VISHAY TFMM5560

TFMM5..0
Vishay Telefunken
Photo Modules for PCM Remote Control Systems
Available types for different carrier frequencies
Type
TFMM 5300
TFMM 5360
TFMM 5380
TFMM 5560
fo
30 kHz
36 kHz
38 kHz
56 kHz
Type
TFMM 5330
TFMM 5370
TFMM 5400
fo
33 kHz
36.7 kHz
40 kHz
Description
The TFMM5..0 – series are miniaturized receivers for
infrared remote control systems. PIN diode and preamplifier are assembled on PC board, the epoxy
package is designed as IR filter.
The demodulated output signal can directly be decoded by a microprocessor. The main benefit is the
reliable function even in disturbed ambient and the
protection against uncontrolled output pulses.
95 10266
Features
Photo detector and preamplifier in one package
5 Volt supply voltage, low power consumption
Output active low
TTL and CMOS compatibility
Internal filter for PCM frequency
Continuous transmission possible (tpi/T0.4)
High immunity against ambient light
SMD
High shielding against electric field disturbance
Block Diagram
2
Control
Circuit
Input
100 k
3
PIN
AGC
Band
Pass
VS
OUT
Demodulator
1
GND
94 8136
Document Number 82003
Rev. 3, 14-Sep-00
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1 (10)
TFMM5..0
Vishay Telefunken
Absolute Maximum Ratings
Tamb = 25_C
Parameter
Supply Voltage
Supply Current
Output Voltage
Output Current
Junction Temperature
Storage Temperature Range
Operating Temperature Range
Power Consumption
Soldering Temperature
Test Conditions
(Pin 2)
(Pin 2)
(Pin 3)
(Pin 3)
(Tamb 85 C)
t 10 s, 1 mm from case
Symbol
VS
IS
VO
IO
Tj
Tstg
Tamb
Ptot
Tsd
Value
–0.3...6.0
5
–0.3...6.0
5
100
–40...+85
–25...+85
50
230
Unit
V
mA
V
mA
C
C
C
mW
C
Typ
0.5
1.0
35
Max
0.8
Unit
mA
mA
m
250
mV
Basic Characteristics
Tamb = 25_C
Parameter
Supply
Su
ly Current (Pin 2)
Transmission Distance
Output Voltage Low (Pin 3)
Irradiance (30 – 40 kHz)
Irradiance (56 kHz)
Irradiance
Directivity
Test Conditions
VS = 5 V, Ev = 0
VS = 5 V, Ev = 40 klx, sunlight
Ev = 0, test signal see fig.7,
IR diode TSIP5201, IF = 1.5 A
IOSL = 0.5 mA,Ee = 0.7 mW/m2,
f = fo, tp/T = 0.4
Pulse width tolerance:
tpo = tpii±160 ms,
ms
test signal (see fig.7)
Angle of half transmission distance
Symbol
ISD
ISH
d
Min
0.4
VOSL
Ee min
0.6
mW/m 2
Ee min
0.8
mW/m 2
±40
W/m 2
deg
Ee max
ϕ1/2
20
Application Circuit
330 W *)
2
TFM. 5..0
TSUS 5...
TSIP 5...
3
4.7 mF *)
+ 5V **)
>10 kW
optional
mC
1
94 8137
GND
*) only necessary to suppress power supply disturbances
**) tolerated supply voltage range : 4.5V< VS < 5.5 V
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Document Number 82003
Rev. 3, 14-Sep-00
TFMM5..0
Vishay Telefunken
Typical Characteristics (Tamb = 25_C unless otherwise specified)
0.8
0.6
0.4
E
e min
0.2
4
Ee min – Threshold Irradiance ( mW/m 2 )
/e E – Rel. Responsitivity
1.0
f = f0"5%
Df ( 3 dB ) = f0 / 10
3
2
1
0.0
0
0.7
0.8
0.9
1.0
1.1
1.3
1.2
f / f0 – Relative Frequency
94 8143
Input Burst Duration
600
400
200
l = 950 nm, Optical Test Signal, Fig.7
0
1
10
100
Ee – Irradiance (
95 10187
1000
2.0
1.6
100
f = f0
10
10 kHz
1
100 Hz
mW / m2
10000
)
Ee min – Threshold Irradiance ( mW/m 2 )
1
0.1
1
E – Irradiance (
10
W / m2
)
Figure 3. Sensitivity in Bright Ambient
Document Number 82003
Rev. 3, 14-Sep-00
1
10
1000
100
DVs RMS – AC Voltage on DC Supply Voltage ( mV )
Figure 5. Sensitivity vs. Supply Voltage Disturbances
10
0.1
0.01
0.1
95 10194
Figure 2. Sensitivity in Dark Ambient
Ee min – Threshold Irradiance ( mW/m 2 )
1.2
0.1
0.1
95 10189
0.8
Figure 4. Sensitivity vs. Electric Field Disturbances
Ee min – Threshold Irradiance ( mW/m2 )
tpo – Output Pulse Length ( m s )
1000
0.4
E – Field Strength of Disturbance ( kV / m )
95 10188
Figure 1. Frequency Dependence of Responsivity
800
0
100
1.0
0.8
Sensitivity in dark Ambient
0.6
0.4
0.2
0.0
–30
95 10195
0
30
90
60
Tamb – Ambient Temperature ( °C )
Figure 6. Sensitivity vs. Ambient Temperature
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TFMM5..0
Vishay Telefunken
Optical Test Signal
( IR diode TSIP 5201, IF = 1.5 A, 30 pulses, f = f0, T = 10 ms )
t
tpi *
T
* tpi w 400 ms is recommended for optimal function
Output Signal
VO
VOH
94 8133
1.0
T on ,T off - Output Pulse Length ( ms )
Ee
tpo = tpi "160 ms
0.8
Ton
0.6
Toff
0.4
0.2
l = 950 nm, Optical Test Signal, Fig.8
0.0
0.1
VOL
t
1
10
100
1000
10000
Ee – Irradiance ( mW / m2 )
95 10191
tpo
Figure 10. Output Pulse Diagram
Figure 7. Output Function
Optical Test Signal
1.0
600 ms
t
600 ms
T = 60 ms
94 8134
VO
Output Signal, ( see Fig.10 )
Is – Supply Current ( mA )
Ee
Vs = 5 V
0.8
0.6
0.4
0.2
VOH
0.0
–30
VOL
Ton
t
Toff
S ( l )rel – Relative Spectral Sensitivity
Ee min – Threshold Irradiance ( mW/m 2 )
8
6
4
2
0.15
0.25
0.35
tp / T – Duty Cycle
95 10190
Figure 9. Sensitivity vs. Duty Cycle
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4 (10)
30
60
90
Figure 11. Supply Current vs. Ambient Temperature
Figure 8. Output Function
0
0.05
0
Tamb – Ambient Temperature ( °C )
94 8150
1.2
1.0
0.8
0.6
0.4
0.2
0
750
0.45
94 8408
850
950
1050
1150
l – Wavelength ( nm )
Figure 12. Relative Spectral Sensitivity vs. Wavelength
Document Number 82003
Rev. 3, 14-Sep-00
TFMM5..0
Vishay Telefunken
–20
–10
0
10
–20
20
–30
–10
0
0.2
0
10
20
–30
fy
fx
–40
–40
0.6
0.4
0.2
0
0.2
0.6
0.4
drel – Relative Transmission Distance
0.6
95 10192
Figure 13. Vertical Directivity ϕy
95 10193
0.4
0.2
0.4
0.6
drel – Relative Transmission Distance
Figure 14. Horizontal Directivity ϕx
Soldering Pads for Reflow Soldering
2.2
2.8
2.8
2.2
2.0
1.6
1.7
GND1
(Case GND)
1.7
1.6
1.6
Note: Mounting area on the PC board for
TFMM.... series has to be solid grounded
and has to be insulated by resist.
95 10185
Pinning
Light Receiving Window
Case GND
Vcc
GND1
Out
GND2
95 10186
Document Number 82003
Rev. 3, 14-Sep-00
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5 (10)
TFMM5..0
Vishay Telefunken
Dimensions in mm
15904
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6 (10)
Document Number 82003
Rev. 3, 14-Sep-00
TFMM5..0
Vishay Telefunken
Operating Instructions
Reflow Soldering
DReflow soldering must be done within 48 hoursstored
under max. 30°C, 80% RH after opening envelop
DRecommended soldering paste
(composition: SN 63%, Pb 37%)
Melting temperature 178 to 192°C
DApply solder paste to the specified soldering padsusing a dispenser or by screen printing.
DRecommended thickness of metal mask is 0.2 mmfor
screen printing.
DThe recommended reflow furnace is a combinationtype with upper and lowewr heaters.
DSet the furnace temperatures for pre-heating andheating
in
accordance
with
the
reflow
temperatureprofile as schown below. Excercise extreme care tokeep the maximum temperature below
230_C. Thefollowing temperature profile means the
temperature at the device surface. Since temperature
difference occurs between the work and the surface of
the circuit board depending on the pes of circuit board
or reflow furnace, the operating conditions should be
verified prior to start of operation.
DHandling after reflow should be done only after the
work surface has been cooled off.
Manual Soldering
DUse the 6/4 solder or the solder containing silver.
DUse a soldering iron of 25 W or smaller. Adjust the
temperature of the soldering iron below 300_C.
DFinish soldering within three seconds.
DHandle products only after the temperature is cooled
off.
Cleaning
DPerform cleaning after soldering strictly in
conformance to the following conditions:
Cleaning agent:
2-propanol (isopropyl alcohol).
Commercially available grades (industrial
use) should be used.
Demineralized or distilled water having a
resistivity of not less than 500 m
corresponding to a conductivity of 2 mS/m.
DTemperature and time: 30 seconds under the
temperature below 50_C or 3 minutes below 30_C.
DUltrasonic cleaning: Below 20 W.
94 8625
300
max. 240 °C
ca. 230 °C
10 s
250
215 °C
Temperature (° C )
200
150
max. 160 °C
max. 40 s
100
90 – 120 s
full line
: typical
dotted line : process limits
50
2–4 K / s
Lead Temperature
0
50
100
150
200
250
Time ( s )
Document Number 82003
Rev. 3, 14-Sep-00
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7 (10)
TFMM5..0
Vishay Telefunken
Taping Specifications
(1)
Shape and dimensions of reels (in accordance with EIAJRC-1009B); unit in mm
∅ 13.5
12.5
∅ 24.8
23.2
2.6
1.4
∅ 101
99
∅ 332
328
2.5
1.5
(2)
18.4
16.4
Label
95 10204
Dimensions of tape
8.8
8.6
95 10200
4.1
3.9
1.85
1.65
R=0.80
0.75
7,6
7,4
16.3
15.7
8.4
8.2
0.35
0.25
3.7
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8 (10)
2.05
1.95
12.1
11.9
Direction of Pulling Out
Document Number 82003
Rev. 3, 14-Sep-00
TFMM5..0
Vishay Telefunken
(3)
Configuration of tapes
Empty
Parts mounted
Empty
Leader
End
Start
<
>
<
40 mm min.
(4)
>
<
>
40 mm min. 200 mm min.
Quantity
1000 pcs. per reel
Packing
(1)
Dampproof packing
Products will be packed in anti-humidity aluminium
bags to prevent the products from moisture absorption
during transportation and storage. Each bag contains
a desiccant with moisture indicators. In the event bags
absorb moisture, the indicators change their color from
blue to pink.
Aluminiumbag
Desiccant
Label
Reel
95 10203
(2)
Recommended method of storage
Dry box storage is recommended to prevent the parts
from moisture absorption. The following conditions
should be preserved if dry boxes are not available.
Storage temperature:
10 – 30_C
Storage humidity: 60% RH max
In case of moisture absorption the device will recover
to the former conditon by drying under the following
recommended conditions:
taped version:
untaped version:
60_C/48 h
125_C/2 h
Lot Number
3 digits
5 18
Last digit of calendar year
Month code
Lot number is labeled on the aluminum bag and also indicated on the reverse side of each part.
Document Number 82003
Rev. 3, 14-Sep-00
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9 (10)
TFMM5..0
Vishay Telefunken
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as their
impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of
ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer application
by the customer. Should the buyer use Vishay-Telefunken products for any unintended or unauthorized application, the
buyer shall indemnify Vishay-Telefunken against all claims, costs, damages, and expenses, arising out of, directly or
indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 ( 0 )7131 67 2831, Fax number: 49 ( 0 )7131 67 2423
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Document Number 82003
Rev. 3, 14-Sep-00