. With L set to 1 or 2, the output
of CLKOUT2 is a divided version of the OSCIN signal, exhibiting
a near 50% duty cycle, but without having a deterministic phase
relationship relative to CLKOUT1 (or RXCLK).
Rev. 0 | Page 29 of 36
AD9869
POWER CONTROL AND DISSIPATION
POWER-DOWN
HALF-DUPLEX POWER SAVINGS
The AD9869 provides the ability to control the power-on state
of various functional blocks. The state of the PWRDWN pin,
along with the contents of Register 0x01 and Register 0x02,
allow two user-defined power settings that are pin-selectable.
The default settings1 are such that Register 0x01 has all blocks
powered on (all bits 0), while Register 0x02 has all blocks
powered down (excluding the PLL) such that the clock signal
remains available at CLKOUT1 and CLKOUT2. When the
PWRDWN pin is low, the functional blocks corresponding to
the bits in Register 0x01 are powered down. When the PWRDWN
is high, the functional blocks corresponding to the bits in
Register 0x02 are powered down. PWRDWN immediately affects
the designated functional blocks with minimum digital delay.
Significant power savings can be realized in applications having
a half-duplex protocol, allowing only the Rx path or Tx path to
be operational at one time. The power-savings method depends
on whether the AD9869 is configured for a full-duplex or halfduplex interface. Functional blocks having fast power-on/power-off
times for the Tx path and Rx path are controlled by the
following bits: TxDAC/IAMP, Tx Digital, ADC, and RxPGA
(see Table 23).
Table 23. SPI Registers Associated with Power-Down and
Half-Duplex Power Savings
Address (Hex)
0x01
0x02
0x03
Bit
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
7:3
2
1
0
Description
CLK Synthesizer
TxDAC/IAMP
Tx Digital
REF
ADC CML
ADC
PGA Bias
RxPGA
CLK Synthesizer
TxDAC/IAMP
Tx Digital
REF
ADC CML
ADC
PGA Bias
RxPGA
Tx OFF Delay
Rx PWRDWN via
TXEN
Enable Tx PWRDWN
Enable Rx PWRDWN
Comments
PWRDWN = 0.
Default setting is
all functional blocks
powered on.
PWRDWN = 1.
Default setting is
all functional
blocks powered
off excluding PLL.
Half-duplex power
savings.
In the case of a full-duplex digital interface (MODE = 1), users
can set Register 0x01 to Register 0x60 and Register 0x02 to
Register 0x05 (or vice versa) such that the Tx path and Rx path are
never powered on simultaneously. The PWRDWN pin can then be
used to control which path is powered on, depending on the burst
type. During a Tx burst, the Rx path PGA and ADC blocks can
typically be powered down within 100 ns, while the Tx path
DAC, IAMP, and digital filter blocks are powered up within
0.5 μs. For an Rx burst, the Tx circuitry can be powered down
within 100 ns, while the Rx circuitry is powered up within 2 μs.
Setting the TXQUIET pin low allows it to be used with the fullduplex interface to quickly power down the IAMP and disable
the interpolation filter. This is meant to maintain backward
compatibility with the AD9875/AD9876 MxFEs, except that the
TxDAC remains powered if its IOUTP outputs are used. In
most applications, the interpolation filter needs to be flushed
with 0s before or after being powered down. This ensures that
upon power-up, the TxDAC (and IAMP) have a negligible
differential dc offset, thus preventing spectral splatter due to an
impulse transient.
Applications using a half-duplex interface (MODE = 0) can benefit
from an additional power-savings feature available in Register 0x03.
This register is effective only for a half-duplex interface. In addition
to providing power savings for half-duplex applications, this
feature allows the AD9869 to be used in applications that need
only its Rx (or Tx) path functionality through pin strapping,
making a serial port interface (SPI) optional. This feature also
allows the PWRDWN pin to retain its default function as a master
power control, as defined in Table 10.
The default settings for Register 0x03 provide fast power control
of the functional blocks in the Tx signal path and Rx signal path
(outlined previously) using the TXEN pin. The TxDAC remains
powered on in this mode, while the IAMP is powered down.
Significant current savings are typically realized when the
IAMP is powered down.
1
With MODE = 1 and CONFIG =1, Register 0x02 default settings are with all blocks
powered off, with RXCLK providing a buffered version of the signal appearing
at OSCIN. This setting results in the lowest power consumption upon powerup, while still allowing AD9869 to generate the system clock via a crystal.
Rev. 0 | Page 30 of 36
AD9869
55
For a Tx burst, the falling edge of TXEN is used to generate an
internal delayed signal for powering down the Tx circuitry. Upon
receipt of this signal, power-down of the Tx circuitry occurs
within 100 ns. The user-programmable delay for the Tx path
power-down is meant to match the pipeline delay of the last Tx
burst sample such that power-down of the TxDAC and IAMP
does not impact its transmission. A 5-bit field in Register 0x03 sets
the delay from 0 to 31 TXCLK clock cycles, with the default
being 31 (0.62 μs with fTXCLK = 50 MSPS). The digital interpolation
filter is automatically flushed with midscale samples prior to
power-down if the clock signal into the TXCLK pin is present
for 33 additional clock cycles after TXEN returns low. For an Rx
burst, the rising edge of TXEN is used to generate an internal
signal (with no delay) that powers up the Tx circuitry within 0.5 μs.
50
IAVDDTxDAC (mA)
45
40
35
30
25
20
10
06736-033
15
0
1
2
3
4
5
6
7
8
9
10
11
12
13
ISTANDING (mA)
Figure 33. Reduction in TxDAC Supply Current vs. Standing Current
The Rx path power-on/power-off can be controlled by either
TXEN or RXEN by setting Bit 2 of Register 0x03. In the default
setting, the falling edge of TXEN powers up the Rx circuitry
within 2 μs, while the rising edge of TXEN powers down the Rx
circuitry within 0.5 μs. If RXEN is selected as the control signal,
its rising edge powers up the Rx circuitry, and the falling edge
powers it down. To disable the fast power-down of the Tx
circuitry and/or Rx circuitry, set Bit 1 and/or Bit 0 to 0.
65
60
4× INTERPOLATION
55
IDVDD (mA)
50
POWER REDUCTION OPTIONS
45
40
2× INTERPOLATION
35
30
1× (HALF-DUPLEX ONLY)
25
06736-034
The power consumption of the AD9869 can be significantly
reduced from its default setting by optimizing the power
consumption vs. performance of the various functional blocks
in the Tx signal path and Rx signal path. On the Tx path,
minimum power consumption is realized when the TxDAC
output is used directly and its standing current is reduced to as
low as 1 mA. Although a slight degradation in THD performance
results at reduced standing currents, it often remains adequate
for most applications because the op amp driver typically limits
the overall linearity performance of the Tx path. The load
resistors used at the TxDAC outputs (IOUTP+ and IOUTP−)
can be increased to generate an adequate differential voltage
that can be further amplified via a power efficient op ampbased driver solution. Figure 33 shows how the supply current
for the TxDAC is reduced from 55 mA to 14 mA as the standing
current is reduced from 12.5 mA to 1.25 mA. Further Tx power
savings can be achieved by bypassing or reducing the interpolation factor of the digital filter as shown in Figure 34.
20
15
20
30
40
50
60
70
80
INPUT DATA RATE (MSPS)
Figure 34. Digital Supply Current Consumption vs. Input Data Rate
(DVDD = DRVDD = 3.3 V and fOUT = fDATA/10)
Power consumption on the Rx path can be achieved by reducing
the bias levels of the various amplifiers contained within the
RxPGA and ADC. As previously noted, the RxPGA consists of
two CPGA amplifiers and one SPGA amplifier. The bias levels
of each of these amplifiers, along with the ADC, can be controlled
via Register 0x13 as shown in Table 24. The default setting for
Register 0x13 is 0x00.
Table 24. SPI Register for RxPGA and ADC Biasing
Address (Hex)
0x07
0x13
Rev. 0 | Page 31 of 36
Bit
4
7:5
4:3
2:0
Description
ADC low power.
CPGA bias adjust.
SPGA bias adjust.
ADC power bias adjust.
AD9869
Because the CPGA processes signals in the continuous time
domain, its performance vs. bias setting remains mostly
independent of the sample rate. Table 25 shows how the typical
current consumption seen at AVDD varies as a function of
Register 0x13, Bits[7:5], while the remaining bits are maintained at
their default settings of 0. Only four of the possible settings result
in any reduction in current consumption relative to the default
setting. Reducing the bias level typically results in degradation
in the THD vs. frequency performance as shown in Figure 35.
This is due to a reduction of the amplifier’s unity gain bandwidth,
while the SNR performance remains relatively unaffected.
The SPGA is implemented as a switched capacitor amplifier,
therefore, its performance vs. bias level is mostly dependent on
the sample rate. Figure 36 shows how the typical current consumption seen at AVDD varies as a function of Register 0x13, Bits[4:3]
and sample rate, while the remaining bits are maintained at the
default setting of 0. Figure 37 shows how the SNR and THD
performance is affected for a 10 MHz sine wave input as the
ADC sample rate is swept from 20 MHz to 80 MHz. The SNR
and THD performance remains relatively stable, suggesting that
the SPGA bias can often be reduced from its default setting
without impacting the device’s overall performance.
210
Table 25. Analog Supply Current vs. CPGA Bias Settings at
fADC = 65 MSPS
∆mA
0
−27
−42
−51
−55
+27
+69
+27
200
01
195
00
190
185
10
180
11
06736-036
175
170
20
65.0
–25
60.0
–30
–50
50.0
THD_RxPGA = 0dB
47.5
–55
–60
45.0
–65
42.5
THD_RxPGA = 36dB
001
010
011
–70
100
70
80
61
–54
60
–56
–58
SNR-00
SNR-01
SNR-10
SNR-11
58
SNR (dBc)
–45
52.5
60
59
THD (dBc)
–40
57
–64
–66
–68
THD-00
THD-01
THD-10
THD-11
52
51
20
Figure 35. THD vs. fIN Performance and CPGA Bias Settings (000, 001, 010, 100
with RxPGA = 0 and +36 dB, AIN = −1 dBFS, LPF set to 26 MHz, fADC = 50 MSPS)
–62
55
53
CPGA BIAS SETTING-BITS (7:5)
–60
56
54
06736-035
SNR (dBFS)
SNR_RxPGA = 36dB
55.0
50
Figure 36. AVDD Current vs. SPGA Bias Setting and Sample Rate
–35
57.5
40
ADC SAMPLE RATE (MSPS)
SNR_RxPGA = 0dB
62.5
40.0
000
30
–20
30
40
50
THD (dBc)
Bit 5
0
1
0
1
0
1
0
1
–70
–72
60
70
–74
80
06736-037
Bit 6
0
0
1
1
0
0
1
1
IAVDD (mA)
Bit 7
0
0
0
0
1
1
1
1
205
SAMPLE RATE (MSPS)
Figure 37. SNR and THD Performance vs. fADC and SPGA Bias Setting with
RxPGA = 0 dB, fIN = 10 MHz, LPF set to 26 MHz, AIN = −1 dBFS
Rev. 0 | Page 32 of 36
AD9869
The ADC is based on a pipeline architecture with each stage
consisting of a switched capacitor amplifier. Therefore, its
performance vs. bias level is mostly dependent on the sample
rate. Figure 38 shows how the typical current consumption seen
at AVDD varies as a function of Register 0x13, Bits[2:0] and
sample rate, while the remaining bits are maintained at the
default setting of 0. Setting Bit 4 or Register 0x07 corresponds
to the 011 setting, and the settings of 101 and 111 result in
higher current consumption. Figure 39 shows how the SNR and
THD performance are affected for a 10 MHz sine wave input
for the lower power settings as the ADC sample rate is swept
from 20 MHz to 80 MHz.
220
101 OR 111
210
200
000
190
POWER DISSIPATION
The power dissipation of the AD9869 can become quite high in
full-duplex applications in which the Tx path and Rx path are
simultaneously operating with nominal power bias settings. In
fact, some applications that use the IAMP may need to either
reduce its peak power capabilities or reduce the power
consumption of the Rx path so that the device’s maximum
allowable power consumption, PMAX, is not exceeded.
PMAX is specified at 1.66 W to ensure that the die temperature
does not exceed 125°C at an ambient temperature of 85°C. This
specification is based on the 64-lead LFSCP having a thermal
resistance, θJA, of 24°C/W with its heat slug soldered. (The θJA is
30.8°C/W if the heat slug remains unsoldered.) If a particular
application’s maximum ambient temperature, TA, falls below
85°C, the maximum allowable power dissipation can be
determined by the following equation:
IAVDD (mA)
001
180
PMAX = 1.66 + (85 − TA)/24
010
170
160
011
100
150
Assuming the IAMP common-mode bias voltage is operating
off the same analog supply as the AD9869, the following equation can be used to calculate the maximum total current
consumption, IMAX, of the IC:
101
06736-038
140
130
120
20
30
40
50
60
(10)
70
IMAX = (PMAX − PIAMP)/3.47
80
(11)
With an ambient temperature of up to 85°C, IMAX is 478 mA.
SAMPLE RATE (MSPS)
If the IAMP is operating off a different supply or in the voltage
mode configuration, first calculate the power dissipated in the
IAMP, PIAMP, using Equation 3, and then recalculate IMAX using
Equation 11.
Figure 38. AVDD Current vs. ADC Bias Setting and Sample Rate
61
–54
60
–56
–58
SNR-00
SNR-01
SNR-10
SNR-11
57
–60
–62
56
–64
55
–66
54
53
52
51
20
–68
THD-00
THD-01
THD-10
THD-11
30
40
50
–70
–72
60
70
–74
80
06736-039
SNR (dBc)
58
THD (dBc)
59
SAMPLE RATE (MSPS)
Figure 39. SNR and THD Performance vs. fADC and ADC Bias Setting with
RxPGA = 0 dB, fIN = 10 MHz, AIN = −1 dBFS
A sine wave input is a standard and convenient method of
analyzing the performance of a system. However, the amount of
power reduction that is possible is application dependent, based
on the nature of the input waveform (such as frequency content,
and peak-to-rms ratio), the minimum ADC sample, and the
minimum acceptable level of performance. Thus, it is advisable
that power-sensitive applications optimize the power bias setting
of the Rx path using an input waveform that is representative of
the application.
Figure 33, Figure 34, Figure 36, and Figure 38 can be used to
calculate the current consumption of the Rx and Tx paths for a
given setting.
MODE SELECT UPON POWER-UP AND RESET
The AD9869 power-up state is determined by the logic levels
appearing at the MODE and CONFIG pins. The MODE pin is
used to select a half- or full-duplex interface by pin strapping it
low or high, respectively. The CONFIG pin is used in conjunction with the MODE pin to determine the default settings for
the SPI registers as outlined in Table 10.
The intent of these particular default settings is to allow some
applications to avoid using the SPI (disabled by pin strapping
SEN high), thereby reducing implementation costs. For
example, setting MODE low and CONFIG high configures the
AD9869 to be backward compatible with the AD9975, while
setting MODE high and CONFIG low makes it backward
compatible with the AD9875. Other applications must use the
SPI to configure the device.
Rev. 0 | Page 33 of 36
AD9869
A hardware reset (RESET pin) or software reset (Bit 5 of
Register 0x00) can be used to place the AD9869 into a known
state of operation as determined by the state of the MODE and
CONFIG pins. A dc offset calibration and filter tuning routine
is also initiated upon a hardware reset, but not with a software
reset. Neither reset method flushes the digital interpolation filters
in the Tx path. Refer to the Half-Duplex Mode and Full-Duplex
Mode sections for information on flushing the digital filters.
A hardware reset can be triggered by pulsing the RESET pin low
for a minimum of 50 ns. The SPI registers are instantly reset to
their default settings upon RESET going low, whereas the dc
offset calibration and filter-tuning routine is initiated upon
RESET returning high. To ensure sufficient power-on time of the
various functional blocks, RESET returning high should occur
no less than 10 ms upon power-up. If a digital reset signal from
a microprocessor reset circuit (such as ADM1818) is not available,
a simple R-C network referenced to DVDD can be used to hold
RESET low for approximately 10 ms upon power-up.
ANALOG AND DIGITAL LOOPBACK TEST MODES
The AD9869 features analog and digital loopback capabilities
that can assist in system debug and final test. Analog loopback
routes the digital output of the ADC back into the Tx data
path prior to the interpolation filters such that the Rx input
signal can be monitored at the output of the TxDAC or IAMP.
As a result, the analog loopback feature can be used for a halfduplex or full-duplex interface to allow testing of the
functionality of the entire IC (excluding the digital data
interface).
For example, the user can configure the AD9869 with similar
settings as the target system, inject an input signal (sinusoidal
waveform) into the Rx input, and monitor the quality of the
reconstructed output from the TxDAC or IAMP to ensure a
minimum level of performance. In this test, the user can exercise
the RxPGA as well as validate the attenuation characteristics of
the RxLPF. Note that the RxPGA gain setting should be selected
such that the input does not result in clipping of the ADC.
Digital loopback can be used to test the full-duplex digital
interface of the AD9869. In this test, data appearing on the
Tx[5:0] port is routed back to the Rx[5:0] port, thereby
confirming proper bus operation. The Rx port can also be
three-stated for half-duplex and full-duplex interfaces.
Table 26. SPI Registers for Test Modes
Address (Hex)
0x0D
Rev. 0 | Page 34 of 36
Bit
7
6
5
Description
Analog loopback.
Digital loopback.
Rx port three-state.
AD9869
OUTLINE DIMENSIONS
9.00
BSC SQ
0.30
0.25
0.18
0.60 MAX
0.60 MAX
64 1
48 49
PIN 1
INDICATOR
PIN 1
INDICATOR
8.75
BSC SQ
TOP
VIEW
(BOTTOM VIEW)
0.50
0.40
0.30
12° MAX
SEATING
PLANE
33
17 16
32
7.50
REF
0.80 MAX
0.65 TYP
0.25 MIN
0.05 MAX
0.02 NOM
0.50 BSC
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
063006-B
1.00
0.85
0.80
7.25
7.10 SQ
6.95
EXPOSED PAD
Figure 40. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm x 9 mm Body, Very Thin Quad
(CP-64-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model
AD9869BCPZ 1
AD9869BCPZRL1
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
Package Description
64-Lead LFCSP_VQ
64-Lead LFCSP_VQ
Z = RoHS Compliant Part.
Rev. 0 | Page 35 of 36
Package Option
CP-64-3
CP-64-3
AD9869
NOTES
©2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06736-0-5/07(0)
Rev. 0 | Page 36 of 36