TAIPEI : TEL : FAX : H.K. : TEL : FAX : 一華半導體股份有限公司 MOSDESIGN SEMICONDUCTOR CORP. LED FLASH 电源控制 三色灯 LED IC VDD CONTROL RGB LED IC 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 M1346 FEATURES 功能叙述 • Minimum external component ( without limit current resister ). P/N FUNCTION • Built-in oscillator. M1346-1 七彩渐明渐暗 • Power on continual function. M1346-2 七彩跳闪 M1346-3 七彩跳闪 + 七彩渐明渐暗 APPLICATION 产品应用 • Blinking LED, Function indicator, R.G.B Mix etc.. ELECTRICAL CHARACTERISTICS 电气规格 Characteristics 工作电压 Operating Voltage Sym. VDD 工作电流 Operating Current ─ Typ. 4.5 Max. 5 Unit V IOP ─ 0.1 0.5 mA No load 静态电流 Quiescent Current 推动电流 Driving Current ISB ─ 20 1 ─ One-shot mode ─ 振荡频率 Oscillator Frequency 工作温度 Operating Temperature FOSC ─ 110 μA mA KHz ±30% TOL. IOL Temp. Min. ( @VDD=4.5V unless otherwise specified ) ─ 0 25 ─ 60 REMARKS @VDS = 1.2 V ℃ APPLICATION DIAGRAM 参考电路图 VDD=4.5V VDD=4.5V BL YGL GL RL BL YGL GL RL M1346P VSS VDD M1346 VSS M1346 VDD 1.35 X 1.09 mm2 底=VDD GL 1 8 BL VSS 1.35 X 1.09 mm2 底=VDD X RL Y X VDD 4 5 Y * 外加电容减慢 * 外加电阻加快 Emitted color Red Green Blue Yellow Green LED Chip Material Algainp Ingan Ingan Algainp λp(nm) 635 525 470 550 Typ. 1.9 3.1 3.65 2.0 Vf ( V ) Max. 2.1 3.5 4.0 2.3 Iv ( mcd ) At Ir ( mA) Typ. 120 100 20 80 120 *All specs and applications shown above subject to change without prior notice. ( 以上电路及规格仅供参考,本公司得径行修正 ) 1/3 2004-09-02 X TAIPEI : TEL : FAX : H.K. : TEL : FAX : 一華半導體股份有限公司 MOSDESIGN SEMICONDUCTOR CORP. LED FLASH 电源控制 三色灯 LED IC VDD CONTROL RGB LED IC 七彩渐明渐暗 * M1346-1 (七彩渐明渐暗 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 M1346 ) R G YG B 1 2 3 4 * M1346-2 ( 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 8 9 10 11 12 13 14 15 16 17 18 19 20 26 27 28 29 30 31 32 七彩跳闪 ) R G YG B 1 2 3 * M1346-3 ( 4 5 6 7 七彩跳闪 + 七彩渐明渐暗 ) R G YG B 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 2/3 19 20 21 22 23 24 25 26 27 2004-09-02 TAIPEI : TEL : FAX : H.K. : TEL : FAX : 一華半導體股份有限公司 MOSDESIGN SEMICONDUCTOR CORP. LED FLASH 电源控制 三色灯 LED IC VDD CONTROL RGB LED IC 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 M1346 PAD ASSIGNMENT & POSITION 1 11 No. 1 2 3 4 5 6 7 8 9 10 11 3 2 4 Y 10 X 9 (0,0) 5 8 7 6 NAME YG GL RL VSS TEST2 TEST1 Y X OPT VDD BL X -282.80 -92.40 552.40 552.40 552.40 559.10 2.20 -552.50 -552.50 -552.50 -552.50 UNIT : um Y 423.20 423.20 423.20 243.20 -184.20 -423.20 -423.20 -264.70 -77.70 109.30 274.30 * CHIP SIZE ~ 1.35 x 1.09 mm2 * IC substrate should be connected to VDD in PCB (PCB 上 IC 必须接 VDD) 3/3 2004-09-02