VISHAY UGB12HT

UG12JT, UGF12JT, UGB12JT Series
Vishay Semiconductors
New Product
formerly General Semiconductor
Ultrafast Rectifiers
Reverse Voltage 500 to 600V
Forward Current 12A
Reverse Recovery Time 30ns
ITO-220AC (UGF12 Series)
0.188 (4.77)
0.172 (4.36)
0.405 (10.27)
0.383 (9.72)
0.110 (2.80)
0.100 (2.54)
TO-220AC (UG12 Series)
0.175 (4.44)
0.154 (3.91)
0.370 (9.40)
0.360 (9.14)
0.148 (3.74)
DIA.
0.055 (1.39)
0.045 (1.14)
0.113 (2.87)
0.103 (2.62)
0.350 (8.89)
0.330 (8.38)
0.350 (8.89)
0.330 (8.38)
0.635 (16.13)
0.625 (15.87)
PIN
1
2
0.191 (4.85)
0.171 (4.35)
0.560 (14.22)
0.530 (13.46)
1.148 (29.16)
1.118 (28.40)
0.160 (4.06)
0.140 (3.56)
2
0.603 (15.32)
0.573 (14.55)
PIN
1
0.676 (17.2)
0.646 (16.4)
0.600 (15.5)
0.580 (14.5)
0.145 (3.68)
0.135 (3.43)
0.410 (10.41)
0.390 (9.91)
PIN 1
0.560 (14.22)
0.530 (13.46)
PIN 1
CASE
PIN 2
0.037 (0.94)
0.027 (0.69)
0.205 (5.20)
0.195 (4.95)
0.105 (2.67)
0.037 (0.94)
0.027 (0.68)
0.095 (2.41)
0.205 (5.20)
0.195 (4.95)
0.110 (2.80)
0.100 (2.54)
0.060 (1.52)
0.110 (2.79)
0.100 (2.54)
PIN 2
0.131 (3.39)
DIA.
0.122 (3.08)
0.140 (3.56)
DIA.
0.130 (3.30)
0.185 (4.70)
0.415 (10.54) MAX.
0.022 (0.55)
0.014 (0.36)
TO-263AB (UGB12 Series)
0.022 (0.56)
0.014 (0.36)
0.190 (4.83)
0.411 (10.45)
0.380 (9.65)
0.160 (4.06)
0.055 (1.40)
0.045 (1.14)
0.245 (6.22)
MIN
Mounting Pad Layout TO-263AB
K
0.42
(10.66)
0.047 (1.19)
1
Dimensions in inches
and (millimeters)
0.63
(17.02)
0.055 (1.40)
0.360 (9.14)
0.320 (8.13)
0.33
(8.38)
K
2
0.624 (15.85)
0.591 (15.00)
0-0.01 (0-0.254)
0.110 (2.79)
0.090 (2.29)
0.027 (0.686)
0.037 (0.940)
0.105 (2.67)
0.08
(2.032)
0.24
(6.096)
0.12
(3.05)
0.095 (2.41)
0.021 (0.53)
0.014 (0.36)
PIN 1
PIN 2
0.205 (5.20)
K - HEATSINK
0.140 (3.56)
0.110 (2.79)
0.195 (4.95)
Features
Mechanical Data
• Plastic package has Underwriters Laboratories
Flammability Classification 94V-0
• Ideally suited for freewheeling diode and power factor
correction applications
• Soft recovery characteristics
• Excellent high temperature switching
• Optimized to reduce switching losses
• Glass passivated chip junction
Case: JEDEC TO-220AC, ITO-220AC & TO-263AB
molded plastic body
Terminals: Plated leads, solderable per
MIL-STD-750, Method 2026
High temperature soldering in accordance with CECC
802 / Reflow guaranteed
Polarity: As marked
Mounting Position: Any
Mounting Torque: 10 in-lbs maximum
Weight: 0.08 oz., 2.24 g
Document Number 88758
30-Jul-02
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1
UG12JT, UGF12JT, UGB12JT Series
Vishay Semiconductors
formerly General Semiconductor
Maximum Ratings
(TC = 25°C unless otherwise noted)
Parameter
Symbol
UG12HT
UG12JT
Unit
Maximum repetitive peak reverse voltage
VRRM
500
600
V
Maximum working reverse voltage
VRWM
400
480
V
Maximum RMS voltage
VRMS
350
420
V
Maximum DC blocking voltage
VDC
500
600
V
Maximum average forward rectified current
IF(AV)
12
A
Peak forward surge current 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method)
IFSM
135
A
TJ, TSTG
–55 to +150
°C
VISOL
4500(1)
3500(2)
1500(3)
V
Operating junction and storage temperature range
RMS Isolation voltage (UGF types only)
from terminals to heatsink with t = 1.0 second, RH ≤ 30%
Electrical Characteristics (T
C
= 25°C unless otherwise noted)
Parameter
Symbol
UG12HT
UG12JT
Unit
IF = 12A, TJ = 25°C
IF = 12A, TJ = 125°C
VF
1.75
1.50
V
TJ = 25°C
TJ = 100°C
TJ = 125°C
IR
30
800
4.0
µA
µA
mA
Maximum reverse recovery time at
IF = 0.5A, IR = 1.0A, Irr = 0.25A
trr
30
ns
Maximum reverse recovery time at
IF = 1.0A, di/dt = 50A/µs, VR = 30V, Irr = 0.1 IRM
trr
50
ns
Typical softness factor (tb/ta)
IF = 12A, di/dt = 240A/µs, VR = 400V, Irr = 0.1 IRM
S
0.9
—
IRM
7.5
A
tfr
500
ns
Maximum instantaneous
forward voltage(4)
Maximum DC reverse current at VRWM
Maximum reverse recovery current at
IF = 12A, di/dt = 96A/µs, VR = 400V, TC = 125°C
Peak forward recovery time at
IF = 12A, di/dt = 96A/µs, VF = 1.1V
Thermal Characteristics (T
C
= 25°C unless otherwise noted)
Parameter
Typical thermal resistance from junction to case
Notes: (1)
(2)
(3)
(4)
Symbol
UG12
UGF12
UGB12
Unit
RθJC
1.73
3.04
1.73
°C/W
Clip mounting (on case), where lead does not overlap heatsink with 0.110” offset
Clip mounting (on case), where leads do overlap heatsink
Screw mounting with 4-40 screw, where washer diameter is ≤ 4.9 mm (0.19”)
Pulse test: 300µs pulse width, 1% duty cycle
Ordering Information
Product
Case
Package Code
UG12HT & UG12JT
TO-220AC
45
UGF12HT & UGF12JT
ITO-220AC
45
Anti-Static tube, 50/tube, 2K/carton
TO-263AB
31
45
81
13” reel, 800/reel, 4.8K/carton
Anti-Static tube, 50/tube, 2K/carton
Anti-Static 13” reel, 800/reel, 4.8K/carton
UGB12HT & UGB12JT
www.vishay.com
2
Package Option
Anti-Static tube, 50/tube, 2K/carton
Document Number 88758
30-Jul-02
UG12JT, UGF12JT, UGB12JT Series
Vishay Semiconductors
formerly General Semiconductor
Ratings and
Characteristic Curves (TA = 25°C unless otherwise noted)
Fig. 1 – Forward Current
Derating Curve
Fig. 2 – Maximum Non-Repetitive Peak
Forward Surge Current
16
200
Peak Forward Surge Current (A)
Average Forward Current (A)
14
UG12HT, UG12JT,
UGB12HT, UGB12JT
12
10
8
UGF12HT, UGF12JT
6
4
2
0
100
75
125
150
125
100
75
50
25
10
1
175
100
Case Temperature (¡C)
Number of Cycles at 60 HZ
Fig. 3 – Typical Instantaneous
Forward Characteristics Per Leg
Fig. 4 – Typical Reverse Leakage
Characteristics Per Leg
100
10,000
Instantaneous Reverse Leakage
Current (µA)
Instantaneous Forward Current (A)
150
0
50
25
0
10
TJ = 125°C
1
TJ = 100°C
TJ = 25°C
0.1
0.01
TJ = 125°C
1,000
TJ = 100°C
100
10
TJ = 25°C
1
0.1
0.3
0.5
0.7
0.9
1.0
1.3
1.5
1.7
1.9
0
2.1
40
20
60
80
100
Instantaneous Forward Voltage (V)
Percent of Rated Peak Reverse Voltage (%)
Fig. 5 – Typical Junction Capacitance
Per Leg
Fig. 6 – Reverse Switching Characteristics
Per Leg
Stored Charge / Reverse Recovery Time
(nC/ns)
100
Junction Capacitance (pF)
175
10
1
10
1
Reverse Voltage (V)
Document Number 88758
30-Jul-02
100
400
trr
Qrr
350
300
12A, 240A/µs, 400V
250
200
150
12A, 240A/µs, 400V
1A, 50A/µs, 30V
100
1A, 50A/µs, 30V
50
0
25
50
75
100
125
Junction Temperature (°C)
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