AD AD5645RBCPZ-R2

FEATURES
FUNCTIONAL BLOCK DIAGRAMS
VDD
VREFIN/VREFOUT
1.25V/2.5V REF
BUFFER
ADDR1
INPUT
REGISTER
DAC
REGISTER
STRING
DAC A
INPUT
REGISTER
DAC
REGISTER
STRING
DAC B
INPUT
REGISTER
DAC
REGISTER
STRING
DAC C
INPUT
REGISTER
DAC
REGISTER
STRING
DAC D
VOUTA
BUFFER
ADDR2
SCL
VOUTB
BUFFER
SDA
VOUTC
BUFFER
POWER-ON RESET
VOUTD
POWER-DOWN LOGIC
06341-001
LDAC CLR
POR
NOTES
1. THE FOLLOWING PINS ARE AVAILABLE ONLY ON 14-LEAD PACKAGE:
ADDR2, LDAC, CLR, POR.
Figure 1. AD5625R/AD5645R/AD5665R
VDD
APPLICATIONS
GND
VREFIN
INPUT
REGISTER
DAC
REGISTER
STRING
DAC A
INPUT
REGISTER
DAC
REGISTER
STRING
DAC B
INPUT
REGISTER
DAC
REGISTER
STRING
DAC C
INPUT
REGISTER
DAC
REGISTER
STRING
DAC D
AD5625/AD5665
Process control
Data acquisition systems
Portable battery-powered instruments
Digital gain and offset adjustment
Programmable voltage and current sources
Programmable attenuators
BUFFER
ADDR1
VOUTA
BUFFER
SCL
BUFFER
SDA
The AD5625R/AD5645R/AD5665R and AD5625/AD5665
members of the nanoDAC® family are low power, quad, 12-/
14-/16-bit, buffered voltage-out DACs with/without an on-chip
reference. All devices operate from a single 2.7 V to 5.5 V supply,
are guaranteed monotonic by design, and have an I2C-compatible
serial interface.
The AD5625R/AD5645R/AD5665R have an on-chip reference. The
LFCSP versions of the AD56x5R have a 1.25 V or 2.5 V, 10 ppm/°C
reference, giving a full-scale output range of 2.5 V or 5 V; the
TSSOP versions of the AD56x5R have a 2.5 V, 5 ppm/°C reference, giving a full-scale output range of 5 V. The WLCSP package
has a 1.25 V reference. The on-chip reference is off at power-up,
allowing the use of an external reference. The internal reference is
enabled via a software write. The AD5625/AD5665 require an
external reference voltage to set the output range of the DAC.
The part incorporates a power-on reset circuit that ensures that
the DAC output powers up to 0 V (POR = GND) or midscale
(POR = VDD) and remains there until a valid write occurs. The
on-chip precision output amplifier enables rail-to-rail output swing.
VOUTB
VOUTC
BUFFER
POWER-ON RESET
VOUTD
POWER-DOWN LOGIC
LDAC CLR
POR
NOTES
1. THE FOLLOWING PINS ARE AVAILABLE ONLY ON 14-LEAD PACKAGE:
ADDR2, LDAC, CLR, POR.
06341-002
ADDR2
GENERAL DESCRIPTION
Rev. C
GND
AD5625R/AD5645R/AD5665R
INTERFACE
LOGIC
Low power, smallest pin-compatible, quad nanoDACs
AD5625R/AD5645R/AD5665R
12-/14-/16-bit nanoDACs
On-chip, 2.5 V, 5 ppm/°C reference in TSSOP
On-chip, 2.5 V, 10 ppm/°C reference in LFCSP
On-chip, 1.25 V, 10 ppm/°C reference in LFCSP
AD5625/AD5665
12-/16-bit nanoDACs
External reference only
3 mm × 3 mm, 10-lead LFCSP; 14-lead TSSOP; and 1.665 mm
× 2.245 mm, 12-ball WLCSP
2.7 V to 5.5 V power supply
Guaranteed monotonic by design
Power-on reset to zero scale/midscale
Per channel power-down
Hardware LDAC and CLR functions
I2C-compatible serial interface supports standard (100 kHz),
fast (400 kHz), and high speed (3.4 MHz) modes
INTERFACE
LOGIC
Data Sheet
Quad, 12-/14-/16-Bit nanoDACs with
5 ppm/°C On-Chip Reference, I2C Interface
AD5625R/AD5645R/AD5665R, AD5625/AD5665
Figure 2. AD5625/AD5665
The AD56x5R/AD56x5 use a 2-wire I2C-compatible serial
interface that operates in standard (100 kHz), fast (400 kHz),
and high speed (3.4 MHz) modes.
Table 1. Related Devices
Part No.
AD5025/AD5045/AD5065
AD5624R/AD5644R/AD5664R,
AD5624/AD5664
AD5627R/AD5647R/AD5667R,
AD5627/AD5667
AD5666
Description
Dual 12-/14-/16-bit DACs
Quad SPI 12-/14-/16-bit DACs,
with/without internal reference
Dual I2C 12-/14-/16-bit DACs,
with/without internal reference
Quad SPI 16-bit DAC with internal
reference
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AD5625R/AD5645R/AD5665R, AD5625/AD5665
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1 External Reference ..................................................................... 24 Applications ....................................................................................... 1 Serial Interface ............................................................................ 24 General Description ......................................................................... 1 Write Operation.......................................................................... 24 Functional Block Diagrams ............................................................. 1 Read Operation........................................................................... 24 Revision History ............................................................................... 2 High Speed Mode ....................................................................... 26 Specifications..................................................................................... 3 Input Shift Register .................................................................... 26 Specifications—AD5665R/AD5645R/AD5625R ..................... 3 Multiple Byte Operation ............................................................ 26 Specifications—AD5665/AD5625 ............................................. 5 Broadcast Mode .......................................................................... 28 AC Characteristics........................................................................ 7 LDAC Function .......................................................................... 28 I C Timing Specifications ............................................................ 8 Power-Down Modes .................................................................. 30 Absolute Maximum Ratings.......................................................... 10 Power-On Reset and Software Reset ....................................... 31 ESD Caution ................................................................................ 10 Internal Reference Setup (R Versions) .................................... 31 Pin Configurations and Function Descriptions ......................... 11 Applications Information .............................................................. 32 Typical Performance Characteristics ........................................... 13 Terminology .................................................................................... 21 Using a Reference as a Power Supply for the
AD56x5R/AD56x5 ..................................................................... 32 Theory of Operation ...................................................................... 23 Bipolar Operation Using the AD56x5R/AD56x5 .................. 32 Digital-to-Analog Converter (DAC) ....................................... 23 Power Supply Bypassing and Grounding ................................ 32 Resistor String ............................................................................. 23 Outline Dimensions ....................................................................... 33 Output Amplifier ........................................................................ 23 Ordering Guide .......................................................................... 35 2
Internal Reference ...................................................................... 23 REVISION HISTORY
3/13—Rev. B to Rev. C
Added 12-Ball WLCSP ...................................................... Universal
Change to Features and General Description Sections ............... 1
Changes to Reference Output (1.25 V), Reference TC
Parameter, Table 2............................................................................. 4
Added θJA Thermal Impedance, WLCSP Parameter, Table 6 ... 10
Added Figure 8; Renumbered Sequentially ................................ 12
Added Table 8; Renumbered Sequentially .................................. 12
Changes to Internal Reference Section ........................................ 23
Changes to Serial Interface Section and Table 9 Title................ 24
Changes to Figure 58 and Figure 60 Captions ............................ 25
Updated Outline Dimensions ....................................................... 33
Changes to Ordering Guide .......................................................... 35
12/09—Rev. A to Rev. B
Changes to Features Section, General Description Section,
and Table 1..........................................................................................1
Changes to Table 2.............................................................................3
Changes to Internal Reference Section ........................................ 22
Updated Outline Dimensions ....................................................... 32
Changes to Ordering Guide .......................................................... 33
6/09—Rev. 0 to Rev. A
Changes to Features and General Description Sections ..............1
Changes to Table 2.............................................................................3
Changes to Table 3.............................................................................5
Changes to Digital-to-Analog Converter (DAC) Section, Added
Figure 54 and Figure 55, Renumbered Subsequent Figures ..... 22
Changes to Ordering Guide .......................................................... 33
3/07—Revision 0: Initial Version
Rev. C | Page 2 of 36
Data Sheet
AD5625R/AD5645R/AD5665R, AD5625/AD5665
SPECIFICATIONS
SPECIFICATIONS—AD5665R/AD5645R/AD5625R
VDD = 2.7 V to 5.5 V; RL = 2 kΩ to GND; CL = 200 pF to GND; VREFIN = VDD; all specifications TMIN to TMAX, unless otherwise noted.
Table 2.
Parameter
STATIC PERFORMANCE 2
AD5665R
Resolution
Relative Accuracy
Differential Nonlinearity
AD5645R
Resolution
Relative Accuracy
Differential Nonlinearity
AD5625R
Resolution
Relative Accuracy
Differential Nonlinearity
Zero-Code Error
Offset Error
Full-Scale Error
Gain Error
Zero-Code Error Drift
Gain Temperature Coefficient
DC Power Supply Rejection
Ratio
DC Crosstalk (External
Reference)
Min
B Grade
Typ
Max
±8
Unit
Test Conditions/Comments 1
±16
±1
Bits
LSB
LSB
Guaranteed monotonic by design
±4
±0.5
Bits
LSB
LSB
Guaranteed monotonic by design
14
±2
12
12
±1
2
±1
−0.1
±0.1
±2
±2.5
−100
±4
±1
10
±10
±0.5
±1.25
±0.5
2
±1
−0.1
±0.1
±2
±2.5
−100
Bits
LSB
LSB
mV
mV
% FSR
% FSR
µV/°C
ppm
dB
15
µV
10
8
25
10
8
25
µV/mA
µV
µV
20
10
20
10
µV/mA
µV
VDD
2×
VREF
0
VDD
2×
VREF
2
10
0.5
30
4
DC Output Impedance
Short-Circuit Current
Power-Up Time
±1
±0.25
10
±10
±0.5
±1
15
0
0
Capacitive Load Stability
REFERENCE INPUTS
Reference Current
Reference Input Range
Reference Input Impedance
Min
16
DC Crosstalk (Internal
Reference)
OUTPUT CHARACTERISTICS 3
Output Voltage Range
A Grade
Typ
Max
210
0.75
26
2
10
0.5
30
4
260
VDD
210
0.75
260
VDD
26
Rev. C | Page 3 of 36
Guaranteed monotonic by design
All 0s loaded to DAC register
All 1s loaded to DAC register
Of FSR/°C
DAC code = midscale; VDD = 5 V ± 10%
Due to full-scale output change,
RL = 2 kΩ to GND or VDD
Due to load current change
Due to powering down (per channel)
Due to full-scale output change,
RL = 2 kΩ to GND or VDD
Due to load current change
Due to powering down (per channel)
V
Internal reference disabled
Internal reference enabled
nF
nF
Ω
mA
µs
RL = ∞
RL = 2 kΩ
µA
V
kΩ
VREF = VDD = 5.5 V
VDD = 5 V
Coming out of power-down mode;
VDD = 5 V
AD5625R/AD5645R/AD5665R, AD5625/AD5665
Parameter
REFERENCE OUTPUT (1.25 V)
Output Voltage
Reference TC3
Output Impedance
REFERENCE OUTPUT (2.5 V)
Output Voltage
Reference TC3
Output Impedance
LOGIC INPUTS (ADDRx, CLR,
LDAC, POR)3
IIN, Input Current
VINL, Input Low Voltage
VINH, Input High Voltage
CIN, Pin Capacitance
VHYST, Input Hysteresis
LOGIC INPUTS (SDA, SCL)3
IIN, Input Current
VINL, Input Low Voltage
VINH, Input High Voltage
CIN, Pin Capacitance
VHYST, Input Hysteresis
Min
A Grade
Typ
Max
1.247
1.253
2.505
2.495
±10
7.5
±5
7.5
±1
0.15 × VDD
0.85 × VDD
2
0.1 × VDD
Test Conditions/Comments1
1.253
V
ppm/°C
ppm/°C
kΩ
At ambient
TSSOP and LFCSP packages
WLCSP package
2.505
±10
V
ppm/°C
kΩ
±1
0.15 × VDD
μA
V
V
pF
V
±1
0.3 × VDD
μA
V
V
pF
V
V
0.85 × VDD
2
0.1 × VDD
±1
0.3 × VDD
0.7 × VDD
2
0.1 × VDD
0.05 × VDD
0.7 × VDD
2
0.1 × VDD
0.05 × VDD
0.4
0.6
±1
0.4
0.6
±1
2
2.7
Unit
±10
±15
7.5
7.5
2.495
B Grade
Typ
Max
1.247
±10
LOGIC OUTPUTS (SDA)3
VOL, Output Low Voltage
Floating-State Leakage
Current
Floating-State Output
Capacitance
POWER REQUIREMENTS
VDD
IDD (Normal Mode)4
VDD = 4.5 V to 5.5 V
VDD = 2.7 V to 3.6 V
VDD = 4.5 V to 5.5 V
VDD = 2.7 V to 3.6 V
IDD (All Power-Down Modes)5
VDD = 2.7 V to 5.5 V
VDD = 3.6 V to 5.5 V
Min
Data Sheet
2
5.5
2.7
V
V
μA
VDD = 4.5 V to 5.5 V
At ambient
High speed mode
Fast mode
ISINK = 3 mA
ISINK = 6 mA
pF
5.5
V
1.0
0.9
1.9
1.4
1.16
1.05
2.14
1.59
1.0
0.9
1.9
1.4
1.16
1.05
2.14
1.59
mA
mA
mA
mA
VIH = VDD, VIL = GND, full-scale loaded
Internal reference off
Internal reference off
Internal reference on
Internal reference on
0.48
0.48
1
1
0.48
0.48
1
1
μA
μA
VIH = VDD, VIL = GND (LFCSP)
VIH = VDD, VIL = GND (TSSOP)
1
Temperature range of A and B grades is −40°C to +105°C.
Linearity calculated using a reduced code range: AD5665R (Code 512 to Code 65,024), AD5645R (Code 128 to Code 16,256), AD5625R (Code 32 to Code 4064). Output
unloaded.
3
Guaranteed by design and characterization; not production tested.
4
Interface inactive. All DACs active. DAC outputs unloaded.
5
All DACs powered down. Power-down function is not available on 14-lead TSSOP parts when the part is powered with VDD < 3.6 V.
2
Rev. C | Page 4 of 36
Data Sheet
AD5625R/AD5645R/AD5665R, AD5625/AD5665
SPECIFICATIONS—AD5665/AD5625
VDD = 2.7 V to 5.5 V; RL = 2 kΩ to GND; CL = 200 pF to GND; VREFIN = VDD; all specifications TMIN to TMAX, unless otherwise noted.
Table 3.
Parameter
STATIC PERFORMANCE 2
AD5665
Resolution
Relative Accuracy
Differential Nonlinearity
AD5625
Resolution
Relative Accuracy
Differential Nonlinearity
Zero-Code Error
Offset Error
Full-Scale Error
Gain Error
Zero-Code Error Drift
Gain Temperature Coefficient
DC Power Supply Rejection Ratio
DC Crosstalk (External Reference)
Min
16
±8
DC Output Impedance
Short-Circuit Current
Power-Up Time
REFERENCE INPUTS
Reference Current
Reference Input Range
Reference Input Impedance
LOGIC INPUTS (ADDRx, CLR, LDAC, POR)3
IIN, Input Current
VINL, Input Low Voltage
VINH, Input High Voltage
CIN, Pin Capacitance
VHYST, Input Hysteresis
LOGIC INPUTS (SDA, SCL)3
IIN, Input Current
VINL, Input Low Voltage
VINH, Input High Voltage
CIN, Pin Capacitance
VHYST, Input Hysteresis
±16
±1
12
±0.5
2
±1
−0.1
±0.1
±2
±2.5
−100
15
DC Crosstalk (Internal Reference)
OUTPUT CHARACTERISTICS 3
Output Voltage Range
Capacitive Load Stability
B Grade
Typ
Max
±1
±0.25
10
±10
±0.5
±1
Unit
Test Conditions/Comments 1
Bits
LSB
LSB
Guaranteed monotonic by design
Bits
LSB
LSB
mV
mV
% FSR
% FSR
µV/°C
ppm
dB
µV
10
8
25
µV/mA
µV
µV
20
10
µV/mA
µV
0
VDD
2
10
0.5
30
4
210
0.75
V
nF
nF
Ω
mA
µs
260
VDD
µA
V
kΩ
±1
0.15 × VDD
µA
V
V
pF
V
±1
0.3 × VDD
µA
V
V
pF
V
V
26
0.85 × VDD
2
0.1 × VDD
0.7 × VDD
2
0.1 × VDD
0.05 × VDD
Rev. C | Page 5 of 36
Guaranteed monotonic by design
All 0s loaded to DAC register
All 1s loaded to DAC register
Of FSR/°C
DAC code = midscale; VDD = 5 V ± 10%
Due to full-scale output change,
RL = 2 kΩ to GND or VDD
Due to load current change
Due to powering down (per channel)
Due to full-scale output change,
RL = 2 kΩ to GND or VDD
Due to load current change
Due to powering down (per channel)
RL = ∞
RL = 2 kΩ
VDD = 5 V
Coming out of power-down mode; VDD = 5 V
VREF = VDD = 5.5 V
High speed mode
Fast mode
AD5625R/AD5645R/AD5665R, AD5625/AD5665
Parameter
LOGIC OUTPUTS (SDA)3
VOL, Output Low Voltage
Floating-State Leakage Current
Floating-State Output Capacitance
POWER REQUIREMENTS
VDD
IDD (Normal Mode) 4
VDD = 4.5 V to 5.5 V
VDD = 2.7 V to 3.6 V
IDD (All Power-Down Modes) 5
VDD = 2.7 V to 5.5 V
VDD = 3.6 V to 5.5 V
Min
B Grade
Typ
Max
Data Sheet
Unit
Test Conditions/Comments 1
0.4
0.6
±1
V
V
µA
pF
ISINK = 3 mA
ISINK = 6 mA
5.5
V
1.0
0.9
1.16
1.05
mA
mA
0.48
0.48
1
1
µA
µA
2
2.7
VIH = VDD, VIL = GND, full-scale loaded
VIH = VDD, VIL = GND (LFCSP)
VIH = VDD, VIL = GND (TSSOP)
Temperature range of B grade is −40°C to +105°C.
Linearity calculated using a reduced code range: AD5665 (Code 512 to Code 65,024), AD5625 (Code 32 to Code 4064). Output unloaded.
3
Guaranteed by design and characterization; not production tested.
4
Interface inactive. All DACs active. DAC outputs unloaded.
5
All DACs powered down. Power-down function is not available on 14-lead TSSOP parts when the part is powered with VDD < 3.6 V.
1
2
Rev. C | Page 6 of 36
Data Sheet
AD5625R/AD5645R/AD5665R, AD5625/AD5665
AC CHARACTERISTICS
VDD = 2.7 V to 5.5 V; RL = 2 kΩ to GND; CL = 200 pF to GND; VREFIN = VDD; all specifications TMIN to TMAX, unless otherwise noted.
Table 4.
Parameter 1,2
Output Voltage Settling Time
AD5625R/AD5625
AD5645R
AD5665R/AD5665
Slew Rate
Digital-to-Analog Glitch Impulse
Digital Feedthrough
Reference Feedthrough
Digital Crosstalk
Analog Crosstalk
DAC-to-DAC Crosstalk
Multiplying Bandwidth
Total Harmonic Distortion
Output Noise Spectral Density
Output Noise
Min
Typ
Max
Unit
Test Conditions/Comments 3
3
3.5
4
1.8
4.5
5
7
µs
µs
µs
V/µs
¼ to ¾ scale settling to ±0.5 LSB
¼ to ¾ scale settling to ±0.5 LSB
¼ to ¾ scale settling to ±2 LSB
15
5
0.1
−90
0.1
1
4
1
4
340
−80
120
100
15
nV-s
nV-s
nV-s
dB
nV-s
nV-s
nV-s
nV-s
nV-s
kHz
dB
nV/√Hz
nV/√Hz
µV p-p
Guaranteed by design and characterization; not production tested.
See the Terminology section.
3
Temperature range is −40°C to +105°C, typical @ 25°C.
1
2
Rev. C | Page 7 of 36
1 LSB change around major carry
LFCSP
TSSOP
VREF = 2 V ± 0.1 V p-p, frequency 10 Hz to 20 MHz
External reference
Internal reference
External reference
Internal reference
VREF = 2 V ± 0.1 V p-p
VREF = 2 V ± 0.1 V p-p, frequency = 10 kHz
DAC code = midscale, 1 kHz
DAC code = midscale, 10 kHz
0.1 Hz to 10 Hz
AD5625R/AD5645R/AD5665R, AD5625/AD5665
Data Sheet
I2C TIMING SPECIFICATIONS
VDD = 2.7 V to 5.5 V; all specifications TMIN to TMAX, fSCL = 3.4 MHz, unless otherwise noted. 1
Table 5.
Parameter
fSCL 3
t1
t2
t3
t4
t5
t6
t7
t8
t9
t10
t11
t11A
Test Conditions 2
Standard mode
Fast mode
High speed mode, CB = 100 pF
High speed mode, CB = 400 pF
Standard mode
Fast mode
High speed mode, CB = 100 pF
High speed mode, CB = 400 pF
Standard mode
Fast mode
High speed mode, CB = 100 pF
High speed mode, CB = 400 pF
Standard mode
Fast mode
High speed mode
Standard mode
Fast mode
High speed mode, CB = 100 pF
High speed mode, CB = 400 pF
Standard mode
Fast mode
High speed mode
Standard mode
Fast mode
High speed mode
Standard mode
Fast mode
Standard mode
Fast mode
High speed mode
Standard mode
Fast mode
High speed mode, CB = 100 pF
High speed mode, CB = 400 pF
Standard mode
Fast mode
High speed mode, CB = 100 pF
High speed mode, CB = 400 pF
Standard mode
Fast mode
High speed mode, CB = 100 pF
High speed mode, CB = 400 pF
Standard mode
Fast mode
High speed mode, CB = 100 pF
High speed mode, CB = 400 pF
Min
4
0.6
60
120
4.7
1.3
160
320
250
100
10
0
0
0
0
4.7
0.6
160
4
0.6
160
4.7
Max
100
400
3.4
1.7
3.45
0.9
70
150
1.3
4
0.6
160
10
20
10
20
10
20
10
20
Unit
kHz
kHz
MHz
MHz
μs
μs
ns
ns
μs
μs
ns
ns
ns
ns
ns
μs
μs
ns
ns
μs
μs
ns
μs
μs
ns
μs
1000
300
80
160
300
300
80
160
1000
300
40
80
1000
μs
μs
μs
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
300
80
160
ns
ns
ns
Rev. C | Page 8 of 36
Description
Serial clock frequency
tHIGH, SCL high time
tLOW, SCL low time
tSU;DAT, data setup time
tHD;DAT, data hold time
tSU;STA, setup time for a repeated start condition
tHD;STA, hold time (repeated) start condition
tBUF, bus-free time between a stop and a start
condition
tSU;STO, setup time for a stop condition
tRDA, rise time of SDA signal
tFDA, fall time of SDA signal
tRCL, rise time of SCL signal
tRCL1, rise time of SCL signal after a repeated start
condition and after an acknowledge bit
Data Sheet
Parameter
t12
t13
t14
t15
tSP 4
AD5625R/AD5645R/AD5665R, AD5625/AD5665
Test Conditions 2
Standard mode
Fast mode
High speed mode, CB = 100 pF
High speed mode, CB = 400 pF
Standard mode
Fast mode
High speed mode
Standard mode
Min
10
20
10
10
10
300
Fast mode
High speed mode
Standard mode
Fast mode
High speed mode
Fast mode
High speed mode
300
30
20
20
20
0
0
Max
300
300
40
80
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
50
10
Description
tFCL, fall time of SCL signal
LDAC pulse width low
Falling edge of ninth SCL clock pulse of last byte
of a valid write to LDAC falling edge
CLR pulse width low
Pulse width of spike suppressed
See Figure 3. High speed mode timing specification applies only to the AD5625RBRUZ-2/AD5625RBRUZ-2REEL7 and AD5665RBRUZ-2/AD5665RBRUZ-2REEL7.
CB refers to the capacitance on the bus line.
3
The SDA and SCL timing is measured with the input filters enabled. Switching off the input filters improves the transfer rate but has a negative effect on the EMC
behavior of the part.
4
Input filtering on the SCL and SDA inputs suppresses noise spikes that are less than 50 ns for fast mode or less than 10 ns for high speed mode.
1
2
t12
t11
t6
t2
SCL
t1
t6
t4
t5
t8
t9
t10
t3
SDA
t7
P
S
S
P
t14
t15
CLR
*ASYNCHRONOUS LDAC UPDATE MODE.
Figure 3. 2-Wire Serial Interface Timing Diagram
Rev. C | Page 9 of 36
06341-003
t13
LDAC*
AD5625R/AD5645R/AD5665R, AD5625/AD5665
Data Sheet
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 6.
Parameter
VDD to GND
VOUT to GND
VREFIN/VREFOUT to GND
Digital Input Voltage to GND
Operating Temperature Range, Industrial
Storage Temperature Range
Junction Temperature (TJ maximum)
Power Dissipation
θJA Thermal Impedance
LFCSP_WD (4-Layer Board)
TSSOP
WLCSP
Reflow Soldering Peak Temperature,
RoHS Compliant
Rating
−0.3 V to +7 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−40°C to +105°C
−65°C to +150°C
150°C
(TJ max − TA)/θJA
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
61°C/W
150.4°C/W
75°C/W
260°C ± 5°C
Rev. C | Page 10 of 36
Data Sheet
AD5625R/AD5645R/AD5665R, AD5625/AD5665
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
VOUTA 4
TOP VIEW
(Not to Scale)
VOUTC 5
POR 6
VREFIN/VREFOUT
7
SCL
SDA
VOUTA 1
12
GND
VOUTB 2
GND 3
11
VOUTB
10
VOUTD
VOUTC 4
9
CLR
VOUTD 5
8
ADDR2
2
AD5625/
AD5665
VDD 3
VOUTA 4
TOP VIEW
(Not to Scale)
14
SCL
13
SDA
12
GND
11
VOUTB
10
VOUTD
POR 6
9
CLR
VREFIN 7
8
ADDR2
VOUTC 5
9
VDD
8
SDA
7
SCL
6
ADDR
Figure 6. Pin Configuration (10-Lead LFCSP), R Suffix Version
VOUTA 1
VOUTB 2
GND 3
VOUTC 4
VOUTD 5
06341-121
LDAC 1
TOP VIEW
(Not to Scale)
10 VREFIN/VREFOUT
EXPOSED PAD TIED TO GND.
Figure 4. Pin Configuration (14-Lead TSSOP), R Suffix Version
ADDR1
AD5625R/
AD5645R/
AD5665R
06341-122
AD5625R/
AD5645R/
AD5665R
VDD 3
14
13
AD5625/
AD5665
TOP VIEW
(Not to Scale)
10
VREFIN
9
VDD
8
SDA
7
SCL
6
ADDR
EXPOSED PAD TIED TO GND.
06341-123
2
06341-120
LDAC 1
ADDR1
Figure 7. Pin Configuration (10-Lead LFCSP)
Figure 5. Pin Configuration (14-Lead TSSOP)
Table 7. Pin Function Descriptions
Pin Number
14-Lead 10-Lead
1
N/A
Mnemonic
LDAC
2
N/A
ADDR1
3
9
VDD
4
5
6
1
4
N/A
VOUTA
VOUTC
POR
7
10
VREFIN/VREFOUT
8
9
N/A
N/A
ADDR2
CLR
10
11
12
13
5
2
3
8
VOUTD
VOUTB
GND
SDA
14
7
SCL
N/A
6
ADDR
EPAD
Description
Pulsing this pin low allows any or all DAC registers to be updated if the input registers have new data.
This allows simultaneous update of all DAC outputs. Alternatively, this pin can be tied permanently
low.
Three-State Address Input. Sets the two least significant bits (Bit A1, Bit A0) of the 7-bit slave address
(see Table 10).
Power Supply Input. These parts can be operated from 2.7 V to 5.5 V, and the supply should be
decoupled with a 10 μF capacitor in parallel with a 0.1 μF capacitor to GND.
Analog Output Voltage from DAC A. The output amplifier has rail-to-rail operation.
Analog Output Voltage from DAC C. The output amplifier has rail-to-rail operation.
Power-On Reset Pin. Tying the POR pin to GND powers up the part to 0 V. Tying the POR pin to VDD
powers up the part to midscale.
The AD56x5R have a common pin for reference input and reference output. When using the internal
reference, this is the reference output pin. When using an external reference, this is the reference
input pin. The default for this pin is as a reference input. (The internal reference and reference output
are only available on R suffix versions.) The AD56x5 has a reference input pin only.
Three-State Address Input. Sets Bit A3 and Bit A2 of the 7-bit slave address (see Table 10).
Asynchronous Clear Input. The CLR input is falling-edge sensitive. While CLR is low, all LDAC pulses
are ignored. When CLR is activated, zero scale is loaded to all input and DAC registers. This clears the
output to 0 V. The part exits clear code mode on the falling edge of the ninth clock pulse of the last
byte of the valid write. If CLR is activated during a write sequence, the write is aborted. If CLR is
activated during high speed mode, the part exits high speed mode.
Analog Output Voltage from DAC D. The output amplifier has rail-to-rail operation.
Analog Output Voltage from DAC B. The output amplifier has rail-to-rail operation.
Ground Reference Point for All Circuitry on the Part.
Serial Data Line. This is used in conjunction with the SCL line to clock data into or out of the 16-bit
input register. It is a bidirectional, open-drain data line that should be pulled to the supply with an
external pull-up resistor.
Serial Clock Line. This is used in conjunction with the SDA line to clock data into or out of the 16-bit
input register.
Three-State Address Input. Sets the two least significant bits (Bit A1, Bit A0) of the 7-bit slave address
(see Table 9).
For the 10-lead LFCSP, the exposed pad must be tied to GND.
Rev. C | Page 11 of 36
AD5625R/AD5645R/AD5665R, AD5625/AD5665
BALL A1
INDICATOR
1
2
Data Sheet
3
VREFIN/
VREFOUT
GND VOUTA
VDD
GND VOUTB
SDA
GND VOUTC
A
B
C
SCL ADDR VOUTD
TOP VIEW
(BALL SIDE DOWN)
Not to Scale
06341-108
D
Figure 8. Pin Configuration (12-Ball WLCSP)
Table 8. Pin Function Descriptions
Pin No.
A1
Mnemonic
VREFIN/VREFOUT
A2, B2, C2
A3
B1
GND
VOUTA
VDD
B3
C1
VOUTB
SDA
C3
D1
VOUTC
SCL
D2
ADDR
D3
VOUTD
Description
The AD5665R has a common pin for reference input and reference output. When using the internal reference,
this is the reference output pin. When using an external reference, this is the reference input pin. The default
for this pin is as a reference input.
Ground Reference Point for All Circuitry on the Part.
Analog Output Voltage from DAC A. The output amplifier has rail-to-rail operation.
Power Supply Input. The AD5665R can be operated from 2.7 V to 5.5 V, and the supply should be decoupled
with a 10 μF capacitor in parallel with a 0.1 μF capacitor to GND.
Analog Output Voltage from DAC B. The output amplifier has rail-to-rail operation.
Serial Data Line. This is used in conjunction with the SCL line to clock data into or out of the 16-bit input
register. It is a bidirectional, open-drain data line that should be pulled to the supply with an external pull-up
resistor.
Analog Output Voltage from DAC C. The output amplifier has rail-to-rail operation.
Serial Clock Line. This is used in conjunction with the SDA line to clock data into or out of the 16-bit input
register.
Three-State Address Input. Sets the two least significant bits (Bit A1, Bit A0) of the 7-bit slave address
(see Table 9).
Analog Output Voltage from DAC D. The output amplifier has rail-to-rail operation.
Rev. C | Page 12 of 36
Data Sheet
AD5625R/AD5645R/AD5665R, AD5625/AD5665
TYPICAL PERFORMANCE CHARACTERISTICS
1.0
10
VDD = VREF = 5V
TA = 25°C
VDD = VREF = 5V
TA = 25°C
0.8
6
0.6
4
0.4
DNL ERROR (LSB)
2
0
–2
–4
0.2
0
–0.2
–0.4
–6
–0.6
–8
–0.8
0
5k 10k 15k 20k 25k 30k 35k 40k 45k 50k 55k 60k 65k
CODE
–1.0
06341-005
–10
0
10k
40k
50k
60k
0.5
VDD = VREF = 5V
TA = 25°C
3
30k
CODE
Figure 12. DNL, AD5665, External Reference
Figure 9. INL, AD5665, External Reference
4
20k
06341-007
INL ERROR (LSB)
8
VDD = VREF = 5V
TA = 25°C
0.4
0.3
DNL ERROR (LSB)
INL ERROR (LSB)
2
1
0
–1
0.2
0.1
0
–0.1
–0.2
–2
–0.3
–3
2500
5000
7500
10000
CODE
12500
15000
–0.5
06341-006
0
0
Figure 10. INL, AD5645R, External Reference
2500
5000
7500
10000
CODE
12500
15000
06341-008
–0.4
–4
Figure 13. DNL, AD5645R, External Reference
1.0
0.20
VDD = VREF = 5V
0.8 TA = 25°C
VDD = VREF = 5V
TA = 25°C
0.15
0.6
0.10
DNL ERROR (LSB)
0.2
0
–0.2
–0.4
0.05
0
–0.05
–0.10
–0.6
–1.0
0
500
1000
1500
2000
2500
CODE
3000
3500
4000
Figure 11. INL, AD5625, External Reference
–0.20
0
500
1000
1500
2000 2500
CODE
3000
3500
Figure 14. DNL, AD5625, External Reference
Rev. C | Page 13 of 36
4000
06341-009
–0.15
–0.8
06341-100
INL ERROR (LSB)
0.4
AD5625R/AD5645R/AD5665R, AD5625/AD5665
Data Sheet
1.0
4
0.4
0
65000
CODE
Figure 15. INL, AD5665R, 2.5 V Internal Reference
06341-013
60000
55000
50000
45000
40000
35000
0
65000
CODE
06341-010
60000
55000
50000
45000
40000
35000
–1.0
30000
–0.8
25000
–8
–10
20000
–0.6
15000
–0.4
–6
10000
–4
30000
–0.2
25000
0
–2
0.2
20000
2
10000
DNL ERROR (LSB)
0.6
0
VDD = 5V
VREFOUT = 2.5V
TA = 25°C
0.8
6
5000
INL ERROR (LSB)
8
15000
VDD = 5V
VREFOUT = 2.5V
TA = 25°C
5000
10
Figure 18. DNL, AD5665R, 2.5 V Internal Reference
4
0.5
VDD = 5V
VREFOUT = 2.5V
TA = 25°C
3
VDD = 5V
VREFOUT = 2.5V
TA = 25°C
0.4
0.3
DNL ERROR (LSB)
INL ERROR (LSB)
2
1
0
–1
0.2
0.1
0
–0.1
–0.2
–2
–0.3
–3
–0.4
16250
15000
13750
11250
12500
8750
10000
7500
6250
5000
3750
2500
1250
0
CODE
06341-014
CODE
–0.5
06341-011
16250
15000
13750
11250
12500
8750
10000
7500
6250
5000
3750
2500
0
1250
–4
Figure 19. DNL, AD5645R, 2.5 V Internal Reference
Figure 16. INL, AD5645R, 2.5 V Internal Reference
1.0
0.20
VDD = 5V
VREFOUT = 2.5V
TA = 25°C
0.8
VDD = 5V
VREFOUT = 2.5V
TA = 25°C
0.15
0.6
DNL ERROR (LSB)
0.2
0
–0.2
0.05
0
–0.05
–0.4
–0.10
–0.6
–1.0
0
500
1000
1500
2000 2500
CODE
3000
3500
4000
–0.20
0
500
1000
1500
2000 2500
CODE
3000
3500
Figure 20. DNL, AD5625R, 2.5 V Internal Reference
Figure 17. INL, AD5625R, 2.5 V Internal Reference
Rev. C | Page 14 of 36
4000
06341-015
–0.15
–0.8
06341-012
INL ERROR (LSB)
0.10
0.4
Data Sheet
AD5625R/AD5645R/AD5665R, AD5625/AD5665
1.0
0.4
0
65000
CODE
Figure 21. INL, AD5665R,1.25 V Internal Reference
06341-019
60000
55000
0
65000
CODE
06341-016
60000
55000
50000
45000
40000
35000
30000
25000
20000
15000
–0.8
–1.0
5000
–8
–10
50000
–0.6
45000
–6
40000
–0.4
35000
–0.2
–4
30000
–2
0.2
25000
0
20000
2
15000
DNL ERROR (LSB)
0.6
4
10000
VDD = 3V
VREFOUT = 1.25V
TA = 25°C
0.8
6
0
INL ERROR (LSB)
8
10000
VDD = 3V
VREFOUT = 1.25V
TA = 25°C
5000
10
Figure 24. DNL, AD5665R,1.25 V Internal Reference
4
0.5
VDD = 3V
VREFOUT = 1.25V
TA = 25°C
3
VDD = 3V
VREFOUT = 1.25V
TA = 25°C
0.4
0.3
DNL ERROR (LSB)
INL ERROR (LSB)
2
1
0
–1
0.2
0.1
0
–0.1
–0.2
–2
–0.3
–3
–0.4
–4
16250
CODE
Figure 22. INL, AD5645R, 1.25 V Internal Reference
06341-020
15000
13750
12500
11250
10000
8750
7500
6250
5000
3750
2500
1250
0
16250
CODE
06341-017
15000
13750
12500
11250
10000
8750
7500
6250
5000
3750
2500
1250
0
–0.5
Figure 25. DNL, AD5645R,1.25 V Internal Reference
0.20
1.0
VDD = 3V
VREFOUT = 1.25V
TA = 25°C
0.8
0.6
VDD = 3V
VREFOUT = 1.25V
TA = 25°C
0.15
DNL ERROR (LSB)
0.2
0
–0.2
0.05
0
–0.05
–0.4
–0.10
–0.6
–1.0
0
500
1000
1500
2000 2500
CODE
3000
3500
4000
Figure 23. INL, AD5625R,1.25 V Internal Reference
–0.20
0
500
1000
1500
2000 2500
CODE
3000
3500
Figure 26. DNL, AD5625R, 1.25 V Internal Reference
Rev. C | Page 15 of 36
4000
06341-021
–0.15
–0.8
06341-018
INL ERROR (LSB)
0.10
0.4
AD5625R/AD5645R/AD5665R, AD5625/AD5665
Data Sheet
8
0
6
VDD = VREF = 5V
VDD = 5V
–0.02
MAX INL
–0.04
GAIN ERROR
4
ERROR (% FSR)
2
MAX DNL
0
MIN DNL
–2
–0.08
–0.10
–0.12
–0.14
–4
FULL-SCALE ERROR
–0.16
MIN INL
–6
–0.18
–20
0
20
40
60
TEMPERATURE (°C)
80
100
–0.20
–40
06341-022
–8
–40
–20
0
20
40
60
TEMPERATURE (°C)
80
100
06341-025
ERROR (LSB)
–0.06
Figure 30. Gain Error and Full-Scale Error vs. Temperature
Figure 27. INL Error and DNL Error vs. Temperature
10
1.5
MAX INL
8
1.0
ZERO-SCALE ERROR
6
0.5
VDD = 5V
TA = 25°C
ERROR (mV)
ERROR (LSB)
4
2
MAX DNL
0
MIN DNL
–2
0
–0.5
–1.0
–4
–1.5
OFFSET ERROR
–6
MIN INL
1.75
2.25
2.75
3.25
VREF (V)
3.75
4.25
4.75
–2.5
–40
Figure 28. INL Error and DNL Error vs. VREF
0
20
40
60
TEMPERATURE (°C)
80
100
Figure 31. Zero-Scale Error and Offset Error vs. Temperature
8
1.0
6
MAX INL
TA = 25°C
0.5
4
ERROR (% FSR)
GAIN ERROR
2
MAX DNL
0
MIN DNL
–2
0
FULL-SCALE ERROR
–0.5
–1.0
–4
MIN INL
–8
2.7
3.2
3.7
4.2
VDD (V)
4.7
5.2
–2.0
2.7
3.2
3.7
4.2
VDD (V)
4.7
5.2
Figure 32. Gain Error and Full-Scale Error vs. Supply
Figure 29. INL Error and DNL Error vs. Supply
Rev. C | Page 16 of 36
06341-027
–1.5
–6
06341-024
ERROR (LSB)
–20
06341-026
1.25
06341-023
–8
–10
0.75
–2.0
Data Sheet
AD5625R/AD5645R/AD5665R, AD5625/AD5665
1.0
2.0
TA = 25°C
1.8 VDD = 5.5V
TA = 25°C
0.5
ZERO-SCALE ERROR
1.6
VREFOUT = 2.5V
1.4
IDD (mA)
ERROR (mV)
0
–0.5
–1.0
1.2
VREFIN = 5V
1.0
0.8
0.6
–1.5
0.4
OFFSET ERROR
3.2
3.7
4.2
VDD (V)
4.7
5.2
0
512
06341-028
–2.5
2.7
0.2
10512
20512
50512
30512
40512
CODE
60512
06341-060
–2.0
Figure 36. Supply Current vs. DAC Code
Figure 33. Zero-Scale Error and Offset Error vs. Supply
30
1.2
VDD = 3.6V
20
0.8
15
0.6
10
0.4
5
0.2
TA = 25°C
0
2.7
3.2
06341-029
0
3.7
4.2
VDD (V)
4.7
06341-061
IDD (mA)
1.0
0.88
0.89
0.90
0.91
0.92
0.93
0.94
0.95
0.96
0.97
0.98
0.99
1.00
1.01
1.02
1.03
1.04
1.05
1.06
1.07
1.08
NUMBER OF DEVICES
VDD = 5.5V
25
5.2
IDD (mA)
Figure 37. Supply Current vs. Supply
Figure 34. IDD Histogram with External Reference
1.2
25
VDD = 3.6V
VDD = 5.5V
0.8
VREFOUT = 1.25V
IDD (mA)
15
VREFOUT = 2.5V
10
VDD = VREF = 3V
0.6
0.4
5
Figure 35. IDD Histogram with Internal Reference
0
–40
–20
0
20
40
60
TEMPERATURE (°C)
80
Figure 38. Supply Current vs. Temperature
Rev. C | Page 17 of 36
100
06341-063
IDD (mA)
06341-030
0
0.2
1.35
1.37
1.39
1.41
1.43
1.45
1.47
1.49
1.51
1.53
1.55
1.57
1.59
1.61
1.63
1.65
1.67
1.69
1.71
1.73
1.75
1.77
1.79
1.81
1.83
1.85
1.87
1.89
1.91
1.93
1.95
1.97
1.99
NUMBER OF DEVICES
VDD = VREF = 5V
1.0
20
AD5625R/AD5645R/AD5665R, AD5625/AD5665
Data Sheet
0.5
0.4
DAC LOADED WITH
FULL-SCALE
SOURCING CURRENT
DAC LOADED WITH
ZERO-SCALE
SINKING CURRENT
ERROR VOLTAGE (V)
0.3
0.2
0.1
VDD = VREF = 5V
TA = 25°C
FULL-SCALE CODE CHANGE
0x0000 TO 0xFFFF
OUTPUT LOADED WITH 2kΩ
AND 200pF TO GND
VDD = 3V
VREFOUT = 1.25V
0
–0.1
–0.2
VOUT = 909mV/DIV
VDD = 5V
VREFOUT = 2.5V
–0.3
1
–8
–6
–4
–2
0
2
CURRENT (mA)
4
6
8
10
06341-048
–0.5
–10
06341-031
–0.4
TIME BASE = 4µs/DIV
Figure 42. Full-Scale Settling Time, 5 V
Figure 39. Headroom at Rails vs. Source and Sink
6
5
VDD = 5V
VREFOUT = 2.5V
TA = 25°C
3/4 SCALE
4
VOUT (V)
VDD = VREF = 5V
TA = 25°C
FULL SCALE
3
MIDSCALE
VDD
2
1
1/4 SCALE
1
MAX(C2)
420.0mV
ZERO SCALE
–20
–10
0
10
CURRENT (mA)
20
VOUT
30
06341-046
–1
–30
2
CH1 2.0V
4
8.0ns/pt
SYNC
VDD = 3V
VREFOUT = 1.25V
TA = 25°C
1
SLCK
FULL SCALE
VOUT (V)
M100µs 125MS/s
A CH1
1.28V
Figure 43. Power-On Reset to 0 V
Figure 40. AD56x5R with 2.5 V Reference, Source and Sink Capability
3
CH2 500mV
06341-049
0
3
3/4 SCALE
2
MIDSCALE
1
1/4 SCALE
VOUT
0
ZERO SCALE
VDD = 5V
–20
–10
0
10
CURRENT (mA)
20
30
Figure 41. AD56x5R with 1.25 V Reference, Source and Sink Capability
Rev. C | Page 18 of 36
CH1 5.0V
CH3 5.0V
CH2 500mV
M400ns
A CH1
Figure 44. Exiting Power-Down to Midscale
1.4V
06341-050
–1
–30
06341-047
2
VDD = VREF = 5V
TA = 25°C
DAC LOADED WITH MIDSCALE
VDD = VREF = 5V
TA = 25°C
5ns/SAMPLE NUMBER
GLITCH IMPULSE = 9.494nV
1LSB CHANGE AROUND
MIDSCALE (0x8000 TO 0x7FFF)
0
50
100
150
200 250 300 350
SAMPLE NUMBER
400
450
512
4s/DIV
Figure 48. 0.1 Hz to 10 Hz Output Noise Plot, External Reference
Figure 45. Digital-to-Analog Glitch Impulse (Negative)
2.498
1
VDD = 5V
VREFOUT = 2.5V
TA = 25°C
DAC LOADED WITH MIDSCALE
VDD = VREF = 5V
TA = 25°C
5ns/SAMPLE NUMBER
ANALOG CROSSTALK = 0.424nV
2.497
06341-051
2µV/DIV
2.538
2.537
2.536
2.535
2.534
2.533
2.532
2.531
2.530
2.529
2.528
2.527
2.526
2.525
2.524
2.523
2.522
2.521
AD5625R/AD5645R/AD5665R, AD5625/AD5665
06341-058
VOUT (V)
Data Sheet
10µV/DIV
VOUT (V)
2.496
2.495
2.494
1
2.493
50
100
150
200 250 300 350
SAMPLE NUMBER
400
450
512
Figure 49. 0.1 Hz to 10 Hz Output Noise Plot, 2.5 V Internal Reference
5µV/DIV
VDD = 3V
VREFOUT = 1.25V
TA = 25°C
DAC LOADED WITH MIDSCALE
VDD = 5V
VREFOUT = 2.5V
TA = 25°C
5ns/SAMPLE NUMBER
ANALOG CROSSTALK = 4.462nV
0
50
100
150
200 250 300 350
SAMPLE NUMBER
400
450
Figure 47. Analog Crosstalk, Internal Reference
512
06341-062
VOUT (V)
Figure 46. Analog Crosstalk, External Reference
2.496
2.494
2.492
2.490
2.488
2.486
2.484
2.482
2.480
2.478
2.476
2.474
2.472
2.470
2.468
2.466
2.464
2.462
2.460
2.458
2.456
5s/DIV
06341-052
0
1
4s/DIV
06341-053
2.491
06341-059
2.492
Figure 50. 0.1 Hz to 10 Hz Output Noise Plot, 1.25 V Internal Reference
Rev. C | Page 19 of 36
AD5625R/AD5645R/AD5665R, AD5625/AD5665
Data Sheet
16
800
TA = 25°C
MIDSCALE LOADED
700
VREF = VDD
TA = 25°C
VDD = 3V
12
500
TIME (µs)
OUTPUT NOISE (nV/√Hz)
14
600
400
10
300
VDD = 5V
8
VDD = 5V
VREFOUT = 2.5V
200
6
1k
10k
FREQUENCY (Hz)
100k
1M
4
06341-054
0
100
0
Figure 51. Noise Spectral Density, Internal Reference
3
4
5
6
7
CAPACITANCE (nF)
5
VDD = 5V
TA = 25°C
DAC LOADED WITH FULL SCALE
VREF = 2V ± 0.3V p-p
8
9
10
VDD = 5V
TA = 25°C
0
–5
BANDWIDTH (dB)
–40
–50
–60
–70
–80
–10
–15
–20
–25
–30
–90
2k
4k
6k
FREQUENCY (Hz)
8k
10k
Figure 52. Total Harmonic Distortion
–40
10k
100k
1M
FREQUENCY (Hz)
Figure 54. Multiplying Bandwidth
Rev. C | Page 20 of 36
10M
06341-057
–35
–100
06341-055
THD (dB)
2
Figure 53. Settling Time vs. Capacitive Load
–20
–30
1
06341-056
VDD = 3V
VREFOUT = 1.25V
100
Data Sheet
AD5625R/AD5645R/AD5665R, AD5625/AD5665
TERMINOLOGY
Relative Accuracy or Integral Nonlinearity (INL)
For the DAC, relative accuracy or integral nonlinearity is a
measurement of the maximum deviation, in LSBs, from a
straight line passing through the endpoints of the DAC
transfer function.
Output Voltage Settling Time
Output voltage settling time is the amount of time it takes for
the output of a DAC to settle to a specified level for a ¼ to ¾
full-scale input change, and it is measured from the rising edge
of the stop condition.
Differential Nonlinearity (DNL)
Differential nonlinearity is the difference between the measured
change and the ideal 1 LSB change between any two adjacent
codes. A specified differential nonlinearity of ±1 LSB maximum
ensures monotonicity. This DAC is guaranteed monotonic
by design.
Digital-to-Analog Glitch Impulse
Digital-to-analog glitch impulse is the impulse injected into the
analog output when the input code in the DAC register changes
state. It is normally specified as the area of the glitch in nV-s
and is measured when the digital input code is changed by
1 LSB at the major carry transition (0x7FFF to 0x8000) (see
Figure 45).
Zero-Code Error
Zero-code error is a measurement of the output error when zero
scale (0x0000) is loaded to the DAC register. Ideally, the output
should be 0 V. The zero-code error is always positive in the
AD5665R because the output of the DAC cannot go below 0 V
due to a combination of the offset errors in the DAC and the output amplifier. Zero-code error is expressed in millivolts (mV).
Full-Scale Error
Full-scale error is a measurement of the output error when fullscale code (0xFFFF) is loaded to the DAC register. Ideally, the
output should be VDD − 1 LSB. Full-scale error is expressed as a
percentage of full-scale range (FSR).
Gain Error
Gain error is a measure of the span error of the DAC. It is the
deviation in slope of the DAC transfer characteristic from ideal
expressed as a percentage of full-scale range (FSR).
Zero-Code Error Drift
Zero-code error drift is a measurement of the change in
zero-code error with a change in temperature. It is expressed in
microvolts per degrees Celsius (µV/°C).
Gain Temperature Coefficient
Gain temperature coefficient is a measurement of the change in
gain error with changes in temperature. It is expressed in parts
per million (ppm) of full-scale range per degrees Celsius
(FSR/°C).
Offset Error
Offset error is a measure of the difference between VOUT (actual)
and VOUT (ideal) expressed in mV in the linear region of the
transfer function. Offset error is measured on the AD5665R
with Code 512 loaded in the DAC register. It can be negative or
positive.
DC Power Supply Rejection Ratio (PSRR)
DC PSRR indicates how the output of the DAC is affected by
changes in the supply voltage. PSRR is the ratio of the change in
VOUT to the change in VDD for full-scale output of the DAC. It is
measured in decibels (dB). VREF is held at 2 V, and VDD is varied
by ±10%.
Digital Feedthrough
Digital feedthrough is a measure of the impulse injected into the
analog output of the DAC from the digital inputs of the DAC
but is measured when the DAC output is not updated. It is
specified in nV-s and is measured with a full-scale code change
on the data bus, that is, from all 0s to all 1s and vice versa.
Reference Feedthrough
Reference feedthrough is the ratio of the amplitude of the signal
at the DAC output to the reference input when the DAC output
is not being updated. It is expressed in decibels (dB).
Output Noise Spectral Density
Output noise spectral density is a measurement of the internally
generated random noise, which is characterized as a spectral
density (nanovolts per square root of hertz frequency (nV/√Hz)).
It is measured by loading the DAC to midscale and measuring
noise at the output. It is measured in nanovolts per square root
of hertz frequency (nV/√Hz). A plot of noise spectral density is
shown in Figure 51.
DC Crosstalk
DC crosstalk is the dc change in the output level of one DAC
in response to a change in the output of another DAC. It is
measured with a full-scale output change on one DAC (or soft
power-down and power-up) while monitoring another DAC
kept at midscale. It is expressed in microvolts (μV).
DC crosstalk due to load current change is a measure of the
impact that a change in load current on one DAC has on
another DAC kept at midscale. It is expressed in microvolts per
milliampere (μV/mA).
Digital Crosstalk
This is the glitch impulse transferred to the output of one DAC
at midscale in response to a full-scale code change (all 0s to all
1s and vice versa) in the input register of another DAC. It is
measured in standalone mode and is expressed in nanovolts per
second (nV-s).
Rev. C | Page 21 of 36
AD5625R/AD5645R/AD5665R, AD5625/AD5665
Analog Crosstalk
Analog crosstalk is the glitch impulse transferred to the output
of one DAC due to a change in the output of another DAC. It is
measured by loading one of the input registers with a full-scale
code change (all 0s to all 1s and vice versa) and then executing
a software LDAC and monitoring the output of the DAC whose
digital code was not changed. The area of the glitch is expressed
in nanovolts per second (nV-s).
DAC-to-DAC Crosstalk
DAC-to-DAC crosstalk is the glitch impulse transferred to the
output of one DAC due to a digital code change and subsequent
analog output change of another DAC. It is measured by
loading the attack channel with a full-scale code change (all 0s
to all 1s and vice versa) with LDAC low while monitoring the
output of the victim channel that is at midscale. The energy of
the glitch is expressed in nanovolts per second (nV-s).
Data Sheet
Multiplying Bandwidth
The multiplying bandwidth is a measure of the finite bandwidth
of the amplifiers within the DAC. A sine wave on the reference
(with full-scale code loaded to the DAC) appears on the output.
The multiplying bandwidth is the frequency at which the output
amplitude falls to 3 dB below the input.
Total Harmonic Distortion (THD)
THD is the difference between an ideal sine wave and its
attenuated version using the DAC. The sine wave is used as the
reference for the DAC, and the THD is a measurement of the
harmonics present on the DAC output. It is measured in
decibels (dB).
Rev. C | Page 22 of 36
Data Sheet
AD5625R/AD5645R/AD5665R, AD5625/AD5665
THEORY OF OPERATION
DIGITAL-TO-ANALOG CONVERTER (DAC)
RESISTOR STRING
The AD56x5R/AD56x5 DACs are fabricated on a CMOS
process. The AD56x5 does not have an internal reference, and
the DAC architecture is shown in Figure 55. The AD56x5R does
have an internal reference and can be configured for use with
either an internal or external reference (see Figure 55 and
Figure 56).
The resistor string is shown in Figure 57. It is simply a string of
resistors, each of value R. The code loaded to the DAC register
determines at which node on the string the voltage is tapped off
to be fed into the output amplifier. The voltage is tapped off by
closing one of the switches connecting the string to the amplifier.
Because it is a string of resistors, it is guaranteed monotonic.
Because the input coding to the DAC is straight binary, the ideal
output voltage when using an external reference is given by
OUTPUT AMPLIFIER
D
VOUT  VREFIN   N 
2 
VREFIN/VREFOUT
REF
BUFFER
REF (+)
DAC
REGISTER
The output buffer amplifier can generate rail-to-rail voltages on its
output, which gives an output range of 0 V to VDD. It can drive a
load of 2 kΩ in parallel with 1000 pF to GND. The source and
sink capabilities of the output amplifier are shown in Figure 39
and Figure 40. The slew rate is 1.8 V/μs with a ¼ to ¾ full-scale
settling time of 7 μs.
OUTPUT
AMPLIFIER
GAIN = ×2
RESISTOR
STRING
R
VOUT
R
REF (–)
TO OUTPUT
AMPLIFIER
06341-034
R
GND
Figure 55. Internal Configuration When Using an External Reference
R
The ideal output voltage when using the internal reference is
given by
R
06341-033
D
VOUT  2  V REFOUT   N 
2 
where:
D is the decimal equivalent of the binary code that is loaded to
the DAC register, as follows:
0 to 4095 for AD5625R/AD5625 (12-bit).
0 to 16,383 for AD5645R (14-bit).
0 to 65,535 for AD5665R/AD5665 (16-bit).
N is the DAC resolution.
VREFIN/VREFOUT
1.25V INTERNAL
REFERENCE 1
REF (+)
DAC
REGISTER
RESISTOR
STRING
OUTPUT
AMPLIFIER
GAIN = ×2
VOUT
1CAN
BE OVERDRIVEN
BY VREFIN/VREFOUT .
GND
06341-035
REF (–)
Figure 56. Internal Configuration When Using the Internal Reference
Figure 57. Resistor String
INTERNAL REFERENCE
The AD5625R/AD5645R/AD5665R feature an on-chip reference.
Versions without the R suffix require an external reference. The
on-chip reference is off at power-up and is enabled via a write to a
control register. See the Internal Reference Setup section for details.
Versions packaged in a 10-lead LFCSP have a 1.25 V reference
or a 2.5 V reference, giving a full-scale output of 2.5 V or 5 V,
depending on the model selected (see the Ordering Guide). The
WLCSP package has an internal reference of 1.25 V. These parts
can be operated with a VDD supply of 2.7 V to 5.5 V. Versions
packaged in a 14-lead TSSOP have a 2.5 V reference, giving a
full-scale output of 5 V. Parts are functional with a VDD supply
of 2.7 V to 5.5 V, but with a VDD supply of less than 5 V, the
output is clamped to VDD. See the Ordering Guide for a full list
of models. The internal reference associated with each part is
available at the VREFOUT pin (available on R suffix versions only).
A buffer is required if the reference output is used to drive
external loads. When using the internal reference, it is recommended that a 100 nF capacitor be placed between the reference
output and GND for reference stability.
Rev. C | Page 23 of 36
AD5625R/AD5645R/AD5665R, AD5625/AD5665
Data Sheet
EXTERNAL REFERENCE
The 2-wire serial bus protocol operates as follows:
The VREFIN pin on the AD56x5R allows the use of an external
reference if the application requires it. The default condition of
the on-chip reference is off at power-up. All devices can be
operated from a single 2.7 V to 5.5 V supply.
1.
SERIAL INTERFACE
The AD56x5R/AD56x5 have 2-wire I2C-compatible serial interfaces. The AD56x5R/AD56x5 can be connected to an I2C bus as
a slave device, under the control of a master device. See Figure 3
for a timing diagram of a typical write sequence.
The AD56x5R/AD56x5 support standard (100 kHz), fast
(400 kHz), and high speed (3.4 MHz) data transfer modes.
High speed operation is only available on selected models. See
the Ordering Guide for a full list of models. Support is not
provided for 10-bit addressing and general call addressing.
The AD56x5R/AD56x5 each has a 7-bit slave address. The
10-lead and 12-ball versions of the part have a slave address
whose five MSBs are 00011, and the two LSBs are set by the
state of the ADDR address pin, which determines the state of
the A0 and A1 address bits. The 14-lead versions of the part
have a slave address whose three MSBs are 001, and the four
LSBs are set by the ADDR1 and ADDR2 address pins, which
determine the state of the A0 and A1 and A2 and A3 address
bits, respectively.
The facility to make hardwired changes to the ADDR pin allows
the user to incorporate up to three of these devices on one bus,
as outlined in Table 9.
Table 9. ADDR Pin Settings (10-Lead and 12-Ball Packages)
ADDR Pin Connection
VDD
NC
GND
A1
0
1
1
A0
0
0
1
The facility to make hardwired changes to the ADDR1 and the
ADDR2 pins allows the user to incorporate up to nine of these
devices on one bus, as outlined in Table 10.
Table 10. ADDR1, ADDR2 Pin Settings (14-Lead Package)
ADDR2 Pin
Connection
VDD
VDD
VDD
NC
NC
NC
GND
GND
GND
ADDR1 Pin
Connection
VDD
NC
GND
VDD
NC
GND
VDD
NC
GND
A3
0
0
0
1
1
1
1
1
1
A2
0
0
0
0
0
0
1
1
1
A1
0
1
1
0
1
1
0
1
1
A0
0
0
1
0
0
1
0
0
1
2.
3.
The master initiates data transfer by establishing a start
condition when a high-to-low transition on the SDA line
occurs while SCL is high. The following byte is the address
byte, which consists of the 7-bit slave address. The slave
address corresponding to the transmitted address responds
by pulling SDA low during the ninth clock pulse (this is
termed the acknowledge bit). At this stage, all other devices
on the bus remain idle while the selected device waits for
data to be written to or read from its shift register.
Data is transmitted over the serial bus in sequences of nine
clock pulses (eight data bits followed by an acknowledge
bit). The transitions on the SDA line must occur during the
low period of SCL and remain stable during the high
period of SCL.
When all data bits have been read or written, a stop
condition is established. In write mode, the master pulls
the SDA line high during the 10th clock pulse to establish a
stop condition. In read mode, the master issues a no
acknowledge for the ninth clock pulse (that is, the SDA line
remains high). The master brings the SDA line low before
the 10th clock pulse, and then high during the 10th clock
pulse to establish a stop condition.
WRITE OPERATION
When writing to the AD56x5R/AD56x5, the user must begin
with a start command followed by an address byte (R/W = 0),
after which the DAC acknowledges that it is prepared to receive
data by pulling SDA low. The AD5665 requires two bytes of
data for the DAC and a command byte that controls various
DAC functions. Three bytes of data must, therefore, be written
to the DAC, the command byte followed by the most significant
data byte and the least significant data byte, as shown in Figure 58
and Figure 59. After these data bytes are acknowledged by the
AD56x5R/AD56x5, a stop condition follows.
READ OPERATION
When reading data back from the AD56x5R/AD56x5, the
user begins with a start command followed by an address byte
(R/W = 1), after which the DAC acknowledges that it is prepared
to transmit data by pulling SDA low. Two bytes of data are then
read from the DAC, which are both acknowledged by the master
as shown in Figure 60 and Figure 61. A stop condition follows.
Rev. C | Page 24 of 36
Data Sheet
AD5625R/AD5645R/AD5665R, AD5625/AD5665
1
9
1
9
SCL
0
SDA
0
0
1
1
A1
A0
R/W
DB23
DB22 DB21 DB20 DB19 DB18
DB17
DB16
ACK. BY
AD56x5
START BY
MASTER
ACK. BY
AD56x5
FRAME 2
COMMAND BYTE
FRAME 1
SLAVE ADDRESS
1
9
1
9
SCL
(CONTINUED)
DB15 DB14
DB13 DB12
DB11 DB10
DB9
DB7
DB8
DB6
DB5
ACK. BY
AD56x5
FRAME 3
MOST SIGNIFICANT
DATA BYTE
DB4
DB3
DB2
DB1
DB0
ACK. BY STOP BY
AD56x5 MASTER
FRAME 4
LEAST SIGNIFICANT
DATA BYTE
06341-103
SDA
(CONTINUED)
Figure 58. I2C Write Operation (10-Lead and 12-Ball Packages)
1
9
1
9
SCL
0
0
SDA
1
A3
A2
A1
A0
R/W
DB23
DB22 DB21 DB20 DB19 DB18
DB17
DB16
ACK. BY
AD56x5
START BY
MASTER
ACK. BY
AD56x5
FRAME 1
SLAVE ADDRESS
FRAME 2
COMMAND BYTE
1
9
1
9
SCL
(CONTINUED)
DB15 DB14
DB13 DB12
DB11 DB10
DB9
DB7
DB8
DB6
DB5
ACK. BY
AD56x5
FRAME 3
MOST SIGNIFICANT
DATA BYTE
DB4
DB3
DB2
DB1
DB0
ACK. BY STOP BY
AD56x5 MASTER
FRAME 4
LEAST SIGNIFICANT
DATA BYTE
06341-104
SDA
(CONTINUED)
Figure 59. I2C Write Operation (14-Lead Package)
1
9
1
9
SCL
0
SDA
0
0
1
1
A1
A0
DB23
R/W
DB22 DB21 DB20 DB19 DB18
DB17
ACK. BY
AD56x5
START BY
MASTER
DB16
ACK. BY
MASTER
FRAME 1
SLAVE ADDRESS
FRAME 2
COMMAND BYTE
1
9
1
9
SCL
(CONTINUED)
DB15 DB14
DB13 DB12
DB11 DB10
FRAME 3
MOST SIGNIFICANT
DATA BYTE
DB9
DB8
DB7
ACK. BY
MASTER
DB6
DB5
DB4
DB2
FRAME 4
LEAST SIGNIFICANT
DATA BYTE
Figure 60. I2C Read Operation (10-Lead and 12-Ball Packages)
Rev. C | Page 25 of 36
DB3
DB1
DB0
NO ACK. STOP BY
MASTER
06341-101
SDA
(CONTINUED)
AD5625R/AD5645R/AD5665R, AD5625/AD5665
1
9
Data Sheet
1
9
SCL
0
SDA
0
1
A3
A2
A1
R/W
A0
DB23
DB22 DB21 DB20 DB19 DB18
DB17
ACK. BY
AD56x5
START BY
MASTER
DB16
ACK. BY
MASTER
FRAME 1
SLAVE ADDRESS
FRAME 2
COMMAND BYTE
1
9
1
9
SCL
(CONTINUED)
DB15 DB14
DB13 DB12
DB11 DB10
DB9
DB7
DB8
DB6
DB5
DB4
ACK. BY
MASTER
FRAME 3
MOST SIGNIFICANT
DATA BYTE
DB3
DB2
DB1
DB0
NO ACK. STOP BY
MASTER
FRAME 4
LEAST SIGNIFICANT
DATA BYTE
06341-102
SDA
(CONTINUED)
Figure 61. I2C Read Operation (14-Lead Package)
FAST MODE
HIGH-SPEED MODE
1
9
1
9
SCL
0
START BY
MASTER
0
0
0
1
X
X
X
0
NO ACK.
0
1
A3
A2
A1
A0
SR
R/W
ACK. BY
AD56x5
HS-MODE
MASTER CODE
SERIAL BUS
ADDRESS BYTE
06341-105
SDA
Figure 62. Placing the AD56x5RBRUZ-2/AD56x5RBRUZ-2REEL7 in High Speed Mode
HIGH SPEED MODE
INPUT SHIFT REGISTER
Some models offer high speed serial communication with a
clock frequency of 3.4 MHz. See the Ordering Guide for a full
list of models.
The input shift register is 24 bits wide. Data is loaded into the
device as a 24-bit word under the control of a serial clock
input, SCL. The timing diagram for this operation is shown in
Figure 3. The eight MSBs make up the command byte. DB23
is reserved and should always be set to 0 when writing to the
device. DB22 (S) is used to select multiple byte operation.
The next three bits are the command bits (C2, C1, and C0)
that control the mode of operation of the device. See Table 11
for details. The last three bits of the first byte are the address bits
(A2, A1, and A0). See Table 12 for details. The rest of the bits
are the 16-/14-/12-bit data-word. The data-word comprises the
16-/14-/12-bit input code followed by two or four don’t care bits
for the AD5645R and the AD5625R/AD5625, respectively (see
Figure 65 through Figure 67).
High speed mode communication commences after the master
addresses all devices connected to the bus with the Master Code
00001XXX to indicate that a high speed mode transfer is to
begin. No device connected to the bus is permitted to acknowledge the high speed master code; therefore, the code is followed
by a no acknowledge. Next, the master must issue a repeated
start followed by the device address. The selected device then
acknowledges its address. All devices continue to operate in
high speed mode until the master issues a stop condition. When
the stop condition is issued, the devices return to standard/fast
mode. The part also returns to standard/fast mode when CLR is
activated while the part is in high speed mode.
MULTIPLE BYTE OPERATION
Multiple byte operation is supported on the AD56x5R/AD56x5.
A 2-byte operation is useful for applications that require fast
DAC updating and do not need to change the command byte.
The S bit (DB22) in the command register can be set to 1 for
2-byte mode of operation (see Figure 64). For standard 3-byte
and 4-byte operation, the S bit (DB22) in the command byte
should be set to 0 (see Figure 63).
Rev. C | Page 26 of 36
AD5625R/AD5645R/AD5665R, AD5625/AD5665
BLOCK 1
BLOCK n
BLOCK 2
S=0
S=0
S=0
SLAVE
COMMAND MOST SIGNIFICANT LEAST SIGNIFICANT COMMAND MOST SIGNIFICANT LEAST SIGNIFICANT
ADDRESS
BYTE
DATA BYTE
DATA BYTE
BYTE
DATA BYTE
DATA BYTE
COMMAND MOST SIGNIFICANT LEAST SIGNIFICANT STOP
BYTE
DATA BYTE
DATA BYTE
Figure 63. Multiple Block Write with Command Byte in Each Block (S = 0)
S=1
S=1
MOST SIGNIFICANT LEAST SIGNIFICANT STOP
DATA BYTE
DATA BYTE
COMMAND MOST SIGNIFICANT LEAST SIGNIFICANT MOST SIGNIFICANT LEAST SIGNIFICANT
SLAVE
DATA BYTE
DATA BYTE
DATA BYTE
DATA BYTE
BYTE
ADDRESS
06341-106
BLOCK n
BLOCK 2
BLOCK 1
S=1
Figure 64. Multiple Block Write with Initial Command Byte Only (S = 1)
S
BYTE
SELECTION
C2
C1
C0
COMMAND
A2
A1
A0
D15
D14
D13
DAC ADDRESS
COMMAND BYTE
D12
D11
D10
DB9
DB8
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
DAC DATA
DAC DATA
DATA HIGH BYTE
DATA LOW BYTE
06341-108
R
RESERVED
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10
Figure 65. AD5665R/AD5665 Input Shift Register (16-Bit DAC)
S
BYTE
SELECTION
C2
C1
C0
COMMAND
A2
A1
A0
D13
D12
D11
DAC ADDRESS
COMMAND BYTE
D10
D9
D8
DB9
DB8
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
D7
D6
D5
D4
D3
D2
D1
D0
X
X
DAC DATA
DAC DATA
DATA HIGH BYTE
DATA LOW BYTE
06341-109
R
RESERVED
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10
R
S
RESERVED
BYTE
SELECTION
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10
C2
C1
C0
COMMAND
COMMAND BYTE
A2
A1
A0
DAC ADDRESS
D11
D10
D9
D8
D7
D6
DB9
DB8
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
D5
D4
D3
D2
D1
D0
X
X
X
X
DAC DATA
DAC DATA
DATA HIGH BYTE
DATA LOW BYTE
Figure 67. AD5625R/AD5625 Input Shift Register (12-Bit DAC)
Rev. C | Page 27 of 36
06341-110
Figure 66. AD5645R Input Shift Register (14-Bit DAC)
06341-107
Data Sheet
AD5625R/AD5645R/AD5665R, AD5625/AD5665
Data Sheet
BROADCAST MODE
LDAC FUNCTION
Broadcast addressing is supported on the AD56x5R/AD56x5
in write mode only. Broadcast addressing can be used to synchronously update or power down multiple AD56x5R/AD56x5
devices. When the broadcast address is used, the AD56x5R/
AD56x5 respond regardless of the states of the address pins.
The AD56x5R/AD56x5 broadcast address is 00010000.
The AD56x5R/AD56x5 DACs have double-buffered interfaces
consisting of two banks of registers: input registers and DAC
registers. The input registers are connected directly to the input
shift register, and the digital code is transferred to the relevant
input register upon completion of a valid write sequence. The
DAC registers contain the digital code used by the resistor strings.
Table 11. Command Definition
Access to the DAC registers is controlled by the LDAC pin.
When the LDAC pin is high, the DAC registers are latched
and the input registers can change state without affecting the
contents of the DAC registers. When LDAC is brought low,
however, the DAC registers become transparent and the contents of
the input registers are transferred to them. The double-buffered
interface is useful if the user requires simultaneous updating of
all DAC outputs. The user can write to one of the input registers
individually and then, by bringing LDAC low when writing to
the other DAC input register, all outputs update simultaneously.
C2
0
0
0
C1
0
0
1
C0
0
1
0
0
1
1
1
1
1
0
0
1
1
1
0
1
0
1
Command
Write to input Register n
Update DAC Register n
Write to input Register n, update all
(software LDAC)
Write to and update DAC Channel n
Power up/power down
Reset
LDAC register setup
Internal reference setup (on/off )
Table 12. DAC Address Command
A2
0
0
0
0
1
A1
0
0
1
1
1
A0
0
1
0
1
1
ADDRESS (n)
DAC A
DAC B
DAC C
DAC D
All DACs
These parts each contain an extra feature whereby a DAC register
is not updated unless its input register has been updated since
the last time LDAC was brought low. Normally, when LDAC is
brought low, the DAC registers are filled with the contents of the
input registers. In the case of the AD56x5R/AD56x5, the DAC
register updates only if the input register has changed since the
last time the DAC register was updated, thereby removing
unnecessary digital crosstalk.
The outputs of all DACs can be simultaneously updated, using
the hardware LDAC pin.
.
Rev. C | Page 28 of 36
Data Sheet
AD5625R/AD5645R/AD5665R, AD5625/AD5665
Synchronous LDAC
Table 13. LDAC Register Mode of Operation on the 10-Lead
LFCSP (Load DAC Register)
The DAC registers are updated after new data is read in. LDAC
can be permanently low or pulsed.
LDAC Bits
(DB3 to DB0)
0
Asynchronous LDAC
The outputs are not updated at the same time that the input
registers are written to. When LDAC goes low, the DAC
registers are updated with the contents of the input register.
1
The LDAC register gives the user full flexibility and control over
the hardware LDAC pin (and software LDAC on the 10-lead
parts that do not have the hardware LDAC pin—see Table 13).
This register allows the user to select which combination of
channels to simultaneously update when the hardware LDAC
pin is executed. Setting the LDAC bit register to 0 for a DAC
channel means that the update of this channel is controlled by
the LDAC pin. If this bit is set to 1, this channel synchronously
updates; that is, the DAC register is updated after new data is
read in, regardless of the state of the LDAC pin. The device
effectively sees the LDAC pin as being pulled low. See Table 14
for the LDAC register mode of operation. This flexibility is
useful in applications when the user wants to simultaneously
update select channels while the rest of the channels are
synchronously updating.
LDAC Mode of Operation
Normal operation (default), DAC register
update is controlled by the write command.
The DAC registers are updated after new data
is read in.
Table 14. LDAC Register Mode of Operation on the 14-Lead
TSSOP (Load DAC Register)
LDAC Bits
(DB3 to DB0)
0
1
LDAC Pin
LDAC Operation
1/0
Determined by the LDAC pin.
x = don’t
care
The DAC registers are updated
after new data is read in.
S
C2
C1
C0
A2
A1
A0
0
X
1
1
0
A2
A1
A0
DON’T
CARE
COMMAND
DAC ADDRESS
(DON’T CARE)
DB15 DB14 DB13 DB12 DB11 DB10
X
X
X
X
X
X
DB9
DB8
DB7
DB6
DB5
DB4
X
X
X
X
X
X
DON’T CARE
Figure 68. LDAC Setup Command
Rev. C | Page 29 of 36
DON’T CARE
DB3
DB2
DB1
DB0
DAC D DAC C DAC B DAC A
DAC SELECT
(0 = LDAC PIN ENABLED)
06341-115
R
RESERVED
Writing to the DAC using Command 110 loads the 4-bit LDAC
register [DB3:DB0]. The default for each channel is 0; that is,
the LDAC pin works normally. Setting the bits to 1 means that
the DAC register is updated, regardless of the state of the LDAC
pin. See Figure 68 for the contents of the input shift register
during the LDAC register setup command.
AD5625R/AD5645R/AD5665R, AD5625/AD5665
Data Sheet
POWER-DOWN MODES
Table 15. Modes of Operation for the AD56x5R/AD56x5
Command 100 is reserved for the power-up/power-down
function. The power-up/power-down modes are programmed
by setting Bit DB5 and Bit DB4. This defines the output state of
the DAC amplifier, as shown in Table 15. Bit DB3 to Bit DB0
determine to which DAC or DACs the power-up/power-down
command is applied. Setting one of these bits to 1 applies the
power-up/power-down state defined by DB5 and DB4 to the
corresponding DAC. If a bit is 0, the state of the DAC is
unchanged. Figure 70 shows the contents of the input shift
register for the power-up/power-down command.
DB5
0
DB4
0
0
1
1
1
0
1
C2
C1
C0
A2
A1
A0
X
1
0
0
A2
A1
A0
Figure 69. Output Stage During Power-Down
The bias generator, output amplifier, resistor string, and other
associated linear circuitry are shut down when power-down
mode is activated. However, the contents of the DAC register
are unaffected when in power-down. The time to exit powerdown is typically 4 μs for VDD = 5 V or VDD = 3 V.
RESERVED
DON’T
CARE
COMMAND
DAC ADDRESS
(DON’T CARE)
DB15 DB14 DB13 DB12 DB11 DB10
X
X
X
RESISTOR
NETWORK
X
X
X
DB9
DB8
DB7
DB6
DB5
DB4
X
X
X
X
PD1
PD0
DON’T CARE
Figure 70. Power-Up/Power-Down Command
Rev. C | Page 30 of 36
POWERDON’T CARE DOWN
MODE
DB3
DB2
DB1
DB0
DAC D DAC C DAC B DAC A
DAC SELECT
(1 = DAC SELECTED)
06341-116
S
VOUT
POWER-DOWN
CIRCUITRY
Note that the 14-lead TSSOP models offer the power-down
function when the part is operated with a VDD of 3.6 V to 5.5 V.
The 10-lead LFCSP models offer the power-down function
when the part is powered with a VDD of 2.7 V to 5.5 V.
0
AMPLIFIER
06341-038
RESISTOR
STRING DAC
When Bit DB5 and Bit DB4 are set to 0, the part works normally
with its normal power consumption of 1 mA at 5 V. However,
for the three power-down modes, the supply current falls to
480 nA at 5 V. Not only does the supply current fall, but the
output stage is also internally switched from the output of the
amplifier to a resistor network of known values. This allows the
output impedance of the part to be known while the part is in
power-down mode. The outputs can either be connected
internally to GND through a 1 kΩ or 100 kΩ resistor or be left
open-circuited (three-state) as shown in Figure 67.
R
Operating Mode
Normal operation
Power-down modes
1 kΩ pull-down resistor to GND
100 kΩ pull-down resistor to GND
Three-state, high impedance
Data Sheet
AD5625R/AD5645R/AD5665R, AD5625/AD5665
POWER-ON RESET AND SOFTWARE RESET
Table 16. Software Reset Modes for the AD56x5R/AD56x5
The AD56x5R/AD56x5 contain a power-on reset circuit that
controls the output voltage during power-up. The 10-lead
version of the device powers up to 0 V. The 14-lead version has
a power-on reset (POR) pin that allows the output voltage to
be selected. By connecting the POR pin to GND, the AD56x5R/
AD56x5 output powers up to 0 V; by connecting the POR pin to
VDD, the AD56x5R/AD56x5 output powers up to midscale. The
output remains powered up at this level until a valid write sequence
is made to the DAC. This is useful in applications where it is
important to know the state of the output of the DAC while it is
in the process of powering up.
DB0
0
1 (Power-On Reset)
INTERNAL REFERENCE SETUP (R VERSIONS)
The on-chip reference is off at power-up by default. It can be
turned on by sending the reference setup command (111) and
setting DB0 in the input shift register. Table 17 shows how the
state of the bit corresponds to the mode of operation.
Any events on LDAC or CLR during power-on reset are ignored.
There is also a software reset function. Command 101 is the
software reset command. The software reset command contains
two reset modes that are software programmable by setting bit
DB0 in the input shift register.
Table 17. Reference Setup Command
C2
C1
C0
A2
A1
A0
X
1
0
1
X
X
X
RESERVED
DON’T
CARE
DB15 DB14 DB13 DB12 DB11 DB10
X
X
X
DAC ADDRESS
(DON’T CARE)
COMMAND
X
X
DB9
DB8
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
X
X
X
X
X
X
X
X
X
RST
X
DON’T CARE
RESET
MODE
S
0
Action
Internal reference off (default)
Internal reference on
DON’T CARE
06341-113
DB0
0
1
Table 16 shows how the state of the bit corresponds to the
software reset modes of operation of the devices. Figure 71
shows the contents of the input shift register during the
software reset mode of operation.
X
Registers Reset to Zero
DAC register
Input shift register
DAC register
Input shift register
LDAC register
Power-down register
Internal reference setup register
C2
C1
C0
A2
A1
A0
X
1
1
1
X
X
X
DON’T
CARE
COMMAND
DAC ADDRESS
(DON’T CARE)
DB15 DB14 DB13 DB12 DB11 DB10
X
X
X
X
X
X
DB9
DB8
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
X
X
X
X
X
X
X
X
X
REF
DON’T CARE
Figure 72. Reference Setup Command
Rev. C | Page 31 of 36
DON’T CARE
06341-114
S
0
REFERENCE
MODE
R
RESERVED
Figure 71. Reset Command
AD5625R/AD5645R/AD5665R, AD5625/AD5665
Data Sheet
APPLICATIONS INFORMATION
R2 = 10kΩ
USING A REFERENCE AS A POWER SUPPLY FOR
THE AD56x5R/AD56x5
+5V
1 mA + (5 V/5 kΩ) = 2 mA
15V
5V
VDD
SCL
SDA
AD5625R/
AD5645R/
AD5665R/
AD5625/
AD5665
VOUT = 0V TO 5V
GND
06341-043
2-WIRE
SERIAL
INTERFACE
VOUT
VDD
+5V
10µF
0.1µF
VO
±5V
AD5625R/
AD5645R/
AD5665R/
AD5625/
AD5665
GND SCL
–5V
SDA
2-WIRE
SERIAL
INTERFACE
Figure 74. Bipolar Operation with the AD56x5R/AD56x5
POWER SUPPLY BYPASSING AND GROUNDING
The load regulation of the REF195 is typically 2 ppm/mA,
resulting in a 4 ppm (20 µV) error for the 2 mA current drawn
from it. This corresponds to a 0.263 LSB error.
REF195
AD820/
OP295
06341-044
Because the supply current required by the AD56x5R/AD56x5 is
extremely low, an alternative option is to use a voltage reference
to supply the required voltage to the part (see Figure 73). This is
especially useful if the power supply is noisy or if the system
supply voltages are at some value other than 5 V or 3 V, for
example, 15 V. The voltage reference outputs a steady supply
voltage for the AD56x5R/AD56x5. If the low dropout REF195 is
used, it must supply 450 µA of current to the AD56x5R/AD56x5
with no load on the output of the DAC. When the DAC output
is loaded, the REF195 also must supply the current to the load.
The total current required (with a 5 kΩ load on the DAC
output) is
R1 = 10kΩ
Figure 73. REF195 as Power Supply to the AD56x5R/AD56x5
BIPOLAR OPERATION USING THE
AD56x5R/AD56x5
The AD56x5R/AD56x5 have been designed for single-supply
operation, but a bipolar output range is also possible using the
circuit shown in Figure 74. The circuit gives an output voltage
range of ±5 V. Rail-to-rail operation at the amplifier output is
achievable using an AD820 or an OP295 as the output amplifier.
The output voltage for any input code can be calculated as follows:

 D   R1 + R2 
 R2 
VO = VDD × 
×
 − VDD × 

R1
65
,
536


 R1 



where D represents the input code in decimal (0 to 65,535).
If VDD = 5 V, R1 = R2 = 10 kΩ,
 10 × D 
VO = 
−5 V
 65,536 
When accuracy is important in a circuit, it is helpful to carefully
consider the power supply and ground return layout on the board.
The printed circuit board containing the AD56x5R/AD56x5
should have separate analog and digital sections, each having its
own area of the board. If the AD56x5R/AD56x5 are in a system
where other devices require an AGND-to-DGND connection,
the connection should be made at one point only. This ground
point should be as close as possible to the AD56x5R/AD56x5.
The power supply to the AD56x5R/AD56x5 should be bypassed
with 10 µF and 0.1 µF capacitors. The capacitors should be
located as close as possible to the device, with the 0.1 µF capacitor ideally right up against the device. The 10 µF capacitor is
the tantalum bead type. It is important that the 0.1 µF capacitor
have low effective series resistance (ESR) and low effective
series inductance (ESI), for example, common ceramic types of
capacitors. This 0.1 µF capacitor provides a low impedance path
to ground for high frequencies caused by transient currents due
to internal logic switching.
The power supply line itself should have as large a trace as
possible to provide a low impedance path and to reduce glitch
effects on the supply line. Clocks and other fast switching
digital signals should be shielded from other parts of the board
by digital ground. Avoid crossover of digital and analog signals
if possible. When traces cross on opposite sides of the board,
ensure that they run at right angles to each other to reduce
feedthrough effects through the board. The best board layout
technique is the microstrip technique where the component
side of the board is dedicated to the ground plane only, and the
signal traces are placed on the solder side. However, this is not
always possible with a 2-layer board.
This is an output voltage range of ±5 V, with 0x0000 corresponding to a −5 V output and 0xFFFF corresponding to a
+5 V output.
Rev. C | Page 32 of 36
Data Sheet
AD5625R/AD5645R/AD5665R, AD5625/AD5665
OUTLINE DIMENSIONS
2.48
2.38
2.23
3.10
3.00 SQ
2.90
0.50 BSC
10
6
1.74
1.64
1.49
EXPOSED
PAD
0.50
0.40
0.30
BOTTOM VIEW
0.80
0.75
0.70
SEATING
PLANE
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.30
0.25
0.20
0.20 MIN
1
5
TOP VIEW
PIN 1
INDICATOR
(R 0.15)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
02-05-2013-C
PIN 1 INDEX
AREA
0.20 REF
Figure 75. 10-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 3 mm Body, Very Very Thin, Dual Lead
(CP-10-9)
Dimensions shown in millimeters
5.10
5.00
4.90
14
8
4.50
4.40
4.30
6.40
BSC
1
7
PIN 1
0.65 BSC
1.20
MAX
0.15
0.05
COPLANARITY
0.10
0.30
0.19
0.20
0.09
SEATING
PLANE
8°
0°
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
Figure 76. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimensions shown in millimeters
Rev. C | Page 33 of 36
0.75
0.60
0.45
061908-A
1.05
1.00
0.80
AD5625R/AD5645R/AD5665R, AD5625/AD5665
Data Sheet
1.705
1.665
1.625
BOTTOM VIEW
(BALL SIDE UP)
3
2
1
A
BALL A1
IDENTIFIER
2.285
2.245
2.205
1.50
REF
B
C
D
0.50
BSC
TOP VIEW
(BALL SIDE DOWN)
SEATING
PLANE
0.380
0.355
0.330
END VIEW
1.00
REF
COPLANARITY
0.05
0.340
0.320
0.300
0.270
0.240
0.210
Figure 77. 12-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-12-9)
Dimensions shown in millimeters
Rev. C | Page 34 of 36
08-31-2012-A
0.650
0.595
0.540
Data Sheet
AD5625R/AD5645R/AD5665R, AD5625/AD5665
ORDERING GUIDE
Model 1
AD5625BCPZ-R2
AD5625BCPZ-REEL7
AD5625BRUZ
AD5625BRUZ-REEL7
AD5625RBCPZ-R2
AD5625RBCPZ-REEL7
AD5625RACPZ-REEL7
AD5625RACPZ-1RL7
AD5625RBRUZ-1
AD5625RBRUZ-1REEL7
AD5625RBRUZ-2
AD5625RBRUZ-2REEL7
AD5645RBCPZ-R2
AD5645RBCPZ-REEL7
AD5645RBRUZ
AD5645RBRUZ-REEL7
AD5665BCPZ-R2
AD5665BCPZ-REEL7
AD5665BRUZ
AD5665BRUZ-REEL7
AD5665RBCBZ-1-RL7
AD5665RBCPZ-R2
AD5665RBCPZ-REEL7
AD5665RBRUZ-1
AD5665RBRUZ-1REEL7
AD5665RBRUZ-2
AD5665RBRUZ-2REEL7
EVAL-AD5665REBZ1
Temperature
Range
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
Accuracy
±1 LSB INL
±1 LSB INL
±1 LSB INL
±1 LSB INL
±1 LSB INL
±1 LSB INL
±4 LSB INL
±4 LSB INL
±1 LSB INL
±1 LSB INL
±1 LSB INL
±1 LSB INL
±4 LSB INL
±4 LSB INL
±4 LSB INL
±4 LSB INL
±16 LSB INL
±16 LSB INL
±16 LSB INL
±16 LSB INL
±16 LSB INL
±16 LSB INL
±16 LSB INL
±16 LSB INL
±16 LSB INL
±16 LSB INL
±16 LSB INL
On-Chip
Reference
None
None
None
None
1.25 V
1.25 V
1.25 V
2.5 V
2.5 V
2.5 V
2.5 V
2.5 V
1.25 V
1.25 V
2.5 V
2.5 V
None
None
None
None
1.25 V
1.25 V
1.25 V
2.5 V
2.5 V
2.5 V
2.5 V
Maximum
I2C Speed
400 kHz
400 kHz
400 kHz
400 kHz
400 kHz
400 kHz
400 kHz
400 kHz
400 kHz
400 kHz
3.4 MHz
3.4 MHz
400 kHz
400 kHz
400 kHz
400 kHz
400 kHz
400 kHz
400 kHz
400 kHz
400 kHz
400 kHz
400 kHz
400 kHz
400 kHz
3.4 MHz
3.4 MHz
EVAL-AD5665REBZ2
1
Z = RoHS Compliant Part.
Rev. C | Page 35 of 36
Package
Description
10-Lead LFCSP_WD
10-Lead LFCSP_WD
14-Lead TSSOP
14-Lead TSSOP
10-Lead LFCSP_WD
10-Lead LFCSP_WD
10-Lead LFCSP_WD
10-Lead LFCSP_WD
14-Lead TSSOP
14-Lead TSSOP
14-Lead TSSOP
14-Lead TSSOP
10-Lead LFCSP_WD
10-Lead LFCSP_WD
14-Lead TSSOP
14-Lead TSSOP
10-Lead LFCSP_WD
10-Lead LFCSP_WD
14-Lead TSSOP
14-Lead TSSOP
12-Ball WLCSP
10-Lead LFCSP_WD
10-Lead LFCSP_WD
14-Lead TSSOP
14-Lead TSSOP
14-Lead TSSOP
14-Lead TSSOP
TSSOP Evaluation
Board
LFCSP Evaluation
Board
Package
Option
CP-10-9
CP-10-9
RU-14
RU-14
CP-10-9
CP-10-9
CP-10-9
CP-10-9
RU-14
RU-14
RU-14
RU-14
CP-10-9
CP-10-9
RU-14
RU-14
CP-10-9
CP-10-9
RU-14
RU-14
CB-12-9
CP-10-9
CP-10-9
RU-14
RU-14
RU-14
RU-14
Branding
D8V
D8V
D8S
D8S
DEU
DFW
D89
D89
D6U
D6U
DA2
DA2
AD5625R/AD5645R/AD5665R, AD5625/AD5665
NOTES
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
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D06341-0-3/13(C)
Rev. C | Page 36 of 36
Data Sheet