TI 74AC11008D

74AC11008
QUADRUPLE 2-INPUT POSITIVE-AND GATE
SCAS014C – AUGUST 1987 – REVISED APRIL 1996
D
D
D
D
D
D, N, OR PW PACKAGE
(TOP VIEW)
Flow-Through Architecture Optimizes
PCB Layout
Center-Pin VCC and GND Configurations
Minimize High-Speed Switching Noise
EPIC  (Enhanced-Performance Implanted
CMOS) 1-µm Process
500-mA Typical Latch-Up Immunity at
125°C
Package Options Include Plastic
Small-Outline (D) and Thin Shrink
Small-Outline (PW) Packages, and
Standard Plastic 300-mil DIPs (N)
1A
1Y
2Y
GND
GND
3Y
4Y
4B
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
1B
2A
2B
VCC
VCC
3A
3B
4A
description
This device contains four independent 2-input AND gates. It performs the Boolean function
Y
+ A • B or Y + A ) B in positive logic.
The 74AC11008 is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
(each gate)
INPUTS
A
B
OUTPUT
Y
H
H
H
L
X
L
X
L
L
logic symbol†
1A
1B
2A
2B
3A
3B
4A
4B
1
&
16
2
1Y
15
3
14
2Y
11
6
10
3Y
9
7
8
4Y
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC is a trademark of Texas Instruments Incorporated.
Copyright  1996, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
74AC11008
QUADRUPLE 2-INPUT POSITIVE-AND GATE
SCAS014C – AUGUST 1987 – REVISED APRIL 1996
logic diagram (positive logic)
1A
1B
2A
2B
3A
3B
4A
4B
1
16
15
14
11
10
9
8
2
3
6
7
1Y
2Y
3Y
4Y
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA
Maximum power dissipation at TA = 55°C (in still air) (see Note 2): D package . . . . . . . . . . . . . . . . . . . . 1.3 W
N package . . . . . . . . . . . . . . . . . . . . 1.1 W
PW package . . . . . . . . . . . . . . . . . . . 0.5 W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150_C and a board trace length of 750 mils,
except for the N package, which has a trace length of zero.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
74AC11008
QUADRUPLE 2-INPUT POSITIVE-AND GATE
SCAS014C – AUGUST 1987 – REVISED APRIL 1996
recommended operating conditions
VCC
Supply voltage
VIH
High-level input voltage
VCC = 3 V
VCC = 4.5 V
VCC = 5.5 V
VCC = 3 V
MIN
NOM
MAX
3
5
5.5
0.9
VI
VO
Input voltage
0
Output voltage
0
IOH
High-level output current
∆t/∆v
Input transition rise or fall rate
TA
Operating free-air temperature
V
3.85
Low-level input voltage
Low-level output current
V
2.1
3.15
VIL
IOL
UNIT
VCC = 4.5 V
VCC = 5.5 V
1.35
V
1.65
VCC
VCC
VCC = 3 V
VCC = 4.5 V
V
V
–4
–24
VCC = 5.5 V
VCC = 3 V
–24
VCC = 4.5 V
VCC = 5.5 V
24
mA
12
mA
24
0
10
ns/V
–40
85
°C
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
IOH = –50 µA
VOH
3V
2.9
2.9
4.5 V
4.4
4.4
5.4
5.4
3V
2.58
2.48
4.5 V
3.94
3.8
IOH = –24
24 mA
A
5.5 V
4.94
IOH = –75 mA†
5.5 V
IOL = 12 mA
IOL = 24 mA
II
ICC
MIN
5.5 V
IOH = –4 mA
IOL = 50 µA
VOL
TA = 25°C
MIN
TYP
MAX
MAX
UNIT
V
4.8
3.85
3V
0.1
0.1
4.5 V
0.1
0.1
5.5 V
0.1
0.1
3V
0.36
0.44
4.5 V
0.36
0.44
5.5 V
0.36
0.44
V
IOL = 75 mA†
5.5 V
VI = VCC or GND
VI = VCC or GND,
5.5 V
±0.1
±1
µA
5.5 V
4
40
µA
IO = 0
Ci
VI = VCC or GND
5V
3.5
† Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1.65
pF
3
74AC11008
QUADRUPLE 2-INPUT POSITIVE-AND GATE
SCAS014C – AUGUST 1987 – REVISED APRIL 1996
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A or B
Y
MIN
TA = 25°C
TYP
MAX
MIN
MAX
1.5
6.3
9
1.5
10.2
1.5
5.6
7.8
1.5
8.6
UNIT
ns
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A or B
Y
MIN
TA = 25°C
TYP
MAX
MIN
MAX
1.5
4.3
6.2
1.5
6.9
1.5
5.6
5.9
1.5
6.5
UNIT
ns
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance per gate
CL = 50 pF,
TYP
f = 1 MHz
29
UNIT
pF
PARAMETER MEASUREMENT INFORMATION
Input
(see Note B)
From Output
Under Test
CL = 50 pF
(see Note A)
VCC
50% VCC
50% VCC
0V
tPLH
tPHL
500 Ω
Output
50% VCC
VOH
50% VCC
VOL
VOLTAGE WAVEFORMS
LOAD CIRCUIT
NOTES: A. CL includes probe and jig capacitance.
B. Input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns.
C. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74AC11008D
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74AC11008DE4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74AC11008DG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74AC11008DR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74AC11008DRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74AC11008DRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74AC11008N
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
74AC11008NE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
74AC11008PWLE
OBSOLETE
TSSOP
PW
16
74AC11008PWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74AC11008PWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74AC11008PWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TBD
Lead/Ball Finish
Call TI
MSL Peak Temp (3)
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2007
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
74AC11008DR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
74AC11008PWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
74AC11008DR
SOIC
D
16
2500
333.2
345.9
28.6
74AC11008PWR
TSSOP
PW
16
2000
367.0
367.0
35.0
Pack Materials-Page 2
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