FEATURES
Input voltage range: 2.5 V to 5.5 V
Small, 8-lead, 2 mm × 2 mm LFCSP package
Initial accuracy: ±1%
High PSRR: 70 dB at 10 kHz, 60 dB at 100 kHz, 40 dB at 1 MHz
Low noise: 27 µV rms at VOUT = 1.2 V, 50 µV rms at VOUT = 2.8 V
Excellent transient response
Low dropout voltage: 170 mV at 300 mA load
65 µA typical ground current at no load, both LDOs enabled
Fixed output voltage from 0.8 V to 3.3 V (ADP222/ADP224)
Adjustable output voltage range from 0.5 V to 5.0 V
(ADP223/ADP225)
Quick output discharge (QOD)—ADP224/ADP225
Overcurrent and thermal protection
APPLICATIONS
Portable and battery-powered equipment
Portable medical devices
Post dc-to-dc regulation
Point of sale terminals
Credit card readers
Automatic meter readers
Wireless network equipment
TYPICAL APPLICATION CIRCUITS
VIN = 4.2V
+ C1
1µF
OFF
R2
ON
R1
ADJ1 8
1 EN1
OFF
ON
2 EN2
ADP223/
ADP225
VOUT2 = 2.0V
VOUT1 7
3 GND
+ C2
1µF
VIN 6
VOUT1 = 2.8V
4 ADJ2
VOUT2 5
R3
+ C3
1µF
09376-001
Data Sheet
Dual, 300 mA Output, Low Noise,
High PSRR Voltage Regulators
ADP222/ADP223/ADP224/ADP225
R4
Figure 1. ADP223/ADP225
VIN = 4.2V
+ C1
1µF
OFF
ON
1
OFF
SENSE1 8
EN1
ADP222/
ADP224
ON
VOUT1 = 1.5V
2
EN2
VOUT1 7
3
GND
VIN 6
4
SENSE2
+ C2
1µF
VOUT2 = 3.3V
+ C3
1µF
09376-101
VOUT2 5
Figure 2. ADP222/ADP224
GENERAL DESCRIPTION
The 300 mA, adjustable dual output ADP223/ADP225 and
fixed dual output ADP222/ADP224 combine high PSRR, low
noise, low quiescent current, and low dropout voltage in a
voltage regulator that is ideally suited for wireless applications
with demanding performance and board space requirements.
100 kHz while operating with a low headroom voltage. The
ADP222/ADP223/ADP224/ADP225 offer much lower noise
performance than competing LDOs without the need for a
noise bypass capacitor. Overcurrent and thermal protection
circuitry prevent damage in adverse conditions.
The ADP222/ADP224 are available with fixed outputs voltages
from 0.8V to 3.3V. The adjustable output ADP223/ADP225 may
be set to output voltages from 0.5 V to 5.0 V. The low quiescent
current, low dropout voltage, and wide input voltage range of
the ADP222/ADP223/ADP224/ADP225 extend the battery life
of portable devices.
The ADP224 and ADP225 are identical to the ADP222 and
ADP223, respectively, but with the addition of a quick output
discharge (QOD) feature.
The ADP222/ADP223/ADP224/ADP225 maintain power
supply rejection greater than 60 dB for frequencies as high as
The ADP222/ADP223/ADP224/ADP225 are available in a
small 8-lead, 2 mm × 2 mm LFCSP package and are stable with
tiny 1 µF, ±30% ceramic output capacitors, resulting in the smallest
possible board area for a wide variety of portable power needs.
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2011 Analog Devices, Inc. All rights reserved.
ADP222/ADP223/ADP224/ADP225
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Typical Performance Characteristics ..............................................7
Applications ....................................................................................... 1
Theory of Operation ...................................................................... 17
Typical Application Circuits............................................................ 1
Applications Information .............................................................. 18
General Description ......................................................................... 1
Capacitor Selection .................................................................... 18
Revision History ............................................................................... 2
Enable Feature ............................................................................ 19
Specifications..................................................................................... 3
Paralleling Outputs to Increase Output Current .................... 19
Input and Output Capacitor, Recommended Specifications .. 4
Quick Output Discharge (QOD) Function ............................ 19
Absolute Maximum Ratings ............................................................ 5
Current Limit and Thermal Overload Protection ................. 20
Thermal Data ................................................................................ 5
Thermal Considerations............................................................ 20
Thermal Resistance ...................................................................... 5
Printed Circuit Board Layout Considerations........................ 22
ESD Caution .................................................................................. 5
Outline Dimensions ....................................................................... 23
Pin Configuration and Function Descriptions ............................. 6
Ordering Guide .......................................................................... 23
REVISION HISTORY
8/11—Rev. A to Rev. B
7/11—Rev. 0 to Rev. A
Changes to Features and General Descriptions Sections ............ 1
Added Figure 64; Renumbered Sequentially .............................. 17
Changes to Theory of Operation Section .................................... 17
Changes to Output Capacitor Section ......................................... 18
Changes to Paralleling Outputs to Increase Output
Current Section ............................................................................... 19
Updated Outline Dimensions ....................................................... 23
Added ADP222, ADP224, and ADP225 ......................... Universal
Changes to Features Section, Applications Section,
General Description Section, and Figure 2 ....................................1
Changes to Table 1.............................................................................3
Added Figure 4; Renumbered Sequentially ...................................6
Changes to Table 5.............................................................................6
Changes to Typical Performance Characteristics Section ...........7
Changes to Theory of Operation Section and Figure 62 .......... 17
Added Figure 63 ............................................................................. 17
Added Quick Output Discharge (QOD) Function Section
Added Figure 70 ............................................................................. 20
2/11—Revision 0: Initial Version
Rev. B | Page 2 of 24
Data Sheet
ADP222/ADP223/ADP224/ADP225
SPECIFICATIONS
VIN = (VOUT + 0.5 V) or 2.5 V (whichever is greater), EN1 = EN2 = VIN, IOUT1 = IOUT2 = 10 mA, CIN = COUT1 = COUT2 = 1 µF, TA = 25°C,
unless otherwise noted.
Table 1.
Parameter
INPUT VOLTAGE RANGE
OPERATING SUPPLY CURRENT
WITH BOTH REGULATORS ON
SHUTDOWN CURRENT
OUTPUT VOLTAGE ACCURACY 1
ADJUSTABLE-OUTPUT VOLTAGE
ACCURACY1
LINE REGULATION
LOAD REGULATION
Symbol
VIN
IGND
IGND-SD
VOUT
VADJ
ΔVOUT/ΔVIN
2
DROPOUT VOLTAGE 3
ΔVOUT/ΔIOUT
VDROPOUT
SENSE INPUT BIAS CURRENT
ADJx INPUT BIAS CURRENT
START-UP TIME 4
SENSEI-BIAS
ADJI-BIAS
tSTART-UP
CURRENT-LIMIT THRESHOLD 5
THERMAL SHUTDOWN
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
EN INPUT
EN Input Logic High
EN Input Logic Low
EN Input Leakage Current
ILIMIT
UNDERVOLTAGE LOCKOUT
Input Voltage Rising
Input Voltage Falling
Hysteresis
OUTPUT DISCHARGE TIME
OUTPUT DISCHARGE RESISTANCE
UVLO
UVLORISE
UVLOFALL
UVLOHYS
tDIS
RQOD
Test Conditions/Comments
TJ = −40°C to +125°C
IOUT = 0 µA
IOUT = 0 µA, TJ = −40°C to +125°C
IOUT = 10 mA
IOUT = 10 mA, TJ = −40°C to +125°C
IOUT = 300 mA
IOUT = 300 mA, TJ = −40°C to +125°C
EN1 = EN2 = GND
TJ = −40°C to +125°C
IOUT = 10 mA
0 µA < IOUT < 300 mA, VIN = (VOUT + 0.5 V) to 5.5 V
TJ = −40°C to +125°C
IOUT = 10 mA
0 µA < IOUT < 300 mA, VIN = (VOUT + 0.5 V) to 5.5 V
VIN = (VOUT + 0.5 V) to 5.5 V
VIN = (VOUT + 0.5 V) to 5.5 V, TJ = −40°C to +125°C
IOUT = 1 mA to 300 mA
IOUT = 1 mA to 300 mA, TJ = −40°C to +125°C
VOUT = 3.3 V
IOUT = 10 mA
IOUT = 10 mA, TJ = −40°C to +125°C
IOUT = 300 mA
IOUT = 300 mA, TJ = −40°C to +125°C A
2.5 V ≤ VIN ≤ 5.5 V, SENSEx connected to VOUTx
2.5 V ≤ VIN ≤ 5.5 V, ADJx connected to VOUTx
VOUT = 3.3 V
VOUT = 0.8 V
Min
2.5
TJ rising
VIH
VIL
VI-LEAKAGE
2.5 V ≤ VIN ≤ 5.5 V
2.5 V ≤ VIN ≤ 5.5 V
EN1 = EN2 = VIN or GND
EN1 = EN2 = VIN or GND, TJ = −40°C to +125°C
Max
5.5
Unit
V
µA
150
450
2
µA
µA
µA
µA
µA
µA
+1
+2
%
%
0.505
0.510
V
V
%/V
%/V
%/mA
%/mA
65
100
200
300
0.2
−1
−2
0.495
0.490
0.500
0.01
−0.05
+0.05
0.001
0.002
6
10
10
240
100
400
mV
mV
mV
mV
nA
nA
µs
µs
mA
155
15
°C
°C
9
170
260
340
TSSD
TSSD-HYS
Typ
1.2
0.4
0.1
1
2.45
2.2
VOUT = 2.8 V
Rev. B | Page 3 of 24
120
1000
140
V
V
µA
µA
V
V
mV
µs
Ω
ADP222/ADP223/ADP224/ADP225
Parameter
OUTPUT NOISE
Symbol
OUTNOISE
POWER SUPPLY REJECTION RATIO
PSRR
Data Sheet
Test Conditions/Comments
10 Hz to 100 kHz, VIN = 5 V, VOUT = 3.3 V
10 Hz to 100 kHz, VIN = 5 V, VOUT = 2.8 V
10 Hz to 100 kHz, VIN = 3.6 V, VOUT = 2.5 V
10 Hz to 100 kHz, VIN = 3.6 V, VOUT = 1.2 V
VIN = 2.5 V, VOUT = 0.8 V, IOUT = 100 mA
100 Hz
1 kHz
10 kHz
100 kHz
1 MHz
VIN = 3.8 V, VOUT = 2.8 V, IOUT = 100 mA
100 Hz
1 kHz
10 kHz
100 kHz
1 MHz
Min
Typ
56
50
45
27
Max
Unit
µV rms
µV rms
µV rms
µV rms
76
76
70
60
40
dB
dB
dB
dB
dB
68
68
68
60
40
dB
dB
dB
dB
dB
Accuracy when VOUTx is connected directly to ADJx or SENSEx. When the VOUTx voltage is set by external feedback resistors, the absolute accuracy in adjust mode
depends on the tolerances of resistors used.
2
Based on an end-point calculation using 1 mA and 300 mA loads.
3
Dropout voltage is defined as the input-to-output voltage differential when the input voltage is set to the nominal output voltage. This applies only for output
voltages above 2.5 V.
4
Start-up time is defined as the time between the rising edge of EN to VOUT being at 90% of its nominal value.
5
Current-limit threshold is defined as the current at which the output voltage drops to 90% of the specified typical value. For example, the current limit for a 3.0 V
output voltage is defined as the current that causes the output voltage to drop to 90% of 3.0 V or 2.7 V.
1
INPUT AND OUTPUT CAPACITOR, RECOMMENDED SPECIFICATIONS
The minimum input and output capacitance should be greater than 0.70 µF over the full range of the operating conditions. The full range of the
operating conditions in the application must be considered during device selection to ensure that the minimum capacitance specification
is met. X7R and X5R type capacitors are recommended for use with the LDOs, but Y5V and Z5U capacitors are not recommended for use
with the LDOs.
Table 2.
Parameter
MINIMUM INPUT AND OUTPUT CAPACITANCE
CAPACITOR ESR
Symbol
CMIN
RESR
Conditions
TA = −40°C to +125°C
TA = −40°C to +125°C
Rev. B | Page 4 of 24
Min
0.70
0.001
Typ
Max
1
Unit
µF
Ω
Data Sheet
ADP222/ADP223/ADP224/ADP225
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
VIN to GND
ADJ1, ADJ2, VOUT1, VOUT2 to GND
EN1, EN2 to GND
Storage Temperature Range
Operating Junction Temperature Range
Soldering Conditions
Rating
−0.3 V to +6 V
−0.3 V to VIN
−0.3 V to +6 V
−65°C to +150°C
−40°C to +125°C
JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL DATA
Absolute maximum ratings apply individually only, not in
combination.
The ADP222/ADP223/ADP224/ADP225 can be damaged when
the junction temperature limits are exceeded. Monitoring
ambient temperature does not guarantee that TJ is within the
specified temperature limits. In applications with high power
dissipation and poor thermal resistance, the maximum ambient
temperature may have to be derated. In applications with
moderate power dissipation and low PCB thermal resistance, the
maximum ambient temperature can exceed the maximum limit as
long as the junction temperature is within specification limits.
The junction temperature (TJ) of the device is dependent on the
ambient temperature (TA), the power dissipation of the device
(PD), and the junction-to-ambient thermal resistance of the
package (θJA). Maximum junction temperature (TJ) is calculated
from the ambient temperature (TA) and power dissipation (PD)
using the formula
Junction-to-ambient thermal resistance (θJA) of the package is
based on modeling and calculation using a 4-layer board. θJA
is highly dependent on the application and board layout. In
applications where high maximum power dissipation exists,
close attention to thermal board design is required. The value
of θJA may vary, depending on PCB material, layout, and
environmental conditions. The specified value of θJA is based
on a 4-layer, 4 in × 3 in, 2½ oz copper board, as per JEDEC
standards. For more information, see the AN-772 Application
Note, A Design and Manufacturing Guide for the Lead Frame
Chip Scale Package (LFCSP).
ΨJB is the junction-to-board thermal characterization parameter
with units of °C/W. ΨJB of the package is based on modeling and
calculation using a 4-layer board. The JESD51-12, Guidelines for
Reporting and Using Package Thermal Information, states that
thermal characterization parameters are not the same as thermal
resistances. ΨJB measures the component power flowing
through multiple thermal paths rather than a single path as in
thermal resistance, θJB. Therefore, ΨJB thermal paths include
convection from the top of the package as well as radiation from
the package, factors that make ΨJB more useful in real-world
applications. Maximum junction temperature (TJ) is calculated
from the board temperature (TB) and power dissipation (PD)
using the formula
TJ = TB + (PD × ΨJB)
Refer to JESD51-8 and JESD51-12 for more detailed
information about ΨJB.
THERMAL RESISTANCE
θJA and ΨJB are specified for the worst-case conditions, that is, a
device soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
8-Lead 2 mm × 2 mm LFCSP
TJ = TA + (PD × θJA)
ESD CAUTION
Rev. B | Page 5 of 24
θJA
50.2
θJC
31.7
ΨJB
18.2
Unit
°C/W
ADP222/ADP223/ADP224/ADP225
Data Sheet
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
ADP222/
ADP224
EN1
SENSE1 8
1
EN1
ADJ1 8
2
EN2
VOUT1 7
2
EN2
VOUT1 7
3
GND
VIN 6
3
GND
VIN 6
4
SENSE2
VOUT2 5
4
ADJ2
VOUT2 5
NOTES
1. CONNECT EXPOSED PAD TO GND.
09376-102
1
NOTES
1. CONNECT EXPOSED PAD TO GND.
Figure 3. ADP222/ADP224 Pin Configuration
09376-002
ADP223/
ADP225
Figure 4. ADP223/ADP225 Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
ADP222/ADP224 ADP223/ADP225
1
1
Mnemonic
EN1
2
2
EN2
3
N/A 1
3
4
GND
ADJ2
4
5
N/A1
5
SENSE2
VOUT2
6
7
6
7
VIN
VOUT1
N/A1
8
ADJ1
8
N/A1
SENSE1
EPAD
1
Description
Enable Input for the Second Regulator. Drive EN1 high to turn on Regulator 1 and
drive EN1 low to turn off Regulator 1. For automatic startup, connect EN1 to VIN.
Enable Input for the First Regulator. Drive EN2 high to turn on Regulator 2 and drive
EN2 low to turn off Regulator 2. For automatic startup, connect EN2 to VIN.
Ground Pin.
Adjust Pin for VOUT2. A resistor divider from VOUT2 to ADJ2 sets the output
voltage.
Sense Pin for VOUT2.
Regulated Output Voltage. Connect an 1 µF or greater output capacitor between
VOUT2 and GND.
Regulator Input Supply. Bypass VIN to GND with a 1 µF or greater capacitor.
Regulated Output Voltage. Connect 1 µF or greater output capacitor between
VOUT1 and GND.
Adjust Pin for VOUT1. A resistor divider from VOUT1 to ADJ1 sets the output
voltage.
Sense Pin for VOUT1.
The exposed paddle must be connected to ground.
N/A means not applicable.
Rev. B | Page 6 of 24
Data Sheet
ADP222/ADP223/ADP224/ADP225
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 5 V, VOUT1 = 3.3 V, VOUT2 = 2.8 V, IOUT1 = IOUT2 = 1 mA, CIN = COUT = 1 µF, TA = 25°C, unless otherwise noted.
1.220
3.40
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA
3.38
3.36
1.210
1.205
3.32
VOUT (V)
3.30
3.28
1.200
1.195
LOAD = 10µA
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
3.26
1.190
3.24
1.185
3.22
–5
25
85
125
JUNCTION TEMPERATURE (°C)
1.180
–40
125
3.40
LOAD = 10µA
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
3.38
3.36
3.34
VOUT (V)
2.81
2.80
3.32
3.30
2.79
3.28
2.78
3.26
2.77
3.24
2.76
3.22
2.75
–40
–5
25
85
125
JUNCTION TEMPERATURE (°C)
3.20
0.01
09376-106
VOUT (V)
2.82
85
Figure 8. Output Voltage vs. Junction Temperature, VOUTx = 1.2 V,
ADP222/ADP224
2.85
2.83
25
JUNCTION TEMPERATURE (°C)
Figure 5. Output Voltage vs. Junction Temperature, VOUTx = 3.3 V,
ADP222/ADP224
2.84
–5
09376-108
–40
09376-105
3.20
Figure 6. Output Voltage vs. Junction Temperature, VOUTx = 2.8 V,
ADP222/ADP224
0.1
1
10
100
1000
ILOAD (mA)
09376-109
VOUT (V)
3.34
1.215
Figure 9. Output Voltage vs. Load Current, VOUTx = 3.3 V, ADP222/ADP224
2.85
1.820
2.84
1.815
2.83
1.810
2.82
VOUT (V)
1.800
2.81
2.80
2.79
1.795
LOAD = 10µA
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
1.785
2.78
2.77
2.76
1.780
–40
–5
25
85
125
JUNCTION TEMPERATURE (°C)
Figure 7. Output Voltage vs. Junction Temperature, VOUTx = 1.8 V,
ADP222/ADP224
2.75
0.01
09376-107
1.790
0.1
1
10
ILOAD (mA)
100
1000
09376-110
VOUT (V)
1.805
Figure 10. Output Voltage vs. Load Current, VOUTx = 2.8 V, ADP222/ADP224
Rev. B | Page 7 of 24
ADP222/ADP223/ADP224/ADP225
Data Sheet
1.820
2.85
2.84
1.815
2.83
1.810
2.82
VOUT (V)
1.800
2.81
2.80
2.79
2.78
1.790
2.77
1.785
2.76
0.1
1
10
100
1000
ILOAD (mA)
Figure 11. Output Voltage vs. Load Current, VOUTx = 1.8 V, ADP222/ADP224
1.215
1.815
1.210
1.810
1.205
1.805
VOUT (V)
1.820
1.795
1.190
1.790
1.185
1.785
0.1
1
10
100
1000
ILOAD (mA)
Figure 12. Output Voltage vs. Load Current, VOUTx = 1.2 V, ADP222/ADP224
4.3
4.5
4.7
4.9
5.1
5.3
5.5
1.800
1.195
1.180
0.01
4.1
Figure 14. Output Voltage vs. Input Voltage, VOUTx = 2.8 V, ADP222/ADP224
1.220
1.200
3.9
VIN (V)
1.780
2.30
09376-112
VOUT (V)
2.75
3.7
09376-111
1.780
0.01
LOAD = 10µA
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
09376-114
1.795
LOAD = 10µA
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
2.70
3.10
3.50
3.90
4.30
4.70
5.10
5.50
VIN (V)
09376-115
VOUT (V)
1.805
Figure 15. Output Voltage vs. Input Voltage, VOUTx = 1.8 V, ADP222/ADP224
3.40
1.220
3.38
1.215
3.36
1.210
1.205
3.32
VOUT (V)
3.30
3.28
3.24
3.22
3.20
3.7
1.195
LOAD = 10µA
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
3.9
4.1
4.3
1.190
1.185
4.5
4.7
VIN (V)
4.9
5.1
5.3
5.5
1.180
2.30
09376-113
3.26
1.200
Figure 13. Output Voltage vs. Input Voltage, VOUTx = 3.3 V, ADP222/ADP224
LOAD = 10µA
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
2.70
3.10
3.50
3.90
VIN (V)
4.30
4.70
5.10
5.50
09376-116
VOUT (V)
3.34
Figure 16. Output Voltage vs. Input Voltage, VOUTx = 1.2 V, ADP222/ADP224
Rev. B | Page 8 of 24
Data Sheet
ADP222/ADP223/ADP224/ADP225
140
250
120
GROUND CURRENT (µA)
80
60
LOAD = 10µA
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
20
–40
–5
25
85
50
0
0.01
09376-117
0
125
JUNCTION TEMPERATURE (°C)
1
10
100
1000
Figure 20. Ground Current vs. Load Current, Dual Output, ADP222/ADP224
300
140
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA
120
GROUND CURRENT (µA)
GROUND CURRENT (µA)
0.1
ILOAD (mA)
Figure 17. Ground Current vs. Junction Temperature, Single Output,
ADP222/ADP224
250
100
09376-120
40
150
200
150
100
50
100
80
60
40
20
–40
–5
25
85
0
2.30
09376-118
0
125
JUNCTION TEMPERATURE (°C)
LOAD = 10µA
LOAD = 100µA
LOAD = 1mA
2.70
3.10
3.50
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
3.90
4.30
4.70
5.10
5.50
VIN (V)
09376-121
GROUND CURRENT (µA)
200
100
Figure 21. Ground Current vs. Input Voltage, VOUTx = 1.2 V, ADP222/ADP224
Figure 18. Ground Current vs. Junction Temperature, Dual Output,
ADP222/ADP224
140
250
120
GROUND CURRENT (µA)
GROUND CURRENT (µA)
200
100
80
60
40
150
100
50
0.1
1
10
ILOAD (mA)
100
1000
0
2.30
09376-119
0
0.01
2.70
3.10
3.50
3.90
VIN (V)
Figure 19. Ground Current vs. Load Current, Single Output, ADP222/ADP224
Rev. B | Page 9 of 24
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
4.30
4.70
5.10
5.50
09376-122
LOAD = 10µA
LOAD = 100µA
LOAD = 1mA
20
Figure 22. Ground Current vs. Input Voltage, VOUTx = 1.2 V and 1.8 V,
ADP222/ADP224
ADP222/ADP223/ADP224/ADP225
Data Sheet
1.220
3.40
3.38
1.215
3.36
1.210
1.205
3.32
VOUT (V)
VOUT (V)
3.34
3.30
3.28
1.200
1.195
3.26
1.185
1.180
–40
–5
25
85
09376-003
3.20
125
JUNCTION TEMPERATURE (°C)
–5
25
85
125
JUNCTION TEMPERATURE (°C)
Figure 26. Output Voltage vs. Junction Temperature, VOUTx = 1.2 V,
ADP223/ADP225
Figure 23. Output Voltage vs. Junction Temperature, VOUTx = 3.3 V,
ADP223/ADP225
2.85
3.40
2.84
3.38
2.83
3.36
2.82
3.34
2.81
3.32
VOUT (V)
2.80
3.30
3.28
2.79
3.26
2.78
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA
2.76
2.75
–40
–5
25
85
125
JUNCTION TEMPERATURE (°C)
3.24
3.22
3.20
0.1
09376-004
2.77
1
10
100
1000
ILOAD (mA)
Figure 24. Output Voltage vs. Junction Temperature, VOUTx = 2.8 V,
ADP223/ADP225
09376-007
VOUT (V)
–40
09376-006
3.22
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA
1.190
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA
3.24
Figure 27. Output Voltage vs. Load Current, VOUTx = 3.3 V, ADP223/ADP225
1.820
2.85
1.815
2.84
2.83
1.810
2.82
VOUT (V)
VOUT (V)
1.805
1.800
2.81
2.80
2.79
1.795
2.78
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA
1.780
–40
–5
25
85
125
JUNCTION TEMPERATURE (°C)
Figure 25. Output Voltage vs. Junction Temperature, VOUTx = 1.8 V,
ADP223/ADP225
2.77
2.76
2.75
0.01
09376-005
1.785
0.1
1
10
ILOAD (mA)
100
1000
09376-008
1.790
Figure 28. Output Voltage vs. Load Current, VOUTx = 2.8 V, ADP223/ADP225
Rev. B | Page 10 of 24
Data Sheet
ADP222/ADP223/ADP224/ADP225
2.85
1.820
2.84
1.815
2.83
1.810
2.82
VOUT (V)
VOUT (V)
1.805
1.800
1.795
2.81
2.80
2.79
2.78
1.790
1.785
2.76
10
100
1000
ILOAD (mA)
Figure 29. Output Voltage vs. Load Current, VOUTx = 1.8 V, ADP223/ADP225
1.215
1.815
1.210
1.810
1.205
1.805
VOUT (V)
1.820
1.795
1.190
1.790
1.185
1.785
1
10
100
1000
ILOAD (mA)
Figure 30. Output Voltage vs. Load Current, VOUTx = 1.2 V, ADP223/ADP225
4.10
4.30
4.70
4.90
5.10
5.30
5.50
1.800
1.195
1.180
0.1
3.90
Figure 32. Output Voltage vs. Input Voltage, VOUTx = 2.8 V, ADP223/ADP225
1.220
1.200
3.70
VIN (V)
1.780
2.30
09376-010
VOUT (V)
2.75
3.50
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA
2.70
3.10
3.50
3.90
4.30
4.70
5.10
5.50
VIN (V)
09376-013
1
09376-009
1.780
0.1
09376-012
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 200mA
LOAD = 300mA
2.77
Figure 33. Output Voltage vs. Input Voltage, VOUTx = 1.8 V, ADP223/ADP225
1.220
3.40
3.38
1.215
3.36
1.210
1.205
3.32
VOUT (V)
VOUT (V)
3.34
3.30
3.28
1.200
1.195
3.26
4.10
4.30
4.70
VIN (V)
4.90
5.10
5.30
5.50
1.180
2.30
Figure 31. Output Voltage vs. Input Voltage, VOUTx = 3.3 V, ADP223/ADP225
2.70
3.10
3.50
3.90
VIN (V)
4.30
4.70
5.10
5.50
09376-014
3.90
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA
1.185
09376-011
3.22
3.20
3.70
1.190
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA
3.24
Figure 34. Output Voltage vs. Input Voltage, VOUTx = 1.2 V, ADP223/ADP225
Rev. B | Page 11 of 24
ADP222/ADP223/ADP224/ADP225
Data Sheet
300
500
450
GROUND CURRENT (µA)
400
200
150
100
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA
0
–40
–5
25
85
125
JUNCTION TEMPERATURE (°C)
350
300
250
200
150
100
50
0
0.01
0.1
1
10
100
1000
ILOAD (mA)
Figure 35. Ground Current vs. Junction Temperature, Single Output,
Includes 100 µA for Output Divider, ADP223/ADP225
09376-018
50
09376-015
GROUND CURRENT (uA)
250
Figure 38. Ground Current vs. Load Current, Dual Output, Includes 200 µA for
Output Dividers, ADP223/ADP225
500
250
450
300
250
200
150
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA
100
50
0
–40
–5
25
85
125
JUNCTION TEMPERATURE (°C)
150
100
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA
50
0
2.3
2.7
3.1
3.5
3.9
4.3
4.7
5.1
5.5
VIN (V)
Figure 36. Ground Current vs. Junction Temperature, Dual Output, Includes
200 µA for Output Dividers, ADP223/ADP225
09376-019
GROUND CURRENT (µA)
200
350
09376-016
GROUND CURRENT (µA)
400
Figure 39. Ground Current vs. Input Voltage, VOUTx = 1.2 V, Single Output,
Includes 100 µA for Output Divider, ADP223/ADP225
250
450
400
150
100
300
250
200
150
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 200mA
LOAD = 300mA
100
50
50
0
0.01
0.1
1
10
100
1000
ILOAD (mA)
Figure 37. Ground Current vs. Load Current, Single Output,
Includes 100 µA for Output Divider, ADP223/ADP225
0
2.3
2.7
3.1
3.5
3.9
VIN (V)
4.3
4.7
5.1
5.5
09376-020
GROUND CURRENT (µA)
350
09376-017
GROUND CURRENT (µA)
200
Figure 40. Ground Current vs. Input Voltage, VOUTx = 1.2 V and 1.8 V,
Dual Output, Includes 200 µA for Output Dividers, ADP223/ADP225
Rev. B | Page 12 of 24
Data Sheet
ADP222/ADP223/ADP224/ADP225
140
2.90
2.85
120
100
2.75
VOUT (V)
80
60
2.70
2.65
2.60
2.55
LOAD = 1mA
LOAD = 5mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA
2.50
20
2.45
1
10
100
1000
ILOAD (mA)
2.40
2.6
09376-021
0
2.8
2.9
3.0
3.1
VIN (V)
Figure 44. Output Voltage vs. Input Voltage in Dropout, VOUTx = 2.8 V
Figure 41. Dropout Voltage vs. Load Current, VOUT = 3.3 V
450
160
400
140
350
120
GROUND CURRENT (µA)
DROPOUT VOLTAGE (mV)
2.7
09376-024
40
100
80
60
40
300
250
200
150
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA
100
20
50
1
10
100
1000
ILOAD (mA)
0
3.1
09376-022
0
3.2
3.3
3.4
3.5
3.6
VIN (V)
09376-025
DROPOUT VOLTAGE (mV)
2.80
Figure 45. Ground Current vs. Input Voltage in Dropout, VOUTx = 3.3 V
Figure 42. Dropout Voltage vs. Load Current, VOUT = 2.8 V
3.40
400
3.35
350
VOUT (V)
3.25
3.20
3.15
3.10
3.05
LOAD = 1mA
LOAD = 5mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA
2.95
2.90
3.1
3.2
3.3
3.4
VIN (V)
3.5
250
200
150
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 50mA
LOAD = 100mA
LOAD = 300mA
100
50
3.6
0
2.6
09376-023
3.00
300
Figure 43. Output Voltage vs. Input Voltage in Dropout, VOUTx = 3.3 V
2.7
2.8
2.9
VIN (V)
3.0
3.1
09376-026
GROUND CURRENT (uA)
3.30
Figure 46. Ground Current vs. Input Voltage in Dropout, VOUTx = 2.8 V
Rev. B | Page 13 of 24
ADP222/ADP223/ADP224/ADP225
–30
–40
–40
–50
–60
–50
–60
–70
–70
–80
–80
–90
–90
–100
–100
10
10
100
1k
10k
100k
1M
10M
FREQUENCY (Hz)
0
–40
PSRR (dB)
–30
–40
–50
–60
–70
–80
–90
–90
10k
100k
1M
10M
FREQUENCY (Hz)
–100
10
–40
–40
PSRR (dB)
–30
–50
–60
–70
–80
–90
–90
10k
100k
1M
FREQUENCY (Hz)
100k
1M
10M
10M
Figure 49. Power Supply Rejection Ratio vs. Frequency,
VIN = 2.8 V, VOUTx = 1.8 V
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
–60
–80
1k
10k
–50
–70
100
1k
0
VRIPPLE = 50mV
–10 VIN = 3.3V
VOUT = 2.8V
COUT = 1µF
–20
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
–30
–100
10
100
Figure 51. Power Supply Rejection Ratio vs. Frequency,
VIN = 3.8 V, VOUTx = 3.3 V
09376-029
PSRR (dB)
VRIPPLE = 50mV
–10 VIN = 2.8V
VOUT = 1.8V
COUT = 1µF
–20
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
FREQUENCY (Hz)
Figure 48. Power Supply Rejection Ratio vs. Frequency,
VIN = 3.8 V, VOUTx = 2.8 V
0
10M
–60
–80
1k
1M
–50
–70
100
100k
VRIPPLE = 50mV
–10 VIN = 3.8V
VOUT = 3.3V
COUT = 1µF
–20
–30
–100
10
10k
0
09376-028
PSRR (dB)
–20
1k
Figure 50. Power Supply Rejection Ratio vs. Frequency,
VIN = 2.5 V, VOUTx = 1.2 V
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
VRIPPLE = 50mV
VIN = 3.8V
VOUT = 2.8V
COUT = 1µF
100
FREQUENCY (Hz)
Figure 47. Power Supply Rejection Ratio vs. Frequency,
VIN = 4.3, V VOUTx = 3.3 V
–10
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
09376-030
PSRR (dB)
–30
09376-027
PSRR (dB)
–20
VRIPPLE = 50mV
–10 VIN = 2.5V
VOUT = 1.2V
COUT = 1µF
–20
09376-031
–10
0
LOAD = 100µA
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
VRIPPLE = 50mV
VIN = 4.3V
VOUT = 3.3V
COUT = 1µF
–100
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
Figure 52. Power Supply Rejection Ratio vs. Frequency,
VIN = 3.3 V, VOUTx = 2.8 V
Rev. B | Page 14 of 24
10M
09376-032
0
Data Sheet
Data Sheet
ADP222/ADP223/ADP224/ADP225
0
–10
–20
VRIPPLE = 50mV
VIN = 2.5V
VOUT = 1.8V
COUT = 1µF
VIN
PSRR (dB)
–30
–40
VOUT1
2
–50
–60
VOUT2
–70
3
–80
LOAD = 1mA
LOAD = 10mA
LOAD = 100mA
LOAD = 300mA
100
1k
10k
100k
1M
10M
FREQUENCY (Hz)
CH1 1V
CH3 10mV
B
W
VIN
VOUT2
1
B
W
B
W
M1µs A CH4
T 10.40%
200mV
09376-034
1
CH2 10mV
200mV
VOUT2
3
W
M1µs A CH4
T 9.8%
VOUT1
2
3
B
W
VIN
VOUT1
CH1 1V
CH3 10mV
B
W
Figure 56. Transient Line Response, VOUTx = 3.3 V and 2.8 V, VIN = 4 V to 5 V,
ILOAD = 300 mA
Figure 53. Power Supply Rejection Ratio vs. Frequency,
VIN = 2.5 V, VOUTx = 1.8 V
2
CH2 10mV
B
09376-036
10
CH1 1V
CH3 10mV
Figure 54. Transient Line Response, VOUTx = 3.3 V and 2.8 V, VIN = 4 V to 5 V,
ILOAD = 10 mA
B
W
CH2 10mV
B
W
B
W
M1µs A CH4
T 10.00%
200mV
09376-037
–100
1
09376-033
–90
Figure 57. Transient Line Response, VOUTx = 1.2 V and 1.8 V, VIN = 4 V to 5 V,
ILOAD = 300 mA
LOAD CURRENT
ON VOUT1
VIN
1
VOUT1
2
2
VOUT1
VOUT2
3
VOUT2
1
B
W
B
W
CH2 10mV
B
W
M4µs A CH4
T 9.8%
200mV
CH1 200mA Ω
CH3 10mV
Figure 55. Transient Line Response, VOUTx = 1.2 V and 1.8 V, VIN = 4 V to 5 V,
ILOAD = 10 mA
B
W
B
W
CH2 50mV
B
W
M10µs A CH1
T 10.20%
200mA
09376-038
CH1 1V
CH3 10mV
09376-035
3
Figure 58. Transient Load Response, VOUTx = 3.3 V, ILOAD = 1 mA to 300 mA;
VOUTx = 2.8 V, ILOAD = 1 mA
Rev. B | Page 15 of 24
ADP222/ADP223/ADP224/ADP225
Data Sheet
10
1
2
VOUT1
VOUT2
3
B
W
CH2 50mV
B
W
B
W
M10µs A CH1
T 10.20%
200mA
60
40
30
20
1.2V
1.8V
2.8V
3.3V
0.1
1
10
100
1000
ILOAD (mA)
09376-040
NOISE (µV rms)
50
0.01
100
1k
10k
100k
Figure 61. Output Noise Spectral Density, VIN = 5 V, ILOAD = 10 mA, COUT = 1 μF
70
0
0.001
0.1
FREQUENCY (Hz)
Figure 59. Transient Load Response, VOUTx = 1.2 V, ILOAD = 1 mA to 300 mA;
VOUTx = 1.8 V, ILOAD = 1 mA
10
1
0.01
10
09376-039
CH1 200mA Ω
CH3 10.0mV
1.2V
1.8V
2.8V
3.3V
09376-041
NOISE SPECTRAL DENSITY (µV/√Hz)
LOAD CURRENT
ON VOUT1
Figure 60. RMS Output Noise vs. Load Current and Output Voltage,
VIN = 5 V, COUT = 1 µF
Rev. B | Page 16 of 24
Data Sheet
ADP222/ADP223/ADP224/ADP225
THEORY OF OPERATION
controlled by the error amplifier. The error amplifier compares
the reference voltage with the feedback voltage from the output
and amplifies the difference. If the feedback voltage is lower
than the reference voltage, the gate of the PMOS device is
pulled lower, allowing more current to flow and increasing the
output voltage. If the feedback voltage is higher than the
reference voltage, the gate of the PMOS device is pulled higher,
allowing less current to flow and decreasing the output voltage.
The ADP222/ADP223/ADP224/ADP225 are low quiescent
current, fixed and adjustable dual output, low dropout linear
regulators that operate from 2.5 V to 5.5 V and provide up to
300 mA of current from each output. Drawing a low 300 μA
quiescent current (typical) at full load make the ADP222/
ADP223/ADP224/ADP225 ideal for battery-operated portable
equipment. Shutdown current consumption is typically 200 nA.
Optimized for use with small 1 μF ceramic capacitors, the
ADP222/ADP223/ADP224/ADP225 provide excellent
transient performance.
VIN = 4.2V
+ C1
1µF
OFF
ADP223/ADP225
R1
1 EN1
VIN
VOUT1
THERMAL
SHUTDOWN
R2
ON
OFF
2 EN2
140Ω
CURRENT
LIMIT
ON
EN2
VOUT2 = 2.0V
VOUT1 7
3 GND
4 ADJ2
EN1
ADJ1 8
ADP223/
ADP225
+ C2
1µF
VIN 6
VOUT2 5
VOUT1 = 2.8V
R3
CONTROL
LOGIC
AND
ENABLE
REFERENCE
ADP225 ONLY
R4
+ C3
1µF
09376-064
ADJ1
Figure 64. Typical Application Circuit for Setting Output Voltages,
ADP223/ADP225
CURRENT
LIMIT
140Ω
GND
09376-062
VOUT2
ADJ2
The ADP223/ADP225 are exactly the same as the ADP222/
ADP224 except that the output voltage dividers are internally
disconnected and the feedback input of the error amplifiers is
brought out for each output. The output voltages can be set
according to the following equations:
VOUT1 = 0.50 V(1 + R1/R2)
Figure 62. Internal Block Diagram, ADP223/ADP225
SENSE1
VOUT2 = 0.50 V(1 + R3/R4)
ADP222/ADP224
VIN
THERMAL
SHUTDOWN
EN1
EN2
The value of R1 and R3 should be less than 200 kΩ to minimize
errors in the output voltage caused by the ADJx pin input current.
For example, when R1 and R2 each equal 200 kΩ, the output
voltage is 1.0 V. The output voltage error introduced by the ADJx
pin input current is 2 mV or 0.20%, assuming a typical ADJx pin
input current of 10 nA at 25°C.
VOUT1
CONTROL
LOGIC
AND
ENABLE
140Ω
CURRENT
LIMIT
REFERENCE
The output voltage of the ADP223/ADP225 may be set from
0.5 V to 5.0 V.
ADP224
ONLY
The ADP222/ADP224 are available in multiple output voltage
options ranging from 0.8 V to 3.3 V.
CURRENT
LIMIT
The ADP224/ADP225 are identical to the ADP222/ADP223
with the addition of a quick output discharge (QOD) feature.
This allows the output voltage to start up from a known state.
140Ω
GND
09376-063
VOUT2
SENSE2
Figure 63. Internal Block Diagram, ADP222/ADP224
Internally, the ADP222/ADP223/ADP224/ADP225 consist of a
reference, two error amplifiers, and two PMOS pass transistors.
Output current is delivered via the PMOS pass device, which is
The ADP222/ADP223/ADP224/ADP225 use the EN1/EN2 pins
to enable and disable the VOUT1/VOUT2 pins under normal
operating conditions. When EN1/EN2 are high, VOUT1/VOUT2
turn on; when EN1/EN2 are low, VOUT1/VOUT2 turn off. For
automatic startup, EN1/EN2 can be tied to VIN.
Rev. B | Page 17 of 24
ADP222/ADP223/ADP224/ADP225
Data Sheet
APPLICATIONS INFORMATION
Output Capacitor
The ADP222/ADP223/ADP224/ADP225 are designed for
operation with small, space-saving ceramic capacitors but
function with most commonly used capacitors as long as care is
taken with regard to the effective series resistance (ESR) value.
The ESR of the output capacitor affects the stability of the LDO
control loop. A minimum of 0.7 µF capacitance with an ESR of
1 Ω or less is recommended to ensure the stability of the ADP222/
ADP223/ADP224/ADP225. Transient response to changes in
load current is also affected by output capacitance. Using a
larger value of output capacitance improves the transient response
of the ADP222/ADP223/ADP224/ADP225 to large changes in
load current. Figure 65 shows the transient responses for an
output capacitance value of 1 µF.
Figure 66 depicts the capacitance vs. voltage bias characteristic
of an 0402, 1 µF, 10 V, X5R capacitor. The voltage stability of a
capacitor is strongly influenced by the capacitor size and voltage
rating. In general, a capacitor in a larger package or higher voltage
rating exhibits better stability. The temperature variation of the
X5R dielectric is ~±15% over the −40°C to +85°C temperature
range and is not a function of package or voltage rating.
1.2
1.0
CAPACITANCE (µF)
CAPACITOR SELECTION
LOAD CURRENT
ON VOUT1
0.8
0.6
0.4
0.2
0
0
2
4
6
8
VOLTAGE (V)
2
Figure 66. Capacitance vs. Voltage Bias Characteristic
VOUT1
Use Equation 1 to determine the worst-case capacitance accounting
for capacitor variation over temperature, component tolerance,
and voltage.
VOUT2
CEFF = CBIAS × (1 − TEMPCO) × (1 − TOL)
3
B
W
M10µs A CH1
T 10.20%
200mA
(1)
where:
CBIAS is the effective capacitance at the operating voltage.
TEMPCO is the worst-case capacitor temperature coefficient.
TOL is the worst-case component tolerance.
09376-043
CH1 200mA Ω BW CH2 50mV
B
CH3 10mV
W
10
09376-044
1
Figure 65. Output Transient Response, COUT = 1 µF
Input Bypass Capacitor
Connecting a 1 µF capacitor from VIN to GND reduces the
circuit sensitivity to the printed circuit board (PCB) layout,
especially when long input traces or high source impedance
are encountered. If greater than 1 µF of output capacitance is
required, the input capacitor should be increased to match it.
In this example, the worst-case temperature coefficient (TEMPCO)
over −40°C to +85°C is assumed to be 15% for an X5R dielectric.
The tolerance of the capacitor (TOL) is assumed to be 10%, and
CBIAS is 0.94 µF at 1.8 V, as shown in Figure 66.
Substituting these values in Equation 1 yields
CEFF = 0.94 µF × (1 − 0.15) × (1 − 0.1) = 0.719 µF
Input and Output Capacitor Properties
Any good quality ceramic capacitors can be used with the
ADP222/ADP223/ADP224/ADP225, as long as they meet the
minimum capacitance and maximum ESR requirements.
Ceramic capacitors are manufactured with a variety of
dielectrics, each with different behavior over temperature and
applied voltage. Capacitors must have a dielectric adequate to
ensure the minimum capacitance over the necessary temperature
range and dc bias conditions. X5R or X7R dielectrics with a
voltage rating of 6.3 V or 10 V are recommended, but Y5V and
Z5U dielectrics are not recommended, due to their poor
temperature and dc bias characteristics.
Therefore, the capacitor chosen in this example meets the
minimum capacitance requirement of the LDO over temperature
and tolerance at the chosen output voltage.
To guarantee the performance of the ADP222/ADP223/
ADP224/ADP225, it is imperative that the effects of dc bias,
temperature, and tolerances on the behavior of the capacitors
be evaluated for each application.
Rev. B | Page 18 of 24
Data Sheet
ADP222/ADP223/ADP224/ADP225
3.5
1.4
VIN = 5.5V
OUTPUT VOLTAGE (V)
1.2
3.0
OUTPUT VOLTAGE (V)
The ADP222/ADP223/ADP224/ADP225 use the ENx pins to
enable and disable the VOUTx pins under normal operating
conditions. Figure 67 shows a rising voltage on ENx crossing
the active threshold, where VOUTx turns on. When a falling
voltage on ENx crosses the inactive threshold, VOUTx turns off.
ENx
3.3V
2.8V
1.8V
1.2V
2.5
2.0
1.5
1.0
1.0
0.5
0.8
0
0
100
200
300
400
500
600
800
900
1000
Figure 69. Typical Start-Up Time
0.4
PARALLELING OUTPUTS TO INCREASE OUTPUT
CURRENT
0
0.5
0.6
0.7
0.8
0.9
1.0
1.1
09376-045
0.2
1.2
ENABLE VOLTAGE (V)
Figure 67. Typical ENx Pin Operation, VIN = 5.5 V
As shown in Figure 67, the ENx pins have built-in hysteresis.
This prevents on/off oscillations that can occur due to noise on
the ENx pins as it passes through the threshold points.
The active/inactive thresholds of the ENx pins are derived from
the VIN voltage. Therefore, these thresholds vary with changing
input voltage. Figure 68 shows typical ENx active/inactive thresholds
when the input voltage varies from 2.5 V to 5.5 V.
1.2
The ADP223/ADP225 use a single band gap to generate the
reference voltage for each LDO. The reference voltages are
trimmed to plus or minus a couple of millivolts of each other.
This allows paralleling of the LDOs to increase the output
current to 600 mA. The adjust pins of each LDO are tied
together and a single output voltage divider sets the output
voltage. Even though the output voltage of each LDO is slightly
different, at high load currents, the resistance of the package
and the board layout absorbs the difference. Figure 70 shows
the schematic of a typical application where the LDO outputs
are paralleled.
VIN = 3.3V
ENx FALL
ENx RISE
+ C1
1µF
R2
1.0
R1
1
EN1
ADJ1 8
2
EN2
VOUT1 7
3
GND
VIN 6
4
ADJ2
VOUT2 5
0.8
OFF
ON
0.6
+ C2
1µF
0.4
VOUT2 = 2.8V
09376-053
ENABLE THRESHOLDS (V)
700
TIME (µs)
0.6
09376-047
ENABLE FEATURE
0.2
2.7
3.1
3.5
3.9
4.3
4.7
5.1
5.5
VIN (V)
Figure 70. Paralleling Outputs for Higher Output Current
09376-046
0
2.3
QUICK OUTPUT DISCHARGE (QOD) FUNCTION
Figure 68. Typical Enable Thresholds vs. Input Voltage
The ADP222/ADP223/ADP224/ADP225 use an internal soft
start to limit the inrush current when the output is enabled. The
start-up time for the 2.8 V option is approximately 240 µs from
the time the ENx active threshold is crossed to when the output
reaches 90% of its final value. The start-up time is somewhat
dependent on the output voltage setting and increases slightly as
the output voltage increases.
The ADP224/ADP225 include an output discharge resistor to
force the voltage on each output to zero when the respective
LDO is disabled. This ensures that the outputs of the LDOs are
always in a well-defined state, regardless if it is enabled or not.
The ADP222/ADP223 do not include the output discharge
function. Figure 71 compares the turn-off time of a 3.3 V output
LDO with and without the QOD function. Both LDOs have a
1 kΩ resistor connected to each output. The LDO with the
QOD function discharges the output to 0 V in less than 1 ms,
whereas the 1 kΩ load takes over 5 ms to do the same.
Rev. B | Page 19 of 24
ADP222/ADP223/ADP224/ADP225
Data Sheet
THERMAL CONSIDERATIONS
4.0
In most applications, the ADP222/ADP223/ADP224/ADP225
do not dissipate much heat due to its high efficiency. However,
in applications with high ambient temperature, and high supply
voltage to output voltage differential, the heat dissipated in
the package is large enough that it can cause the junction
temperature of the die to exceed the maximum junction
temperature of 125°C.
3.5
ENABLE
VOUT, NO QOD
VOUT, WITH QOD
VOLTS (V)
3.0
2.5
2.0
1.5
1.0
0
0
2000
4000
6000
8000
10000
TIME (µs)
09376-169
0.5
Figure 71. Typical Turn-Off Time with and Without QOD Function
CURRENT LIMIT AND THERMAL OVERLOAD
PROTECTION
The ADP222/ADP223/ADP224/ADP225 are protected against
damage due to excessive power dissipation by current and
thermal overload protection circuits. The ADP222/ADP223/
ADP224/ADP225 are designed to current limit when the output
load reaches 300 mA (typical). When the output load exceeds
300 mA, the output voltage is reduced to maintain a constant
current limit.
Thermal overload protection is included, which limits the
junction temperature to a maximum of 155°C (typical). Under
extreme conditions (that is, high ambient temperature and
power dissipation) when the junction temperature starts to rise
above 155°C, the output is turned off, reducing the output current
to 0. When the junction temperature drops below 140°C, the
output is turned on again, and output current is restored to its
nominal value.
Consider the case where a hard short from VOUTx to ground
occurs. At first, the ADP222/ADP223/ADP224/ADP225 current limits, so that only 300 mA is conducted into the short. If
self-heating of the junction is great enough to cause its temperature to rise above 155°C, thermal shutdown activates, turning
off the output and reducing the output current to 0 mA. As the
junction temperature cools and drops below 135°C, the output
turns on and conducts 300 mA into the short, again causing the
junction temperature to rise above 155°C. This thermal oscillation between 140°C and 155°C causes a current oscillation
between 300 mA and 0 mA that continues as long as the short
remains at the output.
When the junction temperature exceeds 155°C, the converter
enters thermal shutdown. It recovers only after the junction
temperature has decreased below 140°C to prevent any permanent
damage. Therefore, thermal analysis for the chosen application
is very important to guarantee reliable performance over all
conditions. The junction temperature of the die is the sum of
the ambient temperature of the environment and the temperature
rise of the package due to the power dissipation, as shown in
Equation 2.
To guarantee reliable operation, the junction temperature of
the ADP222/ADP223/ADP224/ADP225 must not exceed
125°C. To ensure that the junction temperature stays below this
maximum value, the user must be aware of the parameters that
contribute to junction temperature changes. These parameters
include ambient temperature, power dissipation in the power
device, and thermal resistances between the junction and ambient
air (θJA). The θJA number is dependent on the package assembly
compounds that are used and the amount of copper used to
solder the package GND pin to the PCB.
Table 6 shows typical θJA values of the 8-lead LFCSP package for
various PCB copper sizes, and Table 7 shows the typical ΨJB value
of the 8-lead LFCSP.
Table 6. Typical θJA Values
Copper Size (mm2)
251
100
500
1000
6400
1
θJA (°C/W)
175.1
135.6
77.3
65.2
51
Device soldered to minimum size pin traces.
Table 7. Typical ΨJB Value
Model
8-Lead LFCSP
Current and thermal limit protections are intended to protect
the device against accidental overload conditions. For reliable
operation, device power dissipation must be externally limited
so that junction temperatures do not exceed 125°C.
Rev. B | Page 20 of 24
ΨJB (°C/W)
18.2
Data Sheet
ADP222/ADP223/ADP224/ADP225
where:
TA is the ambient temperature.
PD is the power dissipation in the die, given by
PD = [(VIN − VOUT) × ILOAD] + (VIN × IGND)
where:
ILOAD is the load current.
IGND is the ground current.
VIN and VOUT are input and output voltages, respectively.
80
60
6400mm 2
1000mm 2
500mm 2
100mm 2
25mm 2
JEDEC
TJ MAX
40
20
0
Power dissipation due to ground current is quite small and can
be ignored. Therefore, the junction temperature equation
simplifies to the following:
As shown in the simplified equation, for a given ambient
temperature, input- to-output voltage differential, and continuous
load current, there exists a minimum copper size requirement
for the PCB to ensure that the junction temperature does not rise
above 125°C. Figure 72 to Figure 75 show junction temperature
calculations for different ambient temperatures, power dissipation,
and areas of PCB copper.
140
0
0.2
0.4
0.6
0.8
1.0
1.2
TOTAL POWER DISSIPATION (W)
Figure 73. 8-Lead LFCSP, TA = 50°C
140
JUNCTION TEMPERATURE TJ (°C)
TJ = TA + {[(VIN − VOUT) × ILOAD] × θJA}
120
100
80
60
6400mm 2
1000mm 2
500mm 2
100mm 2
25mm 2
JEDEC
TJ MAX
40
20
120
0
0
0.2
0.4
0.6
0.8
1.0
1.2
TOTAL POWER DISSIPATION (W)
100
Figure 74. 8-Lead LFCSP, TA = 85°C
80
140
20
0
0
0.2
0.4
0.6
0.8
TOTAL POWER DISSIPATION (W)
Figure 72. 8-Lead LFCSP, TA = 25°C
1.0
1.2
120
100
80
60
40
TB = 25°C
TB = 50°C
TB = 85°C
TJ MAX
20
0
0
1
2
3
4
5
TOTAL POWER DISSIPATION (W)
6
7
09376-051
6400mm 2
1000mm 2
500mm 2
100mm 2
25mm 2
JEDEC
TJ MAX
40
JUNCTION TEMPERATURE TJ (°C)
60
09376-048
JUNCTION TEMPERATURE TJ (°C)
100
09376-049
(2)
120
09376-050
TJ = TA + (PD × θJA)
JUNCTION TEMPERATURE TJ (°C)
140
The junction temperature of the ADP222/ADP223/ADP224/
ADP225 can be calculated by
Figure 75. 8-Lead LFCSP, TA = 85°C
In the case where the board temperature is known, use the
thermal characterization parameter, ΨJB, to estimate the
junction temperature rise (see Figure 75). Maximum junction
temperature (TJ) is calculated from the board temperature (TB)
and power dissipation (PD) using the following formula:
TJ = TB + (PD × ΨJB)
(3)
The typical value of ΨJB is 18.2°C/W for the 8-lead LFCSP package.
Rev. B | Page 21 of 24
ADP222/ADP223/ADP224/ADP225
Data Sheet
PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATIONS
GND
Heat dissipation from the package can be improved by
increasing the amount of copper attached to the pins of the
ADP222/ADP223/ADP224/ADP225. However, as listed in
Table 6, a point of diminishing returns is eventually reached
beyond which an increase in the copper size does not yield
significant heat dissipation benefits.
TB5
J1
R1 R2
EN1
TB2
VOUT1
TB1
VIN
R4
TB4
TB6
VOUT2
C1
J2
C3
R3
ADP223 - ________ - EVALZ
ANALOG
DEVICES
TB7
GND
Figure 76. Example 8-Lead LFCSP PCB Layout
Rev. B | Page 22 of 24
09376-052
EN2
Place the input capacitor as close as possible to the VIN and
GND pins. Place the output capacitor as close as possible to the
VOUTx and GND pins. Use of 0402 or 0603 size capacitors and
resistors achieves the smallest possible footprint solution on
boards where area is limited.
C2
U1
TB3
Data Sheet
ADP222/ADP223/ADP224/ADP225
OUTLINE DIMENSIONS
1.70
1.60
1.50
2.00
BSC SQ
0.50 BSC
8
5
PIN 1 INDEX
AREA
1.10
1.00
0.90
EXPOSED
PAD
0.425
0.350
0.275
1
4
TOP VIEW
BOTTOM VIEW
0.60
0.55
0.50
07-11-2011-B
0.30
0.25
0.20
PIN 1
INDICATOR
(R 0.15)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.05 MAX
0.02 NOM
SEATING
PLANE
0.175 REF
0.20 REF
Figure 77. 8-Lead Lead Frame Chip Scale Package [LFCSP_UD]
2.00 mm × 2.00 mm Body, Ultra Thin, Dual Lead
(CP-8-10)
Dimensions shown in millimeters
ORDERING GUIDE
Model 1
ADP222ACPZ-1218-R7
Temperature Range
−40°C to +125°C
Output Voltage (V)
VOUT1
VOUT2
1.2
1.8
ADP222ACPZ-1228-R7
−40°C to +125°C
1.2
2.8
ADP222ACPZ-1233-R7
−40°C to +125°C
1.2
3.3
ADP222ACPZ-1528-R7
−40°C to +125°C
1.5
2.8
ADP222ACPZ-1533-R7
−40°C to +125°C
1.5
3.3
ADP222ACPZ-1815-R7
−40°C to +125°C
1.8
1.5
ADP222ACPZ-1825-R7
−40°C to +125°C
1.8
2.5
ADP222ACPZ-1827-R7
−40°C to +125°C
1.8
2.7
ADP222ACPZ-1833-R7
−40°C to +125°C
1.8
3.3
ADP222ACPZ-2818-R7
−40°C to +125°C
2.8
1.8
ADP222ACPZ-2827-R7
−40°C to +125°C
2.8
2.7
ADP222ACPZ-3325-R7
−40°C to +125°C
3.3
2.5
ADP222ACPZ-3328-R7
−40°C to +125°C
3.3
2.8
ADP222ACPZ-3330-R7
−40°C to +125°C
3.3
3.0
ADP224ACPZ-2818-R7
−40°C to +125°C
2.8
1.8
ADP225ACPZ-R7
−40°C to +125°C
Adjustable
Adjustable
Package Description
8-Lead Lead Frame Chip Scale
Package [LFCSP_UD]
8-Lead Lead Frame Chip Scale
Package [LFCSP_UD]
8-Lead Lead Frame Chip Scale
Package [LFCSP_UD]
8-Lead Lead Frame Chip Scale
Package [LFCSP_UD]
8-Lead Lead Frame Chip Scale
Package [LFCSP_UD]
8-Lead Lead Frame Chip Scale
Package [LFCSP_UD]
8-Lead Lead Frame Chip Scale
Package [LFCSP_UD]
8-Lead Lead Frame Chip Scale
Package [LFCSP_UD]
8-Lead Lead Frame Chip Scale
Package [LFCSP_UD]
8-Lead Lead Frame Chip Scale
Package [LFCSP_UD]
8-Lead Lead Frame Chip Scale
Package [LFCSP_UD]
8-Lead Lead Frame Chip Scale
Package [LFCSP_UD]
8-Lead Lead Frame Chip Scale
Package [LFCSP_UD]
8-Lead Lead Frame Chip Scale
Package [LFCSP_UD]
8-Lead Lead Frame Chip Scale
Package [LFCSP_UD]
8-Lead Lead Frame Chip Scale
Package [LFCSP_UD]
Rev. B | Page 23 of 24
Package Option
CP-8-10
Branding
L16
CP-8-10
L17
CP-8-10
L18
CP-8-10
LKR
CP-8-10
LKS
CP-8-10
LL0
CP-8-10
LL1
CP-8-10
L3A
CP-8-10
LL2
CP-8-10
LL3
CP-8-10
LJE
CP-8-10
LKV
CP-8-10
LKW
CP-8-10
LKX
CP-8-10
LKP
CP-8-10
LKQ
ADP222/ADP223/ADP224/ADP225
Model
ADP223ACPZ-R7
1
ADP223CP-EVALZ
ADP225CP-EVALZ
1
Temperature Range
−40°C to +125°C
Data Sheet
Output Voltage (V)
VOUT1
VOUT2
Adjustable Adjustable
Adjustable
Adjustable
Adjustable
Adjustable
Package Description
8-Lead Lead Frame Chip Scale
Package [LFCSP_UD]
Evaluation Board
Evaluation Board
Z = RoHS Compliant Part.
©2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09376-0-8/11(B)
Rev. B | Page 24 of 24
Package Option
CP-8-10
Branding
LJQ