TI 5962-8760901DA

SN54AC04, SN74AC04
HEX INVERTERS
SCAS519E − JULY 1995 − REVISED OCTOBER 2003
D 2-V to 6-V VCC Operation
D Inputs Accept Voltages to 6 V
D Max tpd of 7 ns at 5 V
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
6A
6Y
5A
5Y
4A
4Y
2A
NC
2Y
NC
3A
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
6Y
NC
5A
NC
5Y
3Y
GND
NC
4Y
4A
1A
1Y
2A
2Y
3A
3Y
GND
SN54AC04 . . . FK PACKAGE
(TOP VIEW)
1Y
1A
NC
VCC
6A
SN54AC04 . . . J OR W PACKAGE
SN74AC04 . . . D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
NC − No internal connection
description/ordering information
The ‘AC04 devices contain six independent inverters. The devices perform the Boolean function Y = A.
ORDERING INFORMATION
PDIP − N
SN74AC04N
Tube
SN74AC04D
Tape and reel
SN74AC04DR
SOP − NS
Tape and reel
SN74AC04NSR
AC04
SSOP − DB
Tape and reel
SN74AC04DBR
AC04
Tube
SN74AC04PW
Tape and reel
SN74AC04PWR
CDIP − J
Tube
SNJ54AC04J
SNJ54AC04J
CFP − W
Tube
SNJ54AC04W
SNJ54AC04W
LCCC − FK
Tube
SNJ54AC04FK
SNJ54AC04FK
TSSOP − PW
−55°C
55 C to 125
125°C
C
†
TOP-SIDE
MARKING
Tube
SOIC − D
−40°C
40 C to 85°C
85 C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SN74AC04N
AC04
AC04
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
(each inverter)
INPUT
A
OUTPUT
Y
H
L
L
H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN54AC04, SN74AC04
HEX INVERTERS
SCAS519E − JULY 1995 − REVISED OCTOBER 2003
logic diagram, each inverter (positive logic)
A
Y
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA
Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
VCC
Supply voltage
VIH
High-level
High
level input voltage
VCC = 3 V
SN54AC04
SN74AC04
MIN
MAX
MIN
MAX
2
6
2
6
2.1
2.1
VCC = 4.5 V
3.15
3.15
VCC = 5.5 V
3.85
3.85
VCC = 3 V
VIL
Low-level
Low
level input voltage
UNIT
V
V
0.9
0.9
VCC = 4.5 V
1.35
1.35
VCC = 5.5 V
1.65
1.65
V
VI
Input voltage
0
VCC
0
VCC
V
VO
Output voltage
0
VCC
0
VCC
V
IOH
High-level
High
level output current
IOL
Low-level
Low
level output current
Δt/Δv
Input transition rise or fall rate
TA
Operating free-air temperature
VCC = 3 V
−12
−12
VCC = 4.5 V
−24
−24
VCC = 5.5 V
−24
−24
VCC = 3 V
12
12
VCC = 4.5 V
24
24
VCC = 5.5 V
24
24
8
−55
125
−40
mA
mA
8
ns/ V
85
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54AC04, SN74AC04
HEX INVERTERS
SCAS519E − JULY 1995 − REVISED OCTOBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
IOH = −50
50 μA
VOH
SN54AC04
SN74AC04
MIN
MIN
MAX
3V
2.9
2.99
2.9
2.9
4.4
4.49
4.4
4.4
5.5 V
5.4
5.49
5.4
5.4
3V
2.56
2.4
2.46
4.5 V
3.86
3.7
3.76
5.5 V
4.86
4.7
4.76
MAX
5.5 V
5.5 V
3V
0.002
0.1
0.1
0.1
IOL = 50 μA
4.5 V
0.001
0.1
0.1
0.1
5.5 V
0.001
0.1
0.1
0.1
IOL =12 mA
UNIT
V
IOH = −75 mA†
IOL = 24 mA
3.85
3.85
3V
0.36
0.5
0.44
4.5 V
0.36
0.5
0.44
5.5 V
0.36
0.5
0.44
V
mA†
5.5 V
IOL = 75 mA†
5.5 V
II
VI = VCC or GND
5.5 V
± 0.1
±1
±1
μA
ICC
VI = VCC or GND,
5.5 V
2
40
20
μA
Ci
VI = VCC or GND
IOL = 50
†
MAX
mA†
IOH = −50
VOL
TYP
4.5 V
IOH = −12 mA
IOH = −24
24 mA
TA = 25°C
MIN
IO = 0
1.65
1.65
2.8
pF
Not more than one output should be tested at a time, and the duration of the test should not exceed 2 ms.
switching characteristics over recommended operating
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
tPLH
tPHL
FROM
(INPUT)
TO
(OUTPUT)
A
Y
free-air
TA = 25°C
tPLH
tPHL
FROM
(INPUT)
TO
(OUTPUT)
A
Y
range,
SN54AC04
SN74AC04
MAX
MIN
MAX
MIN
4.5
9
1
11
1
10
4.5
8.5
1
10
1
9.5
MIN
TYP
1.5
1.5
switching characteristics over recommended operating
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
temperature
free-air
TA = 25°C
MAX
temperature
UNIT
ns
range,
SN54AC04
SN74AC04
MIN
TYP
MAX
MIN
MAX
MIN
MAX
1.5
4
7
1
8.5
1
7.5
1.5
3.5
6.5
1
7.5
1
7
UNIT
ns
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance
CL = 50 pF,
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
f = 1 MHz
TYP
45
UNIT
pF
3
SN54AC04, SN74AC04
HEX INVERTERS
SCAS519E − JULY 1995 − REVISED OCTOBER 2003
PARAMETER MEASUREMENT INFORMATION
TEST
tPLH/tPHL
S1
Open
From Output
Under Test
CL = 50 pF
(see Note A)
S1
Open
50% VCC
50% VCC
0V
tPLH
2 × VCC
500 Ω
VCC
Input
(see Note B)
tPHL
In-Phase
Output
50% VCC
tPHL
500 Ω
tPLH
Out-of-Phase
Output
LOAD CIRCUIT
VOH
50% VCC
VOL
50% VCC
VOH
50% VCC
VOL
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
C. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
5962-87609012A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
596287609012A
SNJ54AC
04FK
5962-8760901CA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-8760901CA
SNJ54AC04J
5962-8760901DA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-8760901DA
SNJ54AC04W
SN74AC04D
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC04
SN74AC04DBLE
OBSOLETE
SSOP
DB
14
TBD
Call TI
Call TI
-40 to 85
SN74AC04DBR
ACTIVE
SSOP
DB
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC04
SN74AC04DBRE4
ACTIVE
SSOP
DB
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC04
SN74AC04DBRG4
ACTIVE
SSOP
DB
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC04
SN74AC04DE4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC04
SN74AC04DG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC04
SN74AC04DR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC04
SN74AC04DRE4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC04
SN74AC04DRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC04
SN74AC04N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
SN74AC04N
SN74AC04NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
SN74AC04N
SN74AC04NSR
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC04
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
SN74AC04NSRE4
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC04
SN74AC04NSRG4
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC04
SN74AC04PW
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC04
SN74AC04PWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC04
SN74AC04PWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC04
SN74AC04PWLE
OBSOLETE
TSSOP
PW
14
TBD
Call TI
Call TI
-40 to 85
SN74AC04PWR
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC04
SN74AC04PWRE4
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC04
SN74AC04PWRG4
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
AC04
SNJ54AC04FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
596287609012A
SNJ54AC
04FK
SNJ54AC04J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-8760901CA
SNJ54AC04J
SNJ54AC04W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-8760901DA
SNJ54AC04W
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54AC04, SN74AC04 :
• Catalog: SN74AC04
• Automotive: SN74AC04-Q1, SN74AC04-Q1
• Enhanced Product: SN74AC04-EP, SN74AC04-EP
• Military: SN54AC04
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
• Military - QML certified for Military and Defense Applications
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74AC04DBR
Package Package Pins
Type Drawing
SSOP
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DB
14
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
SN74AC04DR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SN74AC04PWR
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74AC04DBR
SSOP
DB
14
2000
367.0
367.0
38.0
SN74AC04DR
SOIC
D
14
2500
367.0
367.0
38.0
SN74AC04PWR
TSSOP
PW
14
2000
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
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