55 Commerce Way Woburn, MA 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway.com GHB-1603-YG Features Description !1.6mmx0.8mm !LOW POWER !WIDE !IDEAL SMT LED, 1.1mm THICKNESS. CONSUMPTION. The Mega Green source color devices are made with DH InGaAlP on GaAs substrate Light VIEWING ANGLE. Emitting Diode. FOR BACKLIGHT AND INDICATOR. !VARIOUS COLORS AND LENS TYPES AVAILABLE. !PACKAGE : 2000PCS / REEL. 1.6x0.8mm SMD CHIP LED LAMP Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. REV NO: V.2 DATE:DEC/05/2002 PAGE: 1 OF 4 Selection Guide P Pa a art rt N No No. o.. M EGA GREEN (InGaAlP) GHB-0603-YG IIv ((mcd m c dd) v (mcd) @ 20mA Lens L e ens nss T Typ Tyy pe Diic ce WATER CLE AR V Viewin Viiewing i ew i n g Angle in. Miin n. T Typ Tyyyp pp.. 18 70 120° Note: 1 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25 C its Un nit t io nss o n d iition T Test e est ss t C Cond 574 nm I F =20mA Mega Green 568 nm I F =20mA S pectral Line Half-width Mega Green 26 nm I F =20mA C Capacitance Mega Green 20 pF V F =0V;f =1MHz VF Forward Voltage Mega Green 2.1 2.5 V I F =20mA IR Reverse Current Mega Green 10 uA V R = 5V S Sy yymbol ymbo mb o l P Pa a aramete r am e t er peak P eak Wavelength Mega Green D D ominate Wavelength 1/2 ev ic e De evic TTyyyp pp.. xx.. ax Ma Absolute Maximum Ratings at TA=25 C P Paramete Pa a arameter r am et er Mega eg a Green G Gree r een U Unit n nit i ts Power dissipation 1 05 mW DC Forward Current 30 mA Peak Forward Current [1] 1 50 mA Reverse Voltage 5 V Operating/Storage Temperature -40 C To +85 C Lead Solder Temperature [2] 260 C For 5 Seconds Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. REV NO: V.2 DATE:DEC/05/2002 PAGE: 2 OF 4 REV NO: V.2 DATE:DEC/05/2002 PAGE: 3 OF 4 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) REV NO: V.2 DATE:DEC/05/2002 PAGE: 4 OF 4