Product Brief PMB 7850 E-GOLD+ V3 GSM/GPRS Single Chip Baseband IC E - G O L D + V 3 i s a G S M / G P R S s i n g l e c h i p mixed signal baseband IC. It combines the analog and digital functionality of a cellular radio together with 2 Mbit on-chip SRAM. It is designed in Infineon Technologies’ proven 0.18 µm 1.8 V technology. E-GOLD+ V3 perfectly meets the ever increasing demands of the GSM cellular subscriber market for low/mid-range devices with data-enabled terminals at low costs. Due to its flexible interfaces E-GOLD+ V3 can be set up easily to control a wide variety of RF architectures. In combination with the Infineon Technologies’ SMARTi RF solution a system approach is achieved, which results in an extremely compact implementation, very low power consumption and cost effective system performance. Te ch n o l o g y ■ ■ ■ ■ ■ ■ Firmware ■ ■ ■ Applications ■ ■ GSM/GPRS/HSCSD Mobile Phones and Data Modems ■ ■ ■ Key Features ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ C166S MCU core, 52 MHz OakDSPCore ® , 78 MHz 2 Mbit on-chip SRAM GPRS cipher units GEA1, GEA2 I 2 C bus interface (eg. PMB 6810) I 2 S PCM digital audio Interface Multimedia Card interface 2 nd SIM card interface Ringer support for PWM output to earpiece 2 IrDA compatible UARTs Logic port signal arranger General Purpose IOs Advanced dynamic power management External memory interface to 1.8 V and 3 V devices Page Mode Flash interface JTAG IEEE 1149.1 Boundary scan and debug interface OCDS level 1 debug support Based on proven Infineon mixed signal 0.18 µm technology 1.8 V - 3.3 V digital IOs 1.8 V internal operating voltage for digital parts 2.5 V internal operating voltage for analog parts P-LFBGA-208 package, 12 x 12 mm, 0.65 mm ball pitch ■ FR, HR, EFR, AMR GPRS class 12, CS 1-4 HSCSD class 10 Echo cancellation Noise reduction Voice memo support MP3 decoding support Polyphonic Ringer support Speech recognition support optional Documentation/Development a n d S u p p o r t To o l s ■ ■ ■ ■ ■ Product Overview Specification Application Note Evaluation Board CD-ROM Support Package Software ■ ■ Complete software solution ranging from layer 1 up to MMI for GSM phase 2+ incl. HSCSD, GPRS and many additional features offered by Comneon Java www.infineon.com/mobilesolutions Mobile Solutions N e v e r s t o p t h i n k i n g . Product Brief A p p l i c a t i o n E x a m p l e G S M / G P R S Te r m i n a l Earpiece A D D Speech and Channel Decoding Equalizer Viterbi HW Accelerator OakDSPCore® Speech and Channel Encoding GMSK Modulator D SMARTi DC+ (PMB 6258) A GSM850/900 I A Ringer Car Kit A D D D Q A GSM1800/1900 A CLK DAT ENA E-GOLD+ V3 (PMB 7850) 2 3 5 6 7 8 9 * 0 # Realtime Clock 2 Mbit SRAM 1 4 GSM Timer Power Management GPRS Cipher Unit C166S Infineon 16-Bit Core Automatic Offset Compensation GSM Cipher Unit Control Logic SAM Fast PLL 26 MHz D Interfaces AFC A Rx/Tx I2C I2S DAI JTAG MMC ASC SSC IrDA GSM850/900 GSM1800/1900 Power Amplifier RF Control Display FLASH E-POWER (PMB 6810) Heading to the Future Based on GPRS and HSCSD new exciting applications will create new opportunities in mobile communications. Infineon Technologies’ enables the customers to benefit from such a tremendous market opportunity. E-GOLD+ V3 provides both, analog functions, like analog baseband filters, ADCs, DACs, and digital signal processing power. To provide the MCU/DSP capabilities, E-GOLD+ V3 makes use of a combination of Infineon’s well proven and established C166 architecture and an OakDSPCore ® . It’s E-GOLD+ V3 solution for the highly integrated baseband as a system-onchip is a result of the corporation’s successful initiative from a mere silicon vendor to a system solution provider. With its system level know-how in the area of GSM, GPRS, EDGE, and UMTS Infineon Technologies leads the way in providing complete system solutions for wireless communication offering a complete semiconductor product range to cover all low- to high-end terminals. This includes Baseband ICs, RF products, Power Management ICs, Power Amplifier, Bluetooth TM modules, GPS, and many more. Infineon Technologies system solutions are jointly developed with its system integration house, Danish Wireless Design A/S in Denmark and its wireless software development house Comneon, with its headquarter in Nuremberg, Germany. Note: OakDSPCore ® is a registered trademark of ParthusCeva, Inc. How to reach us: http://www.infineon.com Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81669 München © Infineon Technologies AG 2004. All Rights Reserved. Template: pb_tmplt.fm/4/2004-01-01 Published by Infineon Technologies AG Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office. Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in lifesupport devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Ordering No. B113-H7805-G3-X-7600 Printed in Germany PS 01042. NB