VISHAY SI9150CY

Si9150
Vishay Siliconix
Synchronous Buck Converter Controller
FEATURES
D 6- to 16.5-V Input Range (Si9150CY)
D Voltage-Mode PWM Control
D Low-Current Standby Mode
D Enable Control
D Dual 100-mA Output Drivers
D 2% Band Gap Reference
D Multiple Converters Easily Synchronized
D Over-Current Protection
DESCRIPTION
The Si9150 synchronous buck regulator controller is ideally
suited for high-efficiency step down converters in
battery-powered equipment. Combined with the Si9943DY
MOSFET half-bridge, a 90% efficient, 7.5-W, 3.3-V or 5-V
power supply can be implemented using standard surfacemount assembly techniques. The wide input range allows
operation from NiCd or NiMH battery packs using six to ten
cells.
Duty ratios of 0 to 100% and switching frequencies up to 300
kHz are possible. The IC can be disabled by pulling EN low
(IDD = 100 mA), or the 2.5-V reference can be maintained, with
all other functions disabled, by pulling STBY low (IDD =
500 mA).
The Si9150 is available in both standard and lead (Pb)-free
14-pin SOIC and rated for the commercial temperature range
of 0 to 70_C (C suffix), and the industrial temperature range of
−40 to +85_C (D suffix).
Over-current protection is achieved by sensing the on-state
voltage drop across the high side p-channel MOSFET, which
eliminates the need for a current sense resistor.
FUNCTIONAL BLOCK DIAGRAM
VDD
14
20 mA
500 kW
EN
13
0.5 V
1
Power Down
Q
R
Oscillator,
Comparators,
& Error Amp
S
P-GATE
UVLO
Reference
Generator
Current
Limit
+
7
−
2
STBY
ISENSE
Strobe
4.7 V
SS
−
1V
3
+
R
Ref
Gen
Error
Amplifier
S
Q
VDD
12
N-GATE
+
−
5W
6
VREF
OSC
BreakBeforeMake
Logic
5
FB
4
COMP
CT
9
RT
10
8
SYNC
11
GND
Synchronous Buck Regulator Controller
Document Number: 70020
S-40752—Rev. F, 19-Apr-04
www.vishay.com
1
Si9150
Vishay Siliconix
ABSOLUTE MAXIMUM RATINGS
Voltages Referenced to GND.
VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V
ISENSE Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −2 V to VDD +2 V
All Other Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 to VDD + 0.3 V
P-Gate, N-Gate Continuous Source/Sink Current . . . . . . . . . . . . . . . . 50 mA
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65 to 125_C
Operating Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150_C
Power Dissipation (Package)a
14-Pin SOIC (Y Suffix)b . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 900 mW
Thermal Impedance (QJA)
14-Pin SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140_C/W
Notes
a. Device mounted with all leads soldered or welded to PC board.
b. Derate 7.2 mW/_C.
SPECIFICATIONSa
Test Conditions
Unless Otherwise Specified
Parameter
Symbol
Limits
Limits
C Suffix 0 to 70_C
D Suffix −40 to 85_C
6.0 v VDD v 16.5 V
Minb
Typc
Maxb
Minb
Typc
Maxb
TA = 25_C
Measured at Feedbacke Pin 5
2.45
2.50
2.55
2.45
2.50
2.55
TMIN to TMAXd
2.425
2.500
2.575
2.40
2.500
2.60
Unit
Reference
Output Voltage
VREF
V
Oscillator
Maximum Frequency
fMAX
COSC =94.3 pF, ROSC = 28.7 kW
TA = 25_Cf
255
300
345
255
300
345
Initial Accuracy
fOSC
COSC =212 pF, ROSC = 41.2 kW
TA = 25_Cf
85
100
115
85
100
115
kHz
Oscillator Ramp Amplitude
VOSC
TA = 25_C, 100 kHz
2.05
2.65
2.85
2.05
2.65
2.85
V
Temperature Stabilityd
fTEMP
VDD = 10 V, TMIN to TMAX
−5
"3
+5
−6
"4
+6
%
IB
VFB = VREF
25
500
25
750
nA
30
mV
Error Amplifier
Input BIAS Current
Open Loop Voltage Gaind
AVOL
Offset Voltage
VOS
Unity Gain Bandwidthd
BW
Output Current
Power Supply Rejection
IOUT
60
72
10
1
Source, VCOMP = 2.50 V
Sink, VCOMP = 1.0 V
PSRR
58
25
1.5
−0.30
72
10
1
−0.20
dB
1.5
−0.30
MHz
−0.15
mA
1
2.5
0.9
2.5
50
70
48
70
0.43
0.49
0.55
0.43
0.49
0.55
V
500
1000
500
1000
ns
5.4
5.7
6.0
5.38
5.7
6.01
0.10
0.17
0.25
0.10
0.17
0.26
dB
Protection
Current Limit
Threshold Voltage
VCL
TA = 25_C, VDD = 10 V
Current Limit
Delay to Outputd
td
TA = 25_C
Undervoltage
Lockout Voltage
VUVLO
Upper Threshold
Undervoltage Hysteresis
VHYS
Softstart Pull-Up Current
ISS
20
Supply Current
(Enable Low)
IOFF
60
100
60
100
mA
Supply Current
(Enable High)
ICC
2.2
3.0
2.2
3.0
mA
Supply Current (STBY Low)
ISB
300
500
300
550
mA
20
V
mA
Supply
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CL = 0 pF, fOSC = 100 kHz
VDD = 10 V
Document Number: 70020
S-40752—Rev. F, 19-Apr-04
Si9150
Vishay Siliconix
SPECIFICATIONSa
Test Conditions
Unless Otherwise Specified
Parameter
Symbol
Limits
Limits
C Suffix 0 to 70_C
D Suffix −40 to 85_C
6.0 v VDD v 16.5 V
Minb
9.75
Typc
Maxb
Minb
Typc
Maxb
Unit
Output
Output High Voltage
VOH
IOUT = 10 mA, VDD = 10 V
Output Low Voltage
VOL
IOUT = −10 mA, VDD = 10 V
Output Resistance
ROUT
IOUT = 100 mA, VDD = 10 V
Rise Timed
tr
Fall Timed
tf
9.7
0.25
CL = 800 pF,
pF VDD = 10 V
0.3
10
20
10
25
30
60
30
70
30
60
30
70
0.25
1
0.25
1
V
W
ns
Logic
Delay to Output
td(EN)
Enable Pull-Up Resistance
REN
STBY Pull-Up Current
ISTBY
Turn-On Threshold
Turn-Off Threshold
Transition High to Low
500
TA = 25_C, VSTBY = 0 V
VDD = 10 V
−25
VENH
VDD = 10 V, Rising Input Voltage
VENL
VDD = 10 V, Falling Input Voltage
500
−20
−15
−28
6
6.8
8
2
3.75
5
ms
kW
−20
−12
6
6.8
8
2
3.75
5
mA
V
Notes
a. Refer to PROCESS OPTION FLOWCHART for additional information.
b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet.
c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
d. Guaranteed by design, not subject to production test.
e. The voltage reference is trimmed with the feedback (Pin 5) connected to compensation (Pin 4) so that the effect of the error amplifier’s input offset voltage is
eliminated.
f.
COSC includes the PC board’s parasitic capacitance.
TYPICAL CHARACTERISTICS (25_C UNLESS OTHERWISE NOTED)
Oscillator Characteristics
Frequency (kHz)
1000
100
50 pF
100 pF
150 pF
200 pF
10
10
100
1000
rOSC − Oscillator Resistance (kW)
Document Number: 70020
S-40752—Rev. F, 19-Apr-04
www.vishay.com
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Si9150
Vishay Siliconix
PIN CONFIGURATION AND ORDERING INFORMATION
SOIC
EN
1
14
VDD
STANDBY
2
13
P-GATE
SS
3
12
N-GATE
COMP
4
11
GND
FB
5
10
RT
VREF
6
9
CT
Si9150DY
ISENSE
7
8
SYNC
Si9150DY-T1
ORDERING INFORMATION
Part Number
Temperature Range
Package
Si9150CY
Si9150CY-T1
0 to 70_C
Si9150CY-T1—E3
SOIC-14
−40
40 to 85
85_C
C
Si9150DY-T1—E3
Top View
PIN DESCRIPTION
Pin 1: EN
When this pin is low, the IC is shut down. After a low signal is
applied to EN, then COMP, REF, RT, and CT settle toward
ground; N-GATE, STBY and Soft-Start are grounded; and
P-GATE is pulled high. The current consumption is no more
than 100 mA in this state. This input’s threshold has substantial
hysteresis so that a capacitor to GND can be used to delay
restart after the current limit is activated. After VENH is
exceeded, one clock cycle elapses before N-GATE and
P-GATE are enabled. EN is pulled up to VDD through a 500-k
resistor and is pulled down internally when the current limit is
triggered.
Pin 2: STBY
Has a function similar to EN. The differences are that the EN
pin is unaffected, that the reference is still available, that bias
currents are still present internally, and that this pin’s pull up
current is present. This pin should be used to disable an
application if the reference voltage is still needed.
Pin 3: Soft-Start (SS)
This pin limits the maximum voltage that the error amplifier can
output. A capacitor between this pin and ground will limit the
rate at which the duty factor can increase during initial power
up, during a restart when EN or STBY goes high, or after the
current limit is triggered. A capacitor here can prevent an
application from triggering the Si9150’s current limit during
startup. Soft-Start is pulled low if either EN or STBY is low.
uses this pin. COMP settles low when either EN or STBY is
pulled low.
Pin 5: Feedback (FB)
This pin is attached directly to the inverting input of the error
amplifier. This pin is used to regulate the power supply’s output
voltage.
Pin 6: Reference (VREF)
The internal 2.5-V reference generator is attached to this pin
through a 5-W resistor. A 0.1-mF bypass capacitor is needed to
suppress noise. Also note that the generator has an open
emitter; it will not pull down. The maximum current that the
generator will source before it current limits is about 10 mA.
Many parts of the IC use this voltage, so it is important not to
overload the reference generator.
Pin 7: ISENSE
This pin should be attached to the switched node (the drains
of the application’s p-channel and n-channel MOSFETs). If the
voltage between VDD and this pin is more then 0.46 V while the
P-GATE is low, the current limit is activated. The current limit
is relatively slow to prevent false triggering due to noise.
Activating the current limit causes EN to be pulled to GND.
ISENSE may be operated from VDD + 2 V to GND − 2 V. For
operation above 13.5 VDD a filter (1 kW, 33 pF) is needed
between the MOSFET drains and the ISENSE pin; refer to
Figure 1.
Pin 8: SYNC
Pin 4: Compensation (COMP)
This pin is tied directly to the output of the error amplifier. The
feedback network which insures the stability of an application
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This pin forces the clock to reset when low, and is also pulled
low when the clock resets itself. Thus if several Si9150’s have
their sync pins shorted together, they will be synchronized; the
shortest duration clock will control the other clocks.
Document Number: 70020
S-40752—Rev. F, 19-Apr-04
Si9150
Vishay Siliconix
the the path from VDD to the source of the application’s
p-channel MOSFET.
Pin 9: CT
A capacitor from this pin to ground is charged until it reaches
2.5 V, at which point the capacitor is rapidly discharged. The
resulting sawtooth with about 1 V added is compared to the
input voltage at COMP to determine whether P-GATE and
N-GATE should be high or low. The maximum recommended
value for COSC is 200 pF (See Typical Characteristics). The
capacitor’s charging current is controlled by Pin 10, RT.
Pin 12: N-GATE
This pin is used to drive the application’s n-channel MOSFET.
When turning the n-channel MOSFET off, the p-channel
MOSFET will not be turned on until N-GATE is within a few volts
of ground. This pin is low while either EN or STBY is low.
Pin 10: RT
Pin 13: P-GATE
The IC applies 2.5 V to this pin, and the current is mirrored and
applied to Pin 9 while charging the capacitor. The minimum
recommended value of ROSC is 20 kW (Figure 1).
This pin is used to drive the application’s p-channel MOSFET.
The break before make circuitry for the P-GATE is
complimentary to that for the N-GATE. This pin is high while
either EN or STBY is low.
Pin 11: GND
Since the Si9150 has a high-side current limit, it is important
that VDD track the voltage on the source of the p-channel
power MOSFET. For noise immunity, it is best to separate the
logic ground from the power ground. The logic ground should
be decoupled to VDD through at least a 1-mF capacitor. The two
grounds may be connected by a path that is long compared to
Pin 14: VDD
This pin powers the IC. The connection between this pin and
the source of the p-channel FET should be as short as
practical. Read Pin 11’s description for bypassing
suggestions.
APPLICATIONS
VIN
100 mF
(20 V)
Si9943
47 pF
220 pF
1
14
2
13
3
12
3.32 kW
0.039 mF
5600 pF
1 mF
4
Si9150
43 mH
+5 V
100 mF
10MQ060
33.2 kW
14.7 kW
1000 pF
11
56.2 kW
5
10
6
9
7
8
200 pF
33.2 kW
VIN
33 pF
1 kW
FIGURE 1. Typical Application Circuit
Document Number: 70020
S-40752—Rev. F, 19-Apr-04
www.vishay.com
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