GILWAY GHB-0603-YG

55 Commerce Way
Woburn, MA 01801
(781) 935 - 4442
(781) 938 - 5867
www.gilway.com
GHB-1603-YG
Features
Description
!1.6mmx0.8mm
!LOW POWER
!WIDE
!IDEAL
SMT LED, 1.1mm THICKNESS.
CONSUMPTION.
The Mega Green source color devices are made
with DH InGaAlP on GaAs substrate Light
VIEWING ANGLE.
Emitting Diode.
FOR BACKLIGHT AND INDICATOR.
!VARIOUS
COLORS AND LENS TYPES AVAILABLE.
!PACKAGE
: 2000PCS / REEL.
1.6x0.8mm SMD CHIP LED LAMP
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is 0.1(0.004") unless otherwise noted.
3. Specifications are subject to change without notice.
REV NO: V.2
DATE:DEC/05/2002
PAGE: 1 OF 4
Selection Guide
P
Pa
a
art
rt N
No
No.
o..
M EGA GREEN (InGaAlP)
GHB-0603-YG
IIv
((mcd
m c dd)
v (mcd)
@ 20mA
Lens
L
e
ens
nss T
Typ
Tyy pe
Diic
ce
WATER CLE AR
V
Viewin
Viiewing
i ew i n g
Angle
in.
Miin
n.
T
Typ
Tyyyp
pp..
18
70
120°
Note:
1 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at TA=25 C
its
Un
nit
t io nss
o n d iition
T
Test
e
est
ss t C
Cond
574
nm
I F =20mA
Mega Green
568
nm
I F =20mA
S pectral Line Half-width
Mega Green
26
nm
I F =20mA
C
Capacitance
Mega Green
20
pF
V F =0V;f =1MHz
VF
Forward Voltage
Mega Green
2.1
2.5
V
I F =20mA
IR
Reverse Current
Mega Green
10
uA
V R = 5V
S
Sy
yymbol
ymbo
mb o l
P
Pa
a
aramete
r am e t er
peak
P eak Wavelength
Mega Green
D
D ominate Wavelength
1/2
ev ic e
De
evic
TTyyyp
pp..
xx..
ax
Ma
Absolute Maximum Ratings at TA=25 C
P
Paramete
Pa
a
arameter
r am et er
Mega
eg a Green
G
Gree
r een
U
Unit
n
nit
i ts
Power dissipation
1 05
mW
DC Forward Current
30
mA
Peak Forward Current [1]
1 50
mA
Reverse Voltage
5
V
Operating/Storage Temperature
-40 C To +85 C
Lead Solder Temperature [2]
260 C For 5 Seconds
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
REV NO: V.2
DATE:DEC/05/2002
PAGE: 2 OF 4
REV NO: V.2
DATE:DEC/05/2002
PAGE: 3 OF 4
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
REV NO: V.2
DATE:DEC/05/2002
PAGE: 4 OF 4