LINER LTC3450

LTC3450
Triple Output Power Supply
for Small TFT-LCD Displays
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FEATURES
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DESCRIPTIO
Generates Three Voltages:
5.1V at 10mA
– 5V, –10, or –15V at 500µA
10V or 15V at 500µA
Better than 90% Efficiency
Low Output Ripple: Less than 5mVP-P
Complete 1mm Component Profile Solution
Controlled Power-Up Sequence: AVDD/VGL/VGH
All Outputs Disconnected and Actively Discharged in
Shutdown
Low Noise Fixed Frequency Operation
Frequency Reduction Input for High Efficiency in
Blank Mode
Ultralow Quiescent Current: 75µA (Typ) in Scan Mode
Available in a 3mm × 3mm 16-Pin QFN Package
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APPLICATIO S
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The LTC®3450 is a complete power converter solution for
small thin film transistor (TFT) liquid crystal display (LCD)
panels. The device operates from a single Lithium-Ion cell,
2- to 3-cell alkaline input or any voltage source between
1.5V and 4.6V.
The synchronous boost converter generates a low noise,
high efficiency 5.1V, 10mA supply. Internal charge pumps
are used to generate 10V, 15V, and –5V, –10V or –15V.
Output sequencing is controlled internally to insure proper
initialization of the LCD panel.
A master shutdown input reduces quiescent current to
<2µA and quickly discharges each output for rapid turn off
of the LCD panel. The LTC3450 is offered in a low profile
(0.8mm max), 3mm × 3mm 16-pin QFN package, minimizing the solution profile and footprint.
, LTC and LT are registered trademarks of Linear Technology Corporation.
Cellular Handsets with Color Display
Handheld Instruments
PDA
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TYPICAL APPLICATIO
5.1V, –10V, 15V Triple Output TFT-LCD Supply
47µH
8
2.2µF
6
BLANK SCAN
4
7
SW
VOUT
11
C1 +
– 10
C1
VIN
MODE
V2X
LTC3450
OFF ON
5
C2 +
C2 –
SHDN
V3X
9
GND
VINV
VNEG C3 – C3 +
3
2
2.2µF
95
0.1µF
100µH
0.47µF
14
15
100
5mA LOAD
12
13
AVDD Efficiency vs VIN
AVDD
5.1V/10mA
0.1µF
VGH (3 × AVDD)
15V/500µA
EFFICIENCY (%)
VIN
1.5V TO
4.6V
90
47µH
85
80
16
0.1µF
75
0.1µF
70
1.5
1
0.1µF
VGL
–10V/500µA
2.0
2.5
3.0 3.5
VIN (V)
4.0
4.5
5.0
3450 TA01b
3450 TA01
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LTC3450
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ABSOLUTE
AXI U RATI GS
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PACKAGE/ORDER I FOR ATIO
(Note 1) (Referred to GND)
ORDER PART
NUMBER
C2–
C2+
VINV
V3X
TOP VIEW
VIN, SW.......................................................... – 0.3 to 7V
SHDN, MODE ................................................. – 0.3 to 7V
VOUT .............................................................................. – 0.3 to 7V
VNEG ........................................................................ –17V to 0.3V
Operating Temperature Range
LTC3450E (Note 4) ............................. – 40°C to 85°C
Storage Temperature Range ................. – 65°C to 125°C
16 15 14 13
C3+ 1
C3–
LTC3450EUD
12 V2X
2
11
17
VNEG 3
C1+
10 C1–
MODE 4
6
7
8
SHDN
VIN
VOUT
SW
9
5
GND
UD PART MARKING
LAAC
UD PACKAGE
16-LEAD (3mm × 3mm) PLASTIC QFN
EXPOSED PAD IS VNEG (PIN 17)
MUST BE SOLDERED TO PCB
TJMAX = 125°C, θJA = 68°C/W
Consult LTC Marketing for parts specified with wider operating temperature ranges.
ELECTRICAL CHARACTERISTICS
The ● denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VIN = 3.6V, VOUT = 5.2V unless otherwise noted.
PARAMETER
CONDITIONS
Input Voltage Range
MIN
●
TYP
1.5
MAX
UNITS
4.6
V
130
µA
50
µA
VIN Quiescent Supply Current
MODE = VIN
75
VOUT Quiescent Supply Current
MODE = VIN
80
VIN Quiescent Supply Current
MODE = GND
30
VOUT Quiescent Supply Current
MODE = GND
13
VIN Quiescent Current
SHDN = GND
0.01
2
µA
5.100
5.151
V
µA
µA
5V Boost Regulator
VOUT Output Voltage
Load on V5X = 5mA
5.049
VOUT Efficiency
Load on V5V = 5mA, (Note 2)
90
%
VOUT Maximum Output Current
L = 47µH, (Note 2)
11
mA
120
mA
Switch Current Limit
90
Switching Frequency—Boost
MODE = VIN
550
kHz
Switching Frequency—Boost
MODE = GND
15.62
kHz
Charge Pumps
V2X Output Voltage
Load on V2X = 100µA
●
9.792
10.1
10.608
V
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LTC3450
ELECTRICAL CHARACTERISTICS
The ● denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VIN = 3.6V, VOUT = 5.2V unless otherwise noted.
PARAMETER
CONDITIONS
V3X Output Voltage
Load on V3X = 100µA
V2X Efficiency
Load on V2X = 100µA, (Note 2)
90
V3X Efficiency
Load on V3X = 100µA, (Note 2)
80
%
Output Impedance V2X, V3X
Flying Capacitors = 0.1µF
1
kΩ
VNEG Output Voltage
Load on VNEG = 100µA, VINV = V2X
VNEG Efficiency
Load on VNEG = 100µA (Note 2)
80
%
Output Impedance VNEG
Flying Capacitor = 0.1µF
1
kΩ
Switching Frequency Charge Pumps
MODE = VIN
62.5
kHz
Switching Frequency Charge Pumps
MODE = GND
VNEG to V3X Delay
(Note 3)
●
MIN
TYP
MAX
14.688
15.2
15.912
● –10.608
–10.1
UNITS
V
%
– 9.792
3.75
V
kHz
3
4
10
0.4
0.77
1.2
ms
Logic Inputs
SHDN Pin Threshold
MODE Pin Threshold
Note 1: Absolute Maximum Ratings are those values beyond which the life
of a device may be impaired.
Note 2: Specification is guaranteed by design and not 100% tested in
production.
●
1.6
V
V
Note 3: Measured from point at which VNEG crosses –5V to point at which
C2– starts switching.
Note 4: The LTC3450E is guaranteed to meet performance specifications
from 0°C to 70°C. Specifications over the – 40°C to 85°C operating
temperature range are assured by design, characterization and correlation
with statistical process controls.
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LTC3450
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TYPICAL PERFOR A CE CHARACTERISTICS
AVDD Efficiency vs VIN
AVDD Efficiency vs VIN
100
100
L = 100µH
L = 47µH
10mA
95
95
EFFICIENCY (%)
EFFICIENCY (%)
5mA
90
2mA
85
80
10mA
90
5mA
85
2mA
80
75
75
70
(TA = 25°C unless otherwise noted)
70
1.5
2.0
2.5
3.0 3.5
VIN (V)
4.0
4.5
5.0
1.5
2.0
2.5
3.0 3.5
VIN (V)
4.5
4.0
3450 G03
3450 G02
No Load VIN Current in Blank Mode
AVDD vs VIN and Load
No Load VIN Current in Scan Mode
100
90
800
5.16
700
5.14
60
50
40
30
0mA
600
5.12
AVDD (V)
VIN CURRENT (µA)
VIN CURRENT (µA)
80
70
500
400
2.0
2.5
3.0
3.5
4.0
4.5
2.0
2.5
VIN (V)
3450 G04
3.5
4.0
4.5
5.04
5.0 5.5
2.0
2.5
3.0 3.5
VIN (V)
4.0
– 9.0
5.200
15.4
– 9.2
5.175
5.150
AVDD (V)
– 9.4
VGL (V)
5.0
AVDD vs Temperature
Figure 1 Circuit, 1mA Load
VGL vs Load
15.2
4.5
3450 G06
15.6
– 9.6
– 9.8
5.125
5.100
5.075
14.8
– 10.0
14.6
14.4
1.5
3450 G05
VGH vs Load
VGH (V)
3.0
VIN (V)
15.0
5mA
10mA
100
1.5
5.0 5.5
5.10
5.06
200
0
1.5
2mA
5.08
300
20
10
5.0
5.050
– 10.2
– 10.4
0 100 200 300 400 500 600 700 800 900 1000
VGH LOAD (µA)
3450 G07
5.025
0 100 200 300 400 500 600 700 800 900 1000
VGL LOAD (µA)
3450 G08
5.000
– 40 – 25 –10 5 20 35 50 65 80 95 110 125
TEMPERATURE (°C)
3450 G09
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LTC3450
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TYPICAL PERFOR A CE CHARACTERISTICS
AVDD Ripple Voltage
AVDD Load = 5mA
AVDD Transient Response
AVDD
100mV/DIV
(AC)
AVDD
5mV/DIV
(AC)
AVDD LOAD 5mA
5mA/DIV 1mA
VIN = 3.6V
C2 = 2.2µF
1µs/DIV
3450 G10
VIN = 3.6V
C2 = 2.2µF
100µs/DIV
3450 G11
AVDD Turn-On Showing Inrush
Current Limiting
AVDD, VGL, VGH Turn-On and
Turn-Off Sequence
INDUCTOR
CURRENT
100mA/DIV
VGH 0
10V/DIV
0
AVDD
5V/DIV
AVDD
2V/DIV
0
VGL
5V/DIV
0
VIN = 3.6V
C2 = 2.2µF
2ms/DIV
3450 G12
VIN = 3.6V
20µs/DIV
3450 G13
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LTC3450
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PI FU CTIO S
C3+ (Pin 1): Charge Pump Inverter Flying Capacitor Positive Node. The charge pump inverter flying capacitor is
connected between C3+ and C3 –. The voltage on C3+ will
alternate between GND and VINV at an approximate 50%
duty cycle while the inverting charge pump is operating.
Use a 10nF or larger X5R type ceramic capacitor for best
results.
SW (Pin 8): Switch Pin. Connect the inductor between SW
and VIN. Keep PCB trace lengths as short and wide as
possible to reduce EMI and voltage overshoot. If the
inductor current falls to zero, the internal P-channel
MOSFET synchronous rectifier is turned off to prevent
reverse charging of the inductor and an internal switch
connects SW to VIN to reduce EMI.
C3 – (Pin 2): Charge Pump Inverter Flying Capacitor Negative Node. The charge pump inverter flying capacitor is
connected between C3+ and C3 –. The voltage on C3 – will
alternate between GND and VNEG at an approximate 50%
duty cycle while the inverting charge pump is operating.
Use a 10nF or larger X5R type ceramic capacitor for best
results.
GND (Pin 9): Signal and Power Ground for the LTC3450.
Provide a short direct PCB path between GND and the
(–) side of the output filter capacitor(s) on VOUT, V2X, V3X
and VNEG.
VNEG (Pin 3): Charge Pump Inverter Output. VNEG can be
either – 5V or –10V depending on where VINV is connected. VNEG should be bypassed to GND with at 0.1µF or
larger X5R type ceramic capacitor. VNEG can also be
configured for –15V with two external low current Schottky
diodes (see Applications section).
MODE (Pin 4): Drive MODE high to force the LTC3450 into
high power (scan) mode. Drive MODE low to force the
LTC3450 into low power (blank) mode. The output voltages remain active with the MODE pin driven low but with
reduced output current capability. MODE must be pulled
up to VIN or higher on initial application of power in order
for proper initialization to occur.
SHDN (Pin 5): Master Shutdown Input for the LTC3450.
Driving SHDN low disables all IC functions and reduces
quiescent current from the battery to less than 2µA. Each
generated output voltage is actively discharged to GND in
shutdown through internal pull down devices. An optional
RC network on SHDN provides a slower ramp up of the
boost converter inductor current during startup (soft-start).
VIN (Pin 6): Input Supply to the LTC3450. Connect VIN to
a voltage source between 1.5V and 4.6V. Bypass VIN to
GND with a 2.2µF X5R ceramic capacitor.
VOUT (Pin 7): Main 5.1V Output of the Boost Regulator and
Input to the Voltage Doubler Stage. Bypass VOUT with a low
ESR, ESL ceramic capacitor (X5R type) between 2.2µF and
10µF.
C1 – (Pin 10): Charge Pump Doubler Flying Capacitor
Negative Node. The charge pump doubler flying capacitor
is connected between C1 + and C1 –. The voltage on C1– will
alternate between GND and VOUT at an approximate 50%
duty cycle while the charge pump is operating. Use a 10nF
or larger X5R type ceramic capacitor for best results.
C1+ (Pin 11): Charge Pump Doubler Flying Capacitor
Positive Node. The charge pump doubler flying capacitor
is connected between C1+ and C1–. The voltage on C1+ will
alternate between VOUT and V2X at an approximate 50%
duty cycle while the charge pump is operating. Use a 10nF
or larger X5R type ceramic capacitor for best results.
V2X (Pin 12): Charge Pump Doubler Output. This output
is 10.2V (nom) at no load and is capable of delivering up
to 500µA to a load. V2X should be bypassed to GND with
a 0.47µF X5R type ceramic capacitor.
C2 – (Pin 13): Charge Pump Tripler Flying Capacitor Negative Node. The charge pump tripler flying capacitor is
connected between C2 + and C2 –. The voltage on C2 – will
alternate between GND and VOUT at an approximate 50%
duty cycle while the charge pump is operating. Use a 10nF
or larger X5R type ceramic capacitor for best results.
C2 + (Pin 14): Charge Pump Tripler Flying Capacitor Positive Node. The charge pump tripler flying capacitor is
connected between C2 + and C2 –. The voltage on C2 + will
alternate between V2X and V3X at an approximate 50%
duty cycle while the charge pump is operating. Use a 10nF
or larger X5R type ceramic capacitor for best results.
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LTC3450
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PI FU CTIO S
V3X (Pin 15): Charge Pump Tripler Output. This output is
15.3V (nom) at no load and is capable of delivering up to
500µA to a load. V3X should be bypassed to GND with a
0.1µF X5R type ceramic capacitor.
Connecting VINV to 5V or 10V will generate –5V or –10V
respectively on VNEG. See Applications section for –15V
generation.
Exposed Pad (Pin 17): The exposed pad must be connected to VNEG (Pin 3) on the PCB. Do not connect the
exposed pad to GND.
VINV (Pin 16): Positive Voltage Input for the Charge Pump
Inverter. The charge pump inverter will generate a negative voltage corresponding to the voltage applied to VINV.
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BLOCK DIAGRA
L1
47µH
VIN
1.5V TO
4.6V
C1
2.2µF
8
VIN
6
SW
SYNCHRONOUS
PWM BOOST
CONVERTER
7
AVDD
5.1V/10mA
VOUT
C2
2.2µF
SHUTDOWN
CHARGE PUMP
DOUBLER
IN
OUT
OSCILLATOR
BLANK SCAN
OFF ON
MODE
SHDN
10
12
C1+
C1–
CF1
0.1µF
V2X
10V
C7
1µF
SHUTDOWN
550kHz
69kHz
CHARGE PUMP
TRIPLER
IN
4
5
11
OUT
GLOBAL SHUTDOWN
14
13
15
C2 +
C2 –
CF2
0.1µF
VGH (3 × AVDD)
15V/500µA
C8
0.47µF
V3X
SHUTDOWN
16
CHARGE PUMP
INVERTER
IN
OUT
1
2
3
VINV
C3 +
C3 –
VNEG
SHUTDOWN
CF3
0.1µF
VGL
–10V/500µA
C11
0.47µF
3450 TA01
9
GND
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LTC3450
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OPERATIO
The LTC3450 is a highly integrated power converter intended for small TFT-LCD display modules. A fixed frequency, synchronous PWM boost regulator generates a
low noise 5.1V, 10mA bias at greater than 90% efficiency
from an input voltage of 1.5V to 4.6V. Three charge pump
converters use the 5.1V output to generate 10V, 15V and
–5V, –10V or –15V at load currents up to 500µA. Each
converter is frequency synchronized to the main 500kHz
(nominal) boost converter. The generated output voltages
are internally sequenced to insure proper initialization of
the LCD panel. A digital shutdown input rapidly discharges
each generated output voltage to provide a near instantaneous turn-off of the LCD display.
Boost Converter
The synchronous boost converter utilizes current mode
control and includes internally set control loop and slope
compensation for optimized performance and simple design. Only three external components are required to
complete the design of the 5.1V, 10mA boost converter.
The high operation frequency produces very low output
ripple and allows the use of small low profile inductors and
tiny external ceramic capacitors. The boost converter also
disconnects its output from VIN during shutdown to avoid
loading the input power source. Softstart produces a
controlled ramp of the converter input current during
startup, reducing the burden on the input power source.
Very low operating quiescent current and synchronous
operation allow for greater than 90% conversion efficiency.
The MODE input reduces the boost converter operating
frequency by approximately 8x when driven high and
reduces the output power capability of the boost converter. MODE is asserted when the polysilicon TFT-LCD
display is in its extremely low power blank condition. The
15V
10V
5V
–10V
boost converter further reduces its quiescent current in
this mode, delivering both lower input (battery) current
drain and low noise operation.
Charge Pumps
The LTC3450 includes three separate charge pump converters which generate 10V, 15V and either –5V, –10V or
–15V. Each output can deliver a maximum of 500µA. The
charge pumps feature fixed frequency, open-loop operation for high efficiency and lowest noise performance. The
charge pump converters operate at 1/8 the boost converter frequency and include internal charge transfer
switches. Thus, each charge pump requires only two small
external capacitors, one to transfer charge, and one for
filtering. Similar to the boost converter, the charge pumps
operating frequency reduces to approximately 4kHz in
blank mode, maintaining low noise operation but at reduced output current capability.
Output Sequencing
Refer to the following text and Figure 1 for the LTC3450
power-up sequence. When input power is applied, the
boost converter initializes and charges its output towards
the final value of 5.1V. When the boost converter output
reaches approximately 90% of its final value (4.5V), an
internal 5V OK signal is asserted which allows the charge
pump doubler to begin operation toward its final goal of
10V. Approximately 1ms later, the charge pump inverter
begins operation toward its final goal of either
–5V or –10V depending on the connection of the VINV
input. When the –5V or –10V output (VNEG) reaches
approximately 50% of its final value, a 4ms (nominal)
timeout period begins. At the conclusion of the 4ms
timeout period, the charge pump tripler is allowed to
begin operation, which will eventually charge V3X to 15V
(nominal).
VX3
VX2
VOUT
1ms
VNEG
4ms
3450 F01
Figure 1. Output Sequencing
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LTC3450
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APPLICATIO S I FOR ATIO
Inductor Selection
Soft-Start
Inductors in the range of 47µH to 100µH with saturation
current (ISAT) ratings of at least 150mA are recommended
for use with the LTC3450. Ferrite core materials are
strongly recommended for their superior high frequency
performance characteristics. A bobbin or toroid type core
will reduce radiated noise. Inductors meeting these requirements are listed in Table␣ 1.
Soft-start operation provides a gradual increase in the
current drawn from the input power source (usually a
battery) during initial startup of the LTC3450, eliminating
the inrush current which is typical in most boost converters. This reduces stress on the input power source, boost
inductor and output capacitor, reduces voltage sag on the
battery and increases battery life. The rate at which the
input current will increase is set by two external components (RSS and CSS) connected to SHDN (refer to Figure
2). Upon initial application of power or release of a pull
down switch on SHDN, the voltage on SHDN will increase
relative to the R • C time constant or RSS␣ • CSS. After one
time constant SHDN will rise to approximately 63.2% of
the voltage on VIN. From 0V to approximately 0.65V on
SHDN, no switching will occur because the shutdown
threshold is 0.65V (typ). From 0.65V to 1V the maximum
switch pin current capability of the LTC3450 will gradually
increase from near zero to the maximum current limit. An
RSS in the range of 1MΩ to 10MΩ is recommended. If
SHDN is driven high with a logic signal, the input current
will gradually increase to its maximum value in approximately 50µs.
Table 1. Recommended Inductors
PART
NUMBER
L MAX DCR HEIGHT
(µH)
(Ω)
(mm) VENDOR
CLQ4D10-470
CLQ4D10-101
CMD4D08-470
47
100
47
1.28
3.15
1.6
DO1606-473
DO1606-104
DT1608-473
DT1608-104
47
100
47
100
1.1
2.3
0.34
1.1
LQH43MN470J03 47
LQH43MN101J03 100
1.5
2.5
2.6
Murata
www.murata.com
DU6629-470M
DU6629-101M
0.64
1.27
2.92
Coev Magnetics
www.circuitprotection.com
47
100
1.2
1.0
2.0
2.92
Sumida
(847) 956-0666
www.sumida.com
Coilcraft
(847) 639-6400
www.coilcraft.com
Capacitor Selection
The boost converter requires two capacitors. The input
capacitor should be an X5R type of at least 1µF. The VOUT
capacitor should also be an X5R type between 2.2µF and
10µF. A larger capacitor (10µF) should be used if lower
output ripple is desired or the output load required is close
to the 10mA maximum.
The charge pumps require flying capacitors of at least
0.1µF to obtain specified performance. Ceramic X5R types
are strongly recommended for their low ESR and ESL and
capacitance versus bias voltage stability. The filter capacitor on V2X should be at least 0.1µF. A 0.47µF or larger
capacitor on V2X is recommended if VINV is connected to
V2X. The filter capacitors on V3X and VNEG should be
0.1µF or larger. Please be certain that the capacitors used
are rated for the maximum voltage with adequate safety
margin. Refer to Table 2 for a listing of capacitor vendors.
Table 2. Capacitor Vendor Information
Supplier
Phone
Website
AVX
(803) 448-9411
www.avxcorp.com
Murata
(714) 852-2001
www.murata.com
Taiyo Yuden
(408) 573-4150
www.t-yuden.com
VIN
RSS
1M
5%
5 SHDN
CSS
6.8nF
1ms SOFT-START WITH 3.6V VIN
3450 F02
Figure 2. Soft-Start Component Configuration
Printed Circuit Board Layout Guidelines
High speed operation of the LTC3450 demands careful
attention to PCB layout. You will not get advertised performance with careless layout. Figure 3 shows the recommended component placement for a single layer PCB. A
multilayer board with a separate ground plane is ideal but
not absolutely necessary.
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LTC3450
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APPLICATIO S I FOR ATIO
V3X
JUMPER
VNEG
MODE
SHDN
VOUT
VIN
GND
NOTE: QFN PACKAGE EXPOSED PAD
IS CONNECTED TO THE VNEG PIN.
DO NOT CONNECT EXPOSED PAD TO GROUND
3450 F03
Figure 3. Suggested Layout
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TYPICAL APPLICATIO
5.1V, –15V, 15V Triple Output TFT-LCD Supply
VIN
1.5V TO
4.6V
L1
47µH
C1
2.2µF
BLANK SCAN
8
6
4
7
SW
VIN
VOUT
11
C1 +
10
C1 –
MODE
V2X
LTC3450
OFF ON
5
SHDN
9
14
C2 –
13
GND
VINV
VNEG C3 – C3 +
3
2
AVDD
5.1V/10mA
CF1
0.1µF
12
C2 +
V3X
C2
2.2µF
CF2
0.1µF
15
C4
0.47µF
D1
VGH
15V/500µA
16
D2
C6
0.1µF
1
0.1µF
CF3
0.1µF
D1, D2: DUAL SCHOTTKY DIODE, PANASONIC MA704WKCT
L1: SUMIDA CMD4D08-470
C5
0.1µF
VGL
–15V/500µA
3450 TA02
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LTC3450
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PACKAGE DESCRIPTIO
UD Package
16-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1691)
0.57 ±0.05
3.35 ± 0.05
1.45 ± 0.05
2.20 ± 0.05 (4 SIDES)
PACKAGE OUTLINE
0.23 ±0.05
0.50 BCS
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
3.00 ± 0.10
(4 SIDES)
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
0.75 ± 0.05
0.40 ± 0.10
15
16
PIN 1
TOP MARK
1
1.45 ± 0.10
(4-SIDES)
2
(UD) QFN 0802
0.200 REF
0.00 – 0.05
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
0.23 ± 0.05
0.50 BSC
3450f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
11
LTC3450
U
TYPICAL APPLICATIO
5.1V, – 5V, 15V Triple Output TFT-LCD Supply
VIN
1.5V TO
4.6V
L1
47µH
8
C1
2.2µF
6
BLANK SCAN
4
7
SW
VIN
VOUT
11
C1 +
10
C1 –
MODE
V2X
LTC3450
OFF ON
5
SHDN
9
14
C2 –
13
GND
VINV
VNEG C3 – C3 +
3
2
AVDD
5.1V/10mA
CF1
0.1µF
12
C2 +
V3X
C2
2.2µF
CF2
0.1µF
C4
0.47µF
VGH (3 × AVDD)
15V/500µA
15
16
C6
0.1µF
1
C5
0.1µF
CF3
0.1µF
VGL
–5V/500µA
L1: SUMIDA CMD4D08-470
3450 TA03
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
LT1310
1.5A ISW, 4.5MHz,
High Efficiency Step-Up DC/DC Converter
VIN: 2.75V to 18V, VOUT = 35V, IQ = 12mA, ISD = <1µA
MSE Package
LT1613
550mA ISW, 1.4MHz,
High Efficiency Step-Up DC/DC Converter
VIN: 0.9V to 10V, VOUT = 34V, IQ = 3mA, ISD = <1µA
ThinSOT Package
LT1615/LT1615-1
300mA/80mA ISW, Constant Off-Time,
High Efficiency Step-Up DC/DC Converter
VIN: 1.2V to 15V, VOUT = 34V, IQ = 20µA, ISD = <1µA
ThinSOT Package
LT1940
Dual Output 1.4A IOUT, Constant 1.1MHz,
High Efficiency Step-Down DC/DC Converter
VIN: 3V to 25V, VOUT (MIN) = 1.2V, IQ = 2.5mA, ISD = <1µA
TSSOP-16E Package
LT1944
Dual Output 350mA ISW, Constant Off-Time,
High Efficiency Step-Up DC/DC Converter
VIN: 1.2V to 15V, VOUT = 34V, IQ = 20µA, ISD = <1µA
MS Package
LT1944-1
Dual Output 150mA ISW, Constant Off-Time,
High Efficiency Step-Up DC/DC Converter
VIN: 1.2V to 15V, VOUT = 34V, IQ = 20µA, ISD = <1µA
MS Package
LT1945
Dual Output, Pos/Neg, 350mA ISW, Constant Off-Time,
High Efficiency Step-Up DC/DC Converter
VIN: 1.2V to 15V, VOUT = ±34V, IQ = 20µA, ISD = <1µA
MS Package
LT1946/LT1946A
1.5A ISW, 1.2MHz/2.7MHz,
High Efficiency Step-Up DC/DC Converter
VIN: 2.45V to 16V, VOUT = 34V, IQ = 3.2mA, ISD = <1µA
MS8 Package
LT1947
Triple Output ( for TFT-LCD) 1.1A ISW,
3MHz High Efficiency Step-Up DC/DC Converter
VIN: 2.7V to 8V, VOUT = 34V, IQ = 9.5mA, ISD = <1µA
MS Package
LT1949/LT1949-1
550mA ISW, 600kHz/1.1MHz,
High Efficiency Step-Up DC/DC Converter
VIN: 1.5V to 12V, VOUT = 28V, IQ = 4.5mA, ISD = <25µA
S8, MS8 Packages
LTC3400/LTC3400B
600mA ISW, 1.2MHz,
Synchronous Step-Up DC/DC Converter
VIN: 0.85V to 5V, VOUT = 5V, IQ = 19µA/300µA, ISD = <1µA
ThinSOT Package
LTC3401
1A ISW, 3MHz, Synchronous Step-Up DC/DC Converter
VIN: 0.5V to 5V, VOUT = 5V, IQ = 38µA, ISD = <1µA, MS Package
LTC3402
2A ISW, 3MHz, Synchronous Step-Up DC/DC Converter
VIN: 0.5V to 5V, VOUT = 5V, IQ = 38µA, ISD = <1µA, MS Package
3450f
12
Linear Technology Corporation
LT/TP 1203 1K • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com
 LINEAR TECHNOLOGY CORPORATION 2003