TRIQUINT TQ6124

T
R
I
Q
U
I
N
T
S E M I C O N D U C T O R, I N C .
The TQ6124 is a 14-bit monolithic digital-to-analog converter. The TQ6124
achieves conversion accuracy by using a segmented architecture, precision
current sources, and on-chip nichrome resistors. The only external
components required are an external reference and loop control amplifier.
The TQ6124 is ideally suited for applications in direct digital synthesis,
pixel generation for high-resolution monitors, broadband video generation,
and high-speed arbitrary waveform generators.
TQ6124
1 Gigasample/sec,
14-bit Digital-to-Analog
Convertor
Features
Figure 1. TQ6124 Block Diagram
• 1Gs/s aggregate bandwidth
LSBs
CLK NCLK
D0
D1
D2
D3
MSBs
Intermediate Bits
D4
D5
D6
D7
D8
D9
• 14-bit resolution
D10 D11 D12 D13
• RF front end
• ECL-compatible inputs
• 0.026% DC differential
non-linearity
• 0.035% DC integral non-linearity
Delay
Stages
S1
S2
...
...
...
S14 S15
Segment
Encoders
• SFDR: 52 dBc @ FOUT = 75 MHz
48 dBc @ FOUT = 148 MHz
45 dBc @ FOUT = 199 MHz
• 1.4 W power dissipation
Slave
Latch
Current
Switches
• 44-pin ceramic QFP package
or die only
Applications
• Direct Digital Synthesis
• Pixel generation for workstations
and high-end monitors
• Direct-generation of broadband
video for cable TV
50 ohm R-2R Ladder Network
VO
VAA
MID_trim
NVO
• High-speed arbitrary waveform
generators
Current
Source
Array
LSB_trim
VREF
VSENSE
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1
MIXED SIGNAL
PRODUCTS
Master
Latch
TQ6124
Functional Description
The TQ6124 registers incoming bits in a master latch
array. The value of the four most-significant bits is
encoded into an n-of-15 thermometer code while the ten
low-order bits pass though an equalizing delay stage. All
25 bits are re-registered in a 25-wide slave latch array
which drives a set of 25 differential pair switches. These
switches steer the corresponding segment and bit
currents into the true (VO) and complementary (NVO)
outputs. This architecture minimizes glitch impulses by
eliminating large mid-scale current transitions.
binary-weighted currents of magnitude IFS/32, IFS/64
and IFS/128 to the outputs. The seven least-significant
bits steer identical IFS/128 currents into a differential
R-2R ladder to generate effective bit currents of IFS/256
to IFS/16384. The DAC output is the sum of the
outputs of the segments and the low-order bits.
Clock and data inputs are ECL-compatible. The outputs
are designed to operate into a 50Ω load, with internal
reverse termination to ground being provided by the
R-2R network.
The most-significant bits generate the segment
currents, which are of equal weight at 1/16 of the fullscale output (IFS). The ten lower-order bits are divided
into two subgroups. The three intermediate bits steer
External compensation is utilized to minimize the effects
of device mismatch. An external op amp senses the sum
of the segment, the intermediate bit, and the LSB currents.
Figure 2. TQ6124 Currents
Segments 1 thru 15
VO
To switches for D0 thru D9
NVO
Q
ID8
ID9
NQ
1.25mA
ID7
.625mA
ID6
dummy
.3125mA .3125mA
dummy
.3125mA
.3125mA
(x8)
2.5mA
VREF
VSENSE
R SENSE
5.8KΩ
R SENSE
5.8KΩ
RSENSE
5.8KΩ
R SOURCE
1.2KΩ
R SOURCE
1.2KΩ
MID_trim
2
R SOURCE
1.2KΩ
VAA
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LSB_trim
TQ6124
Electrical Specifications
Table 1. Recommended Operating Conditions
Symbol
Parameter
Min.
Nom.
Max.
Unit
VSS
VAA
Negative Power Supply
Analog Power Supply
–5.25
–15.5
–5.0
–12
–4.75
–11.5
V
V
TC
Case Temperature
85
°C
–20
Symbol
Parameter
IAA
ISS
VAA Supply Current
VSS Supply Current
VREF
IREF
VIH
VIL
II
Reference Voltage
Reference input current
ECL Input High Voltage
ECL Input Low Voltage
ECL Input Current
VEREF
REREF
DNL
INL
ECL Reference Voltage
ECL Reference Resistance
Differential non-linearity
Integral non-linearity
Full-scale symmetry
Full-scale output voltage
VO, NVO, output resistance
ROUT Matching
Output Voltage
Zero Scale Voltage
Sense output voltage
Thermal Impedance
VFS
ROUT
VO, NVO
VZS
VSENSE
θJC
Condition
VEREF = –1.3 V
VEREF = –1.3 V
Min.
VAA + 2.5
–25
–1.1
–2.5
–25
VSS = –5.0 V
(Note 2)
(Note 2)
(Note 1)
RL = 50 ohms
–0.05
–0.05
–8
44
–2.5
–1.125
–50
VAA + 2.5
Nom.
Max.
Unit
–75
–285
–90
–450
mA
mA
VAA + 3.0
VAA + 3.75
25
–0.6
–1.5
25
V
mA
V
V
mA
–1.34
400
0.026
0.035
2
–1.0
50.9
0.15
–40
0.05
0.05
8
–1.125
57
2.5
0
0
VAA + 3.75
15
MIXED SIGNAL
PRODUCTS
Table 2. DC Operating Characteristics
Unless otherwise specified, measured over Recommended Operating Conditions with balanced 50 Ω loads, VFS = 1.0 V.
V
ohms
%F.S.
%F.S.
mV
V
ohms
%
V
mV
V
°C/W
Notes: 1. Full-scale symmetry is a measure of the balance between VO and NVO. For a full-scale output transition,
the change in VO will match the change in NVO to within the specified amount. Any imbalance in the
output loads will affect symmetry.
2. Linearity can interpreted as 10 bits at 1/2 LSB or as 11 bits at 1 LSB. The device is monotonic to 10 bits.
Linearity is tested with the Mid_trim set for optimal DNL, with the LSB_trim pin open.
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TQ6124
Table 3. AC Operating Characteristics
Unless otherwise noted, measured over DC operating characteristics with balanced 50Ω loads,
VFS = 0.8V, VIN = 0.8VP-P, input rise and fall times ≤ 300 ps.
Symbol
Parameter
Condition
Min.
Typ.
FCLK
tR , tF
Clock Frequency
At full scale
tDS
Data Setup Time
200
ps
tDH
tCLKHI
Data Hold Time
Clock High Time
300
400
ps
ps
tCLKLO
SFDR*
Clock Low Time
Spurious free dynamic range
50
10% to 90%
FOUT = 75 MHz
FOUT = 148 MHz
FOUT = 199 MHz
400
45
45
45
Max.
Unit
1000
350
MHz
ps
ps
dBc
dBc
dBc
52
52
49
*Note: SFDR testing performed at FCLK = 600 MHz only.
Table 4. Absolute Maximum Ratings
Symbol
Parameter
VSS
VAA
VO, NVO
VI
Digital Supply
Analog Supply
Analog Output Voltage
Digital Input Voltage
II
VREF
IREF
Digital Input Current
Reference Voltage
Reference Current
Power Dissipation
Storage Temperature
Operating Junction Temperature
TSTG
TJ
Min.
–7.0
–16.0
–2.0
VSS – 0.5
–1.0
VAA-2
–1
–65
Note: Absolute Maximum Ratings are those beyond which the integrity of the device cannot be guaranteed.
If the device is subjected to the limits in the absolute maximum ratings, its reliability may be impaired.
The Electrical Specifications tables provide conditions for actual device operation.
4
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Max.
Unit
2.0
+0.5
V
V
V
V
+1.0
0
1
5
150
150
mA
V
mA
W
°C
°C
TQ6124
AC Timing
The low-going transition of CLK latches the data.
Production SFDR testing is performed with the clock
transitioning in the center of the data eye. The timing of
the clock transition with respect to the data can
improve SFDR performance. Systems working to
optimize SFDR can 'tune' this phase relationship to
optimize the desired characteristic.
Figure 3. AC Timing Relationships
tDS
tDH
Data
Clock
Operating Notes
Current Source Control Loop
around VAA+3V can be set. Adjusting the full scale
output voltage can be achieved by toggling the inputs
over full scale while adjusting the control voltage to
achieve the desired level.
VAA
Figure 4. Adjusting the Full-Scale Output Voltage
1 KΩ
VAA
20 KΩ
LSB_TRIM
1KΩ
1 KΩ
620 Ω
20 KΩ
20 KΩ
VOUT
MID_TRIM
1 KΩ
+
+VIN
MIXED SIGNAL
PRODUCTS
The full scale output voltage is set through the use of
an external op amp, as shown in Figure 4. Nominal full
scale output voltage can be achieved by using a voltage
source. With this, control voltages on the op amp of
VREF
–
MC34071
AD586
VAA
VSENSE
VAA
VREF Adjustment Range
Figure 5. Full-Scale Output Voltage vs. VREF
1.2
Full-Scale Output Voltage
The output full scale voltage range can be set through
the VREF input. Figure 5 shows the approximate
relationship between VREF and VFS.
–1
1.0
0.8
0.6
0.4
0.2
0
1
2
3
Reference Voltage (vs VAA)
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4
5
TQ6124
Operating Notes (continued)
Power Supplies
buffers, or in VTT, may benefit from adjustments in the
reference. The ECL reference pin may be driven externally.
Its equivalent load is 400 ohms to –1.3V (nominal).
Optimized performance depends on clean supplies.
Utilize very low impedance negative supplies that are
decoupled over a wide frequency range. The analog and
digital grounds should be isolated at the chip, connecting
to a single point ground on the circuit board.
Trim Adjustments
The external trim adjustments for the midrange bits
and the LSBs is optional. Trimming is performed by
monitoring the attribute of greatest concern (INL, DNL,
Spurious levels) while minimizing the unwanted effects.
Trim inputs should be left open if not used.
ECL Reference
The single-ended data inputs switch against an internal
reference of -1.3V (nominal). Variations among input
Signals
36 D 4
35 D 3
34 VSS
2
3
32
31
4
5
6
7
8
9
10
11
30
29
28
27
26
25
D2
D1
D 0 (LSB)
TQ6124
Top View
22
VAA
AGND 18
AGND 19
20
VSNS
21
V REF
VO
17
24
23
VSS
6
38 D 5
37 DGND
VSS
12
NCLK
VSS
33
AGND 13
D11
D12
D13 (MSB)
DGND
DGND
DGND
CLK
1
14
I REF
AGND 15
16
NVO
VSS
D10
40 DGND
39 D 6
44 VSS
43 D9
42 D8
41 D 7
Figure 6. TQ6124 Pinout
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DGND
DGND
ECLref
LSBtrim
Midtrim
VAA
VAA
TQ6124
Table 5. Signal-Pin Descriptions
Signal
Pin(s)
DGND
6, 7, 8, 28, 29, 37, 40
Ground connection for digital circuitry.
AGND
D0 thru D13
13, 15, 18, 19
30, 31, 32, 35, 36, 38, 39,
41, 42, 43, 2, 3, 4, 5
17, 16
Ground connection for analog circuitry.
Data inputs. D0 is the least significant bit. ECL levels.
VO, NVO
Description
True and complementary analog outputs.
9, 10
True and complementary clock inputs. ECL levels.
IREF
VSENSE
VREF
VSS
VAA
Mid_trim
LSB_trim
ECLref
14
20
21
1, 11, 12, 33, 34, 44
22, 23, 24
25
26
27
Connect to AGND. Source of dummy currents in the switch array.
Sense Output.
Reference Input.
Digital negative power supply.
Analog negative power supply.
Trim terminal for mid range bits.
Trim terminal for LSB range bits.
Optional ECL reference level adjustment. Thevinin equivalent is 1.3V
nominally into 400 ohms. Equivalent voltage tracks with digital supply.
MIXED SIGNAL
PRODUCTS
CLK, NCLK
Typical Performance Data
The graph in Figure 7 shows representative
performance data of spurious free dynamic range
(SFDR) vs. output frequency performance measured
from TQ6124 devices.
Figure 7. SFDR vs. Output Frequency
–65
–60
–55
Data was collected at room temperature; note,
however, that SFDR is not strongly dependendent on
temperature. Optimum performance is obtained by
utilizing as high a clock rate as practical.
–50
SFDR
–45
–40
–35
–30
0
50
100
150
200
250
300
350
400
450
500
FOUT
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7
TQ6124
Packaging
Figure 8. 44-pin QFP Package Dimensions
Top View
BottomView
0.805
.650
44
Pin 1
Index
1
Ceramic or
metal lid
A
A
.050
.015
BSC
All dimensions in inches
Section A-A
Device
.125
Seating plane
.035 typ.
8
.065
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TQ6124
TQ6124-CM
TQ6124-CD
ETF6124
MIXED SIGNAL
PRODUCTS
Ordering Information
1 GS/s 14-bit DAC in 44-pin ceramic QFP
1 GS/s 14-bit DAC — die only
Engineering Test Fixture with TQ6124 device
Additional Information
For latest specifications, additional product information,
worldwide sales and distribution locations, and information about TriQuint:
Web: www.triquint.com
Email: [email protected]
Tel: (503) 615-9000
Fax: (503) 615-8900
For technical questions and additional information on specific applications:
Email: [email protected]
The information provided herein is believed to be reliable; TriQuint assumes no liability for inaccuracies or
omissions. TriQuint assumes no responsibility for the use of this information, and all such information
shall be entirely at the user's own risk. Prices and specifications are subject to change without notice.
No patent rights or licenses to any of the circuits described herein are implied or granted to any third party.
TriQuint does not authorize or warrant any TriQuint product for use in life-support devices and/or systems.
Copyright © 1997 TriQuint Semiconductor, Inc. All rights reserved.
Revision 1.1.A
November 1997
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