TI 84093012A

 SCLS112D − DECEMBER 1982 − REVISED OCTOBER 2003
D
D
D
D
D
Wide Operating Voltage Range of 2 V to 6 V
Outputs Can Drive Up To 15 LSTTL Loads
Low Power Consumption, 80-µA Max ICC
Typical tpd = 9 ns
±6-mA Output Drive at 5 V
D Low Input Current of 1 µA Max
D Permit Multiplexing from n Lines to One
Line
D Perform Parallel-to-Serial Conversion
D Strobe (Enable) Line Provided for
Cascading (N Lines to n Lines)
SN54HC153 . . . J OR W PACKAGE
SN74HC153 . . . D, N, NS, OR PW PACKAGE
(TOP VIEW)
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
B
1G
NC
VCC
2G
VCC
2G
A
2C3
2C2
2C1
2C0
2Y
1C3
1C2
NC
1C1
1C0
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
A
2C3
NC
2C2
2C1
1Y
GND
NC
2Y
2C0
1G
B
1C3
1C2
1C1
1C0
1Y
GND
SN54HC153 . . . FK PACKAGE
(TOP VIEW)
NC − No internal connection
description/ordering information
Each of these data selectors/multiplexers contains inverters and drivers to supply full binary decoding data
selection to the AND-OR gates. Separate strobe (G) inputs are provided for each of the two 4-line sections.
ORDERING INFORMATION
PACKAGE†
TA
PDIP − N
SOIC − D
−40°C to 85°C
SOP − NS
TSSOP − PW
−55°C
125°C
−55
C to 125
C
ORDERABLE
PART NUMBER
Tube of 25
SN74HC153N
Tube of 40
SN74HC153D
Reel of 2500
SN74HC153DR
Reel of 250
SN74HC153DT
Reel of 2000
SN74HC153NSR
Tube of 90
SN74HC153PW
Reel of 2000
SN74HC153PWR
TOP-SIDE
MARKING
SN74HC153N
HC153
HC153
HC153
Reel of 250
SN74HC153PWT
CDIP − J
Tube of 25
SNJ54HC153J
SNJ54HC153J
CFP − W
Tube of 150
SNJ54HC153W
SNJ54HC153W
LCCC − FK
Tube of 55
SNJ54HC153FK
SNJ54HC153FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
! " #$%! " &$'(#! )!%*
)$#!" # ! "&%##!" &% !+% !%" %," "!$%!"
"!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)%
!%"!/ (( &%!%"*
&)$#!" #&(! ! 01 (( &%!%" % !%"!%)
$(%"" !+%-"% !%)* (( !+% &)$#!" &)$#!
&#%""/ )%" ! %#%""(. #($)% !%"!/ (( &%!%"*
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCLS112D − DECEMBER 1982 − REVISED OCTOBER 2003
FUNCTION TABLE
INPUTS
SELECT†
DATA
C2
C3
G
OUTPUT
Y
B
A
C0
C1
X
X
X
X
X
X
H
L
L
L
L
X
X
X
L
L
L
L
H
X
X
X
L
H
L
H
X
L
X
X
L
L
L
H
X
H
X
X
L
H
H
L
X
X
L
X
L
L
H
L
X
X
H
X
L
H
H
H
X
X
X
L
L
L
H
H
X
X
X
H
L
H
† Select inputs A and B are common to both sections.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCLS112D − DECEMBER 1982 − REVISED OCTOBER 2003
logic diagram (positive logic)
A
B
1G
1C0
14
2
1
6
TG
TG
1C1
5
TG
7
1C2
4
1Y
TG
TG
1C3
2G
2C0
3
TG
15
10
TG
TG
2C1
11
TG
9
2C2
12
2Y
TG
TG
2C3
13
TG
Pin numbers shown are for the D, J, N, NS, PW, and W packages.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCLS112D − DECEMBER 1982 − REVISED OCTOBER 2003
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA
Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54HC153
VCC
VIH
Supply voltage
High-level input voltage
VCC = 2 V
VCC = 4.5 V
VCC = 6 V
VCC = 2 V
VIL
VI
VO
∆t/∆v
Low-level input voltage
MIN
NOM
MAX
2
5
6
MIN
NOM
MAX
2
5
6
1.5
1.5
3.15
3.15
4.2
4.2
VCC = 4.5 V
VCC = 6 V
Input voltage
0
Output voltage
0
Input transition rise/fall time
SN74HC153
VCC = 2 V
VCC = 4.5 V
VCC = 6 V
0.5
1.35
1.35
1.8
1.8
0
0
V
V
0.5
VCC
VCC
UNIT
VCC
VCC
1000
1000
500
500
400
400
V
V
V
ns
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCLS112D − DECEMBER 1982 − REVISED OCTOBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = −20 µA
VOH
VI = VIH or VIL
IOH = −6 mA
IOH = −7.8 mA
IOL = 20 µA
VOL
VI = VIH or VIL
IOL = 6 mA
IOL = 7.8 mA
II
ICC
VI = VCC or 0
VI = VCC or 0,
IO = 0
VCC
MIN
TA = 25°C
TYP
MAX
MIN
MAX
SN74HC153
MIN
2V
1.9
1.998
1.9
1.9
4.5 V
4.4
4.499
4.4
4.4
6V
5.9
5.999
5.9
5.9
4.5 V
3.98
4.3
3.7
3.84
6V
5.48
5.8
5.2
MAX
UNIT
V
5.34
2V
0.002
0.1
0.1
0.1
4.5 V
0.001
0.1
0.1
0.1
6V
0.001
0.1
0.1
0.1
4.5 V
0.17
0.26
0.4
0.33
6V
0.15
0.26
0.4
0.33
6V
±0.1
±100
±1000
±1000
nA
8
160
80
µA
3
10
10
10
pF
6V
Ci
SN54HC153
2 V to 6 V
V
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
tpd
SN54HC153
SN74HC153
TO
(OUTPUT)
VCC
2V
90
150
225
190
A or B
Y
4.5 V
21
30
45
38
6V
17
26
38
32
Data
(Any C)
G
tt
TA = 25°C
TYP
MAX
FROM
(INPUT)
Y
Y
Y
MIN
MIN
MAX
MIN
MAX
2V
73
126
189
158
4.5 V
17
28
42
35
6V
14
23
35
29
2V
38
95
150
125
4.5 V
11
19
28
24
6V
9
16
24
20
2V
20
60
90
75
4.5 V
8
12
18
15
6V
6
10
15
13
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
ns
ns
5
SCLS112D − DECEMBER 1982 − REVISED OCTOBER 2003
switching characteristics over recommended operating free-air temperature range, CL = 150 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
SN54HC153
SN74HC153
TO
(OUTPUT)
VCC
2V
105
235
355
295
A or B
Y
4.5 V
27
47
71
59
6V
21
41
60
51
Data
(Any C)
tpd
TA = 25°C
TYP
MAX
FROM
(INPUT)
Y
G
Y
tt
Y
MIN
MIN
MAX
MIN
MAX
2V
93
220
335
274
4.5 V
23
44
67
55
6V
19
38
57
48
2V
60
185
280
230
4.5 V
17
37
56
46
6V
14
32
48
40
2V
45
210
315
265
4.5 V
17
42
63
53
6V
13
36
53
45
UNIT
ns
ns
operating characteristics, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance per multiplexer
No load
TYP
UNIT
40
pF
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
Test
Point
Input
VCC
50%
50%
0V
CL
(see Note A)
tPLH
In-Phase
Output
LOAD CIRCUIT
50%
10%
tPHL
90%
90%
tr
Input
50%
10%
90%
90%
tr
tPHL
VCC
50%
10% 0 V
Out-of-Phase
Output
90%
tf
VOH
50%
10%
VOL
tf
tPLH
50%
10%
tf
50%
10%
90%
VOH
VOL
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. The outputs are measured one at a time with one input transition per measurement.
D. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
5962-8409301VEA
ACTIVE
CDIP
J
16
25
TBD
A42
N / A for Pkg Type
5962-8409301VE
A
SNV54HC153J
5962-8409301VFA
ACTIVE
CFP
W
16
25
TBD
A42
N / A for Pkg Type
5962-8409301VF
A
SNV54HC153W
84093012A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
84093012A
SNJ54HC
153FK
8409301EA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
8409301EA
SNJ54HC153J
8409301FA
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
8409301FA
SNJ54HC153W
SN54HC153J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN54HC153J
SN74HC153D
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC153
SN74HC153DE4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC153
SN74HC153DG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC153
SN74HC153DR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC153
SN74HC153DRE4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC153
SN74HC153DRG4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC153
SN74HC153DT
ACTIVE
SOIC
D
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC153
SN74HC153DTE4
ACTIVE
SOIC
D
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC153
SN74HC153DTG4
ACTIVE
SOIC
D
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC153
SN74HC153N
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
SN74HC153N
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
25-Sep-2013
Status
(1)
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
SN74HC153NE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
SN74HC153N
SN74HC153NSR
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC153
SN74HC153NSRE4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC153
SN74HC153NSRG4
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC153
SN74HC153PW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC153
SN74HC153PWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC153
SN74HC153PWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC153
SN74HC153PWLE
OBSOLETE
TSSOP
PW
16
TBD
Call TI
Call TI
-40 to 85
SN74HC153PWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC153
SN74HC153PWRE4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC153
SN74HC153PWRG4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC153
SN74HC153PWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC153
SN74HC153PWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC153
SN74HC153PWTG4
ACTIVE
TSSOP
PW
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC153
SNJ54HC153FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
84093012A
SNJ54HC
153FK
SNJ54HC153J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
8409301EA
SNJ54HC153J
SNJ54HC153W
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
8409301FA
SNJ54HC153W
The marketing status values are defined as follows:
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC153, SN54HC153-SP, SN74HC153 :
• Catalog: SN74HC153, SN54HC153
• Military: SN54HC153
• Space: SN54HC153-SP
NOTE: Qualified Version Definitions:
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74HC153DR
Package Package Pins
Type Drawing
SOIC
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
SN74HC153NSR
SO
NS
16
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
SN74HC153PWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
SN74HC153PWT
TSSOP
PW
16
250
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74HC153DR
SOIC
D
16
2500
333.2
345.9
28.6
SN74HC153NSR
SO
NS
16
2000
367.0
367.0
38.0
SN74HC153PWR
TSSOP
PW
16
2000
367.0
367.0
35.0
SN74HC153PWT
TSSOP
PW
16
250
367.0
367.0
35.0
Pack Materials-Page 2
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